CN103233255A - Direct electroplating process for flexible printed circuit board - Google Patents
Direct electroplating process for flexible printed circuit board Download PDFInfo
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- CN103233255A CN103233255A CN2013101689731A CN201310168973A CN103233255A CN 103233255 A CN103233255 A CN 103233255A CN 2013101689731 A CN2013101689731 A CN 2013101689731A CN 201310168973 A CN201310168973 A CN 201310168973A CN 103233255 A CN103233255 A CN 103233255A
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Abstract
The invention provides a direct electroplating process for a flexible printed circuit board. The process comprises the following steps of: (S001), performing proportion-integration (PI) adjustment; (S002) washing for the first time; (S003), conditioning a hole; (S004), washing for the second time; (S005), oxidizing; (S006), washing for the third time; (S007), polymerizing; and (S008), washing for the fourth time. In the whole process, four chemical reaction tanks for PI adjustment, hole-conditioning, oxidization and polymerization and four overflowing washing processes are needed. The direct electroplating process for the flexible printed circuit board has the advantages of high time efficiency, short flow, manageability, small wastewater discharge quantity, simpleness in management and control, no severe environmental pollution and the like, and can be further applied to small-batch test board production.
Description
Technical field
The present invention relates to printed circuit board (PCB) and related products and make the field, relate in particular to a kind of flexible PCB directly electroplating technology.
Background technology
Printed circuit board (PCB), whether have flexible hard printed circuit board and the flexible printed wiring board of being divided into according to it, the manufacturing of hard printed circuit board is to be parent material with the substrate, make internal layer circuit earlier, whole process needs via pre-treatment, last photoresist material, exposure, develop, steps such as etching and removal photoresist material, to form schematic circuit, and by melanism or brown processing alligatoring copper surface, increase the then property of itself and insulating resin, further with the film pressing, machinery or laser drill are then used in conducting between the ectonexine, form conductive path between substrate through electroplating processes again, the circuit card skin after finishing processing of circuit is coated with anti-solder ink again, and optionally do surface oxidation-resistant again and handle, to strengthen the resistance of oxidation on surface.
As for flexible printed wiring board, be that insulation layer and Copper Foil by tool flexible character is that basic material combines, it is widely used in the electronic product of 3C, particularly the rate of utilization at mobile phone and LCD display is very high, and the employed starting material of flexible printed wiring board can be divided into resin, Copper Foil, solid, surperficial cuticula, flexible copper foil substrate etc.
Traditional electroplating technology adopts the PTH line, and the production time of the single flow process of this production line reaches 1.5 hours, and Production Flow Chart needs 7 chemical reaction grooves altogether, comprises the process of 6 road overflow washings.Also need to carry out project after product is made and detect, as test backlight etc., the product of producing in addition contains harmful substances such as formaldehyde, EDTA.In order to solve above-mentioned technical problem, need a kind of new production technique.
Summary of the invention
The objective of the invention is in order to provide a kind of preparation technology simple, quality product is high, the flexible PCB directly electroplating technology of compliance with environmental protection requirements.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme: a kind of flexible PCB directly electroplating technology is provided, and concrete comprises the steps:
S001:PI adjusts,
S002: washing for the first time
S003: whole hole
S004: washing for the second time
S005: oxidation
S006: washing for the third time
S007: polymerization
S008: the 4th washing
Wherein, described whole hole specifically comprises:
The position, hole arranges, and position, described hole is arranged at a corner of plate, and adjacent distance between borehole is 10-20mm;
Secondary drilling is carried out revisal will need the zone of revisal to split back revisal separately, and then be merged into the secondary drilling correction program of finishing.
Wherein, described PI adjusts to adopt and adjusts agent CL-8110.
Wherein, the described washing first time, washing for the second time, washing for the third time and the 4th washing all adopt clear water to handle; Washing the treatment time the described first time is 2 minutes, and washing and the 4th washing time are 3 minutes for the second time, and the time of washing for the third time is 4 minutes.
Wherein, among the step S010, described microetch adopts the SPS micro-etching solution.
The beneficial effect of the technical program is: above-described flexible PCB directly electroplating technology becomes FDM Direct Electroplating vertical flow path, the whole process of FDM directly electroplating technology only needs to comprise that PI adjusts, 4 chemical reaction grooves of whole hole, oxypolymerization and 4 road overflow washing process, the time efficiency height is arranged, flow process is short, manageability, discharge of wastewater is few, and management and control is simple, do not have advantages such as serious environmental pollutant, can further use the production of short run test plate (panel).
Description of drawings
Shown in Figure 1 is the schema of flexible PCB directly electroplating technology of the present invention.
Embodiment
By describing technology contents of the present invention, structural attitude in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 1, the flexible PCB directly electroplating technology of present embodiment comprises the steps:
S001:PI adjusts, and it is the PI layer of adjusting the hole wall of flexible PCB that described PI adjusts, and adopts and adjusts agent CL-8110.This adjustment agent is specifically designed to the optimization of PI etching technics and studies, and is the adjustment agent of handling at polyimide base material hole wall in two-sided and the multi-layer flexible sheet production process, is to adjust agent at high-accuracy circuit and small-bore to printed circuit board (PCB) hole wall etching.This adjustment agent can be removed defectives such as slight burr on the flexible board hole wall, burr, brill dirt, can strengthen the hydrophilic ability of resin surface and inhale palladium power, strengthens the bonding force of chemical plating and base material, and service temperature is low, is not easy to occur the swelling glued membrane.
S002: washing for the first time, it is residual that PI on the flexible PCB of washing cleaning for the first time adjusts liquid medicine, treatment time is 2 minutes, the employing washing process has replaced traditional etching and soda acid is washed processing, save the emission treatment in later stage, not only reduced manufacturing cost, also eliminated the hidden danger of exhaust emission, and the circuit that is formed by conducting material is more complete, and the yield of its quality is higher.
S003: whole hole, in the process in whole hole, need to carry out the position, hole and arrange, position, described hole is arranged at a corner of plate, and adjacent distance between borehole is 10-20mm.The position, hole of prior art is generally positioned at the corner in the four direction hole of product.Four Kong Weijun of the technical program are arranged at a corner of product, distance between the position, hole is smaller, when the product shrinkage rates is very big, can guarantee that the space length shrinkage value is very little, even can ignore, so just can realize without revisal, to the not distortion of pullling of position, hole, thereby reach do not need that revisal is carried out in the position, hole just can be with the purpose on the borehole jack.
In addition, in the process in whole hole, secondary drilling is carried out revisal will need the zone of revisal to split back revisal separately, and then be merged into the secondary drilling correction program of finishing.Concrete, be about to the whole secondary drilling program of product and be divided into two parts and carry out revisal, two parts can well satisfy the boring requirement of whole product according to the contraction situation revisal respectively of reality after the revisal, do not have product the situation of holes to occur after boring.
S004: washing for the second time, the whole hole liquid medicine on the flexible PCB of washing cleaning for the second time is residual, and the treatment time is 3 minutes.
S005: oxidation, described oxidation is to adhere to the last layer oxidizing substance at flexible PCB and hole wall, for follow-up polymerization is prepared, adopt FDM220A and two kinds of liquid medicine of FDM220B, among the present invention, can add 1-3% sulfuric acid after the oxidation and wash, thus the effective residual potassium permanganate of plate face behind the clean oxidation, and subsequent chemical reaction do not had influence.
S006: washing for the third time, it adopts clear water to handle, and the treatment time is 4 minutes,
S007: polymerization,, described polymerization is to adhere to the last layer conducting material at flexible PCB and hole wall, makes the conducting of flexible PCB hole wall, adopts FDM230A, FDM230B, three kinds of liquid medicine of FDM230C.
S008: the 4th washing, it adopts clear water to handle, and the treatment time is 3 minutes.
Wherein, concrete processing mode is as follows:
Adopt above-mentioned method, after the copper facing vision slit copper be communicated with respond well, after thermal shocking imperforate wall separate, hole copper breakage problem, whole process only needs 22 minutes consuming time, the technological process of Production Flow Chart only needs four chemical reaction grooves, and multiple working procedure has been saved in four road overflow washings.The FDM directly electroplating technology time is short, the efficient height, and the short manageability of flow process, discharge of wastewater is few, and management and control is simple, does not have serious environmental pollutant etc., can further use the production of short run test plate (panel).
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. a flexible PCB directly electroplating technology is characterized in that, comprises the steps:
S001:PI adjusts,
S002: washing for the first time
S003: whole hole
S004: washing for the second time
S005: oxidation
S006: washing for the third time
S007: polymerization
S008: the 4th washing.
2. flexible PCB directly electroplating technology according to claim 1, it is characterized in that: described whole hole specifically comprises:
The position, hole arranges, and position, described hole is arranged at a corner of plate, and adjacent distance between borehole is 10-20mm;
Secondary drilling is carried out revisal will need the zone of revisal to split back revisal separately, and then be merged into the secondary drilling correction program of finishing.
3. flexible PCB directly electroplating technology according to claim 1 is characterized in that: described PI adjustment employing adjustment agent CL-8110.
4. flexible PCB directly electroplating technology according to claim 1 is characterized in that: wash the described first time, wash for the second time, wash for the third time and wash for the 4th time and all adopt the clear water processing;
Washing the treatment time the described first time is 2 minutes, and washing and the 4th washing time are 3 minutes for the second time, and the time of washing for the third time is 4 minutes.
5. flexible PCB directly electroplating technology according to claim 1 is characterized in that: among the step S010, described microetch adopts the SPS micro-etching solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168973.1A CN103233255B (en) | 2013-05-06 | 2013-05-06 | Flexible PCB directly electroplating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168973.1A CN103233255B (en) | 2013-05-06 | 2013-05-06 | Flexible PCB directly electroplating technology |
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| CN103233255A true CN103233255A (en) | 2013-08-07 |
| CN103233255B CN103233255B (en) | 2016-06-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312095A (en) * | 2020-03-18 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Blackening treatment process for side surface of printed board for LED transparent display screen |
| CN113163623A (en) * | 2021-04-27 | 2021-07-23 | 江门市和美精艺电子有限公司 | Method for manufacturing blind hole buried hole filling packaging substrate of multilayer board |
Citations (7)
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| CN1063319A (en) * | 1991-01-15 | 1992-08-05 | 机械电子工业部第十五研究所 | Preparation method of thin copper-clad invar sheets |
| US5770032A (en) * | 1996-10-16 | 1998-06-23 | Fidelity Chemical Products Corporation | Metallizing process |
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| CN1575099A (en) * | 2003-06-18 | 2005-02-02 | 三菱伸铜株式会社 | Method for forming sheet metal |
| JP2006289959A (en) * | 2005-03-14 | 2006-10-26 | Nippon Steel Chem Co Ltd | Copper-clad laminate |
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| CN102787316A (en) * | 2012-08-30 | 2012-11-21 | 长沙牧泰莱电路技术有限公司 | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution |
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2013
- 2013-05-06 CN CN201310168973.1A patent/CN103233255B/en active Active
Patent Citations (7)
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|---|---|---|---|---|
| CN1063319A (en) * | 1991-01-15 | 1992-08-05 | 机械电子工业部第十五研究所 | Preparation method of thin copper-clad invar sheets |
| US5770032A (en) * | 1996-10-16 | 1998-06-23 | Fidelity Chemical Products Corporation | Metallizing process |
| CN1391429A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Process for preparing flexible circuit board |
| CN1575099A (en) * | 2003-06-18 | 2005-02-02 | 三菱伸铜株式会社 | Method for forming sheet metal |
| JP2006289959A (en) * | 2005-03-14 | 2006-10-26 | Nippon Steel Chem Co Ltd | Copper-clad laminate |
| CN101638802A (en) * | 2008-07-28 | 2010-02-03 | 比亚迪股份有限公司 | Pre-plating correction liquid and pre-plating treatment method for circuit board |
| CN102787316A (en) * | 2012-08-30 | 2012-11-21 | 长沙牧泰莱电路技术有限公司 | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution |
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| 王厚邦等: "聚酰亚胺挠性印制电路", 《电子工艺技术》 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312095A (en) * | 2020-03-18 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Blackening treatment process for side surface of printed board for LED transparent display screen |
| CN113163623A (en) * | 2021-04-27 | 2021-07-23 | 江门市和美精艺电子有限公司 | Method for manufacturing blind hole buried hole filling packaging substrate of multilayer board |
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| Publication number | Publication date |
|---|---|
| CN103233255B (en) | 2016-06-22 |
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