CN103379732A - 焊盘加固印刷电路板 - Google Patents
焊盘加固印刷电路板 Download PDFInfo
- Publication number
- CN103379732A CN103379732A CN201210108032.4A CN201210108032A CN103379732A CN 103379732 A CN103379732 A CN 103379732A CN 201210108032 A CN201210108032 A CN 201210108032A CN 103379732 A CN103379732 A CN 103379732A
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- printed circuit
- pcb
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明提供一焊盘加固的印刷电路板。该印刷电路板包括一第一表面及一第二表面,该第一表面包括至少一个第一焊盘,用于焊接电子元件,在第二表面上设置与该第一焊盘数量相同的第二焊盘,且每个第一焊盘对应一第二焊盘,形成一对焊盘,每对焊盘上设置至少一个电镀孔,该电镀孔连接该第一焊盘及第二焊盘。使用本发明,可加固第一焊盘,防止第一焊盘翘起或脱落。
Description
技术领域
本发明涉及一种焊盘加固的印刷电路板。
背景技术
一般的电子元器件都通过焊盘(PAD)焊接在印刷电路板(PCB)上,但由于电子元器件突出于PCB,则焊接在PCB边缘的元器件在产线转运或组装过程中,电子元器件容易被剐蹭到,则可能导致焊盘翘起甚至脱落而损坏PCB。
发明内容
有鉴于此,故需要提供一种焊盘加固的电路板,可加固焊盘,防止焊盘受力翘起或脱落。
该印刷电路板包括一第一表面及一第二表面,该第一表面包括至少一个第一焊盘,用于焊接电子元件,在第二表面上设置与该第一焊盘数量相同的第二焊盘,且每个第一焊盘对应一第二焊盘,形成一对焊盘,每对焊盘上设置至少一个电镀孔,该电镀孔连接该第一焊盘及第二焊盘。
相较于现有技术,本发明通过在PCB焊盘所在面的背面设置一焊盘,并通过一电镀孔将两个焊盘连接起来,从而加固焊盘,防止焊盘翘起或脱落。
附图说明
图1为本发明一实施方式中焊盘加固印刷电路板的俯视图。
图2为图1所示电路板的剖视图。
主要元件符号说明
印刷电路板 | 1 |
第一表面 | 10 |
第一焊盘 | 11 |
电子元器件 | 2 |
引脚 | 21 |
第二表面 | 13 |
第二焊盘 | 14 |
电镀孔 | 15 |
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
如图1所示,一电路板1的第一表面10上设置有多个第一焊盘11,一电子元器件2的引脚21可焊接在该第一焊盘11上。本实施方式中,以三个焊盘11为例进行说明。
请同时参阅图2,该电路板1的第一表面10的背面,即第二表面13上设置与该第一焊盘11数量相同的第二焊盘14,且每个第一焊盘11对应一第二焊盘14,形成一对焊盘。每对焊盘上设置至少一个电镀孔15,该电镀孔15连接该第一焊盘11及第二焊盘14,以加固该第一焊盘11。如此,在第一焊盘11受到焊接于其上的电子元器件2的拉力时,该第二焊盘14对第一焊盘11增加一牵引力,从而使第一焊盘11不容易翘起或脱落。本实施方式中,该第一焊盘11与该第二焊盘14大小相等,且位置相同。
Claims (2)
1.一种印刷电路板,该印刷电路板包括一第一表面及一第二表面,该第一表面包括至少一个第一焊盘,用于焊接电子元件,其特征在于,在第二表面上设置与该第一焊盘数量相同的第二焊盘,且每个第一焊盘对应一第二焊盘,形成一对焊盘,每对焊盘上设置至少一个电镀孔,该电镀孔连接该第一焊盘及第二焊盘。
2.如权利要求1所述的印刷电路板,其特征在于,该第一焊盘与该第二焊盘大小相等,且位置相同。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210108032.4A CN103379732A (zh) | 2012-04-13 | 2012-04-13 | 焊盘加固印刷电路板 |
TW101113967A TW201343020A (zh) | 2012-04-13 | 2012-04-19 | 焊盤加固印刷電路板 |
US13/459,107 US20130269994A1 (en) | 2012-04-13 | 2012-04-28 | Printed circuit board with strengthened pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210108032.4A CN103379732A (zh) | 2012-04-13 | 2012-04-13 | 焊盘加固印刷电路板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103379732A true CN103379732A (zh) | 2013-10-30 |
Family
ID=49324067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210108032.4A Pending CN103379732A (zh) | 2012-04-13 | 2012-04-13 | 焊盘加固印刷电路板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130269994A1 (zh) |
CN (1) | CN103379732A (zh) |
TW (1) | TW201343020A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106102308A (zh) * | 2016-06-28 | 2016-11-09 | 广东欧珀移动通信有限公司 | 移动终端的屏蔽支架的接地结构及移动终端 |
CN106376175A (zh) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | 印刷电路板及移动终端 |
CN107548229A (zh) * | 2016-06-27 | 2018-01-05 | 中兴通讯股份有限公司 | Pcb及其制造方法 |
CN107979914A (zh) * | 2017-10-23 | 2018-05-01 | 努比亚技术有限公司 | 一种电路板及终端 |
CN110337177A (zh) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | 一种具有可承受高推力的焊盘的电路板及其制作方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9368427B2 (en) * | 2013-02-01 | 2016-06-14 | Mxtran Inc. | Integrated circuit film and method of manufacturing the same |
-
2012
- 2012-04-13 CN CN201210108032.4A patent/CN103379732A/zh active Pending
- 2012-04-19 TW TW101113967A patent/TW201343020A/zh unknown
- 2012-04-28 US US13/459,107 patent/US20130269994A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107548229A (zh) * | 2016-06-27 | 2018-01-05 | 中兴通讯股份有限公司 | Pcb及其制造方法 |
CN107548229B (zh) * | 2016-06-27 | 2022-01-28 | 中兴通讯股份有限公司 | Pcb及其制造方法 |
CN106102308A (zh) * | 2016-06-28 | 2016-11-09 | 广东欧珀移动通信有限公司 | 移动终端的屏蔽支架的接地结构及移动终端 |
CN106102308B (zh) * | 2016-06-28 | 2019-05-10 | Oppo广东移动通信有限公司 | 移动终端的屏蔽支架的接地结构及移动终端 |
CN106376175A (zh) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | 印刷电路板及移动终端 |
CN107979914A (zh) * | 2017-10-23 | 2018-05-01 | 努比亚技术有限公司 | 一种电路板及终端 |
CN110337177A (zh) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | 一种具有可承受高推力的焊盘的电路板及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201343020A (zh) | 2013-10-16 |
US20130269994A1 (en) | 2013-10-17 |
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C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20131030 |