CN105609231A - Laminated inductor and manufacturing method therefor and lamination packaging assembly - Google Patents
Laminated inductor and manufacturing method therefor and lamination packaging assembly Download PDFInfo
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- CN105609231A CN105609231A CN201511008059.6A CN201511008059A CN105609231A CN 105609231 A CN105609231 A CN 105609231A CN 201511008059 A CN201511008059 A CN 201511008059A CN 105609231 A CN105609231 A CN 105609231A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title abstract description 5
- 238000003475 lamination Methods 0.000 title abstract 2
- 230000004888 barrier function Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 25
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims description 18
- 230000037361 pathway Effects 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000003854 Surface Print Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/122—Insulating between turns or between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a laminated inductor and a manufacturing method therefor and a lamination packaging assembly, and belongs to the technical field of a semiconductor device. In the laminated inductor, the two ends of a helical coil in the laminated body are not exposed on the two side end planes of the laminated body; instead, the two ends of the helical coil are wholly positioned in the interior of the laminated body, and are electrically connected to a mounting surface of the laminated body though a first inner pin and a second inner pin, so that a first outer electrode and a second outer electrode can be wholly formed on the mounting surface. Therefore, when the laminated inductor is mounted in a circuit board or a packaging assembly through the mounting surface, all the external electrodes can be used as the soldering surfaces, so that the surface mounting reliability of the laminated inductor can be effectively improved.
Description
Technical field
The present invention relates to technical field of semiconductor device, relate in particular to a kind of laminated inductor and manufacture method thereof and stacked package assembly.
Background technology
Inductor is classified and can be divided into Wound-rotor type electrical equipment, thin-film electro sensor, laminated type electrical equipment etc. according to structure. Wherein, laminated type inductor is owing to having miniaturization and lightening, and has and be widely used in compared with little D.C. resistance in the miniature circuit that needs high electric current.
Fig. 1 is that the cross-section structure of a kind of laminated inductor 001 of prior art is schematic diagram, and it mainly comprises laminated body 01, the first external electrode 02 and the second external electrode 03. Wherein, laminated body 01 comprises multiple stacking ceramic sheet materials 011, on each ceramic sheet material 011, be provided with conductive pattern 012, multiple conductive patterns 012 by be arranged in the conductive channel (not shown) of ceramic sheet material 011 be electrically connected to each other form a spiral helicine coil, the head end 0121 of this coil is exposed on laminated body 01 first side, and tail end 0122 is exposed on the second side of laminated body 01. Wherein the first side and the second side are two relative sides on laminated body 01 length direction. The first external electrode 02 is mainly formed on the first side to be electrically connected with head end 0121, and the second external electrode 03 is mainly formed on the second side to be electrically connected with tail end. Fig. 2 is the structural representation that comprises the package assembling of the laminated inductor 001 shown in Fig. 1, chip 002 is electrically connected on lead frame 004 by conductive projection 003, inductance 001 is electrically connected on lead frame by conductive pole 005, then forms package assembling with plastic-sealed body 006 plastic packaging.
Therefore the major part of the external electrode of inductance 001 lays respectively on the first side and the second side, and small part extends on the upper surface and lower surface of laminated body 01. Therefore laminated inductor 001 can only be taking the upper surface of laminated body 01 or lower surface as installed surface in the package assembling shown in Fig. 2. But due to the external electrode of laminated inductor 001 can only small part on installed surface as solder side, therefore when laminated inductor 001 welding in package assembling, weld layer on external electrode on the first side and the second side can melt and expand, thereby can cause the failure risk that package assembling is structural.
Summary of the invention
In view of this, the invention provides a kind of laminated inductor and manufacture method thereof and stacked package assembly, to reduce the risk of the structural failures that described laminated inductor causes in surface mount process.
A kind of laminated inductor, is characterized in that, comprising:
Laminated body, stacking in described laminated body have multiple insulating barriers, a surface of described laminated body is mounting surface, described in each, the surface of insulating barrier is provided with conductive pattern, and multiple described patterns are electrically connected to each other by the pathway electrode that is arranged in described insulating barrier, to form a spiral helicine coil;
The first interior electrode, one end of described the first interior electrode is electrically connected with the first end of described coil, and the other end is exposed in described mounting surface;
The second inner electrode, one end of described the second inner electrode is electrically connected with the second end of described coil, and the other end is exposed in described mounting surface;
The first external electrode, described the first external electrode is positioned in described mounting surface, and is electrically connected with described the first interior electrode;
The second external electrode, described the second external electrode is positioned in described mounting surface, and is electrically connected with described the second inner electrode.
Preferably, the upper surface that described mounting surface is described laminated body or for the lower surface relative with described upper surface.
Preferably, described laminated inductor also comprises upper caldding layer and lower caldding layer, and multiple described stacked dielectric layers are between described upper caldding layer and lower caldding layer.
Preferably, described the first interior electrode and the second inner electrode are by conductive hole and be filled in the conductive material formation in described conductive hole, and wherein, described conductive hole is extended to respectively first end and the second end place of described coil by the mounting surface of described laminated body.
Preferably, described in each, conductive pattern includes head end and tail end, and the tail end of the described conductive pattern of last layer is electrically connected with the head end of the described conductive pattern of lower one deck by described pathway electrode,
The first end of coil described in the head end of the conductive pattern of the top layer of multiple described conductive patterns, the tail end of conductive pattern of lowermost layer of described conductive pattern second end that is described coil.
Preferably, described insulating barrier is formed by magnetic material or dielectric material.
Preferably, described laminated inductor also comprises the weld layer being positioned on described the first external electrode and the second external electrode, and described laminated inductor is electrically connected with external circuit by described weld layer.
A manufacture method for laminated inductor, is characterized in that, comprising:
Form laminated body, stacking in described laminated body have multiple insulating barriers, and a surface of described laminated body is set as to mounting surface, described in each, the surface of insulating barrier is provided with conductive pattern, and multiple described patterns are electrically connected to each other, to form a spiral helicine coil by the pathway electrode being formed in described insulating barrier;
Form the first interior electrode being electrically connected with the first end of described coil, and make described the first interior electrode exposed in described mounting surface;
Form the second inner electrode being electrically connected with the second end of described coil, and make described the second inner electrode exposed in described mounting surface;
In described mounting surface, form the first external electrode being electrically connected with described the first interior electrode, and the second external electrode being electrically connected with the second inner electrode.
Preferably, pressurization after multiple described stacked dielectric layers is formed to laminate, thereby the conductive pattern on upper and lower two insulating barriers is electrically connected by described channel electrode.
Preferably, the step that forms described laminated body also comprises carries out sintering to described laminate.
Preferably, upper surface and lower surface that the step that forms described laminated body is also included in described laminate cover respectively upper caldding layer and lower caldding layer.
Preferably, described the first interior electrode and described the second inner electrode are by conductive hole and be filled in the conductive material formation in described conductive hole, and wherein, described conductive hole is extended to respectively first end and the second end place of described coil by the mounting surface of described laminated body.
Preferably, at described mounting surface place, by the mode of laser beam drilling, form described conductive hole, and in electric hole, fill copper described by filling out process for copper.
Preferably, by silk-screen printing technique, at described mounting surface printing conductive material sintering, to form described the first external electrode and the second external electrode.
Preferably, by rolling ferryman's skill, on described the first external electrode and the second external electrode, plate weld layer.
Preferably, described in each, conductive pattern includes head end and tail end, and the tail end of the described conductive pattern of last layer is electrically connected with the head end of the described conductive pattern of lower one deck by described pathway electrode,
The first end that the head end of the conductive pattern of the top layer of multiple described conductive patterns is described coil, the tail end of conductive pattern of lowermost layer of described conductive pattern second end that is described coil.
A kind of stacked package assembly, is characterized in that, comprises if claim 1 is to laminated inductor, chip, electric connector, lead frame, conductive pole and plastic-sealed body as described in any one in claim 7,
Wherein, described chip is electrically connected with described lead frame by described electric connector, and described conductive pole is positioned at described lead frame around,
Described laminated inductor is positioned over described chip top, and the mounting surface of described laminated inductor is towards described chip, and the first external electrode of described laminated inductor and the second external electrode be welded on described conductive pole,
Described plastic-sealed body covers on described laminated inductor, conductive pole, chip, electric connector and lead frame, and the surface exposure of described plastic-sealed body goes out described lead frame and conductive pole, using the outer pin being electrically connected with external circuit as described stacked package assembly.
Therefore, in laminated inductor provided by the present invention and manufacture method thereof, the two ends that are arranged in laminated body spiral coil are not exposed on two side end faces of laminated body, but be all positioned at the inside of laminated body, and be electrically connected to the mounting surface of laminated body by the first interior pin, the second interior pin, thereby the first external electrode and the second external electrode can be all formed in described mounting surface. Therefore, when described laminated inductor mounts in circuit board or package assembling by described mounting surface, can time whole external electrode all as solder side, thereby the reliability can effectively raise described laminated inductor surface mount time.
Brief description of the drawings
By the description to the embodiment of the present invention referring to accompanying drawing, above-mentioned and other objects of the present invention, feature and advantage will be more clear, in the accompanying drawings:
Fig. 1 is that the cross-section structure of a kind of laminated inductor of prior art is schematic diagram;
Fig. 2 is the structural representation of the package assembling that comprises the laminated inductor in Fig. 1;
Fig. 3 is the cross-sectional view according to a kind of laminated inductor of the embodiment of the present invention;
Fig. 4 is the perspective view of the primary structure of the laminated inductor in Fig. 3;
Fig. 5 is the stacked package modular construction schematic diagram that comprises the laminated inductor in Fig. 3.
Detailed description of the invention
Hereinafter with reference to accompanying drawing, the present invention is described in more detail. In each accompanying drawing, identical part adopts similar Reference numeral to represent. For the sake of clarity, the various piece in accompanying drawing is not drawn in proportion. In addition, may not shown some known part. For brevity, the structure obtaining can be described in a width figure after several steps. Described hereinafter many specific details of the present invention, structure, material, size, treatment process and the technology of for example each part, to more clearly understand the present invention. But just as the skilled person will understand, can realize the present invention not according to these specific details.
Fig. 3 is the cross-sectional view according to a kind of laminated inductor of the embodiment of the present invention, and Fig. 4 is the primary structure perspective view of the laminated inductor shown in Fig. 3.
As shown in Figure 3 and Figure 4, laminated inductor 100 comprises laminated body 1, the first interior electrode 2, the second inner electrode 3, the first external electrode 4, the second external electrode 5.
Laminated body 1 comprises multiple stacking insulating barriers 11, and insulating barrier can form with magnetic material or dielectric material, for example, adopt ceramic sheet material as insulating barrier 11. The surface of each insulating barrier 11 is provided with conductive pattern 12, and the pattern of the conductive pattern 12 on each layer insulating 11 can be the same or different, and conductive pattern 12 comprises head end and tail end, between the head end of conductive pattern and tail end, is wherein conductive path. Conductive pattern 12 on all insulating barriers 11 is electrically connected to each other by the pathway electrode 13 (Fig. 3 does not draw) that is arranged in insulating barrier 11, to form a spiral helicine coil. Pathway electrode 13 can form with the conductive material that is arranged in described through hole for the through hole that is extended to insulating barrier 11 back sides by insulating barrier 11 surfaces. Described through hole one end of filled conductive material is electrically connected with one end of conductive pattern 12 electricity of last layer, and the other end is electrically connected with the conductive pattern 12 of lower one deck, thereby two conductive patterns that are connected are electrically connected to each other. For example in the present embodiment, the tail end of the conductive pattern 12 of last layer is electrically connected with the head end of lower one deck conductive pattern by pathway electrode 13, therefore the first end 121 (as head end) that in multiple conductive patterns 12, the head end of the conductive pattern 12 of the superiors is described spiral coil, and the second end 122 (as tail end) that in multiple conductive pattern 12, the tail end of undermost conductive pattern 12 is described spiral coil. Described spiral helicine coil is all positioned at laminated body 1 inside, and the head end of all conductive patterns 12 and tail end are all not exposed on the surface of laminated body 1, and therefore the first end 121 of described spiral helicine coil and the second end 122 are also positioned at the inside of laminated body 1. Laminated body 1 is cuboid, and it has six surfaces, and one of them surface is the mounting surface of laminated body 1. Laminated inductor 100 is arranged in circuit board or package assembling by mounting surface. Laminated body 1 also can further comprise the upper caldding layer (not shown) that covers multiple insulating barriers 11 tops and the lower caldding layer (not shown) that covers multiple insulating barriers 11 belows, described upper caldding layer and lower caldding layer be in the middle of multiple insulating barriers 11 and cover, and can comprise that conductive pattern 12 on multiple insulating barriers 11 is not subject to the impact of outside unfavorable factor.
First one end of interior electrode 2 and the first end of described spiral helicine coil 121 are electrically connected, and the other end is exposed in described mounting surface. As shown in Figure 3 and Figure 4, in the present embodiment, the lower surface of laminated body 1 is described mounting surface, also can select in other embodiments the upper surface of laminated body 1 as described mounting surface. Wherein, the upper surface of laminated body 1 and lower surface are two relative surfaces on insulating barrier 11 stacking directions. In like manner, the second inner electrode 3 one end are electrically connected with the second end 122 of described spiral helicine coil, and the other end is exposed in described mounting surface. Therefore, the two ends of described spiral helicine coil are electrically connected in the mounting surface of laminated body 1 with the second inner electrode 3 by the first interior electrode 2 respectively. The first interior electrode 2 can form by conductive hole and the conductive material being filled in described conductive hole with the second inner electrode 3, and wherein, described conductive hole is extended to respectively first end 121 and second end 122 places of described spiral helicine coil by the mounting surface of laminated body 1.
The first external electrode 4 (not drawing in Fig. 4) is positioned in described mounting surface, and is electrically connected with the first interior electrode 2. And the second external electrode 5 is equally also positioned in described mounting surface, and be electrically connected with the second inner electrode 3. The first external electrode 4, the second external electrode 5 are electrically connected with first end 121, second end 122 of described spiral helicine coil by the first interior pin 2, the second interior pin 3 respectively, and be all positioned in the mounting surface of laminated body 1, using the electrode being electrically connected with external circuit as laminated inductor 100. Wherein, on the first external electrode 4 and the second external electrode 5, be also provided with weld layer (not shown), for example tin layer, thus laminated inductor 100 is mounted in circuit board or package assembling by described weld layer. As shown in Figure 5, it is the stacked package modular construction schematic diagram that comprises laminated inductor 100, chip 200 is electrically connected on lead frame 400 by electric connector (as conductive projection), laminated inductor 100 is positioned at chip 200 tops, and the mounting surface of laminated inductor 100 is towards chip 200, and be electrically connected on lead frame 400 by conductive pole 500, then form package assembling with plastic-sealed body 600 plastic packagings. Be that plastic-sealed body 600 is on laminated inductor 100, conductive pole 500, chip 200, electric connector 300 and lead frame 400, and the surface exposure of plastic-sealed body 600 goes out lead frame 400 and conductive pole 500, using the outer pin being electrically connected with external circuit as described stacked package assembly. Conductive pole 500 is usually located at lead frame 400 around, and its quantity generally has two or more, and it can be copper post. Because the external electrode of laminated inductance 100 is all positioned in mounting surface, therefore all external electrode all can be used as the solder side being electrically connected with conductive pole 500, thereby to there will not be the most of electrode because of laminated inductor 001 in package assembling be as shown in Figure 2 non-solder side, and occur that solder fusing on non-solder side and expansion cause the problem of structural failures.
Therefore, in laminated inductor provided by the present invention, the two ends that are arranged in laminated body spiral coil are not exposed on two side end faces of laminated body, but be all positioned at the inside of laminated body, and be electrically connected to the mounting surface of laminated body by the first interior pin, the second interior pin, thereby the first external electrode and the second external electrode can be all formed in described mounting surface. Therefore, when described laminated inductor mounts in circuit board or package assembling by described mounting surface, can time whole external electrode all as solder side, thereby the reliability can effectively raise described laminated inductor surface mount time.
In addition, the application also provides a kind of manufacture method of laminated inductor as shown in Figure 3 and Figure 4. The method mainly comprises the following steps:
Step 1: form laminated body 1, stacking in laminated body 1 have multiple insulating barriers 11, and by a surface of laminated body 1, for example lower surface is set as mounting surface, and on the surface of each insulating barrier 11, conductive pattern 12 is set, and multiple patterns 12 are electrically connected to each other, to form a spiral helicine coil by the pathway electrode 13 being formed in described insulating barrier 11.
Step 2: form the first interior electrode 2 being electrically connected with the first end 121 of described spiral helicine coil, and make the first interior electrode 2 exposed in described mounting surface, and form the second inner electrode 3 being electrically connected with the second end 122 of described spiral helicine coil, and make the second inner electrode 3 exposed in described mounting surface simultaneously.
Step 3: in described mounting surface, form be electrically connected with the first interior electrode 2 first outside 4, and the second external electrode 5 being electrically connected with the second inner electrode 3.
Wherein, in step 1, each conductive pattern 12 includes head end and tail end, the tail end of the conductive pattern 12 of last layer is electrically connected with the head end of the conductive pattern 12 of lower one deck by pathway electrode 13, and the first end that the head end that makes the conductive pattern 12 of the top layer of multiple conductive patterns 12 is described spiral helicine coil, the second end 122 that the tail end of the conductive pattern 12 of the lowermost layer of multiple conductive patterns 12 is described spiral helicine coil. In addition, multiple insulating barrier 11 heap poststack pressurizations can be formed to laminate, thereby the conductive pattern 12 on upper and lower two insulating barriers is electrically connected by described channel electrode 13. In addition, also need the described laminate to forming to carry out sintering. In order to protect conductive pattern 12 in described laminate not to be subject to the impact of outside unfavorable factor, upper surface and lower surface that step 1 is also included in described laminate cover respectively upper caldding layer and lower caldding layer.
In step 2, can make the first interior electrode 2 and described the second inner electrode 3 form by conductive hole and the conductive material being filled in described conductive hole, wherein, described conductive hole is extended to respectively first end 121 and the second end place 122 of described spiral helicine coil by the mounting surface of laminated body 1. Concrete, can, at described mounting surface place, by the mode of laser beam drilling, form described conductive hole, and in electric hole, fill copper described by filling out process for copper.
In step 3, can pass through silk-screen printing technique, at described mounting surface printing conductive material sintering, to form the first external electrode 4 and the second external electrode 5. Then by rolling ferryman's skill, on the first external electrode 4 and the second external electrode 5, plate weld layer, as tin layer.
The laminated inductor surface mount forming according to the manufacture method of laminated inductor provided by the invention in circuit board or package assembling time, has the reliability of more increasing.
According to embodiments of the invention as described above, these embodiment do not have all details of detailed descriptionthe, and also not limiting this invention is only described specific embodiment. Obviously,, according to above description, can make many modifications and variations. These embodiment are chosen and specifically described to this description, is in order to explain better principle of the present invention and practical application, thereby under making, technical field technical staff can utilize the present invention and the amendment on basis of the present invention to use well. The present invention is only subject to the restriction of claims and four corner and equivalent.
Claims (17)
1. a laminated inductor, is characterized in that, comprising:
Laminated body, stacking in described laminated body have multiple insulating barriers, a surface of described laminated bodyFor mounting surface, described in each, the surface of insulating barrier is provided with conductive pattern, and multiple described pattern passes throughThe pathway electrode that is arranged in described insulating barrier is electrically connected to each other, to form a spiral helicine coil;
The first interior electrode, one end of described the first interior electrode is electrically connected with the first end of described coil, the other endExposed in described mounting surface;
The second inner electrode, one end of described the second inner electrode is electrically connected with the second end of described coil, the other endExposed in described mounting surface;
The first external electrode, described the first external electrode is positioned in described mounting surface, and with described the first interior electrodeElectrical connection;
The second external electrode, described the second external electrode is positioned in described mounting surface, and with described the second inner electrodeElectrical connection.
2. laminated inductor according to claim 1, is characterized in that, described in described mounting surface isThe upper surface of laminated body or be the lower surface relative with described upper surface.
3. laminated inductor according to claim 1, is characterized in that, also comprise upper caldding layer and underCover layer, multiple described stacked dielectric layers are between described upper caldding layer and lower caldding layer.
4. laminated inductor according to claim 2, is characterized in that described the first interior electrode and secondInterior electrode is by conductive hole and be filled in the conductive material formation in described conductive hole, wherein, and described conductive holeExtended to respectively first end and the second end place of described coil by the mounting surface of described laminated body.
5. laminated inductor according to claim 4, is characterized in that, described in each, conductive pattern is equalComprise head end and tail end, the tail end of the described conductive pattern of last layer is by described pathway electrode and lower one deckThe head end electrical connection of described conductive pattern,
The first end of coil described in the head end of the conductive pattern of the top layer of multiple described conductive patterns, instituteThe tail end of the conductive pattern of the lowermost layer of described conductive pattern is the second end of described coil.
6. laminated inductor according to claim 1, is characterized in that, described insulating barrier is by magnetic materialMaterial or dielectric material form.
7. laminated inductor according to claim 1, is characterized in that, also comprises and is positioned at described firstWeld layer on external electrode and the second external electrode, described laminated inductor is by described weld layer and external circuitElectrical connection.
8. a manufacture method for laminated inductor, is characterized in that, comprising:
Form laminated body, stacking in described laminated body have multiple insulating barriers, and by described laminated bodyA surface is set as mounting surface, and described in each, the surface of insulating barrier is provided with conductive pattern, and makes manyIndividual described pattern is electrically connected to each other by the pathway electrode being formed in described insulating barrier, to form a spiralThe coil of shape;
Form the first interior electrode being electrically connected with the first end of described coil, and make described the first interior electrode exposedIn described mounting surface;
Form the second inner electrode being electrically connected with the second end of described coil, and make described the second inner electrode exposedIn described mounting surface;
In described mounting surface, form the first external electrode that is electrically connected with described the first interior electrode, and with theThe second external electrode of two interior electrode electrical connections.
9. manufacture method according to claim 8, is characterized in that, by multiple described stacked dielectric layersRear pressurization forms laminate, thereby makes the conductive pattern on upper and lower two insulating barriers pass through described channel electrode electricityConnect.
10. manufacture method according to claim 9, is characterized in that, forms described laminated bodyStep also comprises carries out sintering to described laminate.
11. manufacture methods according to claim 10, is characterized in that, forms described laminated bodyUpper surface and lower surface that step is also included in described laminate cover respectively upper caldding layer and lower caldding layer.
12. manufacture methods according to claim 8, is characterized in that, described the first interior electrode with described inThe second inner electrode is by conductive hole and be filled in conductive material in described conductive hole and form, wherein, described in leadElectricity hole is extended to respectively first end and the second end place of described coil by the mounting surface of described laminated body.
13. according to manufacture method described in claim 12, it is characterized in that, at described mounting surface place, logicalCross the mode of laser beam drilling, form described conductive hole, and in electric hole, fill copper described by filling out process for copper.
14. manufacture methods according to claim 13, is characterized in that, by silk-screen printing technique,At described mounting surface printing conductive material sintering, to form described the first external electrode and the second external electrode.
15. manufacture methods according to claim 14, is characterized in that, by rolling ferryman's skill, in instituteState on the first external electrode and the second external electrode and plate weld layer.
16. manufacture methods according to claim 8, is characterized in that, conductive pattern described in eachInclude head end and tail end, make the tail end of described conductive pattern of last layer by described pathway electrode and nextThe head end electrical connection of the described conductive pattern of layer,
The first end that the head end of the conductive pattern of the top layer of multiple described conductive patterns is described coil, instituteThe tail end of the conductive pattern of the lowermost layer of individual described conductive pattern is the second end of described coil.
17. 1 kinds of stacked package assemblies, is characterized in that, comprise if claim 1 is to claim 7Laminated inductor, chip, electric connector, lead frame, conductive pole and plastic-sealed body described in any one,
Wherein, described chip is electrically connected with described lead frame by described electric connector, described conductive pole positionIn described lead frame around,
Described laminated inductor is positioned over described chip top, and the mounting surface of described laminated inductor towardsDescribed chip, and the first external electrode of described laminated inductor and the second external electrode be welded on described conductive pole,
Described plastic-sealed body covers described laminated inductor, conductive pole, chip, electric connector and lead frameUpper, and the surface exposure of described plastic-sealed body goes out described lead frame and conductive pole, using as described stacked packageThe outer pin that assembly is electrically connected with external circuit.
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| CN201511008059.6A CN105609231A (en) | 2015-12-24 | 2015-12-24 | Laminated inductor and manufacturing method therefor and lamination packaging assembly |
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| CN201511008059.6A CN105609231A (en) | 2015-12-24 | 2015-12-24 | Laminated inductor and manufacturing method therefor and lamination packaging assembly |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231338A (en) * | 2016-12-21 | 2018-06-29 | 株式会社村田制作所 | surface mounting inductor |
| CN108257943A (en) * | 2016-12-29 | 2018-07-06 | 今展科技股份有限公司 | Inductor packaging structure and preparation method thereof |
| CN110828137A (en) * | 2018-08-13 | 2020-02-21 | 三星电机株式会社 | Inductor |
| CN111540563A (en) * | 2016-05-30 | 2020-08-14 | Tdk株式会社 | Laminated coil component |
| CN113777447A (en) * | 2021-07-28 | 2021-12-10 | 国网宁夏电力有限公司电力科学研究院 | Reactor for lightning arrester test platform |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102360718A (en) * | 2010-05-24 | 2012-02-22 | 三星电机株式会社 | Multilayer type inductor |
| CN103000608A (en) * | 2012-12-11 | 2013-03-27 | 矽力杰半导体技术(杭州)有限公司 | Chip packaging structure of a plurality of assemblies |
| CN103021995A (en) * | 2012-12-28 | 2013-04-03 | 华天科技（西安）有限公司 | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor and manufacturing technology of single chip packaging piece |
| CN103764592A (en) * | 2011-09-02 | 2014-04-30 | 株式会社村田制作所 | Ferrite ceramic composition, ceramic electronic component, and production method for ceramic electronic component |
-
2015
- 2015-12-24 CN CN201511008059.6A patent/CN105609231A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102360718A (en) * | 2010-05-24 | 2012-02-22 | 三星电机株式会社 | Multilayer type inductor |
| CN103764592A (en) * | 2011-09-02 | 2014-04-30 | 株式会社村田制作所 | Ferrite ceramic composition, ceramic electronic component, and production method for ceramic electronic component |
| CN103000608A (en) * | 2012-12-11 | 2013-03-27 | 矽力杰半导体技术(杭州)有限公司 | Chip packaging structure of a plurality of assemblies |
| CN103021995A (en) * | 2012-12-28 | 2013-04-03 | 华天科技（西安）有限公司 | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor and manufacturing technology of single chip packaging piece |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540563A (en) * | 2016-05-30 | 2020-08-14 | Tdk株式会社 | Laminated coil component |
| CN111564278A (en) * | 2016-05-30 | 2020-08-21 | Tdk株式会社 | Laminated coil component |
| CN111564278B (en) * | 2016-05-30 | 2022-07-12 | Tdk株式会社 | Laminated coil component |
| CN111540563B (en) * | 2016-05-30 | 2023-05-23 | Tdk株式会社 | Laminated coil component |
| CN108231338A (en) * | 2016-12-21 | 2018-06-29 | 株式会社村田制作所 | surface mounting inductor |
| CN108257943A (en) * | 2016-12-29 | 2018-07-06 | 今展科技股份有限公司 | Inductor packaging structure and preparation method thereof |
| CN110828137A (en) * | 2018-08-13 | 2020-02-21 | 三星电机株式会社 | Inductor |
| CN110828137B (en) * | 2018-08-13 | 2024-01-05 | 三星电机株式会社 | Inductor(s) |
| CN113777447A (en) * | 2021-07-28 | 2021-12-10 | 国网宁夏电力有限公司电力科学研究院 | Reactor for lightning arrester test platform |
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