CN103379745A - 电子部件安装基板的制造方法 - Google Patents

电子部件安装基板的制造方法 Download PDF

Info

Publication number: CN103379745A
Authority: CN; China
Prior art keywords: pad; solder joint; center; scolder; welding
Prior art date: 2012-04-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN2012105258171A

Other languages

English (en)

Chinese (zh)

Inventor

疋田笃人

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujifilm Business Innovation Corp

Original Assignee

Fuji Xerox Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-04-11

Filing date

2012-12-07

Publication date

2013-10-30

2012-12-07 Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd

2013-10-30 Publication of CN103379745A publication Critical patent/CN103379745A/zh

Status Pending legal-status Critical Current

Links

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Electric Connection Of Electric Components To Printed Circuits (AREA)
Wire Bonding (AREA)

CN2012105258171A 2012-04-11 2012-12-07 电子部件安装基板的制造方法 Pending CN103379745A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2012-090446		2012-04-11
JP2012090446A JP5062376B1 (ja)	2012-04-11	2012-04-11	電子部品実装基板の製造方法

Publications (1)

Publication Number	Publication Date
CN103379745A true CN103379745A (zh)	2013-10-30

Family

ID=47189600

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN2012105258171A Pending CN103379745A (zh)	2012-04-11	2012-12-07	电子部件安装基板的制造方法

Country Status (2)

Country	Link
JP (1)	JP5062376B1 (ja)
CN (1)	CN103379745A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107231743A (zh) *	2017-07-26	2017-10-03	中航海信光电技术有限公司	一种模块用信号线布线方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103037633B (zh) *	2012-12-13	2015-08-12	无锡江南计算技术研究所	表面贴装器件防焊接偏移方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH1050773A (ja) *	1996-08-05	1998-02-20	Ngk Spark Plug Co Ltd	半導体装置並びに半導体素子及び基板
CN1611929A (zh) *	2003-10-27	2005-05-04	安捷伦科技有限公司	使用x射线检查印刷组件改进缺陷焊点检测的方法和装置
US20050127487A1 (en) *	2003-12-12	2005-06-16	Tae-Sub Chang	Semiconductor package with improved solder joint reliability
CN102164473A (zh) *	2010-02-16	2011-08-24	雅马哈发动机株式会社	元件安装装置以及元件安装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6221298A (ja) *	1985-07-22	1987-01-29	沖電気工業株式会社	チツプ形電子部品の実装方法
JP3656543B2 (ja) *	2000-10-25	2005-06-08	松下電器産業株式会社	電子部品実装方法
JP4181759B2 (ja) *	2001-06-01	2008-11-19	日本電気株式会社	電子部品の実装方法および実装構造体の製造方法
JP2004055827A (ja) *	2002-07-19	2004-02-19	Ngk Spark Plug Co Ltd	配線基板の製造方法

2012
- 2012-04-11 JP JP2012090446A patent/JP5062376B1/ja not_active Expired - Fee Related
- 2012-12-07 CN CN2012105258171A patent/CN103379745A/zh active Pending

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH1050773A (ja) *	1996-08-05	1998-02-20	Ngk Spark Plug Co Ltd	半導体装置並びに半導体素子及び基板
CN1611929A (zh) *	2003-10-27	2005-05-04	安捷伦科技有限公司	使用x射线检查印刷组件改进缺陷焊点检测的方法和装置
US20050127487A1 (en) *	2003-12-12	2005-06-16	Tae-Sub Chang	Semiconductor package with improved solder joint reliability
CN102164473A (zh) *	2010-02-16	2011-08-24	雅马哈发动机株式会社	元件安装装置以及元件安装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107231743A (zh) *	2017-07-26	2017-10-03	中航海信光电技术有限公司	一种模块用信号线布线方法

Also Published As

Publication number	Publication date
JP5062376B1 (ja)	2012-10-31
JP2013219284A (ja)	2013-10-24

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Legal Events

Date	Code	Title	Description
2013-10-30	C06	Publication
2013-10-30	PB01	Publication
2015-05-13	C10	Entry into substantive examination
2015-05-13	SE01	Entry into force of request for substantive examination
2018-05-08	WD01	Invention patent application deemed withdrawn after publication	Application publication date: 20131030
2018-05-08	WD01	Invention patent application deemed withdrawn after publication