CN103220889B - Layer manufacturing method thereof in a kind of oversize PCB backboard - Google Patents
Layer manufacturing method thereof in a kind of oversize PCB backboard Download PDFInfo
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- CN103220889B CN103220889B CN201310128788.XA CN201310128788A CN103220889B CN 103220889 B CN103220889 B CN 103220889B CN 201310128788 A CN201310128788 A CN 201310128788A CN 103220889 B CN103220889 B CN 103220889B
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Abstract
The invention discloses layer manufacturing method thereof in a kind of oversize PCB backboard, by boring PIN nail in the edges of boards position of core material, then make PIN and follow closely film egative film, and PIN is set at this film egative film and corresponding position, PIN nail position follows closely post, then the PIN of film egative film being followed closely post correspondence is enclosed within the PIN nail of core material, afterwards one side exposure is carried out to core material, then repeat the other one side of above-mentioned steps to core material and carry out one side exposure.Compared with exposing with traditional book clamp mode, the present invention is cooperatively interacted by the PIN nail post of the PIN nail on core material and film egative film, the contraposition achieving exposure is accurate, avoid the contraposition offset issue between same central layer two faces, solve size and be greater than the backboard of 660mm × 810mm when carrying out exposure-processed, because of A/B deviation, and cause the problem that core material short circuit is scrapped.
Description
Technical field:
The invention belongs to printed wiring board manufacture technology field, what be specifically related to is layer manufacturing method thereof in a kind of oversize PCB backboard, is greater than the backboard of 660mm*810mm mainly for size.
Background technology:
Along with the height of electronic component on wiring board is integrated and the increase of I/O quantity, the high frequency of the progress of Electronic Assembly Foundation and Signal transmissions and high-speed digitization development, and the upgrading of electronic equipment high speed development and replacement demand, PCB is gradually to future developments such as bearing function daughter board, Signal transmissions and power delivery, its signal processing function is then weakening gradually, and such PCB is backboard.Backboard (Backplane or Backpanel) refers to have circuit and numerous socket hole, be mainly used in carrying other functional daughter board and chip, play a type printed circuit board of high speed transmission of signals, it is as one of key element, is widely used in the important events such as communication, space flight, supercomputer, Medical Devices, military base station.
Owing to backboard existing circuit and numerous socket hole, thus make whole backboard size larger, and current backboard inner plating makes the exposure machine adopted only is suitable for the backboard that size is not more than 550mm*610mm, backboard inner plating making size being greater than to 660mm*810mm needs to adopt book clamp mode to expose usually, core material two sides by backboard is fixedly clamped as book clamp respectively by film egative film, then carries out Manual exposure.
This production method due to film egative film more greatly and be easily out of shape, and when carrying out Manual exposure, the bubble of film egative film between inner plating is needed to discharge, therefore be easy to cause inner plating serious away from book clamp two plate angle off normals on one side, i.e. A/B deviation (the contraposition deviations between same central layer two faces), thus occur that follow-up pressing layer causes the situation that the short circuit of backboard internal layer is scrapped partially.
Summary of the invention:
For this reason, the object of the present invention is to provide layer manufacturing method thereof in a kind of oversize PCB backboard, be mainly used in solving current size and be greater than the backboard of 660mm*810mm when carrying out exposure-processed, easily occur A/B deviation, and cause the problem that the short circuit of backboard internal layer is scrapped.
For achieving the above object, the present invention is mainly by the following technical solutions:
Layer manufacturing method thereof in a kind of oversize PCB backboard, comprises step:
S1, sawing sheet make core material, and bore at four edges of core material the contraposition inspection opening that PIN nail that two diameters are 2.1mm and diameter are 3.175mm respectively;
S2, nog plate, de-smear, oil removing, washing and microetch process are carried out to above-mentioned core material;
S3, making PIN follow closely film egative film, design and punching target that diameter identical corresponding with PIN nail position on core material on film egative film, and design and contraposition pad that diameter identical corresponding with contraposition inspection opening position on core material, then after film egative film light is painted, get in punching target placement the PIN hole that diameter is 2.1mm by film perforating press, by one side glue is corresponding, the PIN of making nail is fixed on PIN hole place afterwards, and the diameter of described PIN nail is 2.1mm, height is 1.0mm, and base diameter is 3.175mm;
S4, core material is placed on exposure machine table top, the PIN nail followed closely by above-mentioned PIN on film egative film is directly enclosed within the PIN nail on core material, and process is vacuumized to it, and when vacuum degree reaches 650mmHg, scraper is adopted to catch up with gas to both sides in the middle of core material, and then catch up with gas from core material side to opposite side, the air that core material and PIN are followed closely between film egative film is drained, expose afterwards, and adopt the same manner to expose to the another side of core material after completion of the exposure;
S5, above-mentioned two sides has been exposed after core material, leave standstill 15 minutes, then carry out developing, etch processes;
S6, by X ray, core material to be checked.
Preferably, step S1 also comprises:
Any one in core material four edges is bored the fool proof hole that a diameter is 3.175mm, follow closely film egative film to prevent PIN and overlap on core material instead.
Preferably, also comprise between step S2 and S3:
Be placed on rig table top according to the mode that 1PNL/ is folded by core material, row-coordinate of going forward side by side adjusts, and all PIN nail of guarantee core material and contraposition inspection opening are positioned at the edges of boards position of core material.
The present invention is by boring PIN nail in the edges of boards position of core material, then make PIN and follow closely film egative film, and PIN is set at this film egative film and corresponding position, PIN nail position follows closely post, then the PIN of film egative film being followed closely post correspondence is enclosed within the PIN nail of core material, afterwards one side exposure is carried out to core material, then repeat the other one side of above-mentioned steps to core material and carry out one side exposure.Compared with exposing with traditional book clamp mode, the present invention is cooperatively interacted by the PIN nail post of the PIN nail on core material and film egative film, the contraposition achieving exposure is accurate, avoid the contraposition offset issue between same central layer two faces, solve size and be greater than the backboard of 660mm*810mm when carrying out exposure-processed, because of A/B deviation, and cause the problem that core material short circuit is scrapped.
Accompanying drawing illustrates:
Fig. 1 is oversize PCB backboard inner plating of the present invention and film egative film positioning states schematic diagram.
Identifier declaration in figure: inner plating 1, PIN nail 101, contraposition inspection opening 102, fool proof hole 103, film egative film 2, PIN follow closely post 201.
Embodiment:
For setting forth thought of the present invention and object, below in conjunction with the drawings and specific embodiments, the present invention is described further.
Shown in Figure 1, Fig. 1 is oversize PCB backboard inner plating of the present invention and film egative film positioning states schematic diagram.The present invention is to provide layer manufacturing method thereof in a kind of oversize PCB backboard, comprise step:
S1, sawing sheet make core material, and bore at four edges of core material the contraposition inspection opening that PIN nail that two diameters are 2.1mm and diameter are 3.175mm respectively;
First sawing sheet is carried out to copper-clad plate, according to normal mode, produce core material 1, then first a special PIN drilling is designed to the edges of boards at core material, because the size of core material is larger, traditional rig table top cannot be adopted to hole, therefore need to adopt the mode of subsection hole-drilling to hole.
Get out four groups of PIN holes 101 in four angles place correspondence of core material, often organize two, and the diameter in PIN hole 101 is 2.1mm.
At four angles place of core material, correspondence gets out the contraposition inspection opening 102 that four diameters are 3.175mm, and described contraposition inspection opening 102 at four angles place each.
Bore at wherein any place at four angles place of core material the fool proof hole 103 that a diameter is 3.175mm in addition, follow closely film egative film to prevent PIN and overlap on core material instead.
S2, nog plate, de-smear, oil removing, washing and microetch process are carried out to above-mentioned core material;
When after core material boring, need to carry out nog plate, de-smear process to it, by removals such as burr burrs that plate face produces because of boring, carry out oil removal treatment afterwards, during holing, remain in greasy dirt in hole or on Copper Foil and grease removes; By washing and then the degreaser remained in when oil removing in plate face or hole being washed off, to prevent from polluting follow-up micro-corrosion liquid and activated solution; Microetch is then main to the roughening treatment of wiring board copper face, for follow-up electroplating copper deposition provides a scabrid movable copper face structure, to improve chemical copper and the direct adhesion of base material copper.
After the above step is finished, be then placed on rig table top according to the mode that 1PNL/ is folded by core material, row-coordinate of going forward side by side adjusts, and all PIN nail of guarantee core material and contraposition inspection opening are positioned at the edges of boards position of core material.
S3, making PIN follow closely film egative film, design and punching target that diameter identical corresponding with PIN nail position on core material on film egative film, and design and contraposition pad that diameter identical corresponding with contraposition inspection opening position on core material, then after film egative film light is painted, get in punching target placement the PIN hole that diameter is 2.1mm by film perforating press, by one side glue is corresponding, the PIN of making nail is fixed on PIN hole place afterwards;
Wherein need here to follow closely 201 according to the thickness respective production PIN of core material, the diameter of described PIN nail 201 is 2.1mm, and height is 1.0mm, and base diameter is 3.175mm.
S4, core material is placed on exposure machine table top, the PIN nail followed closely by above-mentioned PIN on film egative film is directly enclosed within the PIN nail on core material, and process is vacuumized to it, and when vacuum degree reaches 650mmHg, scraper is adopted to catch up with gas to both sides in the middle of core material, and then catch up with gas from core material side to opposite side, the air that core material and PIN are followed closely between film egative film is drained, expose afterwards, and adopt the same manner to expose to the another side of core material after completion of the exposure;
The backboard core material of 660mm*810mm is greater than when exposing to size, need to adopt manual exposure machine to make, first core material is placed on the table top of exposure machine, then directly overlap on PIN hole corresponding onboard by making PIN nail film egative film, and adopt the alignment situation of ten times of spectroscopy corners, then air-breathing vacuumizes, when vacuum degree reaches 650mmHg, gas is wiped again with scraper, wipe gas to refer to and scrape film egative film by scraper, air between core material and film egative film is discharged, to note when carrying out wiping gas, first catch up with gas from the centre of plate to two, and then from plate while wipe to another side, and pilot process can not stop, more do not wipe gas back and forth, to prevent ill-exposed problem, one side exposure mode can be adopted during exposure, after one side has exposed, core material is repeated PIN to be followed closely film egative film conversely and is enclosed within core material another side, adopting uses the same method exposes.
S5, above-mentioned two sides has been exposed after core material, leave standstill 15 minutes, then carry out developing, etch processes;
S6, by X ray, core material to be checked, to check whether the situation that there is A/B deviation, and detect internal layer with or without the inclined situation of layer, guarantee that product quality meets the requirements.
More than that layer manufacturing method thereof in a kind of oversize PCB backboard provided by the present invention is described in detail, apply specific case herein to set forth structural principle of the present invention and execution mode, above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (1)
1. a layer manufacturing method thereof in oversize PCB backboard, is characterized in that comprising step:
S1, sawing sheet make core material, and bore at four edges of core material the contraposition inspection opening that PIN nail that two diameters are 2.1mm and diameter are 3.175mm respectively, and any one in four edges of core material is bored the fool proof hole that a diameter is 3.175mm, follow closely film egative film to prevent PIN and overlap instead on core material;
S2, first nog plate, de-smear, oil removing, washing and microetch process are carried out to above-mentioned core material, then core material is placed on rig table top according to the mode that 1PNL/ is folded, row-coordinate of going forward side by side adjusts, and all PIN nail of guarantee core material and contraposition inspection opening are positioned at the edges of boards position of core material;
S3, making PIN follow closely film egative film, design and punching target that diameter identical corresponding with PIN nail position on core material on film egative film, and design and contraposition pad that diameter identical corresponding with contraposition inspection opening position on core material, then after film egative film light is painted, get in punching target placement the PIN hole that diameter is 2.1mm by film perforating press, by one side glue is corresponding, the PIN of making nail is fixed on PIN hole place afterwards, and the diameter of described PIN nail is 2.1mm, height is 1.0mm, and base diameter is 3.175mm;
S4, core material is placed on exposure machine table top, the PIN nail followed closely by above-mentioned PIN on film egative film is directly enclosed within the PIN nail on core material, and process is vacuumized to it, and when vacuum degree reaches 650mmHg, scraper is adopted to catch up with gas to both sides in the middle of core material, and then catch up with gas from core material side to opposite side, the air that core material and PIN are followed closely between film egative film is drained, expose afterwards, and adopt the same manner to expose to the another side of core material after completion of the exposure;
S5, above-mentioned two sides has been exposed after core material, leave standstill 15 minutes, then carry out developing, etch processes;
S6, by X ray, core material to be checked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310128788.XA CN103220889B (en) | 2013-04-15 | 2013-04-15 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310128788.XA CN103220889B (en) | 2013-04-15 | 2013-04-15 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
Publications (2)
| Publication Number | Publication Date |
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| CN103220889A CN103220889A (en) | 2013-07-24 |
| CN103220889B true CN103220889B (en) | 2016-01-20 |
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| CN201310128788.XA Expired - Fee Related CN103220889B (en) | 2013-04-15 | 2013-04-15 | Layer manufacturing method thereof in a kind of oversize PCB backboard |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752882B (en) * | 2013-12-27 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | The boring method of wiring board |
| CN104460251A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Alignment device for exposure of circuit board and alignment method for exposure of circuit board |
| CN105307388B (en) * | 2015-10-14 | 2018-06-26 | 苏州福莱盈电子有限公司 | The operating method of FPC flexible circuit board circuits PIN contrapositions |
| CN106102331A (en) * | 2016-06-27 | 2016-11-09 | 深圳崇达多层线路板有限公司 | A kind of method of large scale wiring board inner cord exposure aligning |
| CN106112045B (en) * | 2016-07-13 | 2018-04-24 | 广德新三联电子有限公司 | A kind of drilling method of large scale circuit board |
| CN107278020A (en) * | 2017-06-30 | 2017-10-20 | 上达电子（深圳）股份有限公司 | Circuit board and locating tool |
| CN108012421A (en) * | 2017-11-09 | 2018-05-08 | 建业科技电子（惠州）有限公司 | Control separate wells aperture and independent lines thickness production method |
| CN108112195B (en) * | 2018-01-23 | 2020-07-17 | 江西景旺精密电路有限公司 | Method for manufacturing multilayer circuit board |
| CN108337825A (en) * | 2018-02-08 | 2018-07-27 | 江西景旺精密电路有限公司 | PCB internal layer circuits making apparatus and production method |
| CN112947017A (en) * | 2021-01-29 | 2021-06-11 | 珠海杰赛科技有限公司 | Circuit alignment method suitable for manual exposure machine |
| CN114770446A (en) * | 2022-05-30 | 2022-07-22 | 湖北源合达科技有限公司 | A workstation for cell-phone glass exposure processing |
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| JPH03236450A (en) * | 1990-02-09 | 1991-10-22 | Nippon Metal Ind Co Ltd | Carrier plate material for use in press forming of printed circuit board and its production |
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| CN101778536A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Process for controlling diameter of integrated positioning hole of inner cord board for printed circuit board |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
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| CN103220889A (en) | 2013-07-24 |
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Granted publication date: 20160120 Termination date: 20200415 |