CN103574323A - Light emitting diode illuminating apparatus capable of providing directed light beams - Google Patents
Light emitting diode illuminating apparatus capable of providing directed light beams Download PDFInfo
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- CN103574323A CN103574323A CN201210267078.0A CN201210267078A CN103574323A CN 103574323 A CN103574323 A CN 103574323A CN 201210267078 A CN201210267078 A CN 201210267078A CN 103574323 A CN103574323 A CN 103574323A
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Abstract
The invention relates to a semiconductor illuminating technology, in particular to a light emitting diode illuminating apparatus capable of providing directed light beams. According to an embodiment of the invention, the light emitting diode illuminating device (1) comprises a shell (10), a radiator (20), an insulating and heat-conduction substrate (310), at least one light emitting diode unit (320), a driving power source module (330) and an optical unit (40), wherein the radiator (20) is arranged in an inner cavity of the shell (10); the insulating and heat-conduction substrate (310) is arranged on the radiator; the light emitting diode units (320) are arranged on the insulating heat-conducting substrate; the driving power source module (330) is arranged in the radiator (20) and is electrically connected with the light emitting diode units; the optical unit (40) comprises a cover plate (410) covering an opening of the shell and at least one lens element (420) formed on the lower surface of the cover plate; and the lens elements face the light emitting diode units.
Description
Technical field
the present invention relates to semiconductor lighting technology, light emitting diode (LED) lighting device of directional beam is particularly provided.
Background technology
the light emitting diode (LED) that is used as at present light source in lighting device is a kind of solid-state semiconductor devices, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example silica gel or epoxy resin) that is arranged on the semiconductor wafer on support and this wafer surrounding is sealed.Above-mentioned semiconductor wafer includes P-N structure, and when electric current passes through, electronics is pushed to electronics in ， P district, P district and, with hole-recombination, then with the form of photon, sends energy, and light wavelength is to be determined by the material that forms P-N structure.Compare with conventional light source, LED light source has the not available series of advantages of other light source, such as pollution-free, the life-span is long, energy consumption is low, vibration resistance, control convenient and be convenient to light modulation etc.
the lighting device of the generation directional beam such as shot-light (be called not only multiaspect reflection Lamp cup (MR)) and handkerchief lamp (but also being called bowl dish shape aluminium reflection (PAR) lamp) is widely used in market, KTV, show window merchandise display and house decoration at present, so adopts LED to have good commercial promise as light source in this class lighting device.But be subject to the restriction of technical development, LED still has quite a few electric energy to be converted into heat energy in the course of the work.When heat energy is trapped in lamp interior, will unavoidably causes LED temperature to raise, thereby cause light source performance degradation and inefficacy.In MR lamp and PAR lamp, because heat density is higher, so the dissipation of heat how efficiently LED being produced seems particularly outstanding to the problem of lighting device outside.
industry has proposed multiple MR lamp and PAR lamp using LED as light source at present.U.S. Patent No. 6,787,999 such as people such as Tomislav J. Stimac has disclosed a kind of LED-based Assembled lamp, its as a reference, the mode of quoting in full comprises in this manual.The LED-based Assembled lamp that this United States Patent (USP) discloses comprises optical module and electronic module, wherein, optical module comprises a plurality of LED and radiators (heat sink) that are arranged on printed circuit board (PCB), and the printed circuit board (PCB) that is provided with LED is bonded to the surface of radiator; Electronic module is suitable for the power supply to LED, and its one end is connected with radiator, and the other end arranges electric connector to receive external electric energy.In above-mentioned LED-based Assembled lamp, alternatively, optical module also comprises zoom-lens system (slidable zoom lens system), this lens combination comprises lens subassembly and the posting that lens subassembly is aimed at LED module, in addition, zoom-lens system and radiator are fixed together by intermediate plate.
the LED illuminator structure that it is pointed out that existing generation directional beam is comparatively complicated, need to be optimized in design between Performance and Cost Modeling, to provide preferably balance.
Summary of the invention
the object of this invention is to provide a kind of light emitting diode illuminating apparatus that directional beam is provided, it has advantages of compact conformation.
above-mentioned purpose of the present invention can realize by following technical proposal:
the light emitting diode illuminating apparatus that directional beam is provided, comprising:
shell;
radiator, it is arranged at the inner chamber of described shell;
insulating heat-conductive substrate, it is arranged on described radiator;
at least one is arranged on the light emitting diode on described insulating radiation substrate;
be arranged on the driving power module in described radiator, itself and described light emitting diode are electrically connected; And
optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described light emitting diode.
in technique scheme, radiator is arranged on enclosure, when radiator is conductive material, can avoid accidental shock accident.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described shell consists of glass and is bowl-type.Because glass has higher transmissivity to infra-red radiation, so the heat of radiator is except being passed to shell with heat exchange pattern, also can be directly dispersed in environment and go by thermal-radiating form.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, the profile of described radiator is mated with the cavity shape of described shell.Form fit makes the contact area of radiator and shell larger, and this is conducive to the heat conduction between them.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, on the inner surface of described radiator, be formed with step, described insulating heat-conductive substrate is fixed on described step.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described radiator consists of metal, graphite, normal temperature far-infrared ceramic radiative material or heat-conducting plastic.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described radiator consists of metal, and outer surface covers graphite or normal temperature far-infrared ceramic radiative material.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described insulating heat-conductive substrate consists of ceramic material or heat conductive insulating polymer composite.The price that ceramic material is cheap contributes to reduce costs, and in addition, when adopting ceramic material as substrate, wiring can for example, be made by electric slurry (copper slurry or silver slurry) sintering process, the environmental pollution that this can be avoided copper etching technics to cause.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, on the surface of described insulating heat-conductive substrate, be formed with the wiring layer being electrically connected with described light emitting diode, and described driving power module is by wire and the electrical connection of described wiring layer of passing through described insulating heat-conductive substrate.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, on the surface of described insulating heat-conductive substrate, be formed with the wiring layer with the electrical connection of described light emitting diode, and the binding post of described driving power module welds together after passing through described insulating heat-conductive substrate with described wiring layer.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described wiring layer forms by printed circuit technique.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described light emitting diode is light emitting diode monomer, and itself and described wiring layer are electrically connected by welding manner.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described cover plate and described lens element are integrally formed.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described lens element is infundibulate, and cavity is offered to hold described light emitting diode in its bottom.Because light emitting diode is arranged in the cavity of lens element, be therefore conducive to save the inner space of shell.In addition, cavity is more conducive to assemble the light that light emitting diode sends.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, the pocket surfaces of described lens element is coated with fluorescent material.Because fluorescent material and light emitting diode are spatially separated, therefore contribute to suppress the adverse effect of temperature to fluorescent material performance.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, on the outer surface of described lens element, be formed with metal level.While forming metal level on the outer surface of lens element, the light of light emitting diode transmitting is being reflected back again through after lens element, has therefore reduced the loss of light.
above-mentioned purpose of the present invention also can realize by following technical proposal:
the light emitting diode illuminating apparatus that directional beam is provided, comprising:
shell;
radiator, it is arranged at the inner chamber of described shell;
insulating heat-conductive substrate, it is arranged on described radiator;
lED luminous module, comprising:
the metal support plate of patterning, it is arranged on the surface of described insulating heat-conductive substrate and comprises electrode district;
at least one LED core, it is arranged on described metal support plate and with described electrode district and is electrically connected;
be arranged on the driving power module in described radiator, itself and described electrode district are electrically connected; And
optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described LED luminous module.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described LED luminous module further comprises framework, and it is fixed on described metal support plate and surrounds described LED core.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, on the surface of described insulating heat-conductive substrate, be formed with the wiring layer being electrically connected with described LED luminous module, and described driving power module is by wire and the electrical connection of described wiring layer of passing through described insulating heat-conductive substrate.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, on the surface of described insulating heat-conductive substrate, be formed with the wiring layer with the electrical connection of described LED luminous module, and the binding post of described driving power module welds together after passing through described insulating heat-conductive substrate with described wiring layer.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, the transparent silica gel of the mixed fluorescent material of described LED core is surrounded.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described LED core surface applies fluorescent material and transparent silica gel successively.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode, and described LED tube core is arranged on described the second pattern area and with described the first pattern area and is electrically connected.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, the quantity of described LED tube core is at least two, they by lead-in wire realize be connected in series and with being connected of described the first pattern area.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, the quantity of described LED tube core is at least two, and they are realized and being connected and being connected in series by lead-in wire and the realization of the second pattern area of described the first pattern area by lead-in wire.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode district, a plurality of described LED tube cores are arranged on described the first and second pattern area, and it links together and is electrically connected with described the first pattern area.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described metal support plate comprises a plurality of mutual disconnected pattern area, described LED tube core comprises the electrode bottom being formed at and is arranged on different described pattern area, wherein, described electrode is connected respectively in one of them of different pattern area.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, by flip chip technique, described LED tube core is arranged on different pattern area.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, at least two regions that comprise as the pin of described LED light emitting module in described pattern area.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, the quantity of described LED tube core is at least two, and they are realized and be connected in series, be connected in parallel or series-parallel connection connection by described pattern area.
above-mentioned purpose of the present invention also can realize by following technical proposal:
the light emitting diode illuminating apparatus that directional beam is provided, comprising:
shell;
radiator, it is arranged at the inner chamber of described shell;
substrate, it is arranged on described radiator;
at least one lumination of light emitting diode (LED) module, framework and at least one LED tube core that it comprises at least one pair of first metal pattern area, the second metal pattern area, is fixed together with described the first and second metal pattern area, described the first metal pattern area is positioned at inside or the top of the through hole on described substrate, described the second metal pattern area is welded on the surface of described substrate, and described LED tube core is arranged on described the second metal pattern area and by lead-in wire and described the first metal pattern area and is electrically connected together;
be arranged on the driving power module in described radiator, itself and described the first metal pattern area are electrically connected; And
optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described LED luminous module.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described framework surrounds described LED core.
according to the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention, described substrate consists of metal or electric uninsulated heat-conducting plastic.
above-mentioned purpose of the present invention also can realize by following technical proposal:
the light emitting diode illuminating apparatus that directional beam is provided, comprising:
shell;
radiator, it is arranged at the inner chamber of described shell;
substrate, it is arranged on described radiator and offers through hole;
a plurality of light emitting diode monomers, within its bottom is positioned at described through hole with described substrate contacts and pin or top;
be arranged on the driving power module in described radiator, the pin electrical connection of itself and described light emitting diode monomer; And
optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described light emitting diode.
Accompanying drawing explanation
above-mentioned and/or other side of the present invention and advantage become the description of the various aspects by below in conjunction with accompanying drawing more clear and are easier to understand, and in accompanying drawing, same or analogous unit adopts identical label to represent, accompanying drawing comprises:
fig. 1 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of one embodiment of the invention.
fig. 2 is the generalized section of light emitting diode illuminating apparatus shown in Fig. 1.
fig. 3 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
fig. 4 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
fig. 5 is the generalized section of light emitting diode illuminating apparatus shown in Fig. 4.
fig. 6 A is according to the schematic diagram of the LED light emitting module of one embodiment of the invention.
fig. 6 B is according to the schematic diagram of the LED light emitting module of another embodiment of the present invention.
fig. 6 C is according to the schematic diagram of the LED light emitting module of another embodiment of the present invention.
fig. 6 D is according to the schematic diagram of the LED light emitting module of another embodiment of the present invention.
fig. 7 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
fig. 8 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
fig. 9 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
reference list:
1 for providing the light emitting diode illuminating apparatus of directional beam
10 shells
110 steps
20 radiators
210 steps
30 light emitting diode wicks
310 substrates
311 wirings
312A, 312B, 312C through hole
320,320A, 320B, 320C light emitting diode
330 driving power modules
331A, 331B binding post
332A, 332B input pin
340 light emitting modules
341 metal support plates
3411,3411-1,3411-2 the first pattern area
3411A/3411A ' the first electrode pair
3411B/3411B ' the second electrode pair
3411C/3411C ' third electrode pair
3412,3412-1,3412-2 the second pattern area
3413,3414 pattern area
342 frameworks
343 lead-in wires
40 optical units
410 cover plates
420 lens elements
421 cavitys
422 metal levels.
The specific embodiment
below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention, the present invention is described more all sidedly.But the present invention can realize by multi-form, and should not be read as each embodiment that only limits to provide herein.The various embodiments described above that provide are intended to make disclosure herein comprehensively complete, convey to more all sidedly those skilled in the art's protection scope of the present invention.
in this manual, unless stated otherwise, term " semiconductor crystal wafer " refers at the upper a plurality of independently single circuit that form of semi-conducting material (such as silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical arrangement of semiconductor wafer after encapsulation, in typical this physical arrangement, semiconductor wafer is for example installed on support and with encapsulant and encapsulates.
term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
knot inorganic semiconductor light emitting diode can have different version, for example, include but not limited to LED core and light emitting diode monomer.Wherein, " LED core " refers to and includes semiconductor wafer P-N structure, that have electroluminescent ability, and " light emitting diode monomer " refers to the physical arrangement forming after die package, in typical this physical arrangement, tube core is for example installed on support and with encapsulant and encapsulates.
term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern for being electrically connected between components and parts of arranging on insulating surface, include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated through-hole etc.).
term " heat radiation " refer to object owing to thering is temperature the phenomenon of radiated electromagnetic wave.
term " heat conduction " refers to heat and in solid, from the higher part of temperature, is sent to the transfer mode of the part that temperature is lower.
term " ceramic material " general reference needs high-temperature process or densified non-metal inorganic material, includes but not limited to silicate, oxide, carbide, nitride, sulfide, boride etc.
term " heat conductive insulating polymer composite " refers to such macromolecular material, by filling metal or inorganic filler portion's formation within it heat conduction network chain of high-termal conductivity, thereby possesses high thermal conductivity factor.Heat conductive insulating polymer composite is such as including but not limited to add the polypropylene material of aluminium oxide, the Merlon that adds aluminium oxide, carborundum and bismuth oxide and acrylonitrile-butadiene-styrene terpolymer etc.The specific descriptions of relevant heat conductive insulating polymer composite can be referring to the people's such as Li Li paper " research of Merlon and polycarbonate alloy heat conductive insulating macromolecular material " (< < material heat treatment journal > > in August, 2007, Vol. 28, No.4, pp51-54) and the people's such as Li Bing paper " application of aluminium oxide in heat conductive insulating polymer composite " (< < plastic additive > > the 3rd phase in 2008, pp14-16), the mode that these documents are quoted in full comprises in this manual.
term " infrared radiant material " refers to and in engineering, can absorb heat and launch a large amount of ultrared materials, and it has higher emissivity.Further, can adopt in an embodiment of the present invention graphite or normal temperature infrared ceramic radiation material as covering the infrared radiant material of spreader surface or the infrared radiant material of formation radiator.Normal temperature infrared ceramic radiation material for example includes but not limited at least one in following material: magnesia, aluminium oxide, calcium oxide, titanium oxide, silica, chromium oxide, iron oxide, manganese oxide, zirconia, barium monoxide, cordierite, mullite, boron carbide, carborundum, titanium carbide, molybdenum carbide, tungsten carbide, zirconium carbide, ramet, boron nitride, aluminium nitride, silicon nitride, zirconium nitride, titanium nitride, titanium silicide, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.About the detailed description of normal temperature infrared ceramic radiation material can be referring to the people's such as Li Hong great waves and Liu Jianxue paper " present Research of high efficiency infrared radiation ceramic and application " (< < modern technologies pottery > > the 2nd phase in 2005 (total the 104th phase), pp24-26) and Wang Qian equality people's paper " progress of high radiated infrared ceramic material and application " (< < pottery journal > > the 3rd phase in 2011), the mode that these documents are quoted in full comprises in this manual.
in the present invention, reasonable is using transfers between divisions as one of them Consideration of selecting infrared radiant material: for example, below the P-N junction temperature of the light emitting diode of setting (50-80 degree Celsius within the scope of a temperature value), infrared radiant material still has higher emissivity (being for example more than or equal to 70%).
" electrical connection " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, or through one or more Unit the 3rd, indirectly transmits the situation of electric flux or the signal of telecommunication.
" driving power " or " LED driving power " refers to and is connected to the interchange (AC) of lighting device outside or direct current (DC) power supply and as " electronic-controlled installation " between the light emitting diode of light source, is used to light emitting diode that required curtage (such as constant current, constant voltage or firm power etc.) is provided.In specific embodiment, driving power can modular structure be realized, for example it comprises printed circuit board (PCB) and one or more components and parts that are arranged on printed circuit board (PCB) and are electrically connected together by wiring, and the example of these components and parts includes but not limited to LED driving governor chip, rectification chip, resistor, capacitor and coil etc.
term such as " comprising " and " comprising " represent except have in description and claims, have directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had not by directly or other unit of clearly explaining and the situation of step.
term such as " first ", " second ", " the 3rd " and " the 4th " does not represent that unit is to be only used as to distinguish each unit in the order of the aspects such as time, space, size.
term such as " object A is arranged on the surface of object B " should be broadly interpreted as the surface that object A is directly placed on to object B, or object A is placed on to the surface that has other object contacting with object B.
by accompanying drawing, embodiments of the invention are described below.
fig. 1 is the decomposing schematic representation of the light emitting diode that directional beam is provided (LED) lighting device according to one embodiment of the invention.Fig. 2 is the generalized section of light emitting diode illuminating apparatus shown in Fig. 1.
the LED lighting device 1 that directional beam is provided of the present embodiment comprises shell 10, radiator 20, LED wick 30 and optical unit 40.Below each component units is further described.
as illustrated in fig. 1 and 2, in the present embodiment, shell 10 and the common the same bowl-type that is also substantially of MR lamp, arrange radiator 20 and LED wick 30 in its inner chamber.In the bottom of shell 10, pair of pins (not shown) can be set as connector or power pins, be suitable for for example, being electrically connected with external power source (12V/24V dc source or 110V/220V AC power).
in the present embodiment, shell 10 adopts glass material to make.Because glass has higher transmissivity for infra-red radiation, so the heat of radiator 20 can, when being passed to shell 10 with heat exchange pattern, being also dispersed in environment and going through shell 10 with thermal-radiating form.Except glass, other material with suitable infrared radiation transmission is also available.
in the present embodiment, although what adopt with the interface of external power source is plug in construction, other interface is also applicable to the present invention, such as including but not limited to the interface shapes such as E26/E27, E11, E14, E17 and terminal connections.For adaptive E26/E27, E11, E14, E17 interface, corresponding lamp holder can be set on the outer surface of shell 10 bottoms.Also it is pointed out that the shape of shell 10 is also not limited to the bowl-type of the present embodiment, other shape is also available, such as tubular and prismatic etc.
as illustrated in fig. 1 and 2, radiator 20 is housing shape and is for example arranged on, in the inner chamber of shell 10 (being bonded together).Preferably, the profile of radiator 20 is mated with the inner chamber of shell 10, and the contact area that this can increase between the two is conducive to combination and heat conduction between them.In addition,, in order to strengthen thermal conduction effect, adhesive can be selected heat-conducting glue.Radiator can adopt metal, graphite, normal temperature far-infrared ceramic radiative material or heat-conducting plastic, and the metal is here construed as simple metal or their alloy.In order to utilize the advantage of metal and nonmetallic materials simultaneously, can consider to adopt metal to cover one deck graphite or normal temperature far-infrared ceramic radiative material as the material of main part of radiator 20 and at the outer surface of radiator 20.Heat-conducting plastic can be electric insulation or electric uninsulated, and an example of this plastics is Stanyl TC 501 type heat-conducting plastics of being produced by dutch royal DSM group.
referring to Fig. 1 and 2, radiator 20 is formed with step 210 on surface within it and thinks that the substrate 310 of LED wick 30 provides bearing-surface.Can for example, by adhesive (heat-conducting glue) substrate 310 be bonded on step 210.It is pointed out that and can also adopt other mode that LED wick 30 is fixed on radiator 20.For example, can, at the sidepiece coated with thermally conductive glue of substrate 310, be then adhered to the inner surface of radiator 20; Or, at the inner surface of radiator 20, offer groove, by substrate 310 being snapped in groove, LED wick 30 and radiator 20 are fixed together.
as previously mentioned, in the present embodiment, the heat that LED wick 30 produces some in thermal-radiating mode, through radiator 20, be directly dispersed in environment and go.
in the present embodiment, LED wick 30 comprises LED unit 320 and the driving power module 330 of substrate 310, a plurality of monomeric forms, wherein LED unit 320 is arranged on the surface of substrate 310, driving power module 330 adopts the form of printed circuit board (PCB) to realize, and it is arranged on substrate 310 belows and is positioned at radiator 20.
referring to Fig. 1, the surface of substrate 310 be formed with wiring 311(for example by sintering on ceramic material by such as copper, starch or silver slurry the pattern that forms of electric slurry form), the LED unit 320 of a plurality of employing packaged chip forms is soldered to wiring 311.In addition, on substrate 310, offer through hole, between binding post 331A, the 331B of driving power module 330 and wiring 311, by passing through the wire of through hole, be electrically connected.
it is worthy of note, although in the present embodiment, light emitting diode links together with series system, also can be in parallel, the form of series-parallel connection or crossed array links together.Moreover although the LED wick here adopts a plurality of LED unit, adopting single led unit is also feasible as light source.
according to the mode of externally fed, driving power module can adopt the circuit of various topological structures, such as including but not limited to non-isolated buck-type topological circuit structure, reverse exciting topological circuit structure and half-bridge LLC topological circuit structure etc.Can be referring to People's Telecon Publishing House's in May, 2011 the < < LED illumination driving power source of the 1st edition and Design of Luminaires > > mono-book about the detailed description of driving power circuit, this publication in full way of reference comprises in this manual.
driving power module 330 can multiple type of drive (modes such as constant voltage power supply, constant current-supplying and constant pressure and flow power supply) provide suitable curtage to light emitting diode, and it can be comprised of one or more independently parts.In the present embodiment, the one or more parts in driving power module are realized with the form of wafer or packaged chip, below the parts of realizing with the form of wafer or packaged chip in driving power are called to " driving governor ".
alternatively, the circuit of all right other function of integration realization in driving power module 330, such as adjusting control circuit, sensing circuit, circuit of power factor correction, intelligent lighting control circuit, telecommunication circuit and holding circuit etc.These circuit can be integrated in same semiconductor wafer or packaged chip with driving governor, or these circuit can be individually provide with the form of semiconductor wafer or packaged chip, or some or all in these circuit can be combined and provide with the form of semiconductor wafer or packaged chip.
visible in conjunction with Fig. 1 and 2, driving power module 330 comprises a pair of input pin 332A and 332B, its one end extends out as for example, connector or power pins with external power source (12V/24V dc source or 110V/220V AC power) electrical connection from the bottom of shell 10, the other end is connected to other parts (for example rectifier cell) of driving power module 330, makes thus external power source and 330 electrical connections of driving power module.
alternatively, shell 10 comprises a pair of needle-like pin extending out from bottom, its end that is positioned at shell 10 inside is electrically connected (for example the mode by molten tin welding or laser weld is fixed together) with a pairs of posts 331A and the 331B of driving power module 330 respectively, thereby external power source can be powered to driving power module 330 through pin and binding post.
in the present embodiment, optical unit 40 comprises cover plate 410 and a plurality of lens element 420.Refer again to Fig. 1 and 2, on the inner surface of the opening part of shell 10, be formed with step 110 and think that cover plate 410 provides bearing-surface.Cover plate 410 can for example, be bonded on step 110 by adhesive (heat-conducting glue).Alternatively, when cover plate 410 and shell 10 all consist of glass material, can adopt the mode that heat merges that the two is fixed together.
upper at the lower surface of cover plate 410 one side of LED wick (in the face of), for each of LED unit 320 is equipped with corresponding lens element 420, the light that these lens elements send LED unit is transformed to the light beam with required size.The shape of lens element needs design according to application, and for example it is infundibulate in the present embodiment.Preferably, the parts that cover plate and lens element are formed in one.
fig. 2 only shows the combination of pair of LEDs unit and lens element, but for other several combinations to LED unit and lens element, the content the following describes is also suitable for.As shown in Figure 2, lens element 420 be positioned at substrate 310 surperficial top or and Surface Contact, its bottom offer cavity 421 to hold corresponding LED unit 320.Curved cavity can be closed in a space LED unit, and this is conducive to improve light extraction efficiency.Particularly, in the LED lighting device shown in Fig. 2, the light that LED unit 320 sends is under the effect of converging of lens element 420, most of cover plate 410 that sees through is outwards launched, and cannot be transmitted into the outside of lighting device but some light sees through the side from lens element 420.In order to improve light extraction efficiency, can on the outer surface of lens element 420, cover layer of metal layer 422, the light that therefore sees through lens element 420 sides is reflected back toward again cavity 421.
fig. 3 is for according to the schematic diagram of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
the LED lighting device 1 that directional beam is provided according to the present embodiment comprises shell 10, radiator 20, LED wick 30 and optical unit 40 equally, and wherein radiator 20 and LED wick 30 are arranged in the inner chamber of shell 10.Light emitting diode wick 30 comprises the substrate 310 of being made by insulating heat-conduction material, the driving power module 330 that is arranged on a plurality of LED unit 320 on substrate surface and is positioned at radiator 20.Compare by the embodiment described in Fig. 1 and 2 with above-mentioned, the main difference part of the present embodiment is the connected mode of driving power module and LED unit.For other side, the present embodiment can adopt the various features by previous embodiment, no longer describes in detail herein.
as shown in Figure 3, in the present embodiment, driving power module 330 adopts a pairs of posts 331A, 331B as output pin, and this welds together through the welding hole on substrate 310 and with wiring 311 output pin, thereby driving power module and LED unit are electrically connected together.On the other hand, because binding post is rigid element, therefore welding also makes driving power module be fixed on substrate 310 simultaneously.
fig. 4 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.Fig. 5 is the generalized section of light emitting diode illuminating apparatus shown in Fig. 4.
the LED lighting device 1 that directional beam is provided according to the present embodiment comprises shell 10, radiator 20, LED wick 30 and optical unit 40 equally, and wherein radiator 20 and LED wick 30 are also arranged in the inner chamber of shell 10.Compare by the embodiment described in Fig. 1-3 with above-mentioned, the main difference part of the present embodiment is the set-up mode of light emitting diode on substrate and the structure of optical unit.For other side, the present embodiment can adopt the various features by previous embodiment, no longer describes in detail herein.
in the present embodiment, LED light emitting module 340 and the driving power module 330 of the LED unit that LED wick 30 comprises the substrate 310 made by insulating heat-conduction material, comprise die form, wherein LED light emitting module 340 is arranged on the surface of substrate 310, and the driving power module 330 of printed circuit board (PCB) form is arranged on substrate 310 belows and is positioned at radiator 20.
referring to Fig. 4, the surface of substrate 310 be formed with wiring 311(for example by sintering on ceramic material by such as copper, starch or silver slurry the pattern that forms of electric slurry form), the output pin of LED light emitting module 340 is soldered to wiring 311.Meanwhile, binding post 331A, the 331B of driving power module 330 and wiring 311 are electrically connected together by the wire that passes through the through hole of offering on substrate 310.
in the present embodiment, optical unit 40 comprises cover plate 410 and single lens element 420.Cover plate 410 for example, is bonded on the step 110 of inner surface of outer cover by adhesive (heat-conducting glue), or adopts the mode that heat merges to be fixed on step 110.
on the lower surface (facing the one side of LED wick) of cover plate 410, be formed with single lens element 420, its light that LED light emitting module 340 is sent is transformed to the light beam with required size.Preferably, the parts that cover plate and lens element are formed in one.The shape of lens element can need design according to application, and for example it is infundibulate in the present embodiment.
as shown in Figure 5, lens element 420 be positioned at substrate 310 surperficial top or and Surface Contact, its bottom offer cavity 421 to hold LED light emitting module 340.Curved cavity is closed in a space LED light emitting module and is beneficial to improve light extraction efficiency.In order to improve light extraction efficiency, on the outer surface of lens element 420, can cover layer of metal layer 422, make the light that sees through lens element 420 sides be reflected back toward again cavity 421.In addition, in the present embodiment, can on the inner surface of cavity 421, cover the color that fluorescent material is adjusted illuminating ray.Cover the fluorescent material of cavity inner surface owing to directly not contacting with LED unit, so heating temperature decreases, thereby can delay the aging of fluorescent material.
the structure of LED luminous module is described by Fig. 6 A-6D below.
fig. 6 A is according to the schematic diagram of the LED light emitting module of one embodiment of the invention.
as shown in Figure 6A, LED light emitting module 340 comprises metal support plate 341, a plurality of LED tube core 320 and framework 342.Metal support plate 341 comprises the first pattern area 3411 and the second pattern area 3412.The first pattern area 3411 is as electrode district or the output pin of light emitting module, and it comprises each other a plurality of and all disconnected discrete community or electrode pair are usingd as LED tube core 320 and outside electric interfaces with the second pattern area 3412.P type electrode and the N-type electrode of LED tube core 320 are all arranged on upper surface, and it is for example fixed on the second pattern area 3412 by eutectic solder technology.Due to the good heat conductivility of metal, the thermal resistance between LED tube core 320 and the second pattern area 3412 is close to zero, so the heat that the former produces can pass to light emitting module 340 insulating radiation substrate 310 below efficiently.Framework 342 is made by insulating materials, and it is for example fixed together by noting compression technology and metal support plate 341, and LED tube core 320 is surrounded wherein.Because the first and second pattern area 3411 and 3412 are all fixed on framework 342, so their relative position relation is fixed.Referring to Fig. 6 A, LED tube core 320 by go between 343 realize interconnection between them and with being connected of the first pattern area 3411.For fear of LED tube core 320 and lead-in wire 343, be directly exposed in air, can be in the interior injection transparent silica gel of framework 342 so that they be encapsulated.
as mentioned above, can apply the emission wavelength that fluorescent material changes LED tube core by the cavity inner surface at lens element.Alternatively, also can surround LED tube core by for example, silica gel with mixed fluorescent powder (yttrium-aluminium-garnet (YAG) fluorescent material) or on the surface of LED tube core, apply fluorescent material successively and silica gel achieves the above object.As shown in Figure 6A, due to the setting of framework 342, mobile being restricted of silica gel and be only distributed in LED tube core around.
referring to Fig. 6 A, in the present embodiment, the first pattern area 3411 comprises the first electrode pair 3411A/3411A ', the second electrode pair 3411B/3411B ' and third electrode to 3411C/3411C '.These electrode pairs can be connected in parallel to driving power module 330.Correspondingly, the LED tube core that a plurality of LED tube cores 320 are divided in three groups and every group is connected between electrode pair separately with series system, has realized thus the connection of series-parallel connection mode.Between LED tube core, also can adopt other type of attachment such as series, parallel or crossed array.Moreover it is example that the present embodiment be take a plurality of LED tube cores, is also feasible yet adopt single led tube core as light-emitting component.
for LED light emitting module 340 being arranged on substrate 310 and making LED light emitting module and wiring electrical connection, can be first at the surface printing electric slurry pattern of substrate 310, this pattern is corresponding to wiring 311 and the region (being called again below contact zone) that contacts with the first and second pattern area 3411,3412 of LED light emitting module; Then by high temperature sintering, at substrate surface, form wiring 311 and contact zone; Finally the first and second pattern area of metal support plate 341 are fixed to the contact zone of substrate surface by the mode of heat fused, and the part that first, second, and third electrode pair extends out from framework 342 is welded together with wiring.In the present embodiment, metal support plate 341 can adopt the materials such as copper, aluminium to make, and preferably, can on the surface of the first and second pattern area and substrate contacts, form metal or alloy layer that one deck fusing point is lower to be conducive to heat fused.
fig. 6 B is the schematic diagram of light emitting diode (LED) light emitting module according to another embodiment of the present invention.Compare by the embodiment described in Fig. 6 A with above-mentioned, the main difference part of the present embodiment is the pattern form of metal support plate and the connected mode of LED tube core etc., below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
as shown in Figure 6B, LED light emitting module 340 comprises metal support plate 341, a plurality of LED tube core 320 and framework 342.Metal support plate 341 comprises the first pattern area 3411 and the second pattern area 3412, and wherein, the first pattern area 3411 comprises pair of electrodes or output pin 3411A, 3411A ', and LED tube core 320 is for example fixed on the second pattern area 3412 by eutectic solder technology.In the present embodiment, P type electrode and the N-type electrode of LED tube core 320 are also arranged on upper surface, and LED tube core are linked together and be connected with the electrode pair 3411A/3411A ' of the first pattern area 3411 by lead-in wire 343.But different from the embodiment shown in Fig. 6 A, second pattern area 3412 of the present embodiment is except carrying LED tube core 320, also for LED tube core provides electrical connection.Particularly, in Fig. 6 B, for the LED tube core that is arranged in the figure lower left corner and the upper right corner, one of them electrode of each tube core is electrically connected to the second pattern area 3412 by lead-in wire 343.Because the second pattern area 3412 is regions of a connection, therefore between the LED in the lower left corner and upper right corner tube core, realized electrical connection, thus whole LED tube cores are connected in series between the electrode pair 3411A/3411A ' of the first pattern area 3411 successively.The framework 342 of for example, being made by insulating materials (plastics) is for example by noting compression technology and the first and second pattern area 3411,3412 are fixed together and by 320 encirclements of LED tube core wherein.When the first and second pattern area 3411 and 3412 are all fixed on framework 342, the relative position relation between their threes is fixed.For fear of LED tube core 320 and lead-in wire 343, be directly exposed in air, can be in the interior injection transparent silica gel of framework 342 so that they be encapsulated.Equally, the transparent silica gel of injecting can mixed fluorescent powder to change the color of the light that LED light emitting module sends.Alternatively, the coating of fluorescent material and transparent silica gel can separate execution,, first on each LED tube core 320, covers fluorescent material and then to the interior injection transparent silica gel of framework 342 that is.
light emitting module 340 can be same according to the embodiment with above mode be arranged on substrate 310 and with wiring electrical connection.
it is worthy of note, although the LED tube core here adopts series system to link together, also can adopt parallel way.For example two electrodes of each the LED tube core in Fig. 6 B can directly be connected between electrode pair 3411A/3411A ', thereby form and downlink connection.
fig. 6 C is the schematic diagram of light emitting diode (LED) light emitting module according to another embodiment of the present invention.Compare with the embodiment described in 6B by Fig. 6 A with above-mentioned, the main difference part of the present embodiment is the pattern form of metal support plate and the setting of LED tube core and connected mode etc., below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
as shown in Figure 6 C, LED light emitting module 340 comprises metal support plate 341, a plurality of LED tube core 320A-320C and framework 342.Metal support plate 341 comprises the first pattern area 3411-1,3411-2 and the second pattern area 3412-1,3412-2, and wherein, the first pattern area 3411-1,3411-2 comprise respectively to outside electrode 3411A and the 3411A ' extending of framework 342.Different from previous embodiment is, in the present embodiment, on the first and second pattern area, be all provided with LED tube core, the second pattern area comprises two discrete region 3412-1 and 3412-2, and the P type electrode of LED tube core and N-type electrode are separately positioned on upper surface and lower surface.Interconnection between tube core and realizing with being connected according to following manner of the first pattern area.Referring to Fig. 6 C, LED tube core 320A is arranged on the first pattern area 3411-1, it is upper that its electrode that is positioned at lower surface is welded on the first pattern area 3411-1, and the electrode that is positioned at upper surface is electrically connected by the separate areas 3412-1 of lead-in wire the 343 and second pattern area.Meanwhile, it is upper that LED tube core 320B is arranged on separate areas 3412-1, and it is upper that its electrode that is positioned at lower surface is welded on separate areas 3412-1, and another electrode is by lead-in wire 343 and another separate areas 3412-2 electrical connection.It is upper that LED tube core 320C is arranged on separate areas 3412-2, and it is upper that its electrode that is positioned at lower surface is welded on separate areas 3412-2, and another electrode is by lead-in wire the 343 and first pattern area 3411-2 electrical connection.Thus, LED tube core is connected in series between the electrode pair of the first pattern area successively.
equally, the framework 342 of for example, being made by insulating materials (plastics) is for example by noting compression technology and the first and second pattern area are fixed together and by LED tube core 320A-320C encirclement wherein.When the first and second pattern area are all fixed on framework 342, their relative position relation is fixed.In the present embodiment, the transparent silica gel by being mixed with fluorescent material to the interior injection of framework 342 is to be encapsulated LED tube core and lead-in wire.Alternatively, the coating of fluorescent material and transparent silica gel also can separate execution.In addition, in the present embodiment, LED light emitting module 340 also can be arranged on substrate 310 and with wiring and be electrically connected according to the mode of describing in the above.
fig. 6 D is the schematic diagram of light emitting diode (LED) light emitting module according to one embodiment of the invention.Compare with the embodiment described in 6B by Fig. 6 A with above-mentioned, the main difference part of the present embodiment is the pattern form of metal support plate and the setting of LED tube core and connected mode etc., below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
as shown in Figure 6 D, LED light emitting module 340 comprises metal support plate 341, a plurality of LED tube core 320A-320C and framework 342.Metal support plate 341 comprises pattern area 3411,3412,3413 and 3414, and wherein, pattern area 3411 and 3414 comprises respectively the region 3411 ' and 3414 ' of an elongation with the pair of pins as LED light emitting module and external circuit electrical connection.In the present embodiment, between the 3411-3414 of pattern area, be not communicated with mutually, they are for example fixed together with the framework 342 of for example, being made by insulating materials (plastics) by noting compression technology, thereby keep fixing relative position relation.P type electrode and the N-type electrode of LED tube core 320A-320C are all arranged on lower surface, and as shown in Figure 6 D, each LED tube core is separately positioned on a pair of adjacent pattern area.Particularly, LED tube core 320A is positioned on pattern area 3411 and pattern area 3412 simultaneously, and its P type electrode and N-type electrode are respectively welded to pattern area 3411 and pattern area 3412.Similarly, LED tube core 320B is positioned on pattern area 3412 and 3413 simultaneously, and its P type electrode and N-type electrode are welded to respectively pattern area 3412 and 3413.LED tube core 320C is positioned on pattern area 3413 and pattern area 3414 simultaneously, and its P type electrode and N-type electrode are welded to respectively pattern area 3413 and pattern area 3414.Thus, LED tube core is without being connected in series between pin 3411A and 3414A by lead-in wire.
due to the good heat conductivility of metal, the thermal resistance between LED tube core and pattern area is close to zero, so the heat that the former produces can pass to light emitting module 340 insulating radiation substrate 310 below efficiently.In addition, in the present embodiment, when LED tube core is set on metal support plate, can complete the electrical connection of LED tube core, therefore simplify manufacture craft.Preferably, can utilize flip chip technique to complete setting and the electrical connection of LED tube core on metal support plate.
in the present embodiment, the transparent silica gel by being mixed with fluorescent material to the interior injection of framework 342 is to be encapsulated LED tube core and lead-in wire.Alternatively, the coating of fluorescent material and transparent silica gel also can separate execution.In addition, in the present embodiment, LED light emitting module 340 also can be arranged on substrate 310 and with wiring and be electrically connected according to the mode of describing in the above.
it is pointed out that in the present embodiment, the connected mode between LED tube core is not limited to being connected in series shown in Fig. 6 D, and it also can adopt other type of attachment such as parallel connection or crossed array.For example can save pattern area 3412 in Fig. 6 D and 3413 and LED tube core 320A-320C is arranged on to pattern area 3411 and pattern area 3414 simultaneously, the P type electrode of each LED tube core and N-type electrode are respectively welded to pattern area 3411 and pattern area 3414, have realized thus being connected in parallel between LED tube core.Moreover it is example that the present embodiment be take a plurality of LED tube cores, is also feasible yet adopt single led tube core as light-emitting component.
fig. 7 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
compare with the embodiment described in Fig. 6 A-6D by Fig. 4, Fig. 5 with above-mentioned, the main difference part of the present embodiment is the connected mode of driving power module and LED light emitting module.For other side, the present embodiment can adopt the various features by previous embodiment, no longer describes in detail herein.
in the present embodiment, provide the LED lighting device 1 of directional beam to comprise equally shell 10, radiator 20, LED wick 30 and optical unit 40, wherein radiator 20 and LED wick 30 are arranged in the inner chamber of shell 10.Light emitting diode wick 30 comprises the substrate 310 of being made by insulating heat-conduction material, the driving power module 330 that is arranged on the LED light emitting module 340 on substrate surface and is positioned at radiator 20.
as shown in Figure 7, driving power module 330 adopts a pairs of posts 331A, 331B as output pin, and this passes through the welding hole of substrate and weld together with wiring 311 output pin, thereby driving power module and LED light emitting module are electrically connected together.
fig. 8 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
compare by Fig. 4, Fig. 5, Fig. 6 A-6D and the embodiment described in Fig. 7 with above-mentioned, the main difference part of the present embodiment is the connected mode of substrate and driving power module and LED light emitting module.For other side, the present embodiment can adopt the various features by previous embodiment, no longer describes in detail herein.
as shown in Figure 8, the LED lighting device 1 that directional beam is provided of the present embodiment comprises shell 10, radiator 20, LED wick 30 and optical unit 40 equally, and wherein radiator 20 and LED wick 30 are arranged in the inner chamber of shell 10.The driving power module 330 that light emitting diode wick 30 comprises substrate 310, is arranged on the LED light emitting module 340 on substrate surface and is positioned at radiator 20, wherein, the structure that LED light emitting module 340 adopts as shown in Figure 6B.
different from previous embodiment is, in the present embodiment, substrate 310 is made by metal material, and LED light emitting module 340 is arranged on substrate 310 in the following manner: region corresponding with the first pattern area 3411 on substrate 310 offers through hole 312A and 312B, make thus the first pattern area 3411 can be positioned at through hole within or top, thereby avoid contacting with the direct of substrate 310; On the other hand, the heat that between the second pattern area 3412 that makes LED light emitting module 340 and substrate 340, formation face contacts so that LED tube core is produced is passed to substrate.In Fig. 8, owing to being injected into silica gel in framework 342, so the internal structure of not shown LED light emitting module.From Fig. 8 and in conjunction with Fig. 6 B, within pin 3411A and 3411A ' extend out and lay respectively at through hole 312A and 312B from framework 342.
the driving power module 330 that is arranged on substrate 310 belows comprises a pairs of posts 331A, 331B, and this pairs of posts is electrically connected (for example, by welding or bolted mode) with pin 3411A and the 3411A ' of LED light emitting module after passing through hole 312A and 312B.
for the second pattern area 3412 of LED light emitting module 340 is contacted with substrate 310 formation faces, can be first in region corresponding to the surface of substrate and the second pattern area 3412 of LED light emitting module, apply metal level or the alloy-layer of one deck low melting point, then the second pattern area and substrate heat are fused together.In addition, in the present embodiment, can consider to apply infrared radiant material further to strengthen heat-sinking capability on the surface of substrate 310.
although it is pointed out that the structure that LED light emitting module 340 adopts as shown in Figure 6B in the present embodiment, also can adopt the LED light emitting module with other structure, for example there is the LED light emitting module of structure shown in Fig. 6 A.
also it is pointed out that in the present embodiment, substrate 310 also can adopt electric uninsulated heat-conducting plastic to make.An example of this heat-conducting plastic is the Stanyl TC heat-conducting plastic of being produced by dutch royal DSM group.
fig. 9 is for according to the decomposing schematic representation of the light emitting diode illuminating apparatus that directional beam is provided of another embodiment of the present invention.
compare by the embodiment described in Fig. 1-3 with above-mentioned, the main difference part of the present embodiment is the connected mode of substrate and driving power module and LED unit.For other side, the present embodiment can adopt the various features by previous embodiment, no longer describes in detail herein.
as shown in Figure 9, according to the LED lighting device 1 that directional beam is provided of the present embodiment, comprise equally shell 10, radiator 20, LED wick 30 and optical unit 40, wherein radiator 20 and LED wick 30 are arranged in the inner chamber of shell 10.Light emitting diode wick 30 comprises substrate 310, is arranged on LED unit 320A, 320B, the 320C of a plurality of monomeric forms on substrate surface and the driving power module 330 that is positioned at radiator 20.
in the present embodiment, substrate 310 is made by metal material or electric uninsulated heat-conducting plastic, and as shown in Figure 9, offers through hole 312A, 312B and 312C on it.Each LED unit is placed on wherein between a pair of through hole and output pin lay respectively at this to through hole one of them top or within.Particularly, the bottom of LED unit 320A contacts with substrate 310 formation faces, two output pin lay respectively at through hole 312A and 312B top or within, the bottom of LED unit 320B contacts with substrate 310 formation faces, two output pin lay respectively at through hole 312B and 312C top or within, the bottom of LED unit 320C contacts with substrate 310 formation faces, two output pin lay respectively at through hole 312C and 312A top or within.On the other hand, in order to form and to be connected in series between LED unit 320A, 320B, 320C, the output pin that is positioned at through hole 312A of LED unit 320A and 320C links together with driving power module 330 1 pairs of posts 331A, 331B respectively (for example by welding or bolt, being connected), the output pin that is positioned at through hole 312B of LED unit 320A and 320B is electrically connected together by connecting rod, and the output pin that is positioned at through hole 312C of LED unit 320B and 320C is electrically connected together by connecting rod.
due to the bottom of LED unit with substrate 310 for face contacts, so the heat that LED unit produces is conducted efficiently.In addition, in the present embodiment, also can on the surface of substrate 310, apply infrared radiant material further to strengthen heat-sinking capability.
although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that and can change aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, therefore scope of the present invention will be limited by claim and the content that is equal to.
Claims (10)
1. the light emitting diode illuminating apparatus that directional beam is provided, comprising:
Shell;
Radiator, it is arranged at the inner chamber of described shell;
Insulating heat-conductive substrate, it is arranged on described radiator;
At least one is arranged on the light emitting diode on described insulating radiation substrate;
Be arranged on the driving power module in described radiator, itself and described light emitting diode are electrically connected; And
Optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described light emitting diode.
2. the light emitting diode illuminating apparatus for generation of directional beam as claimed in claim 1, wherein, described radiator consists of metal, graphite, normal temperature far-infrared ceramic radiative material or heat-conducting plastic.
3. the light emitting diode illuminating apparatus for generation of directional beam as claimed in claim 1, wherein, described radiator consists of metal, and outer surface covers graphite or normal temperature far-infrared ceramic radiative material.
4. the light emitting diode illuminating apparatus that directional beam is provided, comprising:
Shell;
Radiator, it is arranged at the inner chamber of described shell;
Insulating heat-conductive substrate, it is arranged on described radiator;
LED luminous module, comprising:
The metal support plate of patterning, it is arranged on the surface of described insulating heat-conductive substrate and comprises electrode district;
At least one LED core, it is arranged on described metal support plate and with described electrode district and is electrically connected;
Be arranged on the driving power module in described radiator, itself and described electrode district are electrically connected; And
Optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described LED luminous module.
5. the light emitting diode illuminating apparatus that directional beam is provided as claimed in claim 4, wherein, described LED luminous module further comprises framework, it is fixed on described metal support plate and surrounds described LED core.
6. the light emitting diode illuminating apparatus that directional beam is provided as claimed in claim 4, wherein, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode, and described LED tube core is arranged on described the second pattern area and with described the first pattern area and is electrically connected.
7. the light emitting diode illuminating apparatus that directional beam is provided as claimed in claim 4, wherein, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode district, a plurality of described LED tube cores are arranged on described the first and second pattern area, and it links together and is electrically connected with described the first pattern area.
8. the light emitting diode illuminating apparatus that directional beam is provided as claimed in claim 4, wherein, described metal support plate comprises a plurality of mutual disconnected pattern area, described LED tube core comprises the electrode bottom being formed at and is arranged on different described pattern area, wherein, described electrode is connected respectively in one of them of different pattern area.
9. the light emitting diode illuminating apparatus that directional beam is provided, comprising:
Shell;
Radiator, it is arranged at the inner chamber of described shell;
Substrate, it is arranged on described radiator;
At least one LED luminous module, framework and at least one LED tube core that it comprises at least one pair of first metal pattern area, the second metal pattern area, is fixed together with described the first and second metal pattern area, described the first metal pattern area is positioned at inside or the top of the through hole on described substrate, described the second metal pattern area is welded on the surface of described substrate, and described LED tube core is arranged on described the second metal pattern area and by lead-in wire and described the first metal pattern area and is electrically connected together;
Be arranged on the driving power module in described radiator, itself and described the first metal pattern area are electrically connected; And
Optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described LED luminous module.
10. the light emitting diode illuminating apparatus that directional beam is provided, comprising:
Shell;
Radiator, it is arranged at the inner chamber of described shell;
Substrate, it is arranged on described radiator and offers through hole;
A plurality of light emitting diode monomers, within its bottom is positioned at described through hole with described substrate contacts and pin or top;
Be arranged on the driving power module in described radiator, the pin electrical connection of itself and described light emitting diode monomer; And
Optical unit, its cover plate that comprises the opening that covers described shell and at least one are formed at the lens element on the lower surface of described cover plate, and described lens element is in the face of described light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210267078.0A CN103574323A (en) | 2012-07-31 | 2012-07-31 | Light emitting diode illuminating apparatus capable of providing directed light beams |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210267078.0A CN103574323A (en) | 2012-07-31 | 2012-07-31 | Light emitting diode illuminating apparatus capable of providing directed light beams |
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| CN103574323A true CN103574323A (en) | 2014-02-12 |
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| CN201210267078.0A Pending CN103574323A (en) | 2012-07-31 | 2012-07-31 | Light emitting diode illuminating apparatus capable of providing directed light beams |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287496A (en) * | 2015-05-19 | 2017-01-04 | 赵依军 | LED light source component, LED photovoltaic integration module and LED spotlight |
| WO2018133509A1 (en) * | 2017-01-19 | 2018-07-26 | 杭州华普永明光电股份有限公司 | Led module and lighting fixture |
| CN110265840A (en) * | 2014-10-09 | 2019-09-20 | 爱勒米珍有限责任公司 | Component and in lamp seat formed electrical contacts method |
-
2012
- 2012-07-31 CN CN201210267078.0A patent/CN103574323A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265840A (en) * | 2014-10-09 | 2019-09-20 | 爱勒米珍有限责任公司 | Component and in lamp seat formed electrical contacts method |
| CN110265840B (en) * | 2014-10-09 | 2020-11-03 | 爱勒米珍有限责任公司 | Assembly and method for forming electrical contacts in a lamp base |
| CN106287496A (en) * | 2015-05-19 | 2017-01-04 | 赵依军 | LED light source component, LED photovoltaic integration module and LED spotlight |
| WO2016184372A3 (en) * | 2015-05-19 | 2017-02-02 | 赵依军 | Led light source assembly, led photoelectric integration module, and led spotlight |
| WO2018133509A1 (en) * | 2017-01-19 | 2018-07-26 | 杭州华普永明光电股份有限公司 | Led module and lighting fixture |
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