CN103474565A - Connection of light emitting diode unit and insulation heat conduction substrate - Google Patents
Connection of light emitting diode unit and insulation heat conduction substrate Download PDFInfo
- Publication number
- CN103474565A CN103474565A CN2012101886913A CN201210188691A CN103474565A CN 103474565 A CN103474565 A CN 103474565A CN 2012101886913 A CN2012101886913 A CN 2012101886913A CN 201210188691 A CN201210188691 A CN 201210188691A CN 103474565 A CN103474565 A CN 103474565A
- Authority
- CN
- China
- Prior art keywords
- pattern area
- led
- pattern
- tube core
- led tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to a semiconductor illumination technology and especially relates to a connection method of a light emitting diode unit and an insulation heat conduction substrate, a LED light emitting module based on the method and a method of manufacturing the LED light emitting module. According to one embodiment of the invention, the LED light emitting module comprises a metal support plate (110), at least one LED pipe core (120) and a framework (130), wherein the metal support plate comprises a first pattern area (111) and a second pattern area (112) which are not connected with each other; the first pattern area is served as an electrode; the LED pipe core (120) is arranged in the second pattern area and is electrically connected with the first pattern area; the framework is made of an insulating material and is fixed together with the first pattern area and the second pattern area.
Description
Technical field
The present invention relates to the semiconductor lighting technology, the particularly method of attachment of light-emitting diode (LED) unit and insulating heat-conductive substrate, the LED light emitting module based on the method and the method for manufacturing this LED light emitting module.
Background technology
The light-emitting diode (LED) that is used as at present light source in lighting device is a kind of solid-state semiconductor device, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example silica gel or epoxy resin) that is arranged on the semiconductor wafer on support and this wafer surrounding is sealed.Above-mentioned semiconductor wafer includes the P-N structure, and when electric current passes through, electronics is pushed to the P district, and in the P district, electronics, with hole-recombination, then sends energy with the form of photon, and light wavelength is to be determined by the material that forms the P-N structure.With conventional light source, compare, LED light source has the not available series of advantages of other light source, such as pollution-free, the life-span is long, energy consumption is low, vibration resistance, control convenient and be convenient to light modulation etc.
The characteristics of LED are heats high in minimum volume generation, and the thermal capacity of himself is very little, therefore must the heat of generation be sent out with fast as far as possible speed, otherwise will cause junction temperature to raise, and affect performance and the life-span of LED.For great power LED, heat dissipation problem is particularly outstanding.Can say, heat dissipation problem has become the technical bottleneck of current semiconductor lighting technical development.For this reason, industry is each aspect from chip, circuit board to system, has proposed various optimal design for heat dissipation problem, to obtain best radiating effect.
With regard to chip level, generally can improve heat-sinking capability by increasing chip size and changing material structure.For example, in order to improve the heat radiation of substrate, company of section sharp (Cree) adopts silicon carbide substrates, and its heat conductivility is higher nearly 20 times than sapphire.
In the circuit board aspect, in current many LED light fixtures, all adopt aluminium base as printed circuit board (PCB), this substrate is sandwich construction, and intermediate layer is used has the insulating layer material of high thermal conductivity, thereby makes the heat energy of LED chip see through the aluminium sheet rapid diffusion of lower floor and pass.
For system level, heat radiation strategy commonly used is to be LED light fixture configuration radiating subassembly (for example fin, heat pipe, temperature-uniforming plate, loop hot-pipe and piezoelectric fan), thereby is dispersed in surrounding environment rapidly by its heat that heat-sinking capability produces LED fast.The Chinese patent application " LED lamp radiating structure " that for example applying date and application number are respectively on November 9th, 2004 and 200410052114.7 discloses a kind of LED lamp radiating structure, it comprises that circuit drives luminous plaque and circuit control board, and circuit drives integrated luminous diode array on luminous plaque; Described circuit arranges the reflective aluminium sheet of a heat radiation above driving luminous plaque, and below it, joint one is led the heat radiation glue-line, leads heat radiation glue-line another side and engages a heat-dissipating aluminium plate.Above-mentioned circuit control board can be with leading the thermal paste parcel, further to lead when loose wire road control board is worked the heat produced.
But it is pointed out that the continuous increase along with LED power, need the heat dissipation design that cost performance is higher to meet the heat radiation requirement.
Summary of the invention
The purpose of this invention is to provide a kind of LED luminous module, it has advantages of the good and low cost of manufacture of radiating effect.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of light-emitting diode (LED) light emitting module comprises:
Metal support plate, it comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode;
At least one is arranged on the LED tube core of described the second pattern area, and itself and described the first pattern area are electrically connected; And
The framework of being made by insulating material, itself and described the first and second pattern area are fixed together.
Preferably, in the LED light emitting module according to one embodiment of the invention, the quantity of described LED tube core is at least two, they by lead-in wire, realize being connected in series and with being connected of described the first pattern area.
Preferably, in the LED light emitting module according to one embodiment of the invention, the quantity of described LED tube core is at least two, and they are realized and being connected and being connected in series by lead-in wire and the realization of the second pattern area of described the first pattern area by lead-in wire.
Preferably, in the LED light emitting module according to one embodiment of the invention, cover the transparent silica gel that is mixed with fluorescent material on described LED tube core.
Preferably, in the LED light emitting module according to one embodiment of the invention, on described LED tube core, cover successively fluorescent material and transparent silica gel.
Preferably, in the LED light emitting module according to one embodiment of the invention, described framework surrounds described LED tube core.
Above-mentioned purpose of the present invention also can realize by following technical proposal:
A kind of light-emitting diode (LED) light emitting module comprises:
Metal support plate, it comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode district;
A plurality of LED tube cores that are arranged on described the first and second pattern area, it is electrically connected together and is electrically connected with described the first pattern area; And
The framework of being made by insulating material, itself and described the first and second pattern area are fixed together.
Preferably, in the LED light emitting module according to one embodiment of the invention, one of them electrode welding of the LED tube core by making to be arranged on described the first pattern area, to described the first pattern area, is electrically connected described LED tube core and described the first pattern area.
Preferably, in the LED light emitting module according to one embodiment of the invention, described LED tube core is realized being connected in series by lead-in wire and the second pattern area.
Of the present invention also have a purpose to be to provide a kind of method of manufacturing above-mentioned LED luminous module, and it has advantages of low cost of manufacture.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of method of manufacturing the LED light emitting module, comprise the following steps:
LED support is provided, it comprises metal form and a plurality of framework of being made by insulating material, described metal form comprises public area and a plurality of pattern unit, wherein, each described pattern unit and one of them described framework are fixed together, and comprise the first pattern area and the second pattern area be connected with described public area;
For each described pattern unit, a plurality of LED tube cores are arranged on to described the second pattern area and by lead-in wire, described LED tube core and described the first pattern area are linked together; And
Each described pattern unit is cut down from described public area, so that described the first and second pattern area are not communicated with mutually.
Preferably, in the manufacture method according to one embodiment of the invention, by annotating compression technology, each described pattern unit and described framework are fixed together.
Preferably, in the manufacture method according to one embodiment of the invention, by the eutectic welding procedure, described LED tube core is arranged on to described the second pattern area.
Preferably, in the manufacture method according to one embodiment of the invention, when by lead-in wire, described LED tube core and described the first pattern area being electrically connected together, also by going between, described LED die series is linked together.
Preferably, in the manufacture method according to one embodiment of the invention, when by lead-in wire, described LED tube core and described the first pattern area being electrically connected together, also by going between and described the second pattern area links together described LED die series.
Preferably, in the manufacture method according to one embodiment of the invention, further comprise the following steps:
Cover the transparent silica gel that is mixed with fluorescent material on described LED tube core.
Preferably, in the manufacture method according to one embodiment of the invention, further comprise the following steps:
Cover successively fluorescent material and transparent silica gel on described LED tube core.
Above-mentioned purpose of the present invention can also realize by following technical proposal:
A kind of method of manufacturing the LED light emitting module, comprise the following steps:
LED support is provided, it comprises metal form and a plurality of framework of being made by insulating material, described metal form comprises public area and a plurality of pattern unit, wherein, each described pattern unit and one of them described framework are fixed together, and comprise the first pattern area and the second pattern area be connected with described public area;
For each described pattern unit, a plurality of LED tube cores are arranged on to described the first and second pattern area and it is connected with described the first pattern area; And
Each described pattern unit is cut down from described public area, so that described the first and second pattern area are not communicated with mutually.
Preferably, in the manufacture method according to one embodiment of the invention, one of them electrode welding of LED tube core by making to be arranged on described the first pattern area is to described the first pattern area, and by lead-in wire and the second pattern area, described LED die series is linked together, described LED tube core and described the first pattern area are electrically connected together.
Of the present invention also have a purpose to be to provide a kind of method that light-emitting diode is set on the insulating heat-conductive substrate, and it has advantages of that radiating effect is good and realize that cost is low.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of method that light-emitting diode (LED) is set on the insulating heat-conductive substrate, comprise the following steps:
Metal support plate is provided, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode district, at least one LED tube core is arranged on described the second pattern area, and by lead-in wire, described LED tube core and described the first pattern area is electrically connected together; And
Described metal support plate is fixed in to the surface of described insulating heat-conductive substrate, wherein, described insulating heat-conductive substrate surface is formed with the wiring layer with described the first pattern area electrical connection.
Preferably, in the method according to one embodiment of the invention, before described metal support plate is fixed in to the surface of described insulating heat-conductive substrate, cover the transparent silica gel that is mixed with fluorescent material on described LED tube core.
Preferably, in the method according to one embodiment of the invention, before described metal support plate is fixed in to the surface of described insulating heat-conductive substrate, on described LED tube core, cover successively fluorescent material and transparent silica gel.
Preferably, in the method according to one embodiment of the invention, by electric slurry, described metal support plate is fixed in to the surface of described insulating heat-conductive substrate.
Above-mentioned purpose of the present invention can also realize by following technical proposal:
A kind of method that light-emitting diode (LED) is set on the insulating heat-conductive substrate, comprise the following steps:
Metal support plate is provided, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, and wherein, described the first pattern area is as electrode district, a plurality of LED tube cores are arranged on described the first and second pattern area, and described LED tube core and described the first pattern area are electrically connected together; And
Described metal support plate is fixed in to the surface of described insulating heat-conductive substrate, wherein, described insulating heat-conductive substrate surface is formed with the wiring layer with described the first pattern area electrical connection.
The accompanying drawing explanation
Above-mentioned and/or other side of the present invention and advantage will become by the description of the various aspects below in conjunction with accompanying drawing more clear and be easier to understand, and in accompanying drawing, same or analogous unit adopts identical label to mean, accompanying drawing comprises:
The schematic diagram that Fig. 1 is light-emitting diode (LED) light emitting module according to one embodiment of the invention.
Fig. 2 is that shown in Fig. 1, the LED light emitting module is arranged on the schematic diagram on heat-radiating substrate.
Fig. 3 is the flow chart according to the manufacture LED light emitting module of one embodiment of the invention.
The schematic diagram that Fig. 4 A-4E is the manufacture method of LED light emitting module shown in Fig. 3.
The schematic diagram that Fig. 5 is light-emitting diode (LED) light emitting module according to another embodiment of the present invention.
The LED support that Fig. 6 A and 6B adopt while being respectively LED light emitting module shown in construction drawing 5 and the schematic diagram of metal form.
Fig. 7 is for also having the schematic diagram of light-emitting diode (LED) light emitting module of an embodiment according to the present invention.
The LED support that Fig. 8 A and 8B adopt while being respectively LED light emitting module shown in construction drawing 7 and the schematic diagram of metal form.
Reference list:
10 light emitting modules
110 metal support plates
111 first pattern area
111A/111A ' the first electrode pair
111B/111B ' the second electrode pair
111C/111C ' third electrode pair
112 second pattern area
112A, 112B separate areas
120,120A, 120B, 120C LED core
130 frameworks
140 lead-in wires
20 heat-radiating substrates
210 wirings
30 LED support templates
40 metal forms
410 pattern units
411 first pattern area
412 second pattern area
412A, 412B separate areas
420 public areas
421 frames
422 first bonding pads
423 second bonding pads
Embodiment
Below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention, the present invention is described more all sidedly.But the present invention can realize by multi-form, and should not be read as, not only limit to each embodiment that this paper provides.The various embodiments described above that provide are intended to make the disclosure of this paper comprehensively complete, convey to more all sidedly those skilled in the art's protection scope of the present invention.
In this manual, unless stated otherwise, term " semiconductor crystal wafer " refers at the upper a plurality of independently single circuit that form of semi-conducting material (such as silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical structure of semiconductor wafer after encapsulation, in typical this physical structure, semiconductor wafer for example is installed on support and with encapsulant and encapsulates.
Term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light-emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
P-N knot inorganic semiconductor light-emitting diode can have different version, for example includes but not limited to LED core and light-emitting diode monomer.Wherein, " LED core " refers to and includes the semiconductor wafer P-N structure, that have the electroluminescence ability, and " light-emitting diode monomer " refers to the physical structure will formed after die package, in typical this physical structure, tube core for example is installed on support and with encapsulant and encapsulates.
Term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern for being electrically connected between components and parts of arranging on insulating surface, include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated-through hole etc.).
Term " thermal radiation " refer to object owing to thering is temperature the phenomenon of radiated electromagnetic wave.
Term " heat conduction " refers to heat, and in solid, from temperature, higher part is sent to the transfer mode of the part that temperature is lower.
Term " ceramic material " general reference needs the non-metal inorganic material of high-temperature process or densification, includes but not limited to silicate, oxide, carbide, nitride, sulfide, boride etc.
Term " Insulating Thermal Conductive Polymer Composites " refers to such macromolecular material, by metal or inorganic filler section's formation within it heat conduction network chain of filling high-termal conductivity, thereby possesses high conductive coefficient.Insulating Thermal Conductive Polymer Composites such as the polypropylene material that includes but not limited to add aluminium oxide, the Merlon that adds aluminium oxide, carborundum and bismuth oxide and acrylonitrile-butadiene-styrene terpolymer etc.The specific descriptions of relevant Insulating Thermal Conductive Polymer Composites can be referring to paper " research of Merlon and polycarbonate alloy insulating heat-conductive macromolecular material " (" material heat treatment journal " in August, 2007 of the people such as Li Li, Vol.28, No.4, pp51-54) and paper " application of aluminium oxide in Insulating Thermal Conductive Polymer Composites " (" plastic additive " the 3rd phase in 2008 of the people such as Li Bing, pp14-16), the mode that these documents are quoted in full comprises in this manual.
" electrical connection " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, or indirectly transmits the situation of electric flux or the signal of telecommunication through one or more Unit the 3rd.
Term such as " comprising " and " comprising " mean except have in specification and claims, have directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had not by directly or other unit of clearly explaining and the situation of step.
Term such as " first ", " second ", " the 3rd " and " the 4th " does not mean that unit is only to be used as to distinguish each unit in the order of the aspects such as time, space, size.
In order to improve radiating effect, LED unit and heat-radiating substrate can link together by following manner: at first prepare heat-radiating substrate (for example being made by the insulating heat-conduction material such as pottery and Insulating Thermal Conductive Polymer Composites), then utilize eutectic or cover brilliant technique the LED tube core is arranged on heat-radiating substrate.On the other hand, heat-radiating substrate, except the carrier as carrying LED unit, can also be used as system circuit board, integrated static protective circuit and drive circuit etc. thereon.When by the LED tube core with heat-radiating substrate with eutectic or when covering brilliant mode and being connected, owing to having reduced hot interface, therefore increased substantially radiating efficiency.
Preferably, heat-radiating substrate adopts normal temperature infrared ceramic radiation material to make.Normal temperature infrared ceramic radiation material for example includes but not limited at least one in following material: magnesium oxide, aluminium oxide, calcium oxide, titanium oxide, silica, chromium oxide, iron oxide, manganese oxide, zirconia, barium monoxide, cordierite, mullite, boron carbide, carborundum, titanium carbide, molybdenum carbide, tungsten carbide, zirconium carbide, ramet, boron nitride, aluminium nitride, silicon nitride, zirconium nitride, titanium nitride, titanium silicide, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.About the detailed description of normal temperature infrared ceramic radiation material can be referring to paper " present Research of high efficiency infrared radiation ceramic and application " (" modern technologies pottery " the 2nd phase in 2005 (total the 104th phase) of the people such as Li Hong great waves and Liu Jianxue, pp24-26) and Wang Qian equality people's paper " progress of high radiated infrared ceramic material and application " (" ceramic journal " the 3rd phase in 2011), the mode that these documents are quoted in full comprises in this manual.
But it is to be noted, the connected mode of above-mentioned LED unit and heat-radiating substrate requires very high for the evenness on the wiring precision of heat-radiating substrate and circuit surface, this makes thick film and low-temperature co-fired ceramic substrate, and because precision is subject to the technique half tone, throw the net problem and sintering shrinkage ratio problems affects and be difficult to and use.
According to one embodiment of the present of invention, in order to address the above problem, consider to adopt metal support plate as the transition medium between LED tube core and heat-radiating substrate.Particularly, at first the LED tube core is set on metal support plate to form the LED light emitting module, wherein, metal support plate is designed to have certain pattern, it at least comprises disconnected the first pattern area and the second pattern area mutually, wherein the first pattern area is as electrode district, the second pattern area can be separately or with the first pattern area jointly as the bearing area of LED tube core.For example by the mode of welding, the LED light emitting module is fixed on to the assigned address of heat-radiating substrate subsequently, and make electrode district and the electrical connection of the wiring layer on heat-radiating substrate on metal support plate, realized thus machinery and the electrical connection of LED tube core and heat-radiating substrate.For example, because metal (copper or aluminium) and LED tube core and heat-radiating substrate all have binding ability preferably, and between metal support plate and heat-radiating substrate for face contacts, therefore reduced when the LED unit is set the wiring precision of heat-radiating substrate and the requirement of evenness.
In the above-described embodiments, the setting example of LED tube core on metal support plate is as realized by the COB packaging technology.Particularly, can first the LED tube core be fixed on to the second pattern area of metal support plate by the eutectic solder technology or be fixed on the first and second pattern area of metal support plate, then for example by lead key closing process realize interconnection between the LED tube core and with being connected of the first pattern area as electrode district.Finally with encapsulant, thereby LED tube core and lead-in wire are encapsulated to formation LED light emitting module.
The schematic diagram that Fig. 1 is light-emitting diode (LED) light emitting module according to one embodiment of the invention.
As shown in Figure 1, LED light emitting module 10 comprises metal support plate 110, a plurality of LED tube core 120 and framework 130.Metal support plate 110 comprises the first pattern area 111 and the second pattern area 112.The first pattern area 111 is as the electrode district of light emitting module, and it comprises each other a plurality of and all disconnected discrete community or electrode pair are usingd as LED tube core 120 and outside electric interfaces with the second pattern area 112.P type electrode and the N-type electrode of LED tube core 120 all are arranged on upper surface, and it for example is fixed on the second pattern area 112 by the eutectic solder technology.Due to the good heat conductivility of metal, the thermal resistance between LED tube core 120 and the second pattern area 112 is close to zero, so the heat that the former produces can pass to the following heat-radiating substrate of light emitting module 10 efficiently.Framework 130 is made by insulating material, and it for example is fixed together by annotating compression technology and metal support plate 110, and LED tube core 120 is surrounded wherein.Because the first and second pattern area 111 and 112 all are fixed on framework 130, so their relative position relation is fixed.Referring to Fig. 1, LED tube core 120 by go between 140 realize interconnection between them and with being connected of the first pattern area 111.For fear of LED tube core 120 and lead-in wire 140, be directly exposed in air, can be in the interior injection transparent silica gel of framework 130 so that they be encapsulated.
When the illuminating ray color of the emission wavelength of LED tube core and actual needs has deviation, can utilize the luminescence generated by light effect of fluorescent material to realize the change of wavelength.Particularly, can for example, with the silica gel of mixed fluorescent powder (yttrium-aluminium-garnet (YAG) fluorescent material), cover or surround the LED tube core.Alternatively, can be first at the surface-coated fluorescent material of each LED tube core, and then cover or wrap independent LED tube core or cover the whole zone surrounded by framework 130 with silica gel with silica gel.As shown in Figure 1, due to the setting of framework 130, mobile being restricted of silica gel and only be distributed in the LED tube core around.
Referring to Fig. 1, in the present embodiment, the first pattern area 111 comprises the first electrode pair 111A/111A ', the second electrode pair 111B/111B ' and third electrode to 111C/111C '.These electrode pairs can be connected in parallel to driving power module (not shown).Correspondingly, the LED tube core that a plurality of LED tube cores 120 are divided in three groups and every group is connected between electrode pair separately with series system, has realized thus the connection of series-parallel connection mode.Also can adopt other type of attachment such as series, parallel or crossed array between the LED tube core.Moreover it is example that the present embodiment be take a plurality of LED tube cores, is also feasible yet adopt single led tube core as light-emitting component.
Fig. 2 is that shown in Fig. 1, the LED light emitting module is arranged on the schematic diagram on heat-radiating substrate.
Visible in conjunction with Fig. 1 and 2; lip-deep wiring 210 electrical connections of the part that first, second, and third electrode pair extends out from framework 130 and substrate 20,210 can be connected to the (not shown)s such as electrostatic discharge protective circuit, drive circuit and control and compensation circuit that are integrated on substrate 20 and connect up.
For LED light emitting module 10 is arranged on substrate 20, can be first for example, at the surface printing electric slurry pattern (silver slurry) of substrate 20, this pattern is corresponding to wiring 210 and the zone (the following contact zone that is called again) that contacts with the first and second pattern area 111,112.Then by high temperature sintering, at substrate surface, form wiring 210 and contact zone.Finally the first and second pattern area of metal support plate 110 are fixed to the contact zone on substrate 20 surfaces by the mode of heat fused.In the present embodiment, metal support plate 110 can adopt the materials such as copper, aluminium to make, and preferably, the metal or alloy layer that on the surface that can contact with substrate 20 in the first and second pattern area, formation one deck fusing point is lower is to be conducive to heat fused.
Fig. 3 is the flow chart according to the manufacture LED light emitting module of one embodiment of the invention.The schematic diagram that Fig. 4 A-4E is the manufacturing process of LED light emitting module shown in Fig. 3.The manufacture method of the present embodiment be take the LED light emitting module shown in Fig. 1 and is described as example.
In step S310, at first make or provide the LED support template.The schematic diagram that Fig. 4 A is an exemplary LED support.LED support template 30 shown in Fig. 4 A comprises metal form and a plurality of framework.
The schematic diagram that Fig. 4 B is the metal form in LED support shown in Fig. 4 A.Referring to Fig. 4 B, this metal form 40 comprises a plurality of pattern units 410 and the public area 420 be connected with pattern unit 410 of arranging according to matrix form.In the present embodiment, each pattern unit 410 comprises the first pattern area 411 and the second pattern area 412, wherein, the first pattern area 411 will think that the LED tube core provides and outside electric interfaces as electrode district, and the second pattern area 412 will be as the zone of carrying LED tube core.Public area 420 comprises frame 421, a plurality of the first bonding pad 422 and a plurality of the second bonding pad 423, wherein, frame 421 surrounds pattern unit 410 wherein, each first 422 two ends, bonding pad is connected to frame 421, middle part comprises the long and narrow zone of a plurality of edges perpendicular to direction extension longitudinally, each of the first pattern area 411 of these long and narrow zones and pattern unit 410 joins to electrode, thereby makes two adjacent row pattern units indirectly link together by the first bonding pad 422.Meanwhile, the second bonding pad 423 is connected between the second pattern area 412 of two adjacent patterns unit of same a line and between the second pattern area 412 and frame 421.In the metal form shown in Fig. 4 A, the first and second pattern area the 411, the 412nd of each pattern unit 410, disconnected mutually, that is to say, the two does not directly link together.But because the first and second pattern area all are connected with public area 420, so their relative position is fixed.
In the embodiment shown in fig. 1, P type electrode and the N-type electrode of LED tube core all are positioned at upper surface, therefore relatively be applicable to adopting nation to determine technique the LED tube core is arranged on pattern unit.For this reason, in step S420, for each pattern unit 410, for example can LED tube core 120 be arranged on the second pattern area 412 by the eutectic solder technology.Fig. 4 C has been provided with the schematic diagram of the pattern unit of LED tube core for one of them.As shown in Figure 4 C, a plurality of LED tube cores 120 are fixed on the second pattern area 412 according to latticed form.
Enter subsequently step S330, by Bonding realize interconnection between the LED tube core and with being connected of the first pattern area 411 as electrode district.Fig. 4 D has completed the schematic diagram of the pattern unit of lead-in wire connection for one of them.As shown in Figure 4 D, LED tube core 120 is divided into three groups, and every group of interior LED tube core is connected between electrode pair separately with series system by lead-in wire 140.
Then enter step S340, to the interior injection transparent silica gel 150 of framework 130 so that LED tube core 120 and lead-in wire 140 are encapsulated, thereby complete the making of LED light emitting module.In order to change the color of the light that the LED light emitting module sends, in the present embodiment, the transparent silica gel mixed fluorescent powder that can inject.But, in order to save the consumption of fluorescent material, in step S340, can first on each LED tube core 120, cover fluorescent material, and then to the interior injection transparent silica gel of framework 130.
Subsequently, in step S350, the chain-dotted line in Fig. 4 B is cut metal form 40, so that pattern unit 410 separates with public area 420, thereby obtains the LED light emitting module.The schematic diagram that Fig. 4 E is one of them LED light emitting module of cutting down.In this LED light emitting module, first and second pattern area 411,412 is not communicated with mutually, but because two pattern area all are fixed together with framework 130, so the relative position of the two is fixed.
The schematic diagram that Fig. 5 is light-emitting diode (LED) light emitting module according to another embodiment of the present invention.With above-mentioned, by the described embodiment of Fig. 1, compare, the main difference part of the present embodiment is the pattern form of metal support plate and the connected mode of LED tube core etc., below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
As shown in Figure 5, LED light emitting module 10 comprises metal support plate 110, a plurality of LED tube core 120 and framework 130.Metal support plate 110 comprises the first pattern area 111 and the second pattern area 112, and wherein, the first pattern area 111 comprises pair of electrodes 111A, 111A ', and LED tube core 120 for example is fixed on the second pattern area 112 by the eutectic solder technology.In the present embodiment, P type electrode and the N-type electrode of LED tube core 120 also are arranged on upper surface, and the LED tube core are linked together and be connected with the electrode pair 111A/111A ' of the first pattern area 111 by lead-in wire 140.But different from the embodiment shown in Fig. 1, second pattern area 112 of the present embodiment, except carrying LED tube core 120, also provides electrical connection for the LED tube core.Particularly, in Fig. 5, for the LED tube core that is arranged in the figure lower left corner and the upper right corner, one of them electrode of each tube core is electrically connected to the second pattern area 112 by lead-in wire 140.Because the second pattern area 112 is zones of a connection, therefore between the LED in the lower left corner and upper right corner tube core, realized electrical connection, thus whole LED tube cores are connected in series between the electrode pair 111A/111A ' of the first pattern area 111 successively.The framework 130 of for example, being made by insulating material (plastics) is for example by annotating compression technology and the first and second pattern area 111,112 are fixed together and by 120 encirclements of LED tube core wherein.When the first and second pattern area 111 and 112 all are fixed on framework 130, the relative position relation between their threes is fixed.For fear of LED tube core 120 and lead-in wire 140, be directly exposed in air, can be in the interior injection transparent silica gel of framework 130 so that they be encapsulated.Equally, the transparent silica gel of injecting can mixed fluorescent powder to change the color of the light that the LED light emitting module sends.Alternatively, the coating of fluorescent material and transparent silica gel can separate execution,, first on each LED tube core 120, covers fluorescent material and then to the interior injection transparent silica gel of framework 130 that is.
It is worthy of note, although the LED tube core here adopts series system to link together, also can adopt parallel way.For example two electrodes of each the LED tube core in Fig. 5 can directly be connected between electrode pair 111A/111A ', thereby form and downlink connection.
Manufacture method by the LED module shown in Fig. 3 and Fig. 4 A-4E equally also can be applicable to the present embodiment.
Particularly, in step S310, at first prepare or the template of LED support as shown in Figure 6A is provided.The LED support template also comprises the framework on metal form and a plurality of pattern unit that is fixed on metal form.The schematic diagram of the metal form that Fig. 6 B adopts while being LED light emitting module shown in construction drawing 5.As shown in Figure 6B, this metal form 40 comprises a plurality of pattern units 410 and the public area 420 be connected with pattern unit 410 of arranging according to matrix form.The first pattern area 411 of each pattern unit 410 is electrically connected with the first bonding pad 422 of public area 420, will think that the LED tube core provides and outside electric interfaces as electrode district.Different from the metal form shown in Fig. 4 B, the first pattern area 411 of the metal form shown in Fig. 6 B comprises pair of electrodes.The first bonding pad 422 joins with the electrode pair of frame 421 and the first pattern area 411, thereby makes two adjacent row pattern units indirectly link together by the first bonding pad.The second pattern area 412 will double as carrying LED tube core and the zone of electrical connection will be provided, and between the second pattern area 412 of two adjacent patterns unit of same a line and link together by the second bonding pad 423 between the second pattern area 412 and frame 421.421, the frame of public area 420 surrounds pattern unit 310 wherein.The first and second pattern area 411,412 of each pattern unit 410 directly do not link together, but because the first and second pattern area all are connected with public area 420, so their relative position is fixed.In addition, because framework 130 and the first and second pattern area 411,412 are fixed together, therefore at pattern unit and public area after separating, between the first and second pattern area 411,412, still keep relatively-stationary position relationship.
The step S350 that the LED tube core is arranged on to step S320, the step S330 that realizes Bonding, the step S340 that completes encapsulating and cutting metal template on the second pattern area shown in execution graph 3 successively subsequently, thus produce the LED light emitting module.Wherein, in step S330, except welding lead 140 between LED tube core 120 between LED tube core 120 and the first pattern area, also utilize the lead-in wire 140 LED tube cores that will be positioned at Fig. 5 lower left corner and the upper right corner to be connected to the second pattern area, thereby whole LED tube cores are connected in series between the electrode pair of the first pattern area successively.
The schematic diagram that Fig. 7 is light-emitting diode (LED) light emitting module according to another embodiment of the present invention.With above-mentioned, by Fig. 1, with 5 described embodiment, compare, the main difference part of the present embodiment is the setting of the pattern form of metal support plate and LED tube core and connected mode etc., below this is further described.For other side, the present embodiment can adopt the various features of previous embodiment, therefore no longer describes in detail.
As shown in Figure 7, LED light emitting module 10 comprises metal support plate 110, a plurality of LED tube core 120A-120C and framework 130.Metal support plate 110 comprises the first pattern area 111 and the second pattern area 112, and wherein, the first pattern area 111 comprises pair of electrodes 111A and 111A '.Different from previous embodiment is, in the present embodiment, all be provided with the LED tube core on the first and second pattern area 111,112, the second pattern area 112 comprises two discrete regional 112A and 112B, and the P type electrode of LED tube core and N-type electrode are separately positioned on upper surface and lower surface.Interconnection between tube core and realizing with the first being connected according to following manner of pattern area 111.Referring to Fig. 7, LED tube core 120A is arranged on the electrode 111A of the first pattern area 111, its electrode that is positioned at lower surface is welded on the electrode 111A of the first pattern area 111, and the electrode that is positioned at upper surface is electrically connected by the separate areas 112A of lead-in wire the 140 and second pattern area 112.Simultaneously, it is upper that LED tube core 120B is arranged on separate areas 112A, and it is upper that its electrode that is positioned at lower surface is welded on separate areas 112A, and another electrode is by lead-in wire 140 and another separate areas 112B electrical connection.It is upper that LED tube core 120C is arranged on separate areas 112B, and it is upper that its electrode that is positioned at lower surface is welded on separate areas 112B, and another electrode is electrically connected by the electrode 111A ' of lead-in wire the 140 and first pattern area 111.Thus, the LED tube core is connected in series between the electrode pair of the first pattern area 111 successively.
Equally, the framework 130 of for example, being made by insulating material (plastics) is for example by annotating compression technology and the first and second pattern area are fixed together and by LED tube core 120A-120C encirclement wherein.When the first and second pattern area 111 and 112 all are fixed on framework 130, their relative position relation is fixed.In the present embodiment, the transparent silica gel by being mixed with fluorescent material to the interior injection of framework 130 is to be encapsulated LED tube core and lead-in wire.Alternatively, the coating of fluorescent material and transparent silica gel also can separate execution.
For the LED light emitting module of the present embodiment, it also can utilize the method for the LED module shown in Fig. 3 and Fig. 4 A-4E to make.
Particularly, in step S310, at first prepare or the template of LED support as shown in Figure 8 A is provided.The LED support template also comprises the framework on metal form and a plurality of pattern unit that is fixed on metal form.The schematic diagram of the metal form that Fig. 8 B adopts while being LED light emitting module shown in construction drawing 7.As shown in Figure 8 B, this metal form 40 comprises a plurality of pattern units 410 and the public area 420 be connected with pattern unit 410 of arranging according to matrix form.Public bonding pad 420 comprises frame 421, a plurality of the first bonding pad 422 and a plurality of the second bonding pad 423 that pattern unit 410 is surrounded wherein, wherein, the first pattern area 411 of each pattern unit 410 comprises pair of electrodes and will double as and the zone of outside electric interfaces with carrying LED tube core, the first bonding pad 422 joins with the electrode pair of frame 421 and the first pattern area 411, thereby makes two adjacent row pattern units indirectly link together by the first bonding pad.As shown in Figure 8 B, each second pattern area 412 comprises discrete two regional 412A and 412B, and it also provides the electrical connection between the LED tube core except carrying LED tube core.Between the second pattern area 412 of two adjacent patterns unit of same a line and link together by the second bonding pad 423 between the second pattern area 412 and frame 421.Because the first and second pattern area all are connected with public area 420, so their relative position is fixed.Equally, because framework 130 and the first and second pattern area 411,412 are fixed together, therefore at pattern unit and public area after separating, between the first and second pattern area 411,412, still keep relatively-stationary position relationship.
The step S350 that the LED tube core is arranged on to step S320, the step S330 that realizes Bonding, the step S340 that completes encapsulating and cutting metal template on the second pattern area shown in execution graph 3 successively subsequently, thus produce the LED light emitting module.
Although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that and can be changed aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, so scope of the present invention will be limited by claim and the content be equal to.
Claims (10)
1. a light-emitting diode (LED) light emitting module comprises:
Metal support plate, it comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode;
At least one is arranged on the LED tube core of described the second pattern area, and itself and described the first pattern area are electrically connected; And
The framework of being made by insulating material, itself and described the first and second pattern area are fixed together.
2. LED light emitting module as claimed in claim 1, wherein, the quantity of described LED tube core is at least two, they by lead-in wire, realize being connected in series and with being connected of described the first pattern area.
3. LED light emitting module as claimed in claim 1, wherein, the quantity of described LED tube core is at least two, they are realized and being connected and being connected in series by lead-in wire and the realization of the second pattern area of described the first pattern area by lead-in wire.
4. LED light emitting module as described as any one in claim 1-3, wherein, cover the transparent silica gel that is mixed with fluorescent material on described LED tube core.
5. LED light emitting module as described as any one in claim 1-3, wherein, cover fluorescent material and transparent silica gel on described LED tube core successively.
6. a light-emitting diode (LED) light emitting module comprises:
Metal support plate, it comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode district;
A plurality of LED tube cores that are arranged on described the first and second pattern area, it links together and is electrically connected with described the first pattern area; And
The framework of being made by insulating material, itself and described the first and second pattern area are fixed together.
7. a method of manufacturing LED light emitting module as claimed in claim 1, comprise the following steps:
LED support is provided, it comprises metal form and a plurality of framework of being made by insulating material, described metal form comprises public area and a plurality of pattern unit, wherein, each described pattern unit is fixed together with one of them described framework and comprises the first pattern area and the second pattern area be connected with described public area;
For each described pattern unit, a plurality of LED tube cores are arranged on to described the second pattern area and by lead-in wire, described LED tube core and described the first pattern area are linked together; And
Each described pattern unit is cut down from described public area, so that described the first and second pattern area are not communicated with mutually.
8. a method of manufacturing LED light emitting module as claimed in claim 6, comprise the following steps:
LED support is provided, it comprises metal form and a plurality of framework of being made by insulating material, described metal form comprises public area and a plurality of pattern unit, wherein, each described pattern unit is fixed together with one of them described framework and comprises the first pattern area and the second pattern area be connected with described public area;
For each described pattern unit, a plurality of LED tube cores are arranged on to described the first and second pattern area and it is connected with described the first pattern area; And
Each described pattern unit is cut down from described public area, so that described the first and second pattern area are not communicated with mutually.
9. the method that light-emitting diode (LED) is set on the insulating heat-conductive substrate, comprise the following steps:
Metal support plate is provided, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, wherein, described the first pattern area is as electrode district, at least one LED tube core is arranged on described the second pattern area, and by lead-in wire, described LED tube core and described the first pattern area is electrically connected together; And
Described metal support plate is fixed in to the surface of described insulating heat-conductive substrate, wherein, described insulating heat-conductive substrate surface is formed with the wiring layer with described the first pattern area electrical connection.
10. the method that light-emitting diode (LED) is set on the insulating heat-conductive substrate, comprise the following steps:
Metal support plate is provided, described metal support plate comprises disconnected the first pattern area and the second pattern area mutually, and wherein, described the first pattern area is as electrode district, a plurality of LED tube cores are arranged on described the first and second pattern area, and described LED tube core and described the first pattern area are electrically connected together; And
Described metal support plate is fixed in to the surface of described insulating heat-conductive substrate, wherein, described insulating heat-conductive substrate surface is formed with the wiring layer with described the first pattern area electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101886913A CN103474565A (en) | 2012-06-08 | 2012-06-08 | Connection of light emitting diode unit and insulation heat conduction substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101886913A CN103474565A (en) | 2012-06-08 | 2012-06-08 | Connection of light emitting diode unit and insulation heat conduction substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103474565A true CN103474565A (en) | 2013-12-25 |
Family
ID=49799323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101886913A Pending CN103474565A (en) | 2012-06-08 | 2012-06-08 | Connection of light emitting diode unit and insulation heat conduction substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103474565A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104747934A (en) * | 2013-12-31 | 2015-07-01 | 赵依军 | LED lighting device providing directed beams |
| CN104879731A (en) * | 2015-05-25 | 2015-09-02 | 华南理工大学 | LED panel lamp with thermal conductive plastic frame free of substrate packaging |
| CN105299500A (en) * | 2014-06-30 | 2016-02-03 | 赵依军 | Light emitting diode (LED) lighting device used for providing directional light beam |
| CN107256922A (en) * | 2017-07-14 | 2017-10-17 | 湖南粤港模科实业有限公司 | A kind of aluminum foil type radiator and chip package integrated optical source structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874010A (en) * | 2005-06-03 | 2006-12-06 | 邢陈震仑 | Packaging device for LED in low thermal resistance |
| JP2007180227A (en) * | 2005-12-27 | 2007-07-12 | Toshiba Corp | Optical semiconductor device and its manufacturing method |
| DE102008026303A1 (en) * | 2007-06-01 | 2008-12-04 | I-Chiun Precision Industry Co., Ltd., Sinjhuang | Carrier for light-emitting-diode, has guiding band, metal support, which is connected with guiding band and covers range, and another metal base is connected with guiding band and cover another area |
-
2012
- 2012-06-08 CN CN2012101886913A patent/CN103474565A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874010A (en) * | 2005-06-03 | 2006-12-06 | 邢陈震仑 | Packaging device for LED in low thermal resistance |
| JP2007180227A (en) * | 2005-12-27 | 2007-07-12 | Toshiba Corp | Optical semiconductor device and its manufacturing method |
| DE102008026303A1 (en) * | 2007-06-01 | 2008-12-04 | I-Chiun Precision Industry Co., Ltd., Sinjhuang | Carrier for light-emitting-diode, has guiding band, metal support, which is connected with guiding band and covers range, and another metal base is connected with guiding band and cover another area |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104747934A (en) * | 2013-12-31 | 2015-07-01 | 赵依军 | LED lighting device providing directed beams |
| CN105299500A (en) * | 2014-06-30 | 2016-02-03 | 赵依军 | Light emitting diode (LED) lighting device used for providing directional light beam |
| CN104879731A (en) * | 2015-05-25 | 2015-09-02 | 华南理工大学 | LED panel lamp with thermal conductive plastic frame free of substrate packaging |
| CN107256922A (en) * | 2017-07-14 | 2017-10-17 | 湖南粤港模科实业有限公司 | A kind of aluminum foil type radiator and chip package integrated optical source structure |
| CN107256922B (en) * | 2017-07-14 | 2023-05-26 | 湖南粤港模科实业有限公司 | Aluminum foil type radiator and chip packaging integrated light source structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104180202A (en) | LED (light emitting diode) lamp wick and LED bulb lamp comprising LED lamp wick | |
| JP2005093681A (en) | Light-emitting device | |
| CN102709281A (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| US20110084612A1 (en) | Hybrid chip-on-heatsink device and methods | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| CN101980388A (en) | Radiator package-based LED device and manufacturing process for LED device | |
| US8441028B2 (en) | Light emitting device including a lighting emitting chip attached on a heat conductive layer via an undercoating and method of manufacturing the light emitting device | |
| CN103363332A (en) | LED bulb lamp with large light-emitting angle and manufacturing method thereof | |
| CN103474565A (en) | Connection of light emitting diode unit and insulation heat conduction substrate | |
| CN101126863A (en) | Light-emitting diode light source module with heat dissipation structure | |
| CN103672459A (en) | Light-emitting diode lighting device compact in structure and capable of providing directional light beams | |
| CN102593317B (en) | High-power high-brightness light-emitting diode (LED) light source packaging structure and packaging method thereof | |
| CN102723324A (en) | Double-face light emitting planar wafer type LED (Light-Emitting Diode) packaging structure | |
| CN103579210B (en) | The connection of light emitting diode and heat-radiating substrate | |
| CN101126485A (en) | Light source module possessing LED and its forming method | |
| CN103470968A (en) | Light emitting diode lamp core with large light emitting angle and illumination device with lamp core | |
| CN103367346A (en) | Novel high-power LED light source and implementation method thereof | |
| KR20070094480A (en) | Led reflector molding process, construction, and loader thereof | |
| CN106549090A (en) | Light emitting diode chip package | |
| CN103470969A (en) | LED (Light Emitting Diode) illumination device for generating directional light beams | |
| JP2010003946A (en) | Package of light emitting element, and manufacturing method of light emitting element | |
| CN105609496A (en) | High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof | |
| CN103322438A (en) | High-power LED projection lamp and manufacturing method thereof | |
| CN102322584A (en) | Ultrathin LED (light-emitting diode) surface light source based on COB (chip on board) packaging technology | |
| CN103574323A (en) | Light emitting diode illuminating apparatus capable of providing directed light beams |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131225 |