CN103444275A - Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method - Google Patents
Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method Download PDFInfo
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- CN103444275A CN103444275A CN2008800200212A CN200880020021A CN103444275A CN 103444275 A CN103444275 A CN 103444275A CN 2008800200212 A CN2008800200212 A CN 2008800200212A CN 200880020021 A CN200880020021 A CN 200880020021A CN 103444275 A CN103444275 A CN 103444275A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Provided is a plating method for embedding inside a through hole and a via hole by an electrolytic method. By the method, manufacture cost is reduced, and a shift between a surface of an embedded metal layer and an outer layer surface of a printed wiring is reduced. In the embedding copper plating method for manufacture of printed wiring boards, inside the via hole or the through hole having a conductive film is embedded by electroplating. The method is provided with a two-stage plating step which is composed of a first embedding copper plating step and a second embedding copper plating step. A copper plating liquid having the same composition is used for the first embedding copper plating step and the second embedding copper plating step.
Description
Technical field
The printed circuit board (PCB) that the present invention relates to the copper facing fill method of printed circuit board (PCB) manufacture use and use this copper facing fill method to obtain.
Background technology
In recent years, electronic instrument, electric product are required miniaturization, high performance, multifunction etc.Therefore, the printed circuit board (PCB) used in the control of the signal of telecommunication of these products and power supply also requires miniaturization.And, with regard to the miniaturization of printed circuit board (PCB), the viewpoint required from the high speed that meets signaling rate simultaneously, adopt multilayer board always.
This multilayer board is the printed circuit board (PCB) circuit layer more than three layers is laminated by insulating resin layer.In order to ensure the conducting between the multilayer board circuit layer of this stacked state, as the interlayer conduction member, adopt through hole as disclosed as patent documentation 1, as patent documentation 2 disclosed vias etc.
The interlayer conduction member of this through hole of picture and via, or be the hole that connects the insulating resin layer of printed circuit board (PCB), or be similar to the cave of the recess shapes of so-called blind hole, form the interlayer conduction electrodeposited coating at least within it on wall.Exposed the insulating resin layer without conductivity on internal face due to the through hole before electroplating and via, therefore, by carrying out successively electroless plating, metallide forms this interlayer conduction electrodeposited coating.
To the functional requirement of through hole and via, so long as can guarantee that the conducting between the superposing circuit face gets final product.Therefore, above-mentioned interlayer conduction is electroplated, and the internal face usually needed only at through hole and via forms conductor layer, and needn't proceed to the degree of the inside that can fill this through hole and via.Yet, if electroplating the inside of rear through hole and via, interlayer conduction is empty shape, in the etching and processing of the outer conductive layer carried out after interlayer conduction is electroplated, while pasting resist layer, around the hole of through hole and via, occur inhomogeneous, perhaps, can't installing component at the position of through hole and via, also limited the miniaturization of printed circuit board (PCB).
So the method for the internal voids of through hole and via is filled in employing always.For example, in patent documentation 3, as the method that forms planarization multilayer line layer, following method is disclosed, that is, and evaporation catalyst on the first line layer bottom through hole and Etching mask, catalyst on Etching mask and Etching mask is removed simultaneously, thereby can independently make with the material of through hole bottom the activation of through hole lower surface, electroplate thus filling by electroless plating in through hole, form electrodeposited coating.Its result, can form without step-like smooth multilayer line layer, prevents the fracture in each layer of step, can access good interlayer and connect.
In addition, in patent documentation 4, for the through hole that makes circuit board two surperficial conductings being provided and installing with pad at same position, and the economical printed circuit board (PCB) that erection space is large, adopt following method, , filled conductive printing ink in the through hole arranged on the double-sided copper-clad laminated sheet, and after making it to solidify under defined terms, electrolytic copper plating is implemented on two surfaces at above-mentioned double-sided copper-clad laminated sheet, thereby form the copper electrodeposited coating, then form and use printing ink by dry film or other circuit, circuit directly over the above-mentioned electrically conductive ink of describing to make parts to install on above-mentioned copper electrodeposited coating to be arranged on pad after solidifying, and by formation circuit such as etchings.
And then, in patent documentation 5, its purpose is to provide a kind of also can fill the plating filling perforation method in the minor diameter via that length-width ratio is large well by copper facing, the method is characterized in that, comprise following operation: the resin coated copper that forms resin coated copper on the wall of the surface of insulating layer that comprises substrate and via bottom surface forms operation; In being added with the aqueous solution of electroplating promoter, dipping is formed with the substrate of resin coated copper, thereby makes to electroplate the dipping process that promoter is attached to the resin coated copper surface; On the resin coated copper surface beyond the internal face that comprises the via bottom surface, remove the stripping process of accompanying plating promoter; And, after stripping process, at the resin coated copper that is formed at surface of insulating layer, with comprising on the resin coated copper formed on the wall of via bottom surface, implement electrolytic copper plating, thereby fill the electrolytic copper plating operation of plated metal in via.
Patent documentation 3:JP Unexamined Patent 5-166939 communique
Patent documentation 4:JP Unexamined Patent 5-218618 communique
Patent documentation 5:JP JP 2001-291954 communique
Summary of the invention
The problem that invention will solve
Yet, there are the following problems in above-mentioned patent documentation 3～patent documentation 5 inventions disclosed point.
In patent documentation 3 inventions disclosed, adopt non-electrolytic plating method to form the electrodeposited coating that is filled in the state in through hole.Because this non-electrolytic plating method is not switched on, therefore aspect cost, be superior, still, during the plating carrying out filling, than electrolysis, need the time in through hole, be not therefore the method for productivity ratio excellence.In addition, the surface of the filling electrodeposited coating that will form by non-electrolytic plating method, from the position of the superficies of printed wire with the Deviation Control of depth direction at 5 μ m with interior and to form be difficult.Therefore, if this filling arranges resist layer at skin after electroplating, resist layer becomes the state of suspension at the filling electrodeposited coating position of depression, and while being exposed in order to form the resist pattern, easily the generation exposure is unintelligible, therefore is difficult to form micro-interval circuit.And, if the deviation of the depth direction at through hole position surpasses 5 μ m, pad also can not be installed the filling plate surface of through hole as parts and use.
In addition, in patent documentation 4 inventions disclosed, by being arranged on the through hole filled conductive printing ink on the double-sided copper-clad laminated sheet and making it curing, thereby fill through hole.Yet, conductive ink is to consist of resinous principle and metallic composition, when solidifying this conductive ink, significant shrinkage phenomenon occurs, therefore, be difficult to make fill and the position consistency of the surface of curing conductive ink and the superficies of printed wire, easily produce thus the deviation over 5 μ m thereby the generation problem identical with patent documentation 3 on the depth direction at this through hole position.
In contrast to this, patent documentation 5 adopts with copper component fills the method in via, while with copper, filling final via, uses electro-coppering., according to the disclosed content of patent documentation 5, must possess following operation: " resin coated copper that forms resin coated copper on the wall of the surface of insulating layer that comprises substrate and via bottom surface forms operation ", " in being added with the aqueous solution of electroplating promoter, dipping is formed with the substrate of resin coated copper, thereby make to electroplate the dipping process that promoter is attached to the resin coated copper surface ", " removal comprises the stripping process of plating promoter accompanying on the internal face resin coated copper surface in addition of via bottom surface ", " after stripping process, implement electrolytic copper plating on the resin coated copper of the resin coated copper formed and the wall formation that comprises the via bottom surface on surface of insulating layer, fill thus the electrolytic copper plating operation of plated metal in via ".At this, will " in being added with the aqueous solution of electroplating promoter, dipping is formed with the substrate of resin coated copper; thus make to electroplate the dipping process that promoter is attached to the resin coated copper surface " and " removal comprises the stripping process of plating promoter accompanying on the internal face resin coated copper surface in addition of via bottom surface " as necessary operation, mean that process number will correspondingly increase, and production cost increases.
Known from above narration, wish to develop the plating fill method of a kind of through hole and via, the method is finally to use electrolysis to fill the electro-plating method of the inside of through hole and via, its production cost excellence, easily make to fill the electrodeposition of metals surface of through hole and via and the position consistency of the superficies of printed wire, and can form recess occupied state still less.
For solving the method for problem
So the inventor etc., through the result of concentrated research, have expected the via of the following stated or the copper facing fill method of through hole.
Copper facing fill method of the present invention: copper facing fill method of the present invention adopts the copper facing fill method of printed circuit board (PCB) manufacture use, to fill the copper facing fill method of the inside of via with conductive film covering or through hole by galvanoplastic, it is characterized in that, electroplating work procedure with two steps that formed by the first copper facing filling work procedure and the second copper facing filling work procedure, the copper electroplating liquid of use same composition in this first copper facing filling work procedure and the second copper facing filling work procedure.
In copper facing fill method of the present invention, it is that 20 ℃～30 ℃, copper concentration are the copper electroplating liquid more than 30g/L that preferred above-mentioned copper electroplating liquid is used liquid temperature.
In copper facing fill method of the present invention, preferably between above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure, arrange 1 second～600 second without conduction time.
In copper facing fill method of the present invention, preferably above-mentioned the first copper facing filling work procedure adopts and carries out the copper facing filling than the larger current density of current density of using in above-mentioned the second copper facing filling work procedure.
In copper facing fill method of the present invention, preferably above-mentioned the first copper facing filling work procedure adopts 1A/dm
2～5A/dm
2the current density of scope is implemented copper facing.
In copper facing fill method of the present invention, preferably above-mentioned the first copper facing filling work procedure is by using 1A/dm
2～5A/dm
2a plurality of sub-electroplating work procedure of the current density of scope forms.
And, also preferably between the operation of above-mentioned a plurality of sub-electroplating work procedures, at least arrange 1 second～600 second without conduction time.
In addition, preferred above-mentioned the first copper facing filling work procedure carries out forming the copper facing filling of 0.3 μ m～5 μ m thickness.
In copper facing fill method of the present invention, preferably above-mentioned the second copper facing filling work procedure adopts 0.5A/dm
2～4A/dm
2the current density of scope is carried out copper facing.
Printed circuit board (PCB) of the present invention: printed circuit board (PCB) of the present invention is characterised in that, adopts the copper facing fill method of above-mentioned printed circuit board (PCB) manufacture use to carry out the copper facing filling.
The effect of invention
The copper facing fill method of printed circuit board (PCB) manufacture use of the present invention, although there is above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure, even the current density in this each operation during electrolysis is variant, but can use identical copper electroplating liquid, can shorten operation.And, owing to can using identical copper electroplating liquid, copper facing can also be filled to manufacturing line and be designed to a production line, can realize the reduction of manufacturing equipment cost and management cost, its result, also can realize the reduction of the manufacturing cost of printed circuit panel products.
And, in the copper facing fill method of this printed circuit board (PCB) manufacture use, use identical copper electroplating liquid in whole plating fill process, and finally adopt electrolytic plating method, thus, easily control the copper coatings state of filling through hole and via.Its result, the printed circuit board (PCB) that uses this copper facing fill method to manufacture, easily make the copper facing filling face of its through hole and via and the superficies position consistency of printed wire, can form the occupied state that 5 μ m are few with interior depth direction deviation, thus, it is also good that surperficial adherence is filled in the resist layer formed afterwards and the copper facing of through hole and via, and the exposure that can not produce resist layer is unintelligible, therefore, form the ability excellence of micro-interval circuit.And then, because the depression of through hole and via is few, therefore, the copper facing of through hole and via is filled to surface and as parts installation pad, use and also become easy.
The accompanying drawing explanation
Fig. 1 is the metal microstructure sem observation photo (Sample A) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 2 is the metal microstructure sem observation photo (sample B) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 3 is the metal microstructure sem observation photo (sample C) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 4 is the metal microstructure sem observation photo (sample D) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 5 is the metal microstructure sem observation photo (sample E) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 6 is the metal microstructure sem observation photo (sample F) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 7 is the metal microstructure sem observation photo (sample G) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 8 is the metal microstructure sem observation photo (sample H) of the blind hole section that uses the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention to obtain.
Fig. 9 is the metal microstructure sem observation photo of the blind hole section of the duplicate that obtains of comparative example.
Embodiment
Below, each execution mode of copper facing fill method of the present invention and printed circuit board (PCB) of the present invention is described.
The execution mode of copper facing fill method of the present invention: copper facing fill method of the present invention is to fill the copper facing fill method of the inside of via with conductive film covering or through hole by galvanoplastic.In copper facing fill method of the present invention, due to the inside that will fill by galvanoplastic " via or through hole " as purpose, therefore, be obviously that multilayer board more than the double-sided printed-circuit board with two-tier circuit layer in printed circuit board (PCB) is as object.This be because, in the situation that single-clad board is the cause that does not need to arrange via or through hole.
Below, illustrate at this said " conductive film covering ".This conductive film covering typically refers to the resin coated copper that formed by electroless plating, nickel overlay film, golden overlay film etc.That is, the via of printed circuit board (PCB) or through hole, be to use mechanical boring, laser processing etc. carry out perforate processing and form on printed circuit board (PCB).Expose the resin bed that the insulating resin substrate is arranged on via after this perforate processing or the internal face of through hole, owing to not switching on, therefore, the metal level by non-electrolytic plating method wall formation within it as conductive film covering.Thereby the material of this conductive film covering so long as can switch on and get final product with the adherence of insulating resin substrate is excellent, can be used material arbitrarily.
In addition, copper facing fill method of the present invention has the electroplating work procedure of two steps that consist of the first copper facing filling work procedure and the second copper facing filling work procedure.And its maximum feature is to use the copper electroplating liquid of same composition in this first copper facing filling work procedure and the second copper facing filling work procedure.
At this, the common copper electroplating liquid used in the first copper facing filling work procedure and the second copper facing filling work procedure is described.Copper electroplating liquid used herein, preferably used copper concentration for the copper electroplating liquid more than 30g/L.As long as meet this condition, no longer limit sulfuric acid and be copper electroplating liquid, pyrophosphoric acid and be the electrolyte system of copper electroplating liquid etc.At this, when copper concentration during lower than 30g/L, when the speed of separating out of copper is slack-off, copper concentration is more low more be can not get uniform copper facing and fills.In addition, more preferably use copper concentration for the copper electroplating liquid more than 50g/L.This is because the filling capacity of not only separating out copper is stable, also improves the cause of separating out surperficial flatness.And, there is no the upper limit of special provision copper concentration at this.Its reason is to have following liquid temperature, and concentration can be risen to the cause of the saturated concentration under following liquid temperature scope.
Preferred above-mentioned copper electroplating liquid is used the electrolyte that liquid temperature is adjusted into to 20 ℃～30 ℃ of scopes.In electro-coppering, the key factor of the copper electrodeposited coating proterties that liquid temperature is separated out about being.For example, the hardness, crystalline texture, density of copper etc. are separated out in impact.The result of these being concentrated one's attention on to research to implement copper facing to be filled to prerequisite, shown that above-mentioned scope is best conclusion.At this, when liquid temperature during lower than 20 ℃, although can access density high separate out copper, speed of separating out is slack-off., from industrial viewpoint, consider simultaneously, for liquid temperature being adjusted into to the temperature lower than 20 ℃, must carry out this copper electroplating liquid coolingly, also affect equipment cost.On the other hand, when liquid temperature surpasses 30 ℃, although the speed of separating out of copper accelerates, but carry out in the copper facing filling process can not get smooth plate surface, be difficult to the Deviation Control of depth direction in 5 μ m, so that the position consistency of the superficies of face and printed wire is filled in the copper facing of through hole and via.In order further to guarantee the meaning of above-mentioned control liquid temperature, preferably liquid temperature is controlled to 22 ℃～28 ℃, more preferably be controlled at the scope of 23 ℃～26 ℃.
And, in copper facing fill method of the present invention, preferably between above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure, arrange regulation without conduction time.That is, above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure can be designed as a copper facing filling manufacturing line, be the very large advantage that adopts copper facing fill method of the present invention.
Now, above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure also can be set continuously, thereby the current density of using changes over the current density of using in above-mentioned the second copper facing filling work procedure continuously from above-mentioned the first copper facing filling work procedure.Yet, in copper facing fill method of the present invention, in the current density of carrying out using from above-mentioned the first copper facing filling work procedure during to the change of the current density of using in above-mentioned the second copper facing filling work procedure, if without "on" position, official hour is not set to what there is no an electric current, do not go the plating condition of operation separately of clearly separating, thereby do not avoid the words of the electroplating operations of above-mentioned the first copper facing filling work procedure on the impact of above-mentioned the second copper facing filling work procedure, be difficult to the copper facing of through hole and via filling face consistent with the Position Control of the superficies of printed wire, and the 5 μ m that remain on depth direction are with in interior accuracy rating.
At this, if this without conduction time lower than 1 second, above-mentioned the second copper facing filling work procedure can be subject to the impact of the electroplating operations of above-mentioned the first copper facing filling work procedure, can't clearly separate each operation, can't realize that copper facing fills the planarization of face.On the other hand, if this is without surpassing for 600 seconds conduction time, in the first copper facing filling work procedure, the copper electrodeposited coating of the formed state of activation is in without the state in being exposed to atmospheric environment or solution under "on" position, therefore, carry out oxidation and cause the formation of useless cupric oxide, tack variation between the copper electrodeposited coating that makes to form in the copper electrodeposited coating that forms in the first copper facing filling work procedure and the second copper facing filling work procedure, simultaneously, uniform copper facing filling can't be carried out, the planarization of copper facing filling face can't be realized.In addition, in order more positively to realize arranging the above-mentioned meaning without conduction time, preferably without being conduction time 5 seconds～500 seconds, more preferably 10 seconds～350 seconds.
Below, the current density of using in the above-mentioned first copper facing filling work procedure of copper facing fill method of the present invention and above-mentioned the second copper facing filling work procedure is described.At first, " current density of using in above-mentioned the first copper facing filling work procedure (and below; be called the first current density) " and " current density of using in above-mentioned the second copper facing filling work procedure (below, be called the second current density) " even between the relation of relation [the first current density]=[the second current density] also be fine.This be because, above-mentioned without conduction time by arranging between above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure, can realize the cause of good copper facing filling.
And, with regard to current density, preferably meet the relation of [the first current density]>[the second current density].That is, in above-mentioned the first copper facing filling work procedure, use high current density, thus the surface of the tack excellence of the electro-coppering that forms and form thereon afterwards.And, approach uniform plating condition in order to make the plating condition, by using the second copper facing filling work procedure of low current density, the copper electrodeposited coating is grown on the copper electrodeposited coating formed in above-mentioned the first copper facing filling work procedure equably.
Now, preferably above-mentioned the first copper facing filling work procedure adopts 1A/dm
2～5A/dm
2the current density of scope is implemented copper facing.Herein, when the current density of the first copper facing filling work procedure lower than 1A/dm
2the time, can not get the surface with the tack excellence of the electro-coppering formed afterwards thereon, lost the meaning that the first copper facing filling work procedure is set.On the other hand, the current density when the first copper facing filling work procedure surpasses 5A/dm
2the time, the surface of copper electrodeposited coating is too coarse, thus the surface state of the copper electrodeposited coating formed in the second copper facing filling work procedure becomes coarse, thereby not preferred.
And then this first copper facing filling work procedure can be also the multi-step electroplating work procedure consisted of a plurality of sub-electroplating work procedures.That is, consider that the first copper facing filling work procedure is the operation for high value by current settings, carries out the energising under high electric current several times.For example, if carry out continuously the energising under the high electric current in 10 seconds, at the jog of formed electrodeposited coating, cause that electric current concentrates, thereby easily section is separated out in formation extremely.But, if will be the energising under the high electric current in 10 seconds equally, to repeat 5 times each 2 seconds, the surface of formed electrodeposited coating, just without extremely separating out section, can access and have evenly fine concavo-convex surface.Therefore, preferably the first copper facing filling work procedure is arranged to the multi-step electroplating work procedure consisted of a plurality of sub-electroplating work procedures.
At this, in sub-electroplating work procedure, adopt the 1A/dm used at above-mentioned the first copper facing filling work procedure
2～5A/dm
2the current density of scope.This is based on reason same as described above.And, between the operation of above-mentioned a plurality of sub-electroplating work procedures, also preferably arrange at least one times 1 second～600 second without conduction time.This meaning without conduction time is set also same as described above.
In the above-mentioned first copper facing filling work procedure of above narration, preferably carry out forming the copper facing filling of 0.3 μ m～5 μ m thickness.Once carry out the copper facing lower than 0.3 μ m thickness in this first copper facing filling work procedure, can't form and pass through afterwards the copper coatings of the tack excellence of the formed electro-coppering of the second copper facing filling work procedure thereon.On the other hand, if surpass the copper facing of 5 μ m thickness in this first copper facing filling work procedure, the surperficial chap of this copper electrodeposited coating, thereon by after the copper facing of the electro-coppering that forms of the second copper facing filling work procedure fill surperficial chap, thereby not preferred.
In the second copper facing filling work procedure carried out after the above-mentioned first copper facing filling work procedure of above narration, preferably adopt 0.5A/dm
2～4A/dm
2the current density of scope is implemented copper facing and is filled.At this, if the current density of the second copper facing filling work procedure is lower than 0.5A/dm
2, the speed of separating out of copper is slack-off, has lost the meaning of using copper electroplating method, simultaneously, can not meet the productivity ratio of industrial requirement.On the other hand, if the current density of the second copper facing filling work procedure surpasses 4A/dm
2, the speed of separating out of copper is too fast, and surperficial chap is filled in copper facing, thereby not preferred.
Printed circuit board (PCB) of the present invention: printed circuit board (PCB) of the present invention, it is characterized in that, adopt the copper facing fill method enforcement through hole of above-described printed circuit board (PCB) manufacture use and/or the copper facing of via to fill.Therefore, to the formation number of plies of printed circuit board (PCB), material, size, the kind of the Copper Foil that uses, thickness of Copper Foil etc., there is no particular limitation.But, as described above, printed circuit board (PCB) to as if there is the printed circuit board (PCB) of circuit layer more than three layers.
Embodiment
In this embodiment, mean according to the flow process shown in following table 1, in the blind hole of the diameter 100 μ m that arrange by the laser beam drilling method, implement the result that 8 kinds of copper facing are filled on double-sided printed-circuit board.At this, from a side surface of double-sided printed-circuit board, by carbonic acid gas laser, form the blind hole shape of diameter 100 μ m.Then, for the internal perisporium to this blind hole is given conductivity, each preliminary treatment that implement alkali degreasing, adjusting, catalysis (Sn-Pd colloid), promotes and carry out electroless plating copper, form electrolytic copper free electroplating layer that 0.3 μ m is thick as conductive film covering.
Then, according to the operation shown in following table 1, to carrying out the copper facing filling in this blind hole.In the acid degreasing shown in table 1, (commodity are by name: メ Le プ レ mono-ト PC-316) for the acid degreasing agent that has used Merude Co., Ltd. (Meltex Incorporated) to manufacture.In activation processing, use the dilution heat of sulfuric acid (room temperature) that sulfuric acid concentration is 10wt%.In antirust processing, the BTA solution that working concentration is 10wt%.In addition, in the first copper facing filling work procedure and the second copper facing filling work procedure, adopt copper sulphate, use and contain the sulfuric acid copper electroplating liquid that copper concentration is 50ppm for 50g/L, free sulfuric acid for 70g/L, chloride ion.
Then, the current density as the first copper facing filling work procedure adopts 2.0A/dm
2, adopt 1.5A/dm as the current density of the second copper facing filling work procedure
2, separate out the copper layer in blind hole, so that the gross thickness of copper layer reaches 25 μ m.In addition, by between the first copper facing filling work procedure and the second copper facing filling work procedure without being set as 10 seconds conduction time.And then, in the situation that form the first copper facing filling work procedure by a plurality of sub-electroplating work procedures, between sub-electroplating work procedure, also arrange 5 seconds without conduction time.
Table 1
| Operation | Processing time |
| Acid degreasing process | 3 minutes |
| Washing step | 2 minutes |
| The activation processing operation | 1 minute |
| The first copper facing filling work procedure | Minute 4.5 (2 μ m thickness), 11.3 minutes (5 μ m thickness) |
| The second copper facing filling work procedure | 60～70 minutes (can make gross thickness reach the time of 25 μ m) |
| Washing step | 1 minute |
| Antirust and dry | 1 minute |
In table 2 below, with 8 kinds of copper facing, fill the corresponding and position of superficies of simultaneously having put down in writing the copper facing filling face of this blind hole and printed wire of condition at the deviation of depth direction (in table 2 referred to as " gap ").8 kinds of samples that will obtain at this in addition, are expressed as Sample A～sample H.And meaned the photo of the blind hole section by obtaining in this embodiment of metal microstructure sem observation in Fig. 1～Fig. 8.In accompanying drawing, the part shown in arrow is gap, and still, clearly stating at this width that this arrow means not is to mean gap length accurately.
Comparative example
In this comparative example, omit the first copper facing operation of embodiment, only by the second copper facing filling work procedure, carried out the copper facing filling of this blind hole.In order to compare with embodiment, its result is recorded in table 2.Fig. 9 means the photo of the blind hole section by obtaining in this comparative example of metal microstructure sem observation.In addition, illustrate that at this multiplying power of Fig. 1～Fig. 8 of this Fig. 9 and embodiment has some difference.
Table 2
The contrast of embodiment and comparative example: from above-mentioned table 2, the gap of the Sample A of embodiment～sample H is all below 0.5 μ m.In contrast to this, the gap of duplicate means to surpass the value of 5 μ m.That is, can say that the situation of filling with the electrolytic copper plating of implementing once electrolytic copper facing and fill to carry out blind hole compares, while implementing respectively the first copper facing operation and the second copper facing filling work procedure, can access good filling capacity and occupied state.
Industrial applicibility
Although the copper facing fill method of printed circuit board (PCB) manufacture use of the present invention has above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure, can use identical copper electroplating liquid, can shorten operation.Therefore, also copper facing can be filled to manufacturing line and be designed to a production line, can realize the reduction of manufacturing equipment cost and management cost.And, the printed circuit board (PCB) obtained by the copper facing fill method of this printed circuit board (PCB) manufacture use, can easily make the copper facing of through hole and via fill the position consistency of the superficies of face and printed wire, the deviation that can form depth direction at 5 μ m with interior occupied state, the adherence of the resist layer formed afterwards is good, is applicable to being applied in the formation of micro-interval circuit.And, because the depression of through hole and via is few, therefore, also can easily the copper facing of through hole and via be filled to surface, as parts, the pad use is installed.
Claims (10)
1. the copper facing fill method of a printed circuit board (PCB) manufacture use, fill via with conductive film covering or the inside of through hole by galvanoplastic, it is characterized in that, electroplating work procedure with two steps that formed by the first copper facing filling work procedure and the second copper facing filling work procedure, the copper electroplating liquid of use same composition in this first copper facing filling work procedure and the second copper facing filling work procedure.
2. the copper facing fill method of printed circuit board (PCB) manufacture use according to claim 1, wherein, it is that 20 ℃～30 ℃, copper concentration are the copper electroplating liquid more than 30g/L that above-mentioned copper electroplating liquid is used liquid temperature.
3. the copper facing fill method of printed circuit board (PCB) manufacture use according to claim 1 and 2, wherein, between above-mentioned the first copper facing filling work procedure and above-mentioned the second copper facing filling work procedure, arrange 1 second～600 second without conduction time.
4. according to the copper facing fill method of the described printed circuit board (PCB) manufacture of any one in claim 1～3 use, wherein, above-mentioned the first copper facing filling work procedure adopts and carries out the copper facing filling than the larger current density of current density of using in above-mentioned the second copper facing filling work procedure.
5. according to the copper facing fill method of the described printed circuit board (PCB) manufacture of any one in claim 1～4 use, wherein, above-mentioned the first copper facing filling work procedure adopts 1A/dm
2～5A/dm
2the current density of scope is implemented copper facing.
6. according to the copper facing fill method of the described printed circuit board (PCB) manufacture of any one in claim 1～5 use, wherein, above-mentioned the first copper facing filling work procedure is by using 1A/dm
2～5A/dm
2a plurality of sub-electroplating work procedure of the current density of scope forms.
7. the copper facing fill method of printed circuit board (PCB) manufacture use according to claim 6, wherein, between the operation of above-mentioned a plurality of sub-electroplating work procedures, at least arrange 1 second～600 second without conduction time.
8. according to the copper facing fill method of the described printed circuit board (PCB) manufacture of any one in claim 1～7 use, wherein, above-mentioned the first copper facing filling work procedure carries out forming the copper facing of 0.3 μ m～5 μ m thickness.
9. according to the copper facing fill method of the described printed circuit board (PCB) manufacture of any one in claim 1～7 use, wherein, above-mentioned the second copper facing filling work procedure adopts 0.5A/dm
2～4A/dm
2the current density of scope.
10. a printed circuit board (PCB), is characterized in that, by the copper facing fill method of the described printed circuit board (PCB) manufacture of any one use in the claims 1～9, through hole and/or via implemented to the copper facing filling.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP159577/2007 | 2007-06-15 | ||
| JP2007159577 | 2007-06-15 | ||
| PCT/JP2008/061010 WO2008153185A1 (en) | 2007-06-15 | 2008-06-16 | Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103444275A true CN103444275A (en) | 2013-12-11 |
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ID=40129785
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800200212A Pending CN103444275A (en) | 2007-06-15 | 2008-06-16 | Embedding copper plating method for manufacture of printed wiring board, and printed wiring board obtained by using the embedding copper plating method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5247252B2 (en) |
| CN (1) | CN103444275A (en) |
| WO (1) | WO2008153185A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105612821A (en) * | 2013-10-09 | 2016-05-25 | 日立化成株式会社 | Method for manufacturing multilayer wiring substrate |
| US10165691B2 (en) | 2013-10-09 | 2018-12-25 | Hitachi Chemical Company, Ltd. | Method for manufacturing multilayer wiring substrate |
| CN109327975A (en) * | 2017-07-31 | 2019-02-12 | 奥特斯奥地利科技与***技术有限公司 | The method and plater that zero defect copper for the hole in component load-bearing part is filled |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5247252B2 (en) * | 2007-06-15 | 2013-07-24 | メルテックス株式会社 | Embedded copper plating method for printed wiring board manufacture and printed wiring board obtained by using the embedded copper plating method |
| JP6241641B2 (en) | 2013-03-28 | 2017-12-06 | 日立化成株式会社 | Manufacturing method of multilayer wiring board |
| CN103533776A (en) * | 2013-09-18 | 2014-01-22 | 金悦通电子（翁源）有限公司 | Method for manufacturing embedded PCB (printed circuit board) |
| JP6350063B2 (en) * | 2013-10-09 | 2018-07-04 | 日立化成株式会社 | Multilayer wiring board |
| CN104661446A (en) * | 2015-02-10 | 2015-05-27 | 深圳市五株科技股份有限公司 | Circuit board processing method |
| JP6641717B2 (en) | 2015-04-08 | 2020-02-05 | 日立化成株式会社 | Method for manufacturing multilayer wiring board |
| US10512174B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| US10508357B2 (en) * | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| EP4063533A1 (en) * | 2021-03-25 | 2022-09-28 | Atotech Deutschland GmbH & Co. KG | A process for electrochemical deposition of copper with different current densities |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1132500A3 (en) * | 2000-03-08 | 2002-01-23 | Applied Materials, Inc. | Method for electrochemical deposition of metal using modulated waveforms |
| JP3941433B2 (en) * | 2001-08-08 | 2007-07-04 | 株式会社豊田自動織機 | How to remove smear in via holes |
| JP4000796B2 (en) * | 2001-08-08 | 2007-10-31 | 株式会社豊田自動織機 | Via hole copper plating method |
| JP3780302B2 (en) * | 2002-02-27 | 2006-05-31 | 株式会社関東学院大学表面工学研究所 | Method for plating substrate having via hole and through hole |
| JP2003318544A (en) * | 2002-04-22 | 2003-11-07 | Toppan Printing Co Ltd | Multilayer wiring board and its manufacturing method |
| JP2004128053A (en) * | 2002-09-30 | 2004-04-22 | Sumitomo Bakelite Co Ltd | Manufacturing method of multilayer printed wiring board |
| JP3937993B2 (en) * | 2002-10-02 | 2007-06-27 | 日立電線株式会社 | Wiring board manufacturing method |
| JP4457843B2 (en) * | 2004-10-15 | 2010-04-28 | 住友ベークライト株式会社 | Circuit board manufacturing method |
| JP5247252B2 (en) * | 2007-06-15 | 2013-07-24 | メルテックス株式会社 | Embedded copper plating method for printed wiring board manufacture and printed wiring board obtained by using the embedded copper plating method |
-
2008
- 2008-06-16 JP JP2008157287A patent/JP5247252B2/en active Active
- 2008-06-16 WO PCT/JP2008/061010 patent/WO2008153185A1/en active Application Filing
- 2008-06-16 CN CN2008800200212A patent/CN103444275A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105612821A (en) * | 2013-10-09 | 2016-05-25 | 日立化成株式会社 | Method for manufacturing multilayer wiring substrate |
| CN105612821B (en) * | 2013-10-09 | 2018-06-22 | 日立化成株式会社 | The manufacturing method of multi-layered wiring board |
| US10076044B2 (en) | 2013-10-09 | 2018-09-11 | Hitachi Chemical Company, Ltd. | Method for manufacturing multilayer wiring substrate |
| US10165691B2 (en) | 2013-10-09 | 2018-12-25 | Hitachi Chemical Company, Ltd. | Method for manufacturing multilayer wiring substrate |
| CN109327975A (en) * | 2017-07-31 | 2019-02-12 | 奥特斯奥地利科技与***技术有限公司 | The method and plater that zero defect copper for the hole in component load-bearing part is filled |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008153185A1 (en) | 2008-12-18 |
| JP5247252B2 (en) | 2013-07-24 |
| JP2009021581A (en) | 2009-01-29 |
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