CN103377795A - Coil structure and electromagnetic component using the same - Google Patents
Coil structure and electromagnetic component using the same Download PDFInfo
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- CN103377795A CN103377795A CN2013101456958A CN201310145695A CN103377795A CN 103377795 A CN103377795 A CN 103377795A CN 2013101456958 A CN2013101456958 A CN 2013101456958A CN 201310145695 A CN201310145695 A CN 201310145695A CN 103377795 A CN103377795 A CN 103377795A
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Abstract
An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.
Description
Technical field
The present invention relates to a kind of electromagnetic device, particularly relate to a kind of surface-adhered type (surface-mounting) electromagnetic device.
Background technology
As be familiar with known to the technology personage of the art, the electromagnetic devices such as past such as inductance (inductor) or choking-winding (choke coil) are normally with conductor or wire, as be subjected to the copper cash of insulating wrapped, twine a cylindrical core and form, and generally this electromagnetic device is designed to be fit to surface mount device (SMD) structure that surface mount process uses.
In recent years, along with electronic components towards small size more and more high-effect development, therefore the demand for smaller szie and dynamical coil component increases day by day.The usefulness of above-mentioned coil component height can be from its saturation current (saturation current, I again
Sat) and D.C. resistance (DC resistance, DCR) weigh.Yet, with present coil component structure, its size of further micro and volume very difficult.
Therefore, at present the art still needs a kind of electromagnetic device of improvement, and except possessing better usefulness, beyond larger saturation current, lower D.C. resistance and better efficient, its volume and size can also be further by micros.
Summary of the invention
Main purpose of the present invention is providing a kind of electromagnetic device of improvement, and its volume is less, and can utilize as electroplating the modes such as lamination techniques or laminated stack technology and make, and obtains high yield.
For reaching above-mentioned purpose, a kind of electromagnetic device is provided in one embodiment of the invention, it includes a coil unit, has a multiple-level stack structure; One formed body coats described coil unit; And two electrodes, be electrically coupled to respectively two end points of described coil unit.Each layer line of described multiple-level stack structure is wide can be between 180～240 microns, and thickness is between 40～60 microns.Wherein said coil unit can utilize plating lamination process or pressing fabrication techniques to form.
A kind of method of making electromagnetic device is provided in one embodiment of the invention.At first form a coil unit, it has the multi-layer conductor leads pattern; Form a formed body, coat described coil unit, wherein said formed body comprises a magnetic material; Then, form two electrodes, be electrically coupled to respectively the two-end-point of described coil unit.
According to one embodiment of the invention, the method of above-mentioned formation coil unit comprises: a substrate at first is provided, then on described substrate, form one first patterning photoresist layer, described the first patterning photoresist layer includes an opening, again electro-coppering is inserted described opening, form one first wire pattern, then remove described the first patterning photoresist layer; One dielectric layer is covered on described the first wire pattern, described dielectric layer has an interlayer hole, then on described dielectric layer, electroplate a bronze medal layer, make described copper layer fill up described interlayer hole, on described copper layer, form again one second patterning photoresist layer, then ablation is not by the described copper layer of described the second patterning photoresist layer covering, so form one second wire pattern and be stacked on described the first wire pattern, the common coiling that consists of described coil unit of wherein said the first wire pattern and described the second wire pattern.
According to another embodiment of the present invention, the method for above-mentioned formation coil unit comprises: a substrate at first is provided, has one first line pattern on it; Make described substrate and the stacked and pressing of a laminated film, described laminated film comprises an insulating barrier and a copper foil layer; In described laminated film, form again at least one blind hole; On described laminated film, form again a copper electroplating layer, make it fill up described blind hole, form an interlayer connector, be electrically connected described the first line pattern and described copper electroplating layer; And the described copper electroplating layer of patterning and described copper foil layer are to form one second line pattern, the common coiling that consists of described coil unit of wherein said the first line pattern and described the second line pattern.
For allowing above-mentioned purpose of the present invention, feature and the advantage can be more clear and easy to understand, hereinafter the spy lists several preferred implementations and cooperates accompanying drawing to be described in detail below.Yet described preferred implementation and accompanying drawing are only for reference and usefulness explanation, and the present invention is limited.
Description of drawings
Fig. 1 is the side perspective diagram of the electromagnetic device that illustrates according to one embodiment of the invention.
Fig. 2 is the decomposing schematic representation of the coil unit of electromagnetic device among Fig. 1.
Fig. 3 to Figure 12 shows the method schematic diagram of making electromagnetic device for what illustrate according to the embodiment of the invention with the cross section.
Figure 13 to Figure 14 shows the electromagnetic device of another embodiment of the present invention, and wherein Figure 13 A and Figure 13 B are the side perspective view of different angles of the coil unit of electromagnetic device, and Figure 14 A to Figure 14 D is the schematic diagram of each sandwich circuit layout of coil unit.
Figure 15 to Figure 23 shows the method schematic diagram of making electromagnetic device for what illustrate according to another embodiment of the present invention with the cross section.
Figure 24 and Figure 25 example illustrate the different aspects of the packaging part of electromagnetic device in the embodiment of the invention.
Wherein, description of reference numerals is as follows:
1 electromagnetic device
The 1a electromagnetic device
The 1b electromagnetic device
10 coil units
12,12a, the 12b formed body
13 electrodes
100 coil stacks stack structures
The 101-106 coil pattern
101a-106a slit breach
120 conductive poles
201-205 interlayer connector
3 electromagnetic devices
300 substrates
The 300a perforation
301 insulative core layers
302 bronze medal layers
303 interlayer connectors
310 patterning photoresist layers
The 310a opening
320 first wire patterns
330,430,480 dielectric layers
330a, 430a dielectric hole
The 330b opening
340,440 bronze medal layers
340a, 440a interlayer connector
350,450 patterning photoresist layers
360,460 second wire patterns
412 formed bodys
412a central authorities magnetic post
5 electromagnetic devices
500 coil units
The 500a central perforation
The 501-504 coil pattern
510 coil units
512 formed bodys
512a central authorities magnetic post
521,525 side extensions
521a, the 525a side
Connect layer in the 522-524
522a, 523a, 524a interlayer connector
531-534, the 541-544 end
550,552,554 interlayer connectors
561-564 slit breach
The electromagnetic device that 6a, 6b do not encapsulate
600 substrates
601 insulative cores
602,603 copper foil layers
604,605 copper electroplating layers
612,614 perforation
612a, 614a interlayer connector
620,630 lamination moulds
622,632 insulating barriers
623,633 copper foil layers
642,644,652,654 blind holes
642a, 644a652a, 654a interlayer connector
662,663 copper electroplating layers
The 702-705 line pattern
The 722-725 line pattern
730 insulating protective layers
Embodiment
Details of the present invention hereinafter is described with reference to the accompanying drawings, the some that Composition of contents specification details in those accompanying drawings is described, and illustrated with feasible embodiment special case describing mode.Embodiment has hereinafter described out enough details so that one of ordinary skill in the art is able to tool to implement.Certainly, also practicable other embodiment, or under the prerequisite departing from embodiment described in the literary composition not, make any structural, logicality, and electrically on change.Therefore, details is hereinafter described should not be considered to be kind of a restriction, and on the contrary, the embodiment that wherein comprises will be defined by the claims of enclosing.
See also Fig. 1 and Fig. 2, wherein Fig. 1 is the side perspective diagram of the electromagnetic device that illustrates according to one embodiment of the invention, and Fig. 2 is the decomposing schematic representation of the coil unit of electromagnetic device among Fig. 1.As shown in Figures 1 and 2, electromagnetic device 1, such as choking-winding or inductance, include one single around (single-winding) coil unit 10, coated by formed body (molded body) 12 encapsulation, wherein formed body 12 can be such as cuboid, square or other shape, there is no certain limitation.In addition, electromagnetic device 1 also comprises two electrodes 13, is electrically coupled to respectively the respective ends point of coil unit 10.Wherein electrode 13 can stretch out from the relative two sides of formed body 12, conveniently is electrically connected with other circuit devcie.According to the embodiment of the invention, above-mentioned formed body 12 can be the magnetic material that is comprised of resin and Magnaglo, is formed on around the coil unit 10 through extrusion forming.In addition, Magnaglo is to comprise iron powder, ferrite powder, iron containing alloy powder or any suitable magnetic material.
According to the embodiment of the invention, above-mentioned two electrodes 13 can form jointly with the equivalent layer of coil unit 10, and into a single integrated structure.Yet those of ordinary skill in the art will be understood that above-mentioned two electrodes 13 can be the somes that belongs to lead frame.Above-mentioned two electrodes 13 can be along the recessed folding in relative two sides of formed body 12, and convenient follow-up surface mount process uses.
According to the embodiment of the invention, coil unit 10 is to electroplate lamination techniques or the laminated stack fabrication techniques forms, and describes after its process detail holds.According to the embodiment of the invention, coil unit 10 is the individual pen list around, sandwich construction, six layers of metal stack structure as shown in Figure 2.Each layer coil pattern of coil unit 10, such as the label 101～106 among the 2nd figure, it can have about 180～240 microns live width, and for example, each layer coil pattern 101～106 live widths can be 210 microns, and about 40～60 microns thickness, such as 46 microns.Between each layer coil pattern 101～106, have an insulating barrier (not expressing in figure), make each layer coil pattern 101～106 insulated from each other.Be simplicity of illustration, among Fig. 1 and Fig. 2 the insulating barrier between above-mentioned each layer coil pattern 101～106 that is formed on coil unit 10 omitted.According to the embodiment of the invention, the thickness of above-mentioned insulating barrier can be between 2～10 microns, such as 5 microns.In addition, the number of plies of coil unit 10 can be between 2～8.Yet those of ordinary skill in the art will be understood that the number of plies of above-mentioned coil unit 10 can adjust according to design requirement, the present invention thereby not as limit.
According to the embodiment of the invention, when overlooking, each layer coil pattern 101～106 of coil unit 10 can be annular or avette strip pattern, and be non-enclosed circular pattern, in other words, shown in the label 101a～106a among Fig. 2, between two ends of each layer coil pattern 101～106, has a slit breach.According to the embodiment of the invention, the slit breach 101a～106a of coil unit 10 aims at thickness direction, but deliberately make adjacent two-layer slit breach have a side-play amount, for example, go up 150～180 microns side-play amount clockwise, so so that the rear end on upper strata, such as coil pattern 101, can be electrically connected to via interlayer connector (with label 201～205 expressions) front end of lower one deck, such as coil pattern 102, be formed in the series winding configuration of each circle on this single coiling unit.Above-mentioned interlayer connector 201～205 passes respectively the thickness of each layer insulating, and between coil pattern 101～106, and can have about about 180 microns diameter.
Fig. 3 to Figure 12 is the schematic cross-sectional view of the method for the making electromagnetic device that illustrates according to the embodiment of the invention.As shown in Figure 3, at first provide a substrate 300, such as a copper clad laminate (copper clad laminate, CCL).Can have at least one copper layer 302 on the substrate 300, it is laminated on the insulative core layer 301, such as dielectric layer or glass epoxy etc., and at least one interlayer connector 303, pass substrate 300 full depths.Above-mentioned interlayer connector 303 can be electroplating ventilating hole, and it can be to utilize machine drilling or laser beam perforation coordination galvanization technique to be made.Be simplified illustration, among the figure only the example each layer structure that is formed on substrate 300 single faces is shown, yet those of ordinary skill in the art will be understood that, same stacked structure can be formed on the another side of substrate 300, and utilizes the same steps as that is exposed among the embodiment to finish.
Then form a patterning photoresist layer 310 in the surface of substrate 300.Wherein patterning photoresist layer 310 includes opening 310a, manifests the copper layer 302 of part.For instance, the width of each opening 310a is about 210 microns, and the degree of depth is about 50 microns.
As shown in Figure 4, then carry out an electroplating technology, opening 310a is filled up the copper metal, so forming live width is 210 microns, and thickness is about the first wire pattern 320 of 46 microns.Then, remove patterning photoresist layer 310.Layer 101～106 among the shape of above-mentioned the first wire pattern 320 such as Fig. 1 and Fig. 2.It should be noted that in addition above-mentioned the first wire pattern 320 can have a vertical sidewall profile, but be not limited to this.
As shown in Figure 5, after forming the first wire pattern 320, then remove the copper layer 302 between the first wire pattern 320.Next on the first wire pattern 320 surfaces, conformally cover a dielectric layer 330.In dielectric layer 330, be formed with an interlayer hole 330a, manifest the part upper surface of each first wire pattern 320, be represented by dotted lines out wherein that cross-sectional configuration is in different tangent planes among interlayer hole 330a and the present figure.Can be formed with opening 330b in the dielectric layer 330 between the first wire pattern 320.
As shown in Figure 6, can carry out another electroplating technology, on substrate 300, form all sidedly a bronze medal layer 340.Can form a bronze medal crystal seed layer (not being shown among the figure) in the sputter mode first before forming copper layer 340.Above-mentioned copper layer 340 can be inserted interlayer hole 330a and form an interlayer connector 340a.In addition, above-mentioned copper layer 340 can be inserted opening 330b.Then on copper layer 340, form a patterning photoresist layer 350, define the second layer pattern of the coil unit of electromagnetic device.
As shown in Figure 7, then ablation is not patterned the copper layer 340 that photoresist layer 350 covers, and for example utilizes the wet etching etching method, so forms one second wire pattern 360 and is stacked on the first wire pattern 320.Layer 101～106 among the shape of above-mentioned the second wire pattern 360 such as Fig. 1 and Fig. 2, and be electrically connected with the first wire pattern 320 of below via interlayer connector 340a.Above-mentioned the second wire pattern 360 can have a sloped sidewall profile, but is not limited to this.
Extremely shown in Figure 10 such as Fig. 8, repeat the step such as Fig. 5 to Fig. 7, form the dielectric layer 430 (Fig. 8) with an interlayer hole 430a on the second wire pattern 360, wherein interlayer hole 430a is in different cross sections (staggering such as Fig. 2 intermediary layer connector upper and lower position) from interlayer hole 330a.Then copper electroplating layer 440 all sidedly on substrate 300 forms interlayer connector 440a in interlayer hole 430a, forms patterning photoresist layer 450 (Fig. 9) on copper layer 440, and forms privates pattern 460 (Figure 10).Same, the layer 101～106 among the shape of above-mentioned privates pattern 460 such as Fig. 1 and Fig. 2, and be electrically connected with the second wire pattern 360 of below via interlayer connector 440a.In addition, above-mentioned privates pattern 460 can have a sloped sidewall profile, but is not limited to this.
As shown in figure 11, on privates pattern 460, conformally cover dielectric layer 480, so namely form the one-sided coil stacks stack architecture 100 of substrate 300.As mentioned before, can utilize above-mentioned same steps as to form identical coil stacks stack structure at the opposite side of substrate 300.
As shown in figure 12, in modes such as laser or machine drillings substrate 300 is partly removed at last, in the coil stacks stack structure 100 central perforation 300a that form, follow-up again to be formed on coil stacks stack structure 100 formed body 412 on every side by the magnetic material that resin and Magnaglo were formed through the extrusion forming encapsulation.Formed body 412 fills up perforation 300a, consists of a central magnetic post 412a, makes coil stacks stack structure 100 around central magnetic post 412a, so finishes an electromagnetic device 3.Should be noted that electromagnetic device 3 only is presented at the one-sided coil stacks stack structure 100 of substrate 300 among the figure, certainly, electromagnetic device 3 can be included in the coil stacks stack structure of substrate 300 opposite sides in addition, equally by formed body 412 coating that seals.
See also Figure 13 to Figure 14, it shows the electromagnetic device of another embodiment of the present invention, and wherein Figure 13 A and Figure 13 B are the side perspective view of different angles of the coil unit of electromagnetic device, and Figure 14 A to Figure 14 D is the schematic diagram of each sandwich circuit layout of electromagnetic device.To shown in Figure 14, the coil unit 510 of electromagnetic device 5 has the lattice coil structure equally such as Figure 13, and stacked in multi-layers is on a substrate 500.In this example, each layer line circle of coil unit 510 is nonocclusive circular coil pattern, mutually links with the interlayer connector 550,552,554 that staggers upper and lower each other, can be dielectric layer or insulating barrier (not being shown among the figure) between each layer line circle.The lattice coil structure can utilize laser or machine drill to form central perforation 500a, encapsulates out formed body 512 with resin and Magnaglo through extrusion forming again, and consists of a central magnetic post 512a (Figure 14) in central perforation 500a.
Shown in Figure 14 A, an end of ground floor (M1) coil pattern 501 comprises a side extension 521, and it connects end 541.One slit breach 561 is arranged between end 541 and the end 531, and the position of interlayer connector 550 then is located near 531 places, end, is used for ground floor coil pattern 501 is linked to second layer coil pattern 502.There is the exposed sides 521a that is not coated by formed body 512 side extension 521, and an outer electrode can be coupled.
As shown in Figure 14B, the second layer (M2) coil pattern 502 has both ends 532,542 equally, and a slit breach 562, and wherein slit breach 561 staggers upper and lower with slit breach 562.The position of interlayer connector 552 then is located near 542 places, end, is used for second layer coil pattern 502 is linked to the 3rd layer of coil pattern 503.
Shown in Figure 14 C, the 3rd layer of (M3) coil pattern 503 also has both ends 533,543, and a slit breach 563, and wherein slit breach 563 staggers with slit breach 562.The position of interlayer connector 554 then is located near 543 places, end, is used for the 3rd layer of coil pattern 503 is linked to the 4th layer of coil pattern 504.
Shown in Figure 14 D, one end of the 4th layer of (M4) coil pattern 504 comprises a side extension 525, one slit breach 564 is arranged between one end 534 and the end 544, the position of interlayer connector 554 then is located near 534 places, end, is used for the 4th layer of coil pattern 504 is linked to the 3rd layer of coil pattern 503.There is the exposed sides 525a that is not coated by formed body 512 side extension 525, and an outer electrode can be coupled.In addition, side extension 521 can see through interiorly connect layer 522,523,524 and interlayer connector 522a, 523a, 524a are stacked to side extension 525 coplanar.Certainly, electromagnetic device of the present invention can be more than four layers, also can have more multi-layered.
Figure 15 to Figure 23 is the schematic cross-sectional view of the method for the making electromagnetic device that illustrates according to another embodiment of the present invention.At first as shown in figure 15, provide a substrate 600, comprise an insulative core 601, have copper foil layer 602,603 on its relative two sides.Then carry out bore process, for example machine drilling forms perforation 612,614 in substrate 600.
As shown in figure 16, then carry out filling perforation and electroplate, on copper foil layer 602,603, form copper electroplating layer 604,605, and make copper electroplating layer 604,605 fill up perforation 612,614, consist of interlayer connector 612a, 614a.
As shown in figure 17, then carry out the line pattern etching, respectively with copper electroplating layer 604,605 and copper foil layer 602,603 be etched into line pattern 702,703 and line pattern 722,723.Wherein, second layer coil pattern 502 and interior the connect layer 522 of line pattern 702,722 in can similar Figure 14 B, line pattern 703,723 the 3rd layer of coil pattern 503 and the interior layer 523 that connects in can similar Figure 14 C.Interlayer connector 612a, 614a be interlayer connector 552, the 523a among similar Figure 14 C then.
As shown in figure 18, laminated film 620,630 is such as the resinous coat Copper Foil, and wherein laminated film 620 comprises insulating barrier 622 and copper foil layer 623, and laminated film 630 comprises insulating barrier 632 and copper foil layer 633, with laminated film 620,630 stacked and with substrate 600 pressings.
As shown in figure 19, can utilize the laser ablation mode, in laminated film 620, form blind hole 642,644, in laminated film 630, form blind hole 652,654.Blind hole 642,652 manifests respectively the line pattern 702,703 of part, and blind hole 644,654 manifests respectively the line pattern 722,723 of part.
As shown in figure 20, the slag technique of removing photoresist and copper electroplating technology form copper electroplating layer 662 and 663. Copper electroplating layer 662 and 663 fills up respectively blind hole 642,644 and blind hole 652,654, forms interlayer connector 642a, 644a and interlayer connector 652a, 654a.
As shown in figure 21, carry out again the line pattern etching, respectively with copper electroplating layer 662,663 and copper foil layer 623,633 be etched into line pattern 704,705 and line pattern 724,725.Wherein, ground floor coil pattern 501 and the side extension 521 of line pattern 704,724 in can similar Figure 14 A, four layer coil pattern 504 and interior the connect layer 524 of line pattern 705,725 in can similar Figure 14 D.Interlayer connector 642a, 644a be interlayer connector 550, the 522a among similar Figure 14 A then.Interlayer connector 652a, 654a be interlayer connector 554, the 524a among similar Figure 14 D then.
Then, shown in Figure 22 A and Figure 23 A, can utilize the modes such as machine drilling or microetch to remove the insulating barrier 622 of part, 632 and insulative core 601, then the upper insulating protective layer 730 of spraying is so finished separately the not electromagnetic device 6a of encapsulation.Perhaps, shown in Figure 22 B and Figure 23 B, first wire mark insulating protective layer 730 is removed the insulating protective layer 730, insulating barrier 622,632 and insulative core 601 of part again in modes such as machine drilling or microetches, finish separately the not electromagnetic device 6b of encapsulation.The follow-up continuation again with resin and Magnaglo extrusion forming encapsulation.
Figure 24 and Figure 25 example illustrate the different aspects of the packaging part of electromagnetic device in the embodiment of the invention.
As shown in figure 24, electromagnetic device 1a comprises single wrap coil unit 10 as shown in fig. 1, and with formed body 12 mould Feng Chengru cuboids, square or other stereochemical structure.Other has two electrodes 13, and it is electrically coupled to respectively coil unit 10 corresponding two-end-points.Above-mentioned two electrodes 13 intactly are coated in the formed body 12.Above-mentioned formed body 12 can be formed on around the coil unit 10 by the magnetic material process extrusion forming that comprises resin and Magnaglo.Magnaglo can comprise iron powder, ferrite powder, iron containing alloy powder or any suitable magnetic material.In addition, be embedded with two electric-conductors or conductive pole 120 at formed body 12, it is electrically connected to electrode 13, and coil unit 10 can be linked with circuit board or extraneous module (not being shown among the figure).
As shown in figure 25, electromagnetic device 1b comprise as shown in fig. 1 list around coil unit 10, it is partly coated by formed body 12a and formed body 12b.Other has two electrodes 13 to be electrically coupled to respectively the corresponding two-end-point of coil unit 10.Above-mentioned two electrodes 13 partly are emerging in outside the formed body 12, and coil unit 10 can be linked with circuit board or extraneous module (not being shown among the figure).
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (16)
1. an electromagnetic device is characterized in that, comprises:
One coil unit has a multiple-level stack structure;
One formed body coats described coil unit; And
Two electrodes are electrically coupled to respectively two end points of described coil unit.
2. electromagnetic device according to claim 1 is characterized in that, described multiple-level stack structure comprises an insulated substrate and the lattice coil pattern is positioned on the described insulated substrate.
3. electromagnetic device according to claim 1 is characterized in that, described multiple-level stack structure has a central perforation, and described formed body is filled described central hole.
4. electromagnetic device according to claim 1 is characterized in that, described formed body comprises resin and Magnaglo.
5. electromagnetic device according to claim 1 is characterized in that, each of described coil unit layer is annular or avette strip pattern.
6. electromagnetic device according to claim 5 is characterized in that, has a slit breach between two ends of described each layer.
7. electromagnetic device according to claim 6 is characterized in that, the slit breach of one deck of described multiple-level stack structure and the slit breach of adjacent bed have a side-play amount at thickness direction.
8. electromagnetic device according to claim 1 is characterized in that, the rear end on a upper strata of described multiple-level stack structure is electrically connected to the front end of a lower floor via an interlayer connector, is formed in series winding configuration of each circle on the described coil unit.
9. electromagnetic device according to claim 1 is characterized in that, has insulating barrier between each layer of described multiple-level stack structure.
10. a method of making electromagnetic device is characterized in that, comprises:
Form a coil unit, have the multi-layer conductor leads pattern;
Form a formed body, coat described coil unit, wherein said formed body comprises a magnetic material; And
Form two electrodes, be electrically coupled to respectively the two-end-point of described coil unit.
11. the method for making electromagnetic device according to claim 10 is characterized in that, the step of described formation one coil unit comprises:
One substrate is provided;
Form one first patterning photoresist layer on described substrate, described the first patterning photoresist layer comprises an opening;
Described opening is inserted in electro-coppering, formed one first wire pattern;
Remove described the first patterning photoresist layer;
One dielectric layer is covered on described the first wire pattern, and described dielectric layer has an interlayer hole;
On described dielectric layer, electroplate a bronze medal layer, make described copper layer fill up described interlayer hole;
On described copper layer, form one second patterning photoresist layer; And
The described copper layer that ablation is not covered by described the second patterning photoresist layer so forms one second wire pattern and is stacked on described the first wire pattern, the common coiling that consists of described coil unit of wherein said the first wire pattern and described the second wire pattern.
12. the method for making electromagnetic device according to claim 11 is characterized in that, described ablation is not the wet etching etching method by the method for the described copper layer of described the second patterning photoresist layer covering.
13. the method for making electromagnetic device according to claim 11 is characterized in that, described substrate is a copper clad laminate.
14. the method for making electromagnetic device according to claim 11 is characterized in that, described the second patterning photoresist layer is removed after forming described the second wire pattern.
15. the method for making electromagnetic device according to claim 10 is characterized in that, the step of described formation one coil unit comprises:
One substrate is provided, has one first wire pattern on it;
Make described substrate and the stacked and pressing of a laminated film, described laminated film comprises an insulating barrier and a copper foil layer;
In described laminated film, form at least one blind hole;
On described laminated film, form a copper electroplating layer and make it fill up described blind hole, form an interlayer connector and be electrically connected described the first line pattern and described copper electroplating layer; And
The described copper electroplating layer of patterning and described copper foil layer form one second wire pattern, the common coiling that consists of described coil unit of wherein said the first wire pattern and described the second wire pattern.
16. the method for making electromagnetic device according to claim 15 is characterized in that, after finishing described the second wire pattern, other includes:
Get rid of described insulating barrier and the described substrate of part; And
Form an insulating protective layer.
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| CN201510943288.0A CN105355360A (en) | 2012-04-24 | 2013-04-24 | Electromagnetic component and fabrication method thereof |
| CN201510943552.0A CN105355361B (en) | 2012-04-24 | 2013-04-24 | Electromagnetic device and preparation method thereof |
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| US201261637277P | 2012-04-24 | 2012-04-24 | |
| US61/637,277 | 2012-04-24 | ||
| US13/868,993 US9009951B2 (en) | 2012-04-24 | 2013-04-23 | Method of fabricating an electromagnetic component |
| US13/868,993 | 2013-04-23 |
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| CN108597731A (en) * | 2014-03-18 | 2018-09-28 | 三星电机株式会社 | Chip electronic component and its manufacturing method |
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| CN111919269A (en) * | 2018-04-09 | 2020-11-10 | 日东电工株式会社 | Magnetic wiring circuit board |
| CN111919269B (en) * | 2018-04-09 | 2023-02-17 | 日东电工株式会社 | Magnetic wiring circuit board |
| CN110876012A (en) * | 2018-08-31 | 2020-03-10 | 凤凰先驱股份有限公司 | Integrated driving module with energy conversion function and manufacturing method thereof |
| CN110876012B (en) * | 2018-08-31 | 2021-06-15 | 恒劲科技股份有限公司 | Integrated driving module with energy conversion function and manufacturing method thereof |
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