CN103233255B - Flexible PCB directly electroplating technology - Google Patents
Flexible PCB directly electroplating technology Download PDFInfo
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- CN103233255B CN103233255B CN201310168973.1A CN201310168973A CN103233255B CN 103233255 B CN103233255 B CN 103233255B CN 201310168973 A CN201310168973 A CN 201310168973A CN 103233255 B CN103233255 B CN 103233255B
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Abstract
The present invention provides a kind of flexible PCB directly electroplating technology, comprises the steps: that S001:PI adjusts, S002: first time washing；S003: whole hole；S004: second time washing；S005: oxidation；S006: third time washing；S007: polymerization；S008: the four washing, owing to whole process only needs to include PI adjustment, whole hole, 4 chemical reaction grooves of oxidation polymerization and 4 road overflow washing process, there is time efficiency high, flow process is short, manageability, discharge of wastewater is few, and management and control is simple, the advantages such as thing without Heavy environmental pollution, it is possible to use small lot test plate (panel) to produce further。
Description
Technical field
The present invention relates to printed circuit board (PCB) and Related product manufactures field, particularly relate to a kind of flexible PCB directly electroplating technology。
Background technology
Printed circuit board (PCB), according to it, whether there is flexibility and can be divided into hard printed circuit board and flexible printed wiring board, the manufacture of hard printed circuit board is with substrate for parent material, first make internal layer circuit, whole process need to via pre-treatment, upper photoresist, exposure, development, the steps such as etching and removal photoresist, to form circuit diagram, and process alligatoring copper surface by melanism or brown, increase the adherence of itself and insulating resin, further with film pressing, conducting between ectonexine then uses machinery or laser drill, the conductive path between substrate is formed then through electroplating processes, circuit board outer layer after completing processing of circuit, it is coated anti-solder ink, and optionally do surface oxidation-resistant process again, to strengthen the oxidation resistance on surface。
As for flexible printed wiring board, it is that based on the insulating barrier by the flexible character of tool and Copper Foil, material combination forms, it is widely used in the electronic product of 3C, particularly significantly high in the utilization rate of mobile phone and LCD display, the raw material that flexible printed wiring board uses can divide into resin, Copper Foil, solid, surface cuticula, flexible copper foil substrate etc.。
Traditional electroplating technology adopts PTH line, and the production time of the single flow process of this production line, production procedure needed 7 chemical reaction grooves altogether up to 1.5 hours, including the process of 6 road overflow washings。Product also needs to after making carry out project detection, and such as backlight test etc., the product produced in addition contains the harmful substance such as formaldehyde, EDTA。In order to solve above-mentioned technical problem, it is necessary to a kind of new production technology。
Summary of the invention
The invention aims to provide a kind of preparation technology simple, product quality is high, meets the flexible PCB directly electroplating technology of environmental requirement。
In order to solve above-mentioned technical problem, the present invention adopts the following technical scheme that: providing a kind of flexible PCB directly electroplating technology, concrete comprises the steps:
S001:PI adjusts,
S002: first time washing
S003: whole hole
S004: second time washing
S005: oxidation
S006: third time washing
S007: polymerization
S008: the four washing
S009: copper facing
Wherein, described whole hole specifically includes:
Position, hole is arranged, and position, described hole is arranged at a corner of plate, and adjacent holes spacing is 10-20mm；
Secondary drilling is maked corrections and individually makes corrections after the region needing correction is split, then remerge into the secondary drilling correction program completed。
Wherein, described PI adjusts and adopts regulator CL-8110。
Wherein, washing of described first time, second time washing, third time washing and the 4th washing all adopt clear water to process；The described first time washing process time is 2 minutes, and second time washing and the 4th washing time are 3 minutes, and third time washing time is 4 minutes。
Wherein, in step S010, described microetch adopts SPS micro-corrosion liquid。
The technical program provides the benefit that: above-described flexible PCB directly electroplating technology becomes FDM Direct Electroplating vertical flow path, the whole process of FDM directly electroplating technology only needs to include PI adjustment, whole hole, 4 chemical reaction grooves of oxidation polymerization and 4 road overflow washing process, there is time efficiency high, flow process is short, manageability, discharge of wastewater is few, and management and control is simple, the advantages such as thing without Heavy environmental pollution, it is possible to use small lot test plate (panel) to produce further。
Accompanying drawing explanation
It it is the flow chart of the flexible PCB directly electroplating technology of the present invention shown in Fig. 1。
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment and coordinate accompanying drawing to be explained in detail。
Refer to Fig. 1, the flexible PCB directly electroplating technology of present embodiment, comprise the steps:
S001:PI adjusts, and described PI adjusts the PI layer of the hole wall being adjustment flexible PCB, adopts regulator CL-8110。This regulator is used exclusively for PI etching technics optimization and studies, and is the regulator processed for polyimide base material hole wall in two-sided and multi-layer flexible sheet production process, is etch regulator for high-accuracy circuit and small-bore to printed circuit board (PCB) hole wall。This regulator can remove the defects such as the slight burr on flexible board hole wall, burr, brill dirt, can strengthen the hydrophilic ability of resin surface and inhale palladium power, strengthening the adhesion of chemical deposit and base material, and operation temperature is low, is not easy to swelling glued membrane occur。
S002: first time washing, PI on first time washing cleaning flexible PCB adjusts liquid medicine residual, the process time is 2 minutes, adopt washing process to instead of traditional etching and soda acid washes process, eliminate the emission treatment in later stage, not only reduce manufacturing cost, also eliminate the hidden danger of exhaust emission, and the circuit that formed by conductive materials is more complete, the yield of its quality is higher。
S003: whole hole, needs to carry out the setting of position, hole in the process in whole hole, and position, described hole is arranged at a corner of plate, and adjacent holes spacing is 10-20mm。The position, hole of prior art is generally positioned at the corner in the four direction hole of product。Position, four holes of the technical program may be contained within a corner of product, distance between position, hole is smaller, when product shrinkage rates is very big time, can ensure that space length shrinkage value is only small, even it is negligible, thus can realize making corrections, pullling of position, hole is not deformed, just can by the purpose on borehole jack thus reaching position, hole to be carried out correction。
Additionally, in the process in whole hole, secondary drilling is maked corrections and individually makes corrections after the region needing correction is split, then remerge into the secondary drilling correction program completed。Concrete, it being divided into two parts by the whole secondary drilling program of product and make corrections, two parts make corrections respectively according to actual contraction situation, can well meet the boring requirement of whole product, it does not have product occurs the situation of holes after piercing after correction。
S004: second time washing, the whole hole liquid medicine residual on second time washing cleaning flexible PCB, the process time is 3 minutes。
S005: oxidation, described oxidation is on flexible PCB and hole wall attachment last layer oxidation material, prepare for follow-up polymerization, adopt two kinds of liquid medicine of FDM220A and FDM220B, in the present invention, 1-3% sulphuric acid can be added after oxidation wash, thus the potassium permanganate that effectively clean oxidation back plate face remains, and on subsequent chemical reaction without impact。
S006: third time washing, it adopts clear water to process, and the process time is 4 minutes,
S007: polymerization, described polymerization is on flexible PCB and hole wall attachment last layer conductive materials, makes flexible PCB hole wall turn on, adopts tri-kinds of liquid medicine of FDM230A, FDM230B, FDM230C。
S008: the four washing, it adopts clear water to process, and the process time is 3 minutes。
Wherein, concrete processing mode is as follows:
Adopt with the aforedescribed process, observe the connection of copper hole after copper facing respond well, imperforate wall separation, breakage problem after thermal shock, whole process only needs 22 minutes consuming time, the technical process of production procedure only needs four chemical reaction grooves, four road overflow washings, has saved multiple working procedure。The FDM directly electroplating technology time is short, and efficiency is high, the short manageability of flow process, and discharge of wastewater is few, and management and control is simple, without Heavy environmental pollution thing etc., it is possible to use small lot test plate (panel) to produce further。
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention and accompanying drawing content to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention。
Claims (2)
1. a flexible PCB directly electroplating technology, it is characterised in that comprise the steps:
S001:PI adjusts,
S002: first time washing
S003: whole hole
S004: second time washing
S005: oxidation
S006: third time washing
S007: polymerization
S008: the four washing；
S009: copper facing
Described whole hole specifically includes:
Position, hole is arranged, and position, described hole is arranged at a corner of plate, and adjacent holes spacing is 10-20mm；
Secondary drilling is maked corrections and individually makes corrections after the region needing correction is split, then remerge into the secondary drilling correction program completed；
Described PI adjusts and adopts regulator CL-8110；
Described flexible PCB directly electroplating technology is FDM directly electroplating technology。
2. flexible PCB directly electroplating technology according to claim 1, it is characterised in that: the washing of described first time, second time washing, third time washing and the 4th washing all adopt clear water to process；
The described first time washing process time is 2 minutes, and second time washing and the 4th washing time are 3 minutes, and third time washing time is 4 minutes。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168973.1A CN103233255B (en) | 2013-05-06 | 2013-05-06 | Flexible PCB directly electroplating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168973.1A CN103233255B (en) | 2013-05-06 | 2013-05-06 | Flexible PCB directly electroplating technology |
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| CN103233255A CN103233255A (en) | 2013-08-07 |
| CN103233255B true CN103233255B (en) | 2016-06-22 |
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| CN201310168973.1A Active CN103233255B (en) | 2013-05-06 | 2013-05-06 | Flexible PCB directly electroplating technology |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111312095A (en) * | 2020-03-18 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Blackening treatment process for side surface of printed board for LED transparent display screen |
| CN113163623B (en) * | 2021-04-27 | 2022-03-11 | 江门市和美精艺电子有限公司 | Method for manufacturing blind hole buried hole filling packaging substrate of multilayer board |
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| CN1063319A (en) * | 1991-01-15 | 1992-08-05 | 机械电子工业部第十五研究所 | Preparation method of thin copper-clad invar sheets |
| US5770032A (en) * | 1996-10-16 | 1998-06-23 | Fidelity Chemical Products Corporation | Metallizing process |
| CN1391429A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Process for preparing flexible circuit board |
| CN1575099A (en) * | 2003-06-18 | 2005-02-02 | 三菱伸铜株式会社 | Method for forming sheet metal |
| JP2006289959A (en) * | 2005-03-14 | 2006-10-26 | Nippon Steel Chem Co Ltd | Copper-clad laminate |
| CN101638802A (en) * | 2008-07-28 | 2010-02-03 | 比亚迪股份有限公司 | Pre-plating correction liquid and pre-plating treatment method for circuit board |
| CN102787316A (en) * | 2012-08-30 | 2012-11-21 | 长沙牧泰莱电路技术有限公司 | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution |
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2013
- 2013-05-06 CN CN201310168973.1A patent/CN103233255B/en active Active
Patent Citations (7)
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|---|---|---|---|---|
| CN1063319A (en) * | 1991-01-15 | 1992-08-05 | 机械电子工业部第十五研究所 | Preparation method of thin copper-clad invar sheets |
| US5770032A (en) * | 1996-10-16 | 1998-06-23 | Fidelity Chemical Products Corporation | Metallizing process |
| CN1391429A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Process for preparing flexible circuit board |
| CN1575099A (en) * | 2003-06-18 | 2005-02-02 | 三菱伸铜株式会社 | Method for forming sheet metal |
| JP2006289959A (en) * | 2005-03-14 | 2006-10-26 | Nippon Steel Chem Co Ltd | Copper-clad laminate |
| CN101638802A (en) * | 2008-07-28 | 2010-02-03 | 比亚迪股份有限公司 | Pre-plating correction liquid and pre-plating treatment method for circuit board |
| CN102787316A (en) * | 2012-08-30 | 2012-11-21 | 长沙牧泰莱电路技术有限公司 | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution |
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| CN103233255A (en) | 2013-08-07 |
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