CN103254425B - 封端共聚酰胺热熔胶及其制造方法 - Google Patents
封端共聚酰胺热熔胶及其制造方法 Download PDFInfo
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- CN103254425B CN103254425B CN201210036477.6A CN201210036477A CN103254425B CN 103254425 B CN103254425 B CN 103254425B CN 201210036477 A CN201210036477 A CN 201210036477A CN 103254425 B CN103254425 B CN 103254425B
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- China
- Prior art keywords
- acid
- capping reagent
- copolyamide
- reaction
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 15
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 229920000305 Nylon 6,10 Polymers 0.000 claims abstract description 10
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000001361 adipic acid Substances 0.000 claims abstract description 7
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 7
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims abstract 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 18
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 229910021529 ammonia Inorganic materials 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 125000003368 amide group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 6
- 150000004702 methyl esters Chemical class 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 4
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 239000002808 molecular sieve Substances 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 238000005576 amination reaction Methods 0.000 claims description 2
- HJMZMZRCABDKKV-UHFFFAOYSA-N carbonocyanidic acid Chemical group OC(=O)C#N HJMZMZRCABDKKV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 150000004985 diamines Chemical class 0.000 claims description 2
- 230000032050 esterification Effects 0.000 claims description 2
- 238000005886 esterification reaction Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 125000001165 hydrophobic group Chemical group 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- IJXHLVMUNBOGRR-UHFFFAOYSA-N methyl nonanoate Chemical compound CCCCCCCCC(=O)OC IJXHLVMUNBOGRR-UHFFFAOYSA-N 0.000 description 2
- IBMRTYCHDPMBFN-UHFFFAOYSA-N monomethyl glutaric acid Chemical compound COC(=O)CCCC(O)=O IBMRTYCHDPMBFN-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- OSYQOBUUFRGFNG-UHFFFAOYSA-N Sebacic acid monomethyl ester Chemical compound COC(=O)CCCCCCCCC(O)=O OSYQOBUUFRGFNG-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000002311 glutaric acids Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Polyamides (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210036477.6A CN103254425B (zh) | 2012-02-17 | 2012-02-17 | 封端共聚酰胺热熔胶及其制造方法 |
Applications Claiming Priority (1)
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CN201210036477.6A CN103254425B (zh) | 2012-02-17 | 2012-02-17 | 封端共聚酰胺热熔胶及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN103254425A CN103254425A (zh) | 2013-08-21 |
CN103254425B true CN103254425B (zh) | 2016-08-17 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210036477.6A Active CN103254425B (zh) | 2012-02-17 | 2012-02-17 | 封端共聚酰胺热熔胶及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103254425B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114163632A (zh) * | 2022-01-04 | 2022-03-11 | 上海东睿化学有限公司 | 一种耐黄变共聚酰胺及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850887A (en) * | 1972-09-13 | 1974-11-26 | Usm Corp | Lactam copolyamides for adhesive use |
US4024116A (en) * | 1974-09-21 | 1977-05-17 | Basf Aktiengesellschaft | Hot-melt adhesive based on copolyamides from caprolactam and alkylene dicarboxylic acid salts of polyether diamine |
CN1884419A (zh) * | 2006-07-03 | 2006-12-27 | 无锡殷达尼龙有限公司 | 癸二胺产品在共聚酰胺热熔胶制备中的应用 |
CN101307218A (zh) * | 2008-06-20 | 2008-11-19 | 上海天洋热熔胶有限公司 | 服装用耐高温水洗聚酰胺热熔胶及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7001979B2 (en) * | 2002-06-14 | 2006-02-21 | H.B. Fuller Licensing & Financing Inc. | Polyamide and composition and article including same |
-
2012
- 2012-02-17 CN CN201210036477.6A patent/CN103254425B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850887A (en) * | 1972-09-13 | 1974-11-26 | Usm Corp | Lactam copolyamides for adhesive use |
US4024116A (en) * | 1974-09-21 | 1977-05-17 | Basf Aktiengesellschaft | Hot-melt adhesive based on copolyamides from caprolactam and alkylene dicarboxylic acid salts of polyether diamine |
CN1884419A (zh) * | 2006-07-03 | 2006-12-27 | 无锡殷达尼龙有限公司 | 癸二胺产品在共聚酰胺热熔胶制备中的应用 |
CN101307218A (zh) * | 2008-06-20 | 2008-11-19 | 上海天洋热熔胶有限公司 | 服装用耐高温水洗聚酰胺热熔胶及其制备方法 |
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CN103254425A (zh) | 2013-08-21 |
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Denomination of invention: Terminated copolyamide hot melt adhesive and its manufacturing method Effective date of registration: 20220721 Granted publication date: 20160817 Pledgee: Industrial Bank Co.,Ltd. Shanghai Branch Pledgor: SHANGHAI DONGRUI CHEMICAL Co.,Ltd. Registration number: Y2022310000135 |
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Date of cancellation: 20230718 Granted publication date: 20160817 Pledgee: Industrial Bank Co.,Ltd. Shanghai Branch Pledgor: SHANGHAI DONGRUI CHEMICAL Co.,Ltd. Registration number: Y2022310000135 |
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Denomination of invention: Capped copolyamide hot melt adhesive and its manufacturing method Effective date of registration: 20230726 Granted publication date: 20160817 Pledgee: Industrial Bank Co.,Ltd. Shanghai Jinshan Branch Pledgor: SHANGHAI DONGRUI CHEMICAL Co.,Ltd. Registration number: Y2023310000400 |
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Address after: 639 Xiasheng Road, Jinshan District, Shanghai, May 12, 2015 Patentee after: Shanghai Dongrui New Materials Co.,Ltd. Country or region after: China Address before: Room 1104, Building 1, No. 1089 Laoweiqing Road, Jinshanwei Town, Jinshan District, Shanghai, December 2010 Patentee before: SHANGHAI DONGRUI CHEMICAL Co.,Ltd. Country or region before: China |