CN103104828A - Light emitting diode (LED) lamp wick and lighting device with LED as light source - Google Patents

Light emitting diode (LED) lamp wick and lighting device with LED as light source Download PDF

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Publication number
CN103104828A
CN103104828A CN2011104622202A CN201110462220A CN103104828A CN 103104828 A CN103104828 A CN 103104828A CN 2011104622202 A CN2011104622202 A CN 2011104622202A CN 201110462220 A CN201110462220 A CN 201110462220A CN 103104828 A CN103104828 A CN 103104828A
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China
Prior art keywords
light emitting
emitting diode
insulating
substrate
radiating piece
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Pending
Application number
CN2011104622202A
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Chinese (zh)
Inventor
赵依军
李文雄
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Individual
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Individual
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Priority to CN2011104622202A priority Critical patent/CN103104828A/en
Priority to PCT/CN2012/084280 priority patent/WO2013067945A1/en
Publication of CN103104828A publication Critical patent/CN103104828A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to the semiconductor lighting technology, in particular to a light emitting diode (LED) lamp wick and a lighting device with an LED as a light source. The purpose is to provide the LED lamp wick suitable for being fitted to a lamp housing to provide a lighting device which is good in heat dissipating effect and low in production cost. One more purpose is to provide the lighting device with the LED as the light source, and the lighting device with the LED as the light source has the advantages of being both good in heat dissipating effect and low in production cost.

Description

Light emitting diode wick and employing light emitting diode are as the lighting device of light source
Technical field
The present invention relates to the semiconductor lighting technology, particularly light emitting diode wick and employing light emitting diode are as the lighting device of light source.
Background technology
The light emitting diode (LED) that is used as at present light source in lighting device is a kind of solid-state semiconductor device, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example fluorescence silica gel or epoxy resin) that is arranged on the semiconductor wafer on support and this wafer surrounding is sealed.Above-mentioned semiconductor wafer includes the P-N structure, when electric current by the time, electronics is pushed to P district, electronics is followed hole-recombination in P district, then sends energy with the form of photon, light wavelength is by the material decision that forms the P-N structure.Compare with energy-saving fluorescent lamp with incandescent lamp, light emitting diode has the plurality of advantages such as environmental protection, recyclable recycling, high light efficiency, rich color and tunable optical, therefore along with being gradually improved of manufacturing process, will become gradually main stream light sources based on the lighting source of light emitting diode.
LED in the course of the work, only some electric energy is converted into heat energy, remainder all is converted into heat energy, thereby causes the temperature of LED to raise, this is the main cause of its performance degradation and inefficacy.Can say, heat dissipation problem has become the technical bottleneck of current semiconductor lighting technical development.For this reason, industry is each aspect from chip, circuit board to system, has proposed various optimal design for heat dissipation problem, to obtain best radiating effect.
With regard to chip level, generally can improve heat-sinking capability by increasing chip size and changing material structure.For example in order to improve the heat radiation of substrate, company of section sharp (Cree) adopts silicon carbide substrates, and its heat conductivility is higher nearly 20 times than sapphire.
In the circuit board aspect, all adopt aluminium base as printed circuit board (PCB) in present many LED light fixtures, this substrate is sandwich construction, and use in the intermediate layer has the insulating layer material of high thermal conductivity, thereby makes the heat energy of LED chip see through the aluminium sheet rapid diffusion of lower floor and pass.
For system level, heat radiation strategy commonly used is to be LED light fixture configuration radiating subassembly (for example fin, heat pipe, temperature-uniforming plate, loop hot-pipe and piezoelectric fan), thus by its fast heat-sinking capability the heat that LED produces is dispersed in surrounding environment rapidly.For example the applying date and the application number Chinese patent application " LED lamp radiating structure " that is respectively on November 9th, 2004 and 200410052114.7 discloses a kind of LED lamp radiating structure, it comprises that circuit drives luminous plaque and circuit control panel, and circuit drives integrated luminous diode array on luminous plaque; Described circuit drives a reflective aluminium sheet of heat radiation is set above luminous plaque, and below it, joint one is led the heat radiation glue-line, leads heat radiation glue-line another side and engages a heat-dissipating aluminium plate.Above-mentioned circuit control panel can be with leading thermal paste parcel, the heat that produces when further leading the control panel work of loose wire road.
But the enforcement that it is pointed out that above-mentioned heat dissipation design scheme is often with the cost that rises to of manufacturing cost, and this will cause the user to use the decline of wish, be unfavorable for the penetration and promotion of LED lighting device.
Summary of the invention
The purpose of this invention is to provide a kind of light emitting diode wick, it is suitable for being assembled together to provide with lamp housing the lighting device of the good and low cost of manufacture of radiating effect.
Goal of the invention of the present invention can realize by following technical proposal:
A kind of light emitting diode wick comprises:
The insulating heat-conductive substrate;
At least one light emitting diode, its first surface that is arranged at described substrate with and described substrate between form the heat conduction; And
Be arranged at the driving governor of the second surface of described substrate, itself and described at least one light emitting diode are electrically connected to provide required operating current or operating voltage to described at least one light emitting diode, wherein, described the first and second surfaces are identical or relative surface.
Preferably, in above-mentioned light emitting diode wick, described insulating heat-conductive substrate is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned light emitting diode wick, also comprise the wiring layer that is formed at described the first and second surfaces and is electrically connected with described light emitting diode and described driving governor.
Preferably, in above-mentioned light emitting diode wick, described wiring layer is formed at described the first and second surfaces by printed circuit technique.
Preferably, in above-mentioned light emitting diode wick, described light emitting diode is LED core, and it is fixed on described first surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described light emitting diode is the light emitting diode monomer, and itself and described wiring layer are electrically connected by welding manner.
Preferably, in above-mentioned light emitting diode wick, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned light emitting diode wick, described driving governor is the semiconductor wafer form, and it is fixed on described second surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described driving governor is the packaged chip form, and it is fixed on described second surface and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned light emitting diode wick, further comprise at least a in lower column circuits: sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction.
Preferably, in above-mentioned light emitting diode wick, at least a and described driving governor of described circuit is integrated in in semiconductor wafer or packaged chip.
Preferably, in above-mentioned light emitting diode wick, described circuit is the semiconductor wafer form, and it is fixed on first or second surface of described substrate and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described circuit is the packaged chip form, and it is fixed on first or second surface of described substrate and realizes electrical connection with described wiring layer by welding procedure.
Of the present invention also have a purpose to be to provide a kind of light emitting diode that adopts as the lighting device of light source, and it has the advantage of the good and low cost of manufacture of radiating effect concurrently.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of light emitting diode that adopts comprises as the lighting device of light source:
Lamp housing comprises radiating piece;
Light emitting diode wick comprises:
The insulating heat-conductive substrate, and described radiating piece is fixed together to form the heat conduction between described substrate and described radiating piece;
At least one light emitting diode, its first surface that is arranged at described substrate with and described substrate between form the heat conduction; And
Be arranged at the driving governor of the second surface of described substrate, itself and described at least one light emitting diode are electrically connected to provide required operating voltage or operating current to described at least one light emitting diode, wherein, described the first and second surfaces are identical or relative surface.
Preferably, in above-mentioned lighting device, described substrate is fixed in described radiating piece by the double coated film of heat-conducting glue or heat conduction.
Preferably, in above-mentioned lighting device, described radiating piece is made of metal, and described lamp housing also comprises lamp holder, and described radiating piece is connected with described lamp holder through insulating part.
Preferably, in above-mentioned lighting device, described radiating piece is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, described insulating heat-conductive substrate is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, also comprise the wiring layer that is formed at described the first and second surfaces and is electrically connected with described light emitting diode and described driving governor.
Preferably, in above-mentioned lighting device, described wiring layer is formed at described the first and second surfaces by printed circuit technique.
Preferably, in above-mentioned lighting device, described light emitting diode is LED core, and it is fixed on described first surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described light emitting diode is the light emitting diode monomer, and itself and described wiring layer are electrically connected by welding manner.
Preferably, in above-mentioned lighting device, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned lighting device, described driving governor is the semiconductor wafer form, and it is fixed on described second surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described driving governor is the packaged chip form, and it is fixed on described second surface and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned lighting device, further comprise at least a in lower column circuits: sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction.
Preferably, in above-mentioned lighting device, at least a and described driving governor of described circuit is integrated in in semiconductor wafer or packaged chip.
Preferably, in above-mentioned lighting device, described circuit is the semiconductor wafer form, and it is fixed on first or second surface of described substrate and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described circuit is the packaged chip form, and it is fixed on first or second surface of described substrate and realizes electrical connection with described wiring layer by welding procedure.
Above-mentioned purpose of the present invention also can realize by following technical proposal:
A kind of light emitting diode that adopts comprises as the lighting device of light source:
Lamp housing comprises radiating piece;
The insulating heat-conductive substrate, and described radiating piece is fixed together to form the heat conduction between described substrate and described radiating piece;
At least one light emitting diode, its surface that is arranged at described substrate with and described substrate between form the heat conduction;
Be arranged at the driving power module in described lamp housing; And
Be formed at the wiring layer on described radiating piece surface, be used for making described light emitting diode be electrically connected to described driving power module.
Preferably, in above-mentioned lighting device, described substrate is fixed in described radiating piece by the double coated film of heat-conducting glue or heat conduction.
Preferably, in above-mentioned lighting device, described substrate and described radiating piece are integrated.
Preferably, in above-mentioned lighting device, described radiating piece is made of metal, and described lamp housing also comprises lamp holder, and described radiating piece is connected with described lamp holder through insulating part.
Preferably, in above-mentioned lighting device, described radiating piece is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, described substrate is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, described wiring layer is formed at the surface of described radiating piece by printed circuit technique.
Preferably, in above-mentioned lighting device, described light emitting diode is LED core, and it is fixed on the surface of described radiating piece and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described light emitting diode is the light emitting diode monomer, and itself and described wiring layer are electrically connected by welding manner.
Preferably, in above-mentioned lighting device, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned lighting device, described driving power module comprises power converting circuit and Drive and Control Circuit.
Preferably, in above-mentioned lighting device, described driving power module also comprises adjusting control circuit and circuit of power factor correction.
Preferably, in above-mentioned lighting device, further comprise the sensing circuit and the telecommunication circuit that are arranged on described lamp housing inside or described substrate surface.
Above-mentioned purpose of the present invention also can realize by following technical proposal:
A kind of light emitting diode that adopts comprises as the lighting device of light source:
Lamp housing comprises the insulating heat-conductive part;
At least one light emitting diode, its outer surface that is arranged on described insulating heat-conductive part with and described insulating heat-conductive part between form the heat conduction;
Be arranged on the driving power module in described lamp housing; And
Be formed at the wiring layer of described insulating heat-conductive part surface, be used for making described light emitting diode be electrically connected to described driving power module.
Preferably, in above-mentioned lighting device, described insulating heat-conductive part is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, described light emitting diode is LED core, and it is fixed on the outer surface of described insulating heat-conductive part and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described light emitting diode is the light emitting diode monomer, and itself and described wiring layer are electrically connected by welding manner.
Preferably, in above-mentioned lighting device, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned lighting device, described driving power module comprises power converting circuit and Drive and Control Circuit.
Preferably, in above-mentioned lighting device, described driving power module also comprises adjusting control circuit and circuit of power factor correction.
Preferably, in above-mentioned lighting device, further comprise the sensing circuit and the telecommunication circuit that are arranged on described lamp housing inside or described insulating heat-conductive part outer surface.
Above-mentioned purpose of the present invention also can realize by following technical proposal:
A kind of light emitting diode that adopts comprises as the lighting device of light source:
Lamp housing comprises radiating piece;
Along the column that the described lamp housing longitudinal axis extends, it is made of insulating heat-conduction material and one of them end is fixed together to form hot the conduction between described column and described radiating piece with described radiating piece;
At least one light emitting diode, its outer surface that is arranged on described column with and described column between form the heat conduction;
Be arranged on the driving power module in described lamp housing; And
Be formed at the wiring layer of described column outer surface, it makes described light emitting diode be electrically connected to described driving power module.
Preferably, in above-mentioned lighting device, described insulating heat-conduction material is ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, one of them end of described column adheres on described radiating piece by heat-conducting glue.
Preferably, in above-mentioned lighting device, described column and described radiating piece are one-body molded.
Preferably, in above-mentioned lighting device, described light emitting diode is LED core, and it is fixed on the outer surface of described column and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described light emitting diode is the light emitting diode monomer, and itself and described wiring layer are electrically connected by welding manner.
Preferably, in above-mentioned lighting device, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned lighting device, described driving power module comprises power converting circuit and Drive and Control Circuit.
Preferably, in above-mentioned lighting device, described driving power module also comprises adjusting control circuit and circuit of power factor correction.
Preferably, in above-mentioned lighting device, further comprise being arranged on the inner or described column of described lamp housing to sensing circuit and the telecommunication circuit of outer surface.
Of the present invention also have a purpose to be to provide a kind of light emitting diode wick, and it is suitable for being assembled together to provide with lamp housing the lighting device of the good and low cost of manufacture of radiating effect.
Goal of the invention of the present invention can realize by following technical proposal:
A kind of light emitting diode wick comprises:
Printed substrate comprises insulating barrier and the wiring layer that is formed at the first and second surfaces of described insulating barrier;
At least one light emitting diode, it is arranged at the first surface of described insulating barrier and is electrically connected with described wiring layer; And
Be arranged at the driving governor of the second surface of described base material, it is electrically connected to provide required operating voltage or operating current to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
Preferably, in above-mentioned light emitting diode wick, described light emitting diode is LED core, and it is fixed on described first surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described light emitting diode is the light emitting diode monomer, and it is fixed on described first surface and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned light emitting diode wick, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned light emitting diode wick, described driving governor is the semiconductor wafer form, and it is fixed on described second surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described driving governor is the packaged chip form, and it is fixed on described second surface and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned light emitting diode wick, further comprise at least a in lower column circuits: sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction.
Preferably, in above-mentioned light emitting diode wick, at least a and described driving governor of described circuit is integrated in in semiconductor wafer or packaged chip.
Preferably, in above-mentioned light emitting diode wick, described circuit is the semiconductor wafer form, and it is fixed on described first or second surface and realize electrical connection by binding technique or FCOB (FCOB) technique with described wiring layer.
Preferably, in above-mentioned light emitting diode wick, described circuit is the packaged chip form, its be fixed on described first or second surface and with described wiring layer by welding procedure realize the electrical connection.
Of the present invention also have a purpose to be to provide a kind of light emitting diode that adopts as the lighting device of light source, and it has the advantage of the good and low cost of manufacture of radiating effect concurrently.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of light emitting diode that adopts comprises as the lighting device of light source:
Lamp housing comprises radiating piece;
Light emitting diode wick comprises:
Printed substrate comprises insulating barrier and the wiring layer that is formed at the first and second surfaces of described insulating barrier, and described insulating barrier and described radiating piece are fixed together to form the heat conduction between described base material and described radiating piece;
At least one light emitting diode, it is arranged at the first surface of described insulating barrier and is electrically connected with described wiring layer; And
Be arranged at the driving governor of the second surface of described insulating barrier, it is electrically connected to provide required operating voltage or operating current to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
Preferably, in above-mentioned lighting device, described insulating barrier is fixed in described radiating piece by the double coated film of heat-conducting glue or heat conduction.
Preferably, in above-mentioned lighting device, described radiating piece is made of metal, and described lamp housing also comprises lamp holder, and described radiating piece is connected with described lamp holder through insulating part.
Preferably, in above-mentioned lighting device, described radiating piece is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, described light emitting diode is LED core, and it is fixed on described first surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described light emitting diode is the light emitting diode monomer, and it is fixed on described first surface and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned lighting device, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned lighting device, described driving governor is the semiconductor wafer form, and it is fixed on described second surface and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described driving governor is the packaged chip form, and it is fixed on described second surface and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned lighting device, further comprise at least a in lower column circuits: sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction.
Preferably, in above-mentioned lighting device, at least a and described driving governor of described circuit is integrated in in semiconductor wafer or packaged chip.
Preferably, in above-mentioned lighting device, described circuit is the semiconductor wafer form, and it is fixed on described first or second surface and realize electrical connection by binding technique or FCOB (FCOB) technique with described wiring layer.
Preferably, in above-mentioned lighting device, described circuit is the packaged chip form, its be fixed on described first or second surface and with described wiring layer by welding procedure realize the electrical connection.
Of the present invention also have a purpose to be to provide a kind of light emitting diode wick, and it is suitable for being assembled together to provide with lamp housing the lighting device of the good and low cost of manufacture of radiating effect.
Goal of the invention of the present invention can realize by following technical proposal:
A kind of light emitting diode wick comprises:
Printed substrate comprises the first and second insulating barriers, the metal level between described the first and second insulating barriers and the wiring layer that is formed at described the first and second surface of insulating layer;
At least one light emitting diode, it is arranged at described the first surface of insulating layer and is electrically connected with described wiring layer; And
Be arranged at the driving governor of described the second surface of insulating layer, it is electrically connected to provide required operating current or operating voltage to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
Preferably, in above-mentioned light emitting diode wick, described light emitting diode is LED core, and it is fixed on described the first surface of insulating layer and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described light emitting diode is the light emitting diode monomer, and it is fixed on described the first surface of insulating layer and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned light emitting diode wick, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned light emitting diode wick, described driving governor is the semiconductor wafer form, and it is fixed on described the second surface of insulating layer and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described driving governor is the packaged chip form, and it is fixed on described the second surface of insulating layer and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned light emitting diode wick, further comprise at least a in lower column circuits: sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction.
Preferably, in above-mentioned light emitting diode wick, at least a and described driving governor of described circuit is integrated in in semiconductor wafer or packaged chip.
Preferably, in above-mentioned light emitting diode wick, described circuit is the semiconductor wafer form, and it is fixed on the described first or second surface of insulating layer and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned light emitting diode wick, described circuit is the packaged chip form, and it is fixed on the described first or second surface of insulating layer and realizes electrical connection with described wiring layer by welding procedure.
Of the present invention also have a purpose to be to provide a kind of light emitting diode that adopts as the lighting device of light source, and it has the advantage of the good and low cost of manufacture of radiating effect concurrently.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of light emitting diode that adopts comprises as the lighting device of light source:
Lamp housing comprises radiating piece;
Light emitting diode wick comprises:
Printed substrate, comprise the first and second insulating barriers, the metal level between described the first and second insulating barriers and the wiring layer that is formed at described the first and second surface of insulating layer, described metal level and described radiating piece are fixed together to form the heat conduction between described printed substrate and described radiating piece;
At least one light emitting diode, it is arranged at described the first surface of insulating layer and is electrically connected with described wiring layer; And
Be arranged at the driving governor of described the second surface of insulating layer, it is electrically connected to provide required operating voltage or operating current to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
Preferably, in above-mentioned lighting device, the edge of described metal level is fixed in described radiating piece by the double coated film of heat-conducting glue or heat conduction.
Preferably, in above-mentioned lighting device, described radiating piece is made of metal, and described lamp housing also comprises lamp holder, and described radiating piece is connected with described lamp holder through insulating part.
Preferably, in above-mentioned lighting device, described radiating piece is made of ceramic material or heat conductive insulating polymer composite.
Preferably, in above-mentioned lighting device, described light emitting diode is LED core, and it is fixed on described the first surface of insulating layer and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described light emitting diode is the light emitting diode monomer, and it is fixed on described the first surface of insulating layer and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned lighting device, described wiring layer makes a plurality of described light emitting diodes be connected with the form of series, parallel, series-parallel connection or crossed array.
Preferably, in above-mentioned lighting device, described driving governor is the semiconductor wafer form, and it is fixed on described the second surface of insulating layer and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described driving governor is the packaged chip form, and it is fixed on described the second surface of insulating layer and is electrically connected by welding manner with described wiring layer.
Preferably, in above-mentioned lighting device, further comprise at least a in lower column circuits: sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction.
Preferably, in above-mentioned lighting device, at least a and described driving governor of described circuit is integrated in in semiconductor wafer or packaged chip.
Preferably, in above-mentioned lighting device, described circuit is the semiconductor wafer form, and it is fixed on the described first or second surface of insulating layer and realizes electrical connection with described wiring layer by binding technique or FCOB (FCOB) technique.
Preferably, in above-mentioned lighting device, described circuit is the packaged chip form, and it is fixed on the described first or second surface of insulating layer and realizes electrical connection with described wiring layer by welding procedure.
In one embodiment of the invention; light emitting diode wick comprises and is arranged on light emitting diode, driving governor and other circuit (such as sensing circuit, adjusting control circuit, telecommunication circuit and circuit of power factor correction etc.) or an element (such as capacitor and inductance coil etc.) on the insulating heat-conductive substrate; the structure of this Highgrade integration is highly beneficial for large-scale production; can greatly reduce assembling and logistics cost in the light fixture manufacture process, and also save upgrade maintenance expense in the future.
In another embodiment of the present invention, light emitting diode is integrated on the insulating heat-conductive substrate with the die form of not encapsulation, and the insulating heat-conductive substrate is direct and radiating piece lamp housing links together, compare with the thermally conductive pathways of the metallic plate → radiator of the insulating heat-conduction material layer → aluminium base of the wiring layer → aluminium base of tube core → support → aluminium base, obviously reduced heat-transfer interface, thereby improved on the one hand the heat transfer efficiency of lighting device, also reduced on the other hand manufacturing cost.In addition, when being one-body molded, heat transfer efficiency is able to further improvement when insulating heat-conductive substrate and radiating piece.
In another embodiment of the present invention, the insulating heat-conductive substrate adopts ceramic material to make, and due between wiring layer and ceramic material, all have good binding ability between light emitting diode and ceramic material and wiring, so has improved reliability of structure.And the cheap price of ceramic material further promotes the reduction of cost.In addition, when adopting ceramic material as substrate, wiring layer can be starched sintering process by silver and make, the environmental pollution that this can be avoided the copper etching technics to cause.
In another embodiment of the present invention, light emitting diode is set directly at the outer surface of the insulating heat-conductive part of lamp housing, therefore need not the heat dissipation problem that extra radiator can effectively solve light emitting diode, this has greatly reduced material cost and manufacturing cost.
In another embodiment of the present invention, adopt along the lamp housing longitudinal axis and extend and carry light emitting diode by the column that insulating heat-conduction material consists of, thereby can form the emitting space angle of spending near 360, thereby satisfy special application demand.
Description of drawings
Above-mentioned and/or other side of the present invention and advantage will become more clear and be more readily understood by the description below in conjunction with the various aspects of accompanying drawing, and in accompanying drawing, same or analogous unit adopts identical label to represent, accompanying drawing comprises:
Fig. 1 is that it shows the structure of lamp housing according to the employing light emitting diode of the first embodiment of the invention schematic diagram as the lighting device of light source.
Fig. 2 is the decomposing schematic representation of lighting device shown in Figure 1.
Fig. 3 is according to the employing light emitting diode of the second embodiment of the invention schematic diagram as the lighting device of light source.
Fig. 4 is according to the employing light emitting diode of the third embodiment of the invention schematic diagram as the lighting device of light source.
Fig. 5 is according to the employing light emitting diode of the fourth embodiment of the invention schematic diagram as the lighting device of light source.
Fig. 6 is according to the employing light emitting diode of the fifth embodiment of the invention schematic diagram as the lighting device of light source.
Fig. 7 A and 7B are the schematic diagram according to the light emitting diode wick of sixth embodiment of the invention, and wherein, Fig. 7 A is one of them surperficial view of light emitting diode wick, and Fig. 7 B is another surperficial view of light emitting diode wick.
Fig. 8 is the schematic diagram that can be applicable to the substrate that comprises the metal core of the embodiment of the present invention.
Fig. 9 is the schematic diagram that can be applicable to the substrate that comprises the insulating materials core of the embodiment of the present invention.
Figure 10 is the schematic diagram according to the light emitting diode wick of seventh embodiment of the invention.
Figure 11 is according to the employing light emitting diode of the eighth embodiment of the invention decomposing schematic representation as the lighting device of light source.
Figure 12 is according to the employing light emitting diode of the ninth embodiment of the invention decomposing schematic representation as the lighting device of light source.
The specific embodiment
Below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention, the present invention is described more all sidedly.But the present invention can realize by multi-form, not only limit to and should not be read as each embodiment that this paper provides.The various embodiments described above that provide are intended to make the disclosure of this paper comprehensively complete, thereby make the understanding of protection domain of the present invention more comprehensive and accurate.
In this manual, term " lighting device " should be broadly interpreted as all can by providing light to realize the equipment of practical or aesthstic effect, include but not limited to desk lamp, wall lamp, shot-light, pendent lamp, lamp affixed to the ceiling, street lamp, flashlight, scenery lamp and urban look lamp etc.
Term " lamp housing " should be broadly interpreted as a kind of physical arrangement for carrying or hold light source, and light source for example can be arranged in the sealing fully or semi-enclosed space of being surrounded by the lamp housing housing, also can be arranged on outer surface or the inner surface of lamp housing.
Unless stated otherwise, in this manual, term " semiconductor crystal wafer " refers at the upper a plurality of independently single circuit that form of semi-conducting material (such as silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical arrangement of semiconductor wafer through forming after encapsulating, in typical this physical arrangement, semiconductor wafer for example is installed on support and with encapsulant and encapsulates.
Term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
P-N knot inorganic semiconductor light emitting diode can have different version, for example includes but not limited to LED core and light emitting diode monomer.Wherein, " LED core " refers to and includes the semiconductor wafer P-N structure, that have the electroluminescent ability, and " light emitting diode monomer " refers to the physical arrangement that will form after die package, in typical this physical arrangement, tube core for example is installed on support and with encapsulant and encapsulates.
Term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern that is electrically connected between components and parts in being used for of arranging on insulating surface, and include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated through-hole etc.).
Term " heat conduction " refers to heat and be sent to the transfer mode of the lower part of temperature from the higher part of temperature in solid.In the present invention, the heat that light emitting diode produces can mainly be sent to lamp housing with heat exchange pattern, and and then is sent to the outside (such as in modes such as heat conduction, convection current and heat radiations) of lighting device.
Term " ceramic material " general reference needs high-temperature process or densified non-metal inorganic material, includes but not limited to silicate, oxide, carbide, nitride, sulfide, boride etc.
Term " heat conductive insulating polymer composite " refers to such macromolecular material, by metal or inorganic filler section's formation within it heat conduction network chain of filling high-termal conductivity, thereby possesses high thermal conductivity factor.Heat conductive insulating polymer composite such as the polypropylene material that includes but not limited to add aluminium oxide, the Merlon that adds aluminium oxide, carborundum and bismuth oxide and acrylonitrile-butadiene-styrene terpolymer etc.The specific descriptions of relevant heat conductive insulating polymer composite can be referring to paper " research of Merlon and polycarbonate alloy heat conductive insulating macromolecular material " (" material heat treatment journal " in August, 2007 of the people such as Li Li, Vol.28, No.4, pp51-54) and paper " application of aluminium oxide in the heat conductive insulating polymer composite " (" plastic additive " the 3rd phase in 2008 of the people such as Li Bing, pp14-16), the mode quoted in full of these documents comprises in this manual.
" electrical connection " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, perhaps indirectly transmits the situation of electric flux or the signal of telecommunication through one or more Unit the 3rd.
" driving power " or " LED driving power " refers to the interchange (AC) that is connected to the lighting device outside or direct current (DC) power supply and as " electronic-controlled installation " between the light emitting diode of light source, is used to light emitting diode that required curtage (such as constant current, constant voltage or firm power etc.) is provided.
Term such as " comprising " and " comprising " represent except have have in specification and claims directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had not by directly or other unit of clearly explaining and the situation of step.
Term such as " first " and " second " does not represent that the unit is only to be used as to distinguish each unit in the order of the aspects such as time, space, size.
Below by accompanying drawing, embodiments of the invention are described.
The first embodiment
Fig. 1 is that it shows the structure of lamp housing according to the employing light emitting diode of the first embodiment of the invention schematic diagram as the lighting device of light source.
As shown in Figure 1, the lamp housing 1 according to the lighting device of the present embodiment comprises lamp holder 110, radiating piece 120 (parts that are bowl cup-shaped in Fig. 1) and lampshade 130.In the present embodiment, lamp holder 110 can employing and ordinary incandescent lamp and the similar shape of threads of electricity-saving lamp revolve interface shape, thereby for lighting device provides electrical connection with external power source (for example 220 volts of AC powers), but also can adopt other form such as rotary bayonet; Radiating piece 120 is arranged between lamp holder 110 and lampshade 130, it can adopt various insulating radiation materials to make, such as ceramic material or heat conductive insulating polymer composite etc., it is used on the one hand carrying or holds light source and various functional circuit, also plays a part on the other hand the heat that light source and functional circuit produce is delivered to the lamp housing outside; Lampshade 130 adopts light transmissive materials to make, mainly for the protection of light source and functional circuit and make light softer, more equably to space divergence.
It is worthy of note, make radiating piece although adopt insulating heat-conduction material here, but it is also feasible adopting metal material, can set up insulating element (such as pottery or plastics etc.) between lamp holder 110 and radiating piece 120 this moment so that electric insulation between them.
Fig. 2 is the decomposing schematic representation of lighting device shown in Figure 1.The lamp housing 1 of lighting device comprises lamp holder 110, radiating piece 120 and lampshade 130.As shown in Figure 2, be provided with in the inner chamber of radiating piece 120 perpendicular to lamp housing longitudinal axis and substrate 20 that the lamp housing inner space is separated, this substrate also is made of insulating heat-conduction material (such as ceramic material or heat conductive insulating polymer composite etc.), itself and radiating piece 120 can be integrated, and perhaps its periphery also can be fixed together by the double coated film of heat-conducting glue, heat conduction or the notch and the radiating piece 120 that are opened in radiating piece 120 inner surfaces in when assembling.Preferably, can adopt the mould pressing to make the substrate that ceramic material consists of, substrate thicker (for example 1.5-3mm) and hardness that this method is made are high.
Light emitting diode monomer 30 is arranged on substrate 20.Referring to Fig. 2, be formed with wiring 202 (for example forming wiring layer by the silver of sintering on ceramic material slurry pattern) by printed circuit technique on surperficial 201A, it is divided into two sections cablings, every section with one of them electrode welding of light emitting diode monomer 30 together.Every section cabling comprises an exit, represents with label 202A and 202B respectively.The end of wire 203A is connected to exit 202A, the other end passes through through hole 204A and is connected to the driving power module (not shown) that is arranged in the lamp housing inner space, or is connected to the driving power module that is arranged on substrate 20 surfaces (for example one side identical or relative with surperficial 201A); Equally, the end of wire 203B is connected to exit 202B, the other end passes through through hole 204B and is connected to the driving power module that is arranged in the lamp housing inner space, or be connected to and be arranged on the lip-deep driving power module of substrate 20, thus, realized electrical connection between light emitting diode monomer 30 and driving power module.In order to guarantee that wire 203A and 203B and wiring 202 have good conduction, implement welding at the periphery that wire 203A and 203B and exit 202A contact with 202B.
In order to form better heat conduction between LED monomer 30 and substrate 20, can LED monomer 30 be sticked on the surperficial 201A of substrate 20 by adhesive (for example epoxy resin or silica gel).If need to adjust the wavelength of light, can be in epoxy resin or silica gel mixed fluorescent powder, perhaps relend after LED monomer 30 surfaces apply fluorescence coatings and help adhesive that LED monomer 30 is adhered on the surperficial 201A of substrate 20.
Embodiment shown in Figure 2 also can comprise the driving power (not shown).The driving power of the present embodiment comprises power converting circuit and drive circuit, wherein power converting circuit is transformed to low-voltage DC with High Level AC Voltage (for example 100-220 volt alternating current), and drive circuit utilizes low-voltage DC to provide suitable curtage (for example constant voltage, constant current or firm power) to light emitting diode.
Can adopt according to the practical application needs suitable step-down mode in power converting circuit, such as including but not limited to resistance and capacitance decompression, resistance step-down, conventional transformer step-down, electronic transformer step-down, RCC step-down mode switch power supply, PWM control mode Switching Power Supply etc.In addition, drive circuit can adopt multiple type of drive, modes such as constant voltage power supply, constant current-supplying and constant pressure and flow power supply.
Alternatively, driving power can also comprise the control circuit of realizing luminous flux and the functions such as photochromic regulation and control system, PFC and time switch and realize that overvoltage protection, overtemperature protection, short-circuit protection, output open circuit protection, low pressure latch, suppress the holding circuit of electromagnetic interference, conducted noise, antistatic, anti-lightning strike, Anti-surging, anti-harmonic oscillation etc.
Alternatively, driving power can adopt physically independently that the form of circuit module (being for example independently parts by plastic packaging) realizes, in this circuit module is arranged at that radiating piece 120 surrounds lamp housing inner space and with 30 electrical connections of light emitting diode monomer together.
it is to be noted, although Fig. 2 only illustrates the electrical connection between wiring 202 and light emitting diode monomer 30, but alternatively, can also utilize substrate 20 as printed substrate, form certain wiring pattern or wiring layer on its surface and by wiring layer with various components and parts (microcontroller chip for example, resistor, capacitor, radio-frequency signal transceiver, temperature sensor, light intensity sensor and signal modulator/demodulator etc.) electricity piece couples together, thereby form the circuit that to realize various functions, the function here for example includes but not limited to power conversion, drive and control, the illumination Based Intelligent Control, communication, ambient condition sensing and light modulation etc.For this purpose, can utilize printed circuit technique to form suitable wiring pattern on one or two surface of substrate 20 as making printed circuit board (PCB), then corresponding components and parts be installed from the teeth outwards.The advantage of this mode is greatly to have improved integrated level, has reduced manufacturing cost, and is conducive to assembling and the maintenance of LED lamp.
It is worthy of note, although in the embodiment shown in Figure 2, light emitting diode illustrates with the form of light emitting diode monomer 30, also can adopt die form.Under rear a kind of situation, can utilize the binding machine, in the mode (also namely binding technique) of spun gold or filamentary silver, B alloy wire welding, LED core is directly connected in wiring 202.More preferably utilizing onboard, flip-chip (FCOB) technique is electrically connected LED core and wiring.
Adopt single light emitting diode as the layout of light source although only illustrate in the embodiment shown in Figure 2, the present invention can be applicable to adopt the layout of a plurality of light emitting diodes equally.
The second embodiment
Fig. 3 is that it adopts a plurality of light emitting diodes as the layout of light source according to the employing light emitting diode of the second embodiment of the invention schematic diagram as the lighting device of light source.For simplicity, Fig. 3 only illustrates the parts such as the radiating piece that is made of insulating heat-conduction material or metal material and substrate.
As shown in Figure 3, also be provided with perpendicular to its axial substrate 20 in the inner chamber of radiating piece 120 (parts that are bowl cup-shaped in Fig. 3), this substrate is also can be with radiating piece 120 one-body molded or be fixed together by adhesive or notch.The main difference part of the present embodiment and previous embodiment is, is provided with a plurality of LED monomers 30 that are connected in series here on the surface of substrate 20.
Particularly, referring to Fig. 3, five LED monomers 30 are adhered on the surperficial 201A of this substrate 20 by transparent epoxy resin or silica gel.Wiring 202 is divided into the multistage cabling, is connected in series successively by its each LED monomer 30.In addition, central authorities at substrate 20 offer through hole 204, two exit 202A and the 202B of wiring 202 are arranged near through hole 204, wherein, the end of wire 203A is soldered to exit 202A, and the other end passes through through hole 204 and is arranged in the lamp housing inner space or is arranged on driving power module electrical connection on substrate 20 another sides; Equally, the end of wire 203B is soldered to exit 202B, and the other end passes through through hole 204 and is arranged in the lamp housing inner space or is arranged on the lip-deep driving power module electrical connection of substrate 20.
It is to be noted, although in the embodiment shown in fig. 3, access again driving power module or circuit after the LED monomer is connected in series, but a plurality of LED monomers also can adopt other connected mode, such as in parallel, string also, the connected modes such as series-parallel connection or crossed array.
The 3rd embodiment
Fig. 4 is according to the employing light emitting diode of the third embodiment of the invention schematic diagram as the lighting device of light source.
As shown in Figure 4, the lamp housing 1 according to the lighting device of the present embodiment also comprises lamp holder 110, radiating piece 120 and lampshade (not shown).The heat spreader structure that the difference of the present embodiment and above-mentioned Fig. 1-3 illustrated embodiment mainly is to carry light source and various functional circuits below is further described this.
In lamp housing inside, a column 40 is set, this column 40 extends and also is made of insulating heat-conduction material along the longitudinal axis of lamp housing, it can be one-body molded with radiating piece 120, perhaps comprise as shown in Figure 4 a support plinth 401, support plinth 401 and radiating piece 120 are fixed together by the double coated film of heat-conducting glue, heat conduction or the notch that is opened in radiating piece 120 inner surfaces in when assembling.Cavity can be offered in the inside of column 40, and its cross section can be various shapes, such as including but not limited to polygon, circle and oval etc.
In the embodiment shown in fig. 4, a plurality of LED monomers 30 for example are adhered on the outer surface of column 40 by transparent epoxy resin or silica gel.On the other hand, also be formed with wiring 202 (for example forming wiring layer by the silver of sintering on ceramic material slurry pattern) by printed circuit technique on column 40 outer surfaces, it is divided into the multistage cabling so that the mode of light emitting diode monomer 30 with series, parallel, series-parallel connection or crossed array coupled together.Referring to Fig. 4, through hole 204 is offered at the top of column 40, and the end of wire 203A and 203B is welded on the exit of wiring 202, and the other end passes through through hole 204 and driving power electrical connection.
Not shown driving power to light emitting diode power supply in the embodiment shown in fig. 4.Alternatively, driving power can adopt physically independently that the form of circuit module (being for example independently parts by plastic packaging) realizes, this circuit module be arranged in the cavity of lamp housing inner space or column 40 and with 30 electrical connections of light emitting diode monomer together.
alternatively, can also utilize bearing plate 401 as printed substrate, form certain wiring pattern or wiring layer on its one or two surface and by wiring layer with various components and parts (microcontroller chip for example, resistor, capacitor, radio-frequency signal transceiver, temperature sensor, light intensity sensor and signal modulator/demodulator etc.) electricity piece couples together, thereby form the circuit that to realize various functions, the function here for example includes but not limited to power conversion, drive and control, the illumination Based Intelligent Control, communication, ambient condition sensing and light modulation etc.For this purpose, can utilize printed circuit technique to form suitable wiring pattern on one or two surface of bearing plate 401 as making printed circuit board (PCB), then corresponding components and parts be installed from the teeth outwards.This will improve integrated level greatly, reduce manufacturing cost, and be conducive to assembling and the maintenance of LED lamp.
In addition, in the present embodiment, can be evenly distributed in the outer surface of column due to light emitting diode, therefore can realize the all-directional illumination of approximate 360 degree, and illuminating ray be more all even soft.
The 4th embodiment
Fig. 5 is according to the employing light emitting diode of the fourth embodiment of the invention schematic diagram as the lighting device of light source.In the present embodiment, lighting device presents with the form of shot-light.
As shown in Figure 5, the lamp housing 1 according to the lighting device of the present embodiment comprises lamp holder 110, radiating piece 120 and lampshade 130.Radiating piece 120 is arranged between lamp holder 110 and lampshade 130 and also is provided with in its inner chamber perpendicular to its axial substrate 20, this substrate also is made of insulating heat-conduction material, itself and radiating piece 120 is one-body molded or be fixed together by the double coated film of heat-conducting glue, heat conduction or the notch and the radiating piece 120 that are opened in radiating piece 120 inner surfaces.
It is worthy of note, radiating piece can adopt insulating heat-conduction material or metal material to make, and when adopting metal material, can set up insulating element (such as pottery or plastics etc.) between lamp holder 110 and radiating piece 120 so that electric insulation between them.
Referring to Fig. 5, three LED monomers 30 are adhered on the surperficial 201A of this substrate 20 by transparent epoxy resin or silica gel.Wiring 202 is divided into the multistage cabling, is connected in series successively by its a plurality of LED monomers 30.In addition, offer through hole 204 in the central authorities of substrate 20, two exit 202A and the 202B of wiring 202 are arranged near through hole 204, and wherein, the end of wire 203A is soldered to exit 202A, and the other end passes through through hole 204 and driving power electrical connection; Equally, the end of wire 203B is soldered to exit 202B, and the other end passes through through hole 204 and driving power electrical connection.
In the present embodiment, driving power can adopt physically independently that the form of circuit module (being for example independently parts by plastic packaging) realizes, in this circuit module is arranged at that radiating piece 120 surrounds lamp housing inner space and with 30 electrical connections of light emitting diode monomer together.For typical shot-light, its generally with dc low-voltage as external power source.Therefore in the present embodiment, power converting circuit can save, and utilizes the low-voltage direct of external power source output to provide constant curtage to light emitting diode external power source by drive circuit.Alternatively, light adjusting circuit and correcting power factors circuit also can be integrated in driving power.
Except with above-mentioned physically independently the form of circuit module provide driving power, also can be with substrate 20 as printed substrate, (for example surface relative with surperficial 201A) is upper on its surface forms wiring layer and the components and parts of driving power is arranged on the surface.
The 5th embodiment
Fig. 6 is for to also have the employing light emitting diode of an embodiment as the schematic diagram of the lighting device of light source according to the present invention.
As shown in Figure 6, lamp housing 1 according to the lighting device of the present embodiment comprises lamp holder 110, by radiating piece 120 and cover plate 140 that insulating heat-conduction material (such as ceramic material and heat conductive insulating polymer composite etc.) consists of, the effects such as the inner chamber that its cover plate 140 is used for sealing lamp housing 1 is dustproof to play, blocks moisture.This lighting system without lampshade relatively is suitable for the outdoor illumination applications occasions such as Landscape Lighting, street lamp.
Referring to Fig. 6, a plurality of LED monomers 30 for example are adhered on the outer surface of radiating piece 120 by transparent epoxy resin or silica gel.On the other hand, also be formed with wiring 202 (for example forming wiring layers by sintering silver slurry pattern on ceramic material) by printed circuit technique on the outer surface of radiating piece 120, it is divided into the multistage cabling light emitting diode monomer 30 is coupled together in the mode of series, parallel, series-parallel connection or crossed array and be connected to the driving power that is arranged on radiating piece 120 inside through wire 203.
In the present embodiment, driving power can adopt physically independently that the form of circuit module (being for example independently parts by plastic packaging) realizes, this circuit module be arranged in the lamp housing inner space and with 30 electrical connections of light emitting diode monomer together.
In the present embodiment, be evenly distributed in the outer surface of radiating piece 120 due to light emitting diode, therefore can realize the all-directional illumination of 360 degree.In addition, light emitting diode can also be by thermal-radiating mode directly to outside function of environment heat emission except the lamp housing part that transfers heat to the heat-conducting insulation material formation by heat exchange pattern.
The 6th embodiment
Fig. 7 A and 7B are the schematic diagram according to the light emitting diode wick of sixth embodiment of the invention, and wherein, Fig. 7 A is one of them surperficial view of light emitting diode wick, and Fig. 7 B is another surperficial view of light emitting diode wick.
Light emitting diode wick 2 according to the present embodiment comprises substrate 20, a plurality of light emitting diode 30 and driving power 50.
Substrate 20 adopts insulating heat-conduction material (such as ceramic material or heat conductive insulating polymer composite etc.) to make.Referring to Fig. 7 A, be formed with wiring (for example forming wiring layer by the silver of sintering on ceramic material slurry pattern) on one of them surperficial 201A of substrate 20, therefore in the present embodiment, substrate 20 is equivalent to printed substrate on the one hand, for light emitting diode 30 and driving power 50 provide support platform and electrical connection, it also plays a part to be sent to the heat that light emitting diode 30 and driving power 50 produce outside on the other hand.Preferably, can adopt the mould pressing to make the substrate that ceramic material consists of, substrate thicker (for example 1.5-3mm) and hardness that this method is made are high.
It is to be noted, although above-described substrate 20 is made by the insulating heat-conduction material such as pottery and heat conductive insulating polymer composite, also can adopt the metal core printed circuit board (PCB) (MCPCB) (such as aluminium base) that comprises metal-based layer and the substrate that comprises the insulating materials core (such as paper base plate, glass fabric substrate and with glass fabric as the composite base plate of surperficial reinforcing material etc.) make substrate.
Fig. 8 is the schematic diagram that can be applicable to the substrate that comprises metal-based layer of the embodiment of the present invention.
Referring to Fig. 8, substrate 20 with sandwich construction comprises the first insulating barrier 207A, metal-based layer 208 and the second insulating barrier 207B that stacks gradually, wherein, the first and second insulating barrier 207A, 207B are made of the low thermal resistance heat-conducting insulation material, for example select the particular polymer of filling with special cermacis, this material has that thermal resistance is little, viscoelastic property is good and can bear the premium properties such as machinery and thermal stress, is suitable for being adhered on metal-based layer 208.Metal-based layer 208 can adopt the good metal of thermal conductivity (for example aluminium, copper, iron and comprise the alloy of at least two kinds of these metals) to make.
Referring to Fig. 8, can form wiring 202 by printed circuit technique at the first and second insulating barrier 207A and 207B surface, thereby on the one hand provide electrical connection for light emitting diode 30 and driving power 50, the heat that on the other hand light emitting diode 30 and driving power 50 is produced is sent to metal-based layer 208 efficiently, then by metal-based layer 208, heat is sent to beyond substrate 20 efficiently., can the edge of metal-based layer 208 and the radiating piece of lighting device be bonded together with adhesive for this reason, thus dissipation of heat is outside to lighting device.
Heat dissipation problem less when LED power or lighting device is not when giving prominence to very much, and substrate 20 also can adopt the printed circuit board (PCB) that comprises the insulating materials core.Fig. 9 is the schematic diagram that can be applicable to the substrate that comprises the insulating materials core of the embodiment of the present invention.Referring to Fig. 9, substrate 20 comprises insulating substrate 207, and two surface can form wiring 202 by printed circuit technique, thereby provides electrical connection for light emitting diode 30 and driving power 50.
In the present embodiment, light emitting diode 30 adopts die form, and they are upper to form heat conduction preferably between LED unit 30 and substrate 20 by the surperficial 201A that the adhesion mode is arranged on substrate 20.On the other hand, wiring includes a plurality of pad 202C, light emitting diode 30 is connected directly to pad 202C to form the light emitting diode group of series connection by lead-in wire 206 (for example spun gold, filamentary silver or B alloy wires), the light emitting diode 30 at this light emitting diode group two ends is by 206 cabling 202D and the 202E that are connected to wiring that go between, and cabling 202D and 202E the wire 203A through passing through through hole 204 and 203B are connected to the driving power 50 that is positioned on substrate 20 another sides.In the present embodiment, can utilize binding technique to realize that LED core is through the connection of lead-in wire to wiring.
If need to adjust the emission wavelength of light emitting diode 30, can light emitting diode 30 be sticked on surperficial 201A with epoxy resin or the silica gel of mixed fluorescent powder, perhaps apply fluorescence coating on the surface of light emitting diode 30, then it is adhered on surperficial 201A by epoxy resin or silica gel.
Referring to Fig. 7 B, be provided with driving power 50 on another surperficial 201B of substrate 20.According to the mode of externally fed, driving power can adopt the circuit of various topological structures, such as including but not limited to non-isolated buck-type topological circuit structure, reverse exciting topological circuit structure and half-bridge LLC topological circuit structure etc.Can be referring to " LED illumination driving power source and Design of Luminaires " book of the 1st edition in People's Telecon Publishing House 201A1 May about the detailed description of driving power circuit, this publication way of reference in full comprises in this manual.
Driving power can multiple type of drive (modes such as constant voltage power supply, constant current-supplying and constant pressure and flow power supply) provide suitable curtage to light emitting diode 30, and it can be comprised of one or more independently parts.In the present embodiment, the one or more parts in driving power realize with the form of wafer or packaged chip, below the parts of realizing with the form of wafer or packaged chip in driving power are called " driving governor ".
Alternatively, the circuit of all right other function of integration realization in driving power 50, such as adjusting control circuit, sensing circuit, circuit of power factor correction, intelligent lighting control circuit, telecommunication circuit and holding circuit etc.These circuit can be integrated in in semiconductor wafer or packaged chip with driving governor, perhaps these circuit can be individually provide with the form of semiconductor wafer or packaged chip, and perhaps some or all in these circuit can be combined and provide with the form of semiconductor wafer or packaged chip.
as shown in Fig. 7 B, external power source is through binding post 510A and 510B access rectification circuit 520 (here the form with integrated circuit encapsulation chip realizes), and drive circuit 530 (is here realized with the form of integrated circuit encapsulation chip, can be for example the LED driver MAX16820 that U.S. letter (Maxim) integrated products company makes, the inverse-excitation type driver SSL series that grace intelligence Pu (NXP) semiconductor company makes is controlled IC, the HB LED driver MXHV9910 that Clare company makes, the LED driver NCP1351 that ON company makes, the LED driver ACT355A that Active semiconductor company makes etc.) through connect up 202 with rectification circuit 520 electrical connections.Driver 530 is also through connecting up 202 with capacitor 540A and 540B and realizing that the circuit (here take wireless communication transceiver chip 550 as example) of other function is electrically connected.Referring to Fig. 7 B, the output of driving power 50 through passing through through hole 204 wire 203A and 203B and be positioned at light emitting diode 30 electrical connection on substrate surface 201A.
In the present embodiment, driving governor and the circuit of realizing other function for the packaged chip form, for example can utilize welding procedure that it is directly connected in the wiring 202 of surperficial 201B, and for the driving governor of wafer form with realize the circuit of other function, for example can utilize binding technique or onboard flip-chip (FCOB) technique it is directly connected in the wiring 202 of surperficial 201B.In addition, alternatively, also can adopt the power conversion components and parts with rectification circuit 520 and so on be arranged on wick 2 outsides or be integrated in a structure in packaged chip with driver.
It is worthy of note, although in the present embodiment, utilize binding technique that the light emitting diode 30 of die form is directly connected in wiring 202.But also can utilizing onboard, flip-chip (FCOB) technique is electrically connected LED core and wiring.In addition, although in the present embodiment, light emitting diode 30 links together with series system, also can be in parallel, the form of series-parallel connection or crossed array links together.
Although also it is pointed out that in the present embodiment, light emitting diode 30 and driving power 50 are arranged on substrate 20 different surface, and they also can be arranged on same surface.
The 7th embodiment
Figure 10 is the schematic diagram according to the light emitting diode wick of seventh embodiment of the invention.
Compare with the embodiment shown in 9 by Fig. 7 A, 7B, 8 with above-mentioned, the main difference part of the present embodiment is the form of light emitting diode 30, and therefore the view of the substrate surface that light emitting diode is set only is shown here.
Referring to Figure 10, form wiring 202 on the surperficial 201A of substrate 20, thereby adopt the light emitting diode 30 of packaged chip form be welded in wiring 202 and form the heat conduction between substrate 20.In order to add heat-flash conduction, for example can also LED unit 30 be bonded on surperficial 201A with adhesive.In Figure 10, wiring 202 is divided into multistage so that a plurality of LED monomers 30 are connected in series successively.In addition, offer through hole 204 in the central authorities of substrate 20, wiring 202 is electrically connected to the driving governor of another the lip-deep driving power that is arranged at substrate 20 by the wire 203A that passes through through hole 204 and 203B.
The 8th embodiment
Figure 11 is according to the employing light emitting diode of the eighth embodiment of the invention decomposing schematic representation as the lighting device of light source.
As shown in figure 11, the lighting device according to the present embodiment comprises lamp housing 1 and is arranged on the interior light emitting diode wick 2 of lamp housing 1.
Lamp housing 1 comprises lamp holder 110, radiating piece 120 (parts that are bowl cup-shaped in Figure 11) and lampshade 130.In the present embodiment, lamp holder 110 can employing and ordinary incandescent lamp and the similar shape of threads of electricity-saving lamp revolve interface shape, thereby for lighting device provides electrical connection with external power source (for example 220 volts of AC powers), but also can adopt other form such as rotary bayonet.Radiating piece 120 is arranged between lamp holder 110 and lampshade 130, it can adopt various insulating heat-conduction materials to make, such as ceramic material or heat conductive insulating polymer composite etc., it is used for holding light emitting diode wick 2 on the one hand, also plays a part on the other hand the heat that light emitting diode and driving power produce is delivered to the lamp housing outside.As shown in figure 11, a plurality of ribs along the lamp housing longitudinal extension are set to increase area of dissipation on the inwall of radiating piece 120, because radiating piece 120 is made by insulating heat-conduction material, thereby so rib can contact with the components and parts of driving power the increase heat-conducting area.Lampshade 130 adopts light transmissive materials to make, mainly for the protection of light source and functional circuit and make light softer, more equably to space divergence.
It is worthy of note, make radiating piece although adopt insulating heat-conduction material here, but it is also feasible adopting metal material, can set up insulating element (such as pottery or plastics etc.) between lamp holder 110 and radiating piece 120 this moment so that electric insulation between them.
In the present embodiment, wick 2 can adopt top structure by the described embodiment of Fig. 7-10.Referring to Figure 11, light emitting diode wick 2 comprises the light emitting diode 30 of substrate 20, a plurality of employing die form that are arranged on substrate one of them surface and is arranged on another surperficial driving power of substrate.
Substrate 20 is made of insulating heat-conduction material (such as ceramic material or heat conductive insulating polymer composite etc.), its periphery can be fixed together by the double coated film of heat-conducting glue, heat conduction or the notch and the radiating piece 120 that are opened in radiating piece 120 inner surfaces in when assembling, the heat that light emitting diode wick 2 is produced is passed to radiating piece 120 preferably, and and then is dispersed into surrounding environment.Preferably, can adopt the mould pressing to make the substrate that ceramic material consists of, substrate thicker (for example 1.5-3mm) and hardness that this method is made are high.
It is to be noted, although above-described substrate 20 is made by the insulating heat-conduction material such as pottery and heat conductive insulating polymer composite, also can adopt the metal core printed circuit board (PCB) (MCPCB) (such as aluminium base) that comprises metal-based layer and the printed circuit board (PCB) that comprises the insulating materials core (such as paper base plate, glass fabric substrate and with glass fabric as the composite base plate of surperficial reinforcing material etc.) make substrate.
The same with the 7B illustrated embodiment with Fig. 7 A, a plurality of light emitting diodes that are arranged on substrate surface are arranged on the surface of substrate to form heat conduction preferably between LED unit and substrate by the adhesion mode.On the other hand, light emitting diode can by binding technique be connected to wiring (for example by forming wiring layer at sintering silver slurry pattern on ceramic material) upper and thus with the driving power electrical connection that is arranged on another side.If need to adjust the emission wavelength of light emitting diode, can light emitting diode be adhered to from the teeth outwards with epoxy resin or the silica gel of mixed fluorescent powder, perhaps apply fluorescence coating on the surface of light emitting diode, then it is adhered on the surface by epoxy resin or silica gel.
In the present embodiment, driving power can adopt structure and the principle of describing in by Fig. 7 A, 7B, 8 and 9 described embodiment, repeat no more herein.
Equally, alternatively, the circuit (such as adjusting control circuit, sensing circuit, circuit of power factor correction, intelligent lighting control circuit, telecommunication circuit and holding circuit etc.) of all right other function of integration realization in driving power.These circuit can be integrated in in semiconductor wafer or packaged chip with driving governor, perhaps these circuit can be individually provide with the form of semiconductor wafer or packaged chip, and perhaps some or all in these circuit can be combined and provide with the form of semiconductor wafer or packaged chip.
Equally, in the present embodiment, driving governor and the circuit of realizing other function for the wafer form, for example can utilize the binding technique or onboard flip-chip (FCOB) technique it is directly connected in the wiring of substrate surface, and for the driving governor of packaged chip form with realize the circuit of other function, for example can utilize welding procedure that it is directly connected in the wiring of substrate surface.In addition, alternatively, also can adopt the structure that the power conversion components and parts of rectification circuit and so on is arranged on wick 2 outsides (for example in lamp housing 1), also can adopt the structure of saving rectification circuit when perhaps externally power supply provides DC voltage.
It is worthy of note, although in the present embodiment, utilize binding technique that the light emitting diode of die form is directly connected in wiring.But also can utilizing onboard, flip-chip (FCOB) technique is electrically connected LED core and wiring.In addition, although in the present embodiment, light emitting diode 30 links together with series system, also can be in parallel, the form of series-parallel connection or crossed array links together.
Although also it is pointed out that in the present embodiment, light emitting diode and driving power are arranged on substrate 20 different surface, and they also can be arranged on same surface.
The 9th embodiment
Figure 12 is according to the employing light emitting diode of the ninth embodiment of the invention decomposing schematic representation as the lighting device of light source.
The present embodiment and main difference part embodiment illustrated in fig. 11 are, the radiating piece 120 of lamp housing 1 adopts metal materials to make, and sets up insulating element 150 (such as pottery or plastics etc.) between lamp holder 110 and radiating piece 120 so that electric insulation between them for this reason.
As shown in figure 12, the lighting device according to the present embodiment comprises lamp housing 1 and is arranged on the interior light emitting diode wick 2 of lamp housing 1.Lamp housing 1 comprise lamp holder 110, radiating piece 120 (parts that are bowl cup-shaped in Figure 12), lampshade 130 and be arranged on lamp holder 110 and radiating piece 120 between insulating element 150.In the present embodiment, in order to improve radiating effect, a plurality of fins are set with increasing heat radiation area on the outer surface of radiating piece 120.In addition, thereby make radiating piece 120 charged for the circuit that prevents wick 2 contacts with radiating piece 120, the components and parts on substrate 20 and wiring should keep enough gap with substrate edges.
Lamp holder 110 can employing and ordinary incandescent lamp and the similar shape of threads of electricity-saving lamp revolve interface shape, thereby for lighting device provides electrical connection with external power source (for example 220 volts of AC powers), but also can adopt other form such as rotary bayonet; Radiating piece 120 is arranged between lamp holder 110 and lampshade 130, it can adopt various insulating radiation materials to make, such as ceramic material or heat conductive insulating polymer composite etc., it is used for holding light emitting diode wick 2 on the one hand, also plays a part on the other hand the heat that light emitting diode and driving power produce is delivered to the lamp housing outside; Lampshade 130 adopts light transmissive materials to make, mainly for the protection of light source and functional circuit and make light softer, more equably to space divergence.
In the present embodiment, wick 2 can adopt structure and the principle of describing in by the described embodiment in Fig. 7-10, repeat no more herein.
Although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that and can change aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, so scope of the present invention will be limited by claim and the content that is equal to.

Claims (10)

1. a light emitting diode wick, is characterized in that, comprising:
The insulating heat-conductive substrate;
At least one light emitting diode, its first surface that is arranged at described substrate with and described substrate between form the heat conduction; And
Be arranged at the driving governor of the second surface of described substrate, itself and described at least one light emitting diode are electrically connected to provide required operating current or operating voltage to described at least one light emitting diode, wherein, described the first and second surfaces are identical or relative surface.
2. light emitting diode wick as claimed in claim 1, wherein, described insulating heat-conductive substrate is made of ceramic material or heat conductive insulating polymer composite.
3. one kind is adopted light emitting diode as the lighting device of light source, it is characterized in that, comprising:
Lamp housing comprises radiating piece;
Light emitting diode wick comprises:
The insulating heat-conductive substrate, and described radiating piece is fixed together to form the heat conduction between described substrate and described radiating piece;
At least one light emitting diode, its first surface that is arranged at described substrate with and described substrate between form the heat conduction; And
Be arranged at the driving governor of the second surface of described substrate, itself and described at least one light emitting diode are electrically connected to provide required operating voltage or operating current to described at least one light emitting diode, wherein, described the first and second surfaces are identical or relative surface.
4. one kind is adopted light emitting diode as the lighting device of light source, it is characterized in that, comprising:
Lamp housing comprises radiating piece;
The insulating heat-conductive substrate, and described radiating piece is fixed together to form the heat conduction between described substrate and described radiating piece;
At least one light emitting diode, its surface that is arranged at described substrate with and described substrate between form the heat conduction;
Be arranged at the driving power module in described lamp housing; And
Be formed at the wiring layer on described radiating piece surface, be used for making described light emitting diode be electrically connected to described driving power module.
5. one kind is adopted light emitting diode as the lighting device of light source, it is characterized in that, comprising:
Lamp housing comprises the insulating heat-conductive part;
At least one light emitting diode, its outer surface that is arranged on described insulating heat-conductive part with and described insulating heat-conductive part between form the heat conduction;
Be arranged on the driving power module in described lamp housing; And
Be formed at the wiring layer of described insulating heat-conductive part surface, be used for making described light emitting diode be electrically connected to described driving power module.
6. one kind is adopted light emitting diode as the lighting device of light source, it is characterized in that, comprising:
Lamp housing comprises radiating piece;
Along the column that the described lamp housing longitudinal axis extends, it is made of insulating heat-conduction material and one of them end is fixed together to form hot the conduction between described column and described radiating piece with described radiating piece;
At least one light emitting diode, its outer surface that is arranged on described column with and described column between form the heat conduction;
Be arranged on the driving power module in described lamp housing; And
Be formed at the wiring layer of described column outer surface, it makes described light emitting diode be electrically connected to described driving power module.
7. a light emitting diode wick, is characterized in that, comprising:
Printed substrate comprises insulating barrier and the wiring layer that is formed at the first and second surfaces of described insulating barrier;
At least one light emitting diode, it is arranged at the first surface of described insulating barrier and is electrically connected with described wiring layer; And
Be arranged at the driving governor of the second surface of described base material, it is electrically connected to provide required operating voltage or operating current to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
8. one kind is adopted light emitting diode as the lighting device of light source, it is characterized in that, comprising:
Lamp housing comprises radiating piece;
Light emitting diode wick comprises:
Printed substrate comprises insulating barrier and the wiring layer that is formed at the first and second surfaces of described insulating barrier, and described insulating barrier and described radiating piece are fixed together to form the heat conduction between described base material and described radiating piece;
At least one light emitting diode, it is arranged at the first surface of described insulating barrier and is electrically connected with described wiring layer; And
Be arranged at the driving governor of the second surface of described insulating barrier, it is electrically connected to provide required operating voltage or operating current to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
9. a light emitting diode wick, is characterized in that, comprising:
Printed substrate comprises the first and second insulating barriers, the metal level between described the first and second insulating barriers and the wiring layer that is formed at described the first and second surface of insulating layer;
At least one light emitting diode, it is arranged at described the first surface of insulating layer and is electrically connected with described wiring layer; And
Be arranged at the driving governor of described the second surface of insulating layer, it is electrically connected to provide required operating current or operating voltage to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
10. one kind is adopted light emitting diode as the lighting device of light source, it is characterized in that, comprising:
Lamp housing comprises radiating piece;
Light emitting diode wick comprises:
Printed substrate, comprise the first and second insulating barriers, the metal level between described the first and second insulating barriers and the wiring layer that is formed at described the first and second surface of insulating layer, described metal level and described radiating piece are fixed together to form the heat conduction between described printed substrate and described radiating piece;
At least one light emitting diode, it is arranged at described the first surface of insulating layer and is electrically connected with described wiring layer; And
Be arranged at the driving governor of described the second surface of insulating layer, it is electrically connected to provide required operating voltage or operating current to described at least one light emitting diode by described wiring layer and described at least one light emitting diode.
CN2011104622202A 2011-11-11 2011-12-12 Light emitting diode (LED) lamp wick and lighting device with LED as light source Pending CN103104828A (en)

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PCT/CN2012/084280 WO2013067945A1 (en) 2011-11-11 2012-11-08 Led lamp wick and lighting device using led as light source

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CN201120447845.7 2011-11-11
CN201110357803.9 2011-11-11
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