CN103298961B - Cu-Co-Si-Zr合金材料及其制造方法 - Google Patents
Cu-Co-Si-Zr合金材料及其制造方法 Download PDFInfo
- Publication number
- CN103298961B CN103298961B CN201280005365.2A CN201280005365A CN103298961B CN 103298961 B CN103298961 B CN 103298961B CN 201280005365 A CN201280005365 A CN 201280005365A CN 103298961 B CN103298961 B CN 103298961B
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- phase particles
- temperature
- alloy material
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- diameter
- Prior art date
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- 239000000956 alloy Substances 0.000 title claims abstract description 37
- 229910008341 Si-Zr Inorganic materials 0.000 title claims abstract description 15
- 229910006682 Si—Zr Inorganic materials 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000002245 particle Substances 0.000 claims abstract description 112
- 239000013078 crystal Substances 0.000 claims abstract description 37
- 230000032683 aging Effects 0.000 claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000005098 hot rolling Methods 0.000 claims abstract description 14
- 238000005266 casting Methods 0.000 claims abstract description 7
- 239000000243 solution Substances 0.000 claims description 37
- 239000006104 solid solution Substances 0.000 claims description 35
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 13
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 238000005452 bending Methods 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 14
- 238000001556 precipitation Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 238000005097 cold rolling Methods 0.000 description 9
- 229910020711 Co—Si Inorganic materials 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 238000005728 strengthening Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000001376 precipitating effect Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 244000287680 Garcinia dulcis Species 0.000 description 1
- 206010053759 Growth retardation Diseases 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 231100000001 growth retardation Toxicity 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011005088A JP2012144789A (ja) | 2011-01-13 | 2011-01-13 | Cu−Co−Si−Zr合金材 |
JP2011-005088 | 2011-01-13 | ||
PCT/JP2012/050508 WO2012096351A1 (ja) | 2011-01-13 | 2012-01-12 | Cu-Co-Si-Zr合金材及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103298961A CN103298961A (zh) | 2013-09-11 |
CN103298961B true CN103298961B (zh) | 2015-06-17 |
Family
ID=46507242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280005365.2A Active CN103298961B (zh) | 2011-01-13 | 2012-01-12 | Cu-Co-Si-Zr合金材料及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130284323A1 (zh) |
EP (1) | EP2664685B1 (zh) |
JP (1) | JP2012144789A (zh) |
KR (1) | KR20130122654A (zh) |
CN (1) | CN103298961B (zh) |
TW (1) | TWI432587B (zh) |
WO (1) | WO2012096351A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104388859A (zh) * | 2014-11-18 | 2015-03-04 | 昆明理工大学 | 一种同时提高铜铝合金强度和塑性的方法 |
KR102434449B1 (ko) * | 2018-09-10 | 2022-08-18 | 주식회사 엘지화학 | 고 내 피로 특성을 가지는 디스플레이 장치용 백플레이트 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1793394A (zh) * | 2004-12-24 | 2006-06-28 | 株式会社神户制钢所 | 具有弯曲性和应力弛豫性能的铜合金 |
WO2009116649A1 (ja) * | 2008-03-21 | 2009-09-24 | 古河電気工業株式会社 | 電気電子部品用銅合金材 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4943095B2 (ja) * | 2006-08-30 | 2012-05-30 | 三菱電機株式会社 | 銅合金及びその製造方法 |
JP5085908B2 (ja) * | 2006-10-03 | 2012-11-28 | Jx日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
JP4357536B2 (ja) * | 2007-02-16 | 2009-11-04 | 株式会社神戸製鋼所 | 強度と成形性に優れる電気電子部品用銅合金板 |
JP2008266787A (ja) * | 2007-03-28 | 2008-11-06 | Furukawa Electric Co Ltd:The | 銅合金材およびその製造方法 |
JP2009242814A (ja) | 2008-03-28 | 2009-10-22 | Furukawa Electric Co Ltd:The | 銅合金材およびその製造方法 |
JP4697267B2 (ja) | 2008-07-01 | 2011-06-08 | ソニー株式会社 | ハウリング検出装置およびハウリング検出方法 |
WO2010013790A1 (ja) * | 2008-07-31 | 2010-02-04 | 古河電気工業株式会社 | 電気電子部品用銅合金材料とその製造方法 |
JP5619389B2 (ja) * | 2008-08-05 | 2014-11-05 | 古河電気工業株式会社 | 銅合金材料 |
WO2010016429A1 (ja) | 2008-08-05 | 2010-02-11 | 古河電気工業株式会社 | 電気・電子部品用銅合金材料 |
-
2011
- 2011-01-13 JP JP2011005088A patent/JP2012144789A/ja not_active Withdrawn
-
2012
- 2012-01-09 TW TW101100744A patent/TWI432587B/zh not_active IP Right Cessation
- 2012-01-12 EP EP12734565.0A patent/EP2664685B1/en active Active
- 2012-01-12 US US13/979,103 patent/US20130284323A1/en not_active Abandoned
- 2012-01-12 CN CN201280005365.2A patent/CN103298961B/zh active Active
- 2012-01-12 KR KR1020137021206A patent/KR20130122654A/ko active Search and Examination
- 2012-01-12 WO PCT/JP2012/050508 patent/WO2012096351A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1793394A (zh) * | 2004-12-24 | 2006-06-28 | 株式会社神户制钢所 | 具有弯曲性和应力弛豫性能的铜合金 |
WO2009116649A1 (ja) * | 2008-03-21 | 2009-09-24 | 古河電気工業株式会社 | 電気電子部品用銅合金材 |
Also Published As
Publication number | Publication date |
---|---|
EP2664685A1 (en) | 2013-11-20 |
EP2664685B1 (en) | 2015-10-07 |
CN103298961A (zh) | 2013-09-11 |
TWI432587B (zh) | 2014-04-01 |
JP2012144789A (ja) | 2012-08-02 |
TW201233819A (en) | 2012-08-16 |
WO2012096351A1 (ja) | 2012-07-19 |
KR20130122654A (ko) | 2013-11-07 |
EP2664685A4 (en) | 2014-04-09 |
US20130284323A1 (en) | 2013-10-31 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |