CN102130111A - Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device - Google Patents
Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device Download PDFInfo
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- CN102130111A CN102130111A CN 201010605308 CN201010605308A CN102130111A CN 102130111 A CN102130111 A CN 102130111A CN 201010605308 CN201010605308 CN 201010605308 CN 201010605308 A CN201010605308 A CN 201010605308A CN 102130111 A CN102130111 A CN 102130111A
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Abstract
The invention discloses a packaging method of a high-power LED (light-emitting diode) device, and the method comprises the following steps: fixing an LED chip array on a baseplate, arranging the baseplate on a metal housing, and sealing light transmission insulating liquid in the metal housing through a transparent baffle plate. The invention further provides the high-power LED device packaged based on the method. By adopting the method for liquid-packaging the high-power LED and the high-power LED device, double heat radiation channels are provided for LED chips, and the problems of difficulty in heat radiation, low color rendering index and the like in the existing high-power LED packaging technology can be solved.
Description
Technical field
The present invention relates to the lighting source field, be specifically related to the great power LED device of liquid encapsulation and a kind of method for packing of LED matrix.
Background technology
Great power LED as lighting source have that volume is little, little power consumption, heating less, advantages such as the life-span is long, response speed is fast, safe voltage is low, good weatherability, good directionality.Therefore great power LED is widely used in street lamp, flood light illumination.
For the encapsulation of LED, the especially encapsulation of great power LED, fast and effeciently dispelling the heat for led chip is the key problem that encapsulation technology will solve.High-power LED chip is when work, and the interface can produce a large amount of heats, if the heat in interface can not in time obtain diffusion, will cause the reduction of LED luminous efficiency, useful life to reduce.Conventional at present LED encapsulation technology is that led chip is attached in the transparent material that is wrapped in picture epoxy resin one class on the support, and materials such as general transparent resin, glass all are the thermal resistance materials, can't effectively transmit heat; This heat that just causes led chip to produce can only be diffused into the external world to support then by substrate transfer, yet general backing material thermal conductivity is not high, so the substrate of led chip becomes the bottleneck of the passage of heat.In order effectively to solve the heat dissipation problem of high-power LED chip, just have to adopt the inverted structure encapsulation, encapsulation technologies such as laser lift-off substrate, still, cost is higher relatively.
The method that occurs some liquid packaged LEDs in recent years both at home and abroad in succession all be to wish to come LED is dispelled the heat by the convection current of liquid, but these methods misss the core into the led chip heat radiation.Wherein the core of a part of method for packing is with liquid parcel LED lamp pearl, to reach the purpose that LED is dispelled the heat.But, analyze theoretically, with liquid parcel LED lamp pearl is the secondary heat radiation, can't fundamentally solve the problem of led chip heat radiation, we the bottleneck of analyzing conventional LED lamp pearl, especially its heat radiation of large-power LED light bead are that the heat of led chip generation can't conduct from transparent resin or substrate apace preamble; Go to wrap up LED lamp pearl with liquid so, liquid can only be given the resin-case heat radiation of LED lamp pearl, can't dispel the heat to led chip at all.In the prior art, also the someone selects to go packaging LED chips rather than packaged LED lamp pearl with liquid, but but selects with transparent shell enclosing liquid and led chips such as resin, plastics, glass.Existing as mentioned before transparent material substantially all is the thermal resistance material, even enclosing liquid is taken away the heat that led chip produces effectively by convection current, but liquid can't be diffused into heat in the outside air apace and go, because the transparent shell of parcel liquid is the thermal resistance material, it has seriously slowed down liquid and extraneous heat exchange.Therefore this class method for packing can not really effectively solve the heat dissipation problem of LED.
Summary of the invention
The objective of the invention is to solve problems such as the heat radiation difficulty, the color rendering index that have the existence of high-power LED encapsulation technology now are low.
The great power LED device of liquid encapsulation provided by the invention, comprise metal shell, described metal shell comprises opening, medial surface, lateral surface, inner bottom surface and the outer bottom that is oppositely arranged with described inner bottom surface, described cavity hatch, medial surface, inner bottom surface form a cavity, described aperture area is greater than described inner bottom surface area, described inner bottom surface central authorities are provided with base plate, described base plate is provided with the led chip array, described opening part is provided with transparent baffle, and the printing opacity iknsulating liquid is sealed in the described cavity by described transparent baffle.
Preferably, described led chip array by in red, green, blue, the yellow led chip both or both more than arrange according to predetermined quantity and preset space length and to form.
Preferably, the lateral surface of described metal shell and outer bottom are provided with fin or thermal column structure.
The present invention also provides a kind of method for packing of great power LED device, may further comprise the steps: a kind of base plate is provided, the led chip array is fixed on the base plate; A kind of metal shell is provided, described base plate is arranged on the metal shell, wherein, described metal shell comprises opening, medial surface, lateral surface, inner bottom surface and the outer bottom that is oppositely arranged with described inner bottom surface, described cavity hatch, medial surface, inner bottom surface form a cavity, and described aperture area is greater than described inner bottom surface area; At described opening part transparent baffle is set; Described printing opacity iknsulating liquid is sealed in the described cavity by described transparent baffle.
Preferably, the described led chip array is fixed on the base plate comprise, with in red, green, blue, the yellow led chip both or both more than be arranged on the base plate according to predetermined quantity and preset space length.
Preferably, described be sealed in the printing opacity iknsulating liquid in the described cavity after, also comprise, the pipeline that liquid is in communication with the outside is set on described metal shell.
In order to overcome the existing existing problem of liquid packaged LED technology, the present invention adopts the led chip array is placed on the base plate of high heat conductance, base plate is placed in the metal shell filling liquid sealing above chip then again.The advantage of this scheme is, provides two heat dissipation channels to led chip; On the one hand, the heat that chip produces passes to metal shell fast by the base plate of high heat conductance, then metal shell apace with heat transferred in air; On the other hand the heat that chip produced can be directly convection current by liquid pass to metal shell, then metal shell more apace with heat transferred in air.
Led array among the present invention simultaneously is to be formed by multiple monochromatic chip portfolio, can realize the multicolour illumination.If be combined into white-light illuminating, the white light LEDs of comparing existing fluorescent material encapsulation has higher color rendering index, higher light efficiency, and colour temperature is adjustable.
Description of drawings
Fig. 1 is the sectional view of great power LED device in the embodiment of the invention one;
Fig. 2 is the stereogram of great power LED device in the embodiment of the invention one;
Fig. 3 is the stereogram of another great power LED device in the embodiment of the invention one;
Fig. 4 is the sectional view of great power LED device in the embodiment of the invention two;
Fig. 5 is the stereogram of great power LED device in the embodiment of the invention two;
Fig. 6 is the stereogram of another great power LED device in the embodiment of the invention two.
Embodiment
Embodiment one
A kind of great power LED device of liquid encapsulation, schematic cross-section and schematic perspective view are respectively with reference to figure 1, Fig. 2, comprise metal shell 10, described metal shell 10 comprises opening 101, medial surface 102, lateral surface 103, inner bottom surface 104 and the outer bottom 105 that is oppositely arranged with described inner bottom surface, described cavity hatch 101, medial surface 102, inner bottom surface 104 forms a cavity, described aperture area is greater than described inner bottom surface 104 areas, described inner bottom surface 104 central authorities are provided with base plate 11, described base plate is provided with led chip array 12, described opening part is provided with transparent baffle 14, and printing opacity iknsulating liquid 13 is sealed in the described cavity by described transparent baffle 14.
In the present embodiment; described led chip array 12 can be by redness; green; blue; both or both above arrangements according to predetermined quantity and preset space length in the yellow led chip form; for example; the led chip array can be by a red LED chips; a green LED chip is arranged according to preset space length and is formed; also can be by a red LED chips; two blue led chips; a yellow led chip is arranged according to preset space length and is formed; the kind of concrete led chip; quantity and spacing can be provided with as required, all within protection scope of the present invention.
Profile at the described great power LED device of present embodiment can design according to demand, its profile can be designed as square column type as schematically shown in Figure 2, also can be multi-edge column-shaped, also can be for Fig. 3 signal cylindrical, can also be designed to other rule or irregular polyhedron shapes.
In the present embodiment; the medial surface of the metal shell of great power LED device is the plane; as shown in Figure 2; described medial surface also can be arranged to curved surface, as shown in Figure 3, and certainly; curved surface type is not limited to shape shown in Figure 3; also can be parabolic, shapes such as hyperboloid, the conventional simple deformation that those skilled in the art is done on basis of the present invention is all within protection scope of the present invention.
Described great power LED apparatus features is, for the led chip array provides two heat dissipation channels; On the one hand, the heat that chip produces passes to metal shell fast by the base plate of high heat conductance, then metal shell apace with heat transferred in air; On the other hand the heat that chip produced can be directly convection current by liquid pass to metal shell, then metal shell more apace with heat transferred in air.Simultaneously, the led array in the described great power LED device is to be formed by multiple monochromatic chip portfolio, can realize the multicolour illumination.If be combined into white-light illuminating, the white light LEDs of comparing existing fluorescent material encapsulation has higher color rendering index, higher light efficiency, and colour temperature is adjustable.
Embodiment two
A kind of great power LED device of liquid encapsulation, comprise metal shell 20, described metal shell 20 comprises opening 201, medial surface 202, lateral surface 203, inner bottom surface 204 and the outer bottom 205 that is oppositely arranged with described inner bottom surface 204, described cavity hatch 201, medial surface 202, inner bottom surface 204 forms a cavity, described aperture area is greater than described inner bottom surface area, described inner bottom surface central authorities are provided with base plate 21, described base plate is provided with led chip array 22, described opening part is provided with transparent baffle 24, and printing opacity iknsulating liquid 23 is sealed in the described cavity by described transparent baffle 24.In the present embodiment, the lateral surface 203 of described metal shell 20 and outer bottom 205 are provided with heat radiating fin structure 206.Heat radiating fin structure 206 is set on metal shell 20 can the enlarged metal housing and the contact area of air, helps metal shell to extraneous dissipate heat.Certainly, described metal shell also can selectively be arranged on lateral surface or outer bottom wherein a kind of, all is not construed as limiting the invention.
As further improvement, can be provided with reflectorized material on described metal shell 20 medial surfaces 202 to the embodiment of the invention.Reflectorized material is the material that visible light is had high reflectance, can be materials such as gold, silver, aluminium, and these materials can be deposited on the medial surface 202 and inner bottom surface 204 of metal shell 20 by modes such as plated film, printings.On metal shell 20 medial surfaces 202, reflectorized material is set, can improves the whole light extraction efficiency of LED matrix.
As further improvement to the embodiment of the invention, can in metal shell 20, be provided with pipeline, pipeline can be to pass the pipeline that inner bottom surface 204 and outer bottom 205 are in communication with the outside printing opacity iknsulating liquid 23, also can be to pass the pipeline that medial surface 202 and lateral surface 203 are in communication with the outside printing opacity iknsulating liquid 23.The material of pipeline can be that metal also can be plastics, and pipeline can weld or be bonded in the metal shell 20.Pipeline is in communication with the outside the printing opacity iknsulating liquids 23 in the metal shell 20, adopts such structure, can so that the pressure in the cavity with extraneous consistent, thereby can avoid the LED matrix damage that causes because of the expansion of printing opacity iknsulating liquid.
Further improvement as to the embodiment of the invention can be made into lens with transparent baffle, and the material of transparent baffle can be quartz, glass or organic material.Transparent baffle is made into lens can changes the LED matrix light path.
As the further improvement to the embodiment of the invention, printing opacity iknsulating liquid 23 can be a silicone oil.Silicone oil has advantages such as high chemical stability, high-flash, Nonpoisonous, non-environmental-pollution, low price, is a kind of good printing opacity iknsulating liquid.
Led chip array 22 in the embodiment of the invention, by predetermined regularly arranged forming, wherein monochromatic chip comprises red chip, yellow chip, green chip and blue chip by the monochromatic chip of predetermined quantity.Be directed to white-light illuminating, the design that two kinds of preferred led chip arrays are arranged, one is: red, green, blue chip was with 1: 2: 1 ratio assembled arrangement, and another is: yellow, blue chip adds a small amount of red chip assembled arrangement again with 1: 1 ratio.The advantage of these two kinds of white light LED array designs is, under rational drives, can realize high color rendering index (CRI) (＞85) illumination; Simultaneously can regulate (3000-7000) on a large scale in the colour temperature of the designed light source of these two kinds of schemes.These advantages are unexistent with the white light LEDs of fluorescent material encapsulation at present.
The base plate 21 that being used in the embodiment of the invention carried led chip array 22 can be a ceramic material, can be metal material, also can be the crystal material.One of preferred is aluminium nitride ceramics, and advantage has three: the relative crystalline material of price is cheap, the thermal conductivity coefficient height, and thermal coefficient of expansion and led chip are approaching; Preferred two is aluminium oxide ceramics, and its advantage has two: cheap, its metallization process is very ripe; Preferred three is copper, and its great advantage is the thermal conductivity coefficient height, can reach 400.Backplate surface involved in the present invention has the pattern electrode that makes by technologies such as metal ceramic or ceramic metallizations, and this electrode is used for linking to each other with the positive and negative electrode of led chip.
The printing opacity iknsulating liquid that relates in the embodiment of the invention its role is to: when led chip was worked, the heat that its interface produced can be delivered on the metal shell fast by the convection current and the heat conduction of liquid.Because the metal shell among the present invention has very high thermal conductivity coefficient,, can be diffused into the external world by metal shell soon so liquid transfer is given the heat of metal shell.The printing opacity iknsulating liquid can be full of metal shell fully, also can not exclusively be full of metal shell.That printing opacity iknsulating liquid among the present invention need possess is non-conductive, viscosity coefficient is low, chemical stability good, characteristics such as corroding metal and led chip, nuisanceless, low price not; Be directed to this, we are low viscosity silicone preferably.
The transparent baffle that relates in the embodiment of the invention its role is to: can be made into lens as the transparent baffle of light-emitting window and be used for regulating rising angle, simultaneously anti-reflection film can be set on transparent baffle also and be used for improving light extraction efficiency.
Embodiment three
A kind of method for packing of great power LED device may further comprise the steps:
A kind of base plate is provided, the led chip array is fixed on the base plate; The led chip array can be bonded on the base plate by the silver slurry, also can be attached on the base plate by gold, the weldering of tin eutectic.
A kind of metal shell is provided, described base plate is arranged on the metal shell, wherein, described metal shell comprises opening, medial surface, lateral surface, inner bottom surface and the outer bottom that is oppositely arranged with described inner bottom surface, described cavity hatch, medial surface, inner bottom surface form a cavity, and described aperture area is greater than described inner bottom surface area; The profile of metal shell can be circular, can be quadrangle, also can be polygon, and concrete profile can be according to concrete lighting requirement design, and the material of metal shell can be copper, aluminium and the alloy material of high heat conductance.
At described opening part transparent baffle is set, transparent baffle is fixed in the metal shell opening part.
The printing opacity iknsulating liquid is sealed in the described cavity by described transparent baffle, the printing opacity iknsulating liquid is filled by modes such as perfusion or negative pressure suctions and is entered in the metal shell, the printing opacity iknsulating liquid can be full of metal shell fully, also can not exclusively be full of metal shell.
In the present embodiment, the described led chip array is fixed on the base plate comprise, with in red, green, blue, the yellow led chip both or both more than be arranged on the base plate according to predetermined quantity and preset space length; Link together with the mode with serial or parallel connection between a kind of chip, the chip not of the same race directly access external drive circuit that can be mutually do not link to each other, also can connect earlier or parallel connection after insert external drive circuit again.
In the present embodiment, described be sealed in the printing opacity iknsulating liquid in the described cavity after, also comprise, the pipeline that liquid is in communication with the outside is set on metal shell.The material of pipeline can be that metal also can be plastics, and pipeline can weld or be bonded in the metal shell.
The sequencing of above step can be adjusted as required, chip array is arranged on the floor after for example can being arranged on base plate in the metal shell earlier again, all is not construed as limiting the invention.
The concrete structure of the LED matrix that realizes in the present embodiment can repeat no more with reference to the description among embodiment one and the embodiment two herein.
Used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, the present disclosure content should not be construed as limitation of the present invention.
Claims (10)
1. the great power LED device of liquid encapsulation, it is characterized in that: the great power LED device of described liquid encapsulation comprises metal shell, described metal shell comprises opening, medial surface, lateral surface, inner bottom surface and the outer bottom that is oppositely arranged with described inner bottom surface, described cavity hatch, medial surface, inner bottom surface forms a cavity, described aperture area is greater than described inner bottom surface area, described inner bottom surface central authorities are provided with base plate, described base plate is provided with the led chip array, described opening part is provided with transparent baffle, and the printing opacity iknsulating liquid is sealed in the described cavity by described transparent baffle.
2. the great power LED device of liquid as claimed in claim 1 encapsulation is characterized in that: described led chip array by in red, green, blue, the yellow led chip both or both more than arrange according to predetermined quantity and preset space length and to form.
3. the great power LED device of liquid encapsulation as claimed in claim 2, it is characterized in that: the lateral surface of described metal shell and outer bottom are provided with fin or thermal column structure.
4. the great power LED device of liquid encapsulation as claimed in claim 3, it is characterized in that: described metal shell medial surface is provided with reflectorized material.
5. the great power LED device of liquid as claimed in claim 4 encapsulation is characterized in that: described metal shell is provided with and passes the pipeline that described inner bottom surface and described outer bottom are in communication with the outside described printing opacity iknsulating liquid.
6. as any great power LED device that described liquid encapsulates of claim 1 to 5: it is characterized in that described transparent baffle is lens.
7. as any great power LED device that described liquid encapsulates of claim 1 to 5: it is characterized in that described printing opacity iknsulating liquid is a silicone oil.
8. the method for packing of a great power LED device is characterized in that, may further comprise the steps:
A kind of base plate is provided, the led chip array is fixed on the base plate;
A kind of metal shell is provided, described base plate is arranged on the metal shell, wherein, described metal shell comprises opening, medial surface, lateral surface, inner bottom surface and the outer bottom that is oppositely arranged with described inner bottom surface, described cavity hatch, medial surface, inner bottom surface form a cavity, and described aperture area is greater than described inner bottom surface area;
At described opening part transparent baffle is set, the printing opacity iknsulating liquid is sealed in the described cavity by described transparent baffle.
9. the method for packing of great power LED device as claimed in claim 8, it is characterized in that: the described led chip array is fixed on the base plate comprise, with in red, green, blue, the yellow led chip both or both more than be arranged on the described base plate according to predetermined quantity and preset space length.
10. the method for packing of great power LED device as claimed in claim 8 or 9, it is characterized in that: described be sealed in the printing opacity iknsulating liquid in the described cavity after, also comprise, the pipeline that described printing opacity iknsulating liquid is in communication with the outside is set on described metal shell.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010605308 CN102130111A (en) | 2010-12-24 | 2010-12-24 | Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010605308 CN102130111A (en) | 2010-12-24 | 2010-12-24 | Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
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| CN102130111A true CN102130111A (en) | 2011-07-20 |
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| CN 201010605308 Pending CN102130111A (en) | 2010-12-24 | 2010-12-24 | Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN103050606A (en) * | 2013-01-11 | 2013-04-17 | 华南师范大学 | High-color-rendering high-power LED (light emitting diode) encapsulation structure and manufacture method of high-color-rendering high-power LED encapsulation structure |
| CN103779477A (en) * | 2013-06-20 | 2014-05-07 | 苏州恒荣节能科技安装工程有限公司 | LED (light-emitting diode) |
| CN105336831A (en) * | 2015-09-24 | 2016-02-17 | 李峰 | Liquid-filled LED lamp |
| CN106229311A (en) * | 2016-08-22 | 2016-12-14 | 成都众乐泰科技有限公司 | A kind of production technology of LED light emitting diode |
| CN109656087A (en) * | 2018-12-28 | 2019-04-19 | 北京灵犀微光科技有限公司 | Lighting module |
| CN113300211A (en) * | 2021-06-24 | 2021-08-24 | 西安嘉合超亿光电科技有限公司 | Semiconductor laser packaging structure and preparation method thereof |
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| CN101298903A (en) * | 2008-06-12 | 2008-11-05 | 符建 | High-power LED light source with adjustable light beam |
| CN201373272Y (en) * | 2009-01-22 | 2009-12-30 | 深圳市成光兴实业发展有限公司 | White-light LED light source module adopting COB technology and array interconnection |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101298903A (en) * | 2008-06-12 | 2008-11-05 | 符建 | High-power LED light source with adjustable light beam |
| CN201373272Y (en) * | 2009-01-22 | 2009-12-30 | 深圳市成光兴实业发展有限公司 | White-light LED light source module adopting COB technology and array interconnection |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN103050606A (en) * | 2013-01-11 | 2013-04-17 | 华南师范大学 | High-color-rendering high-power LED (light emitting diode) encapsulation structure and manufacture method of high-color-rendering high-power LED encapsulation structure |
| CN103779477A (en) * | 2013-06-20 | 2014-05-07 | 苏州恒荣节能科技安装工程有限公司 | LED (light-emitting diode) |
| CN105336831A (en) * | 2015-09-24 | 2016-02-17 | 李峰 | Liquid-filled LED lamp |
| WO2017049680A1 (en) * | 2015-09-24 | 2017-03-30 | 李峰 | Liquid-filled led lamp |
| JP2017533573A (en) * | 2015-09-24 | 2017-11-09 | 李峰 | Fluid-filled LED lamp |
| CN106229311A (en) * | 2016-08-22 | 2016-12-14 | 成都众乐泰科技有限公司 | A kind of production technology of LED light emitting diode |
| CN106229311B (en) * | 2016-08-22 | 2019-06-07 | 成都众乐泰科技有限公司 | A kind of production technology of LED light emitting diode |
| CN109656087A (en) * | 2018-12-28 | 2019-04-19 | 北京灵犀微光科技有限公司 | Lighting module |
| CN113300211A (en) * | 2021-06-24 | 2021-08-24 | 西安嘉合超亿光电科技有限公司 | Semiconductor laser packaging structure and preparation method thereof |
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Application publication date: 20110720 |