CN103192188B - A kind of packaging machine of double-interface card and method for packing - Google Patents
A kind of packaging machine of double-interface card and method for packing Download PDFInfo
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- CN103192188B CN103192188B CN201310092235.3A CN201310092235A CN103192188B CN 103192188 B CN103192188 B CN 103192188B CN 201310092235 A CN201310092235 A CN 201310092235A CN 103192188 B CN103192188 B CN 103192188B
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Abstract
The invention discloses a kind of packaging machine and method for packing of double-interface card.Packaging machine comprises with lower device: enter card carrying arm, Y-direction antenna correction group, chip turn to group, antenna correction butt-joint group, CCD test set, chip push over group, first time non-contact detection group, revise spot welding group, the first hot weld group, the second hot weld group, cold welding group, contact measurement group, second time non-contact detection group and card casket group.Adopt such scheme, the chip package of double-interface card has been chosen on the double-interface card of antenna to machine or craft by the present invention, and achieve the technique effect of automation encapsulation, it can operate separately, also can connect machine with other equipment and operate; When operating separately, only needing the card base having chosen line to be positioned over blowing transport tape, can realize that automatic card runs, automatic packaging, need not people's hand operated, flexibly and easily.
Description
Technical field
The present invention relates to the encapsulation technology of double-interface card, in particular, a kind of packaging machine of double-interface card and method for packing.
Background technology
By the read-write mode of smart card, Contact Type Ic Card and non-contact IC card can be divided into, above two kinds card functions be combined in one card on, as double-interface card.
Existing machine is all the packaging machine of separate unit double-interface card on the market, for encapsulating two interface chip, it needs workman's manual operations, and need increase fit structure in addition could realize semi-automatic operation, speed is slow, welding is unstable, causes that the product fraction defective produced is high, defective products finds not in time.
Therefore, prior art existing defects, needs to improve.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of packaging machine and method for packing of double-interface card of novel automatic operation.
Technical scheme of the present invention is as follows: a kind of packaging machine of double-interface card, and it comprises with lower device: enter card carrying arm, for the double-interface card having chosen antenna being transported to Y-direction antenna correction group; Y-direction antenna correction group, the Y-direction for the antenna to double-interface card is revised, and is sent to antenna correction butt-joint group; Chip turns to group, for taking out chip from chip material strip, revolving turnback, chip being transported to antenna correction butt-joint group; Antenna correction butt-joint group, for revising the X-direction of the antenna of double-interface card, welding chip with antenna on the card base of double-interface card, the double-interface card of microarray strip is sent to CCD test set; CCD test set, for carrying out CCD detection to the double-interface card of this microarray strip, detect by time be sent to chip and push over group; Chip pushes over group, and it is parallel with double-interface card, for the position of chip on double-interface card is pushed over 90 degree, is sent to first time non-contact detection group; Whether non-contact detection group, weld connection for the antenna detecting the good double-interface card of butt-joint with chip for the first time, is sent to revises spot welding group when welding and connecting; Revise spot welding group, for pushing over the position of chip on double-interface card, chip is revised, and the card base of chip and double-interface card is carried out spot welding, be sent to the first hot weld group; First hot weld group, for carrying out hot weld to chip and card base, is sent to the second hot weld group; Second hot weld group, for carrying out hot weld to chip and card base, is sent to cold welding group; Cold welding group, for carrying out cold welding to chip and card base, is sent to contact measurement group; Contact measurement group, for detect chip weld with card base after whether conducting, be sent to non-contact detection group for the second time when conducting; Whether second time non-contact detection group, weld connection for detection chip with card base, be sent to card casket group when welding and connecting; Card casket group, for having collected the double-interface card of encapsulation; And conveyer belt, for completing described transmission.
Preferably, described packaging machine also comprise draw chip material strip group, chip die cutting die with put chip material strip group; Described draw chip material strip group and described chip die cutting die, described in put the assembly of chip material strip and close, described chip material strip group of putting is for putting chip material strip, described chip material strip group of drawing draws described chip material strip for stepping, described chip die cutting die obtains chip for die-cut, turns to group for described chip.
Preferably, described packaging machine also comprises waste material casket, for detect in CCD test set not by time, at first time non-contact detection bond pads access failure time, when contact measurement group detects non-conducting or at second time non-contact detection bond pads access failure time, double-interface card is sent to described waste material casket.
Preferably, in described packaging machine, described in enter card carrying arm comprise conveyance vacuum cup, conveyance upper and lower air cylinders, slide plate, driving servomotor, rail plate and conveyance base plate; Described conveyance vacuum cup is fixed on described conveyance upper and lower air cylinders, for by moving up and down, picks up double-interface card; Described conveyance upper and lower air cylinders is fixed on described slide plate; Described slide plate is fixed on rail plate; Described rail plate, described driving servomotor are separately fixed on conveyance base plate; Described driving servomotor slides on described rail plate for driving described slide plate, thus drives described conveyance vacuum cup to move to the position picking up double-interface card, and the double-interface card having chosen antenna is transported to Y-direction antenna correction group.
Preferably, in described packaging machine, described antenna correction butt-joint group comprises two butt-joint upper and lower air cylinders, two butt-joint left and right cylinders, about two clamps, butt-joint mouths move forward and backward cylinder, two butt-joint mouths, nitrogen mouth fixed head and nitrogen mouths; Described butt-joint upper and lower air cylinders, described butt-joint left and right cylinder are corresponding with described left and right clamp respectively to be arranged, butt-joint upper and lower air cylinders described in one moves up and down for driving left and right clamp described in, and butt-joint left and right cylinder described in moves left and right for driving left and right clamp described in; Two described left and right clamps move up and down respectively under two described butt-joint upper and lower air cylinders drive, then move left and right under two described butt-joint left and right cylinders drive, move to the position of the X-direction of the antenna revising double-interface card, for revising the X-direction of two antennas simultaneously; Described butt-joint mouth is fixedly installed on described butt-joint mouth and moves forward and backward cylinder, after completing for the X-direction of the antenna revising double-interface card, move forward and backward cylinder drive at butt-joint mouth and be moved to butt-joint position, chip is welded with antenna on the card base of double-interface card; Described nitrogen mouth is fixed on described nitrogen mouth fixed head, for blowing out nitrogen when welding to two antenna welds.
Preferably, in described packaging machine, described chip turns to group to comprise and turns to left and right cylinder, turn to upper and lower air cylinders, rotating servo device, four inhale chip vacuum sucker, four chip controls cylinders; Chip controls cylinder described in chip vacuum sucker correspondence one is inhaled described in each; Wherein, two described suction chip vacuum suckers are used under the control of two described chip controls cylinders, draw die-cut good chip; Described rotating servo device revolves turnback, by described turn to left and right cylinder to drive under move left and right, and by described turn to upper and lower air cylinders to drive under move up and down, for aligned position, chip is delivered to antenna correction butt-joint group; Further, other two suction chip vacuum suckers draw die-cut good chip, for waiting for that described rotating servo device continues to revolve turnback under the control of other two chip controls cylinders.
Preferably, in described packaging machine, described Y-direction antenna correction group comprises the first compression cylinder and the first compact heap, and the second compression cylinder and the second compact heap; Described first compression cylinder is for driving described first compact heap; Described second compression cylinder is for driving described second compact heap; Described first compact heap coordinates with described second compact heap, and the Y-direction for the antenna to double-interface card is revised.
Preferably, in described packaging machine, described chip push over group comprise chip correction before push cylinder, push away chuck before chip correction, the chip correction right side pushes away chuck, the right push cylinder of chip correction, push cylinder, the left push cylinder of chip correction, a chip correction left side push away chuck, chip correction pusher chuck and chip correction working position after chip correction; Before described chip correction, push cylinder pushes away chuck before driving described chip correction, is pushed forward to welding chip position; After described chip correction, push cylinder is for driving described chip correction pusher chuck, shifts it onto welding chip position backward; Push away chuck before described chip correction to coordinate with described chip correction pusher chuck, for the position of chip on double-interface card is pushed over 90 degree; The left push cylinder of described chip correction pushes away chuck for driving a described chip correction left side; The right push cylinder of described chip correction pushes away chuck for driving the described chip correction right side; A described chip correction left side pushes away chuck and pushes away chuck with the described chip correction right side and coordinate, for revising chip soldering line position.
Preferably, in described packaging machine, described correction spot welding group comprises Y-direction fine tuning seat, X presss from both sides upper and lower air cylinders, spot welding head first stroke cylinder, spot welding head second stroke cylinder and spot welding head to fine tuning seat, about two chip correction gas enclosure cylinders, about two chip correction folders, chip corrections; Described spot welding head second stroke cylinder moves up and down for driving described spot welding head, and holds chip by vacuum; Chip correction folder in left and right described in left and right chip correction gas enclosure cylinder correspondence one described in each, described left and right chip correction gas enclosure cylinder moves left and right for driving the described left and right chip correction folder corresponding to it; Described chip correction folder upper and lower air cylinders is used for driving about two chip correction folders to move up and down simultaneously; Two described left and right chip correction folders match, for chip is clamped in described spot welding head; Described Y-direction fine tuning seat, described X are respectively used at Y-direction, X to the relative position of finely tuning chip and card base to fine tuning seat; The card base of chip and double-interface card, for driving described spot welding head, is carried out spot welding by described spot welding head first stroke cylinder.Preferably, in described packaging machine, described card casket group comprises on push cylinder on card, card cuts somebody's hair, collects card casket; On described card, push cylinder is cut somebody's hair for driving on described card, above pushes away double-interface card to described collection card casket.
Another technical scheme of the present invention is, a kind of method for packing of double-interface card, and it comprises the following steps: A1, enter card carrying arm and the double-interface card having chosen antenna is transported to Y-direction antenna correction group; A2, the Y-direction of Y-direction antenna correction group to the antenna of double-interface card are revised, and are sent to antenna correction butt-joint group; A3, chip turn to group to take out chip from chip material strip, revolve turnback, chip is delivered to antenna correction butt-joint group, revise the X-direction of the antenna of double-interface card, chip is welded with antenna on the card base of double-interface card, the double-interface card of microarray strip is sent to CCD test set; A4, CCD test set carries out CCD detection to the double-interface card of this microarray strip, determines whether that detection is passed through, is, is sent to chip and pushes over group; It is parallel with double-interface card that A5, chip push over group, and the position of chip on double-interface card is pushed over 90 degree, is sent to first time non-contact detection group; Whether the antenna that A6, for the first time non-contact detection group detect the good double-interface card of butt-joint welds connection with chip, is, is sent to and revises spot welding group; A7, correction spot welding group push over the position of chip on double-interface card, revise chip, and the card base of chip and double-interface card is carried out spot welding, order is sent to the first hot weld group and the second hot weld group, respectively hot weld is carried out to chip and card base, be then sent to cold welding group; A8, cold welding group carry out cold welding to chip and card base, are sent to contact measurement group; Whether conducting after A9, contact measurement group detect and weld with card base chip, is, is sent to non-contact detection group for the second time; A10, second time non-contact detection group, whether detection chip welds connection with card base, is, is sent to card casket group.
Preferably, in described method for packing, before steps A 3, also perform following steps A30: draw chip material strip group and chip die cutting die, put the assembly of chip material strip and close, put chip material strip, then chip material strip is drawn in stepping, obtain chip by chip die cutting die is die-cut, give chip and turn to group.
Preferably, in described method for packing, in steps A 4, steps A 6, steps A 9, steps A 10, also perform following steps respectively: otherwise be sent to waste material casket.
Adopt such scheme, the chip package of double-interface card has been chosen on the double-interface card of antenna to machine or craft by the present invention, and achieve the technique effect of automation encapsulation, it can operate separately, also can connect machine with other equipment and operate; When operating separately, only needing the card base having chosen line to be positioned over blowing transport tape, can realize that automatic card runs, automatic packaging, need not people's hand operated, flexibly and easily.
Accompanying drawing explanation
Fig. 1 is the overall schematic of one embodiment of the present of invention;
Fig. 2 is part-structure enlarged diagram embodiment illustrated in fig. 1;
Fig. 3 embodiment illustrated in fig. 1 enters card carrying arm enlarged diagram;
Fig. 4 is antenna correction butt-joint group schematic diagram embodiment illustrated in fig. 1;
Fig. 5 is that chip embodiment illustrated in fig. 1 turns to group enlarged diagram;
Fig. 6 is Y-direction antenna correction group enlarged diagram embodiment illustrated in fig. 1;
Fig. 7 is that chip embodiment illustrated in fig. 1 pushes over group enlarged diagram;
Fig. 8 is correction spot welding group enlarged diagram embodiment illustrated in fig. 1;
Fig. 9 is card casket group enlarged diagram embodiment illustrated in fig. 1;
Figure 10 is packaging machine chip material strip embodiment illustrated in fig. 1 and chip die cutting die direction of transfer enlarged diagram.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
One embodiment of the present of invention are, a packaging machine for double-interface card, it comprises with lower device: enter card carrying arm, Y-direction antenna correction group, chip turn to group, antenna correction butt-joint group, CCD test set, chip push over group, first time non-contact detection group, revise spot welding group, the first hot weld group, the second hot weld group, cold welding group, contact measurement group, second time non-contact detection group and card casket group.As Fig. 1, shown in 2, one embodiment of the present of invention include card carrying arm 101, Y-direction antenna correction group 102, antenna correction butt-joint group 103, chip turns to group 104, draw chip material strip group 105, chip die cutting die 106, put chip material strip group 107, CCD(charge-coupled image sensor, also imageing sensor is claimed) test set 108, chip pushes over group 109, non-contact detecting group 110 for the first time, revise spot welding group 111, hot weld group 112, hot weld group 113, cold welding group 114, contact measurement group 115, second time non-contact detection group 116, card casket group 117, waste material casket 118.
Enter card carrying arm, for the double-interface card having chosen antenna being transported to Y-direction antenna correction group; Such as, enter card carrying arm described in and comprise conveyance vacuum cup, conveyance upper and lower air cylinders, slide plate, driving servomotor, rail plate and conveyance base plate; Described conveyance vacuum cup is fixed on described conveyance upper and lower air cylinders, for by moving up and down, picks up double-interface card; Described conveyance upper and lower air cylinders is fixed on described slide plate; Described slide plate is fixed on rail plate; Described rail plate, described driving servomotor are separately fixed on conveyance base plate; Described driving servomotor slides on described rail plate for driving described slide plate, thus drives described conveyance vacuum cup to move to the position picking up double-interface card, and the double-interface card having chosen antenna is transported to Y-direction antenna correction group.Such as, as shown in Figure 3, enter card carrying arm to comprise conveyance vacuum cup 201, conveyance upper and lower air cylinders 202, drive servomotor 203, rail plate 204, slide plate 205, transport base plate 206; Conveyance vacuum cup 201, conveyance upper and lower air cylinders 202, slide plate 205 are fixed on rail plate 204 after being connected, and rail plate 204, driving servomotor 203 are separately fixed on conveyance base plate 206.Transport vacuum cup 201 and run to take-up machine or connection platform under the driving driving servomotor 203, run down to suction card position by conveyance upper and lower air cylinders 202 and card is picked up, now drive servomotor 203 reversion to drive operation to get back to and put card position.Card and described double-interface card.
Y-direction antenna correction group, the Y-direction for the antenna to double-interface card is revised, and is sent to antenna correction butt-joint group; Such as, described Y-direction antenna correction group comprises the first compression cylinder and the first compact heap, and the second compression cylinder and the second compact heap; Described first compression cylinder is for driving described first compact heap; Described second compression cylinder is for driving described second compact heap; Described first compact heap coordinates with described second compact heap, and the Y-direction for the antenna to double-interface card is revised.Such as, as shown in Figure 6, Y-direction correction group comprises the first compression cylinder 501, first compact heap 502, second compact heap 503, second compression cylinder 504; First compact heap 502 and the second compact heap 503 revise antenna respectively under the first compression cylinder 501 and the second compression cylinder 504 act on simultaneously.
Chip turns to group, for taking out chip from chip material strip, revolving turnback, chip being transported to antenna correction butt-joint group; Or chip turns to group to take out the die-cut chip completed from the chip material strip processed.Such as, described chip turn to group to comprise and turn to left and right cylinder, turn to upper and lower air cylinders, rotating servo device, four inhale chip vacuum sucker, four chip controls cylinders; Chip controls cylinder described in chip vacuum sucker correspondence one is inhaled described in each; Wherein, two described suction chip vacuum suckers are used under the control of two described chip controls cylinders, draw die-cut good chip; Described rotating servo device revolves turnback, by described turn to left and right cylinder to drive under move left and right, and by described turn to upper and lower air cylinders to drive under move up and down, for aligned position, chip is delivered to antenna correction butt-joint group; Further, other two suction chip vacuum suckers draw die-cut good chip, for waiting for that described rotating servo device continues to revolve turnback under the control of other two chip controls cylinders.Such as, as shown in Figure 5, chip turns to group to comprise and turns to left and right cylinder 401, turns to upper and lower air cylinders 402, rotating servo device 403, four to inhale chip vacuum sucker 404, four chip controls cylinders 405; Inhale chip vacuum sucker 404 for two and take out die-cut good chip from rushing in Chip mold under the driving of two chip controls cylinders 405, now rotating servo device 403 revolves turnback and welds with antenna on card base, inhales chip vacuum suckers 404 take out die-cut good chip from rushing in Chip mold under the driving of two chip controls cylinders 405 for other two simultaneously.
Antenna correction butt-joint group, for revising the X-direction of the antenna of double-interface card, welding chip with antenna on the card base of double-interface card, the double-interface card of microarray strip is sent to CCD test set; Such as, described antenna correction butt-joint group comprises two butt-joint upper and lower air cylinders, two butt-joint left and right cylinders, about two clamps, butt-joint mouths move forward and backward cylinder, two butt-joint mouths, nitrogen mouth fixed head and nitrogen mouths; Described butt-joint upper and lower air cylinders, described butt-joint left and right cylinder are corresponding with described left and right clamp respectively to be arranged, butt-joint upper and lower air cylinders described in one moves up and down for driving left and right clamp described in, and butt-joint left and right cylinder described in moves left and right for driving left and right clamp described in; Two described left and right clamps move up and down respectively under two described butt-joint upper and lower air cylinders drive, then move left and right under two described butt-joint left and right cylinders drive, move to the position of the X-direction of the antenna revising double-interface card, for revising the X-direction of two antennas simultaneously; Described butt-joint mouth is fixedly installed on described butt-joint mouth and moves forward and backward cylinder, after completing for the X-direction of the antenna revising double-interface card, move forward and backward cylinder drive at butt-joint mouth and be moved to butt-joint position, chip is welded with antenna on the card base of double-interface card; Described nitrogen mouth is fixed on described nitrogen mouth fixed head, for blowing out nitrogen when welding to two antenna welds.Such as, as shown in Figure 4, antenna correction butt-joint group comprises butt-joint mouth 301a and butt-joint mouth 301b, butt-joint left and right clamp 302a and butt-joint left and right clamp 302b, nitrogen mouth fixed head 303, butt-joint upper and lower air cylinders 304a and butt-joint upper and lower air cylinders 304 b, butt-joint left and right cylinder 305a and butt-joint left and right cylinder 305b, butt-joint mouth and moves forward and backward cylinder 306, nitrogen mouth 307; Two butt-joint left and right clamps 302 arrive after two butt-joint upper and lower air cylinders 304 push simultaneously revises aerial position, 2 aerial positions are revised in now two butt-joint left and right cylinder 305 actions simultaneously simultaneously, and after aerial position correction completes, two butt-joint mouths 301 move forward and backward cylinder 306 effect at butt-joint mouth and are moved to nitrogen mouth 307 while that butt-joint position and chip carrying out butt-joint and blow out nitrogen to two antenna welds.
CCD test set, for carrying out CCD detection to the double-interface card of this microarray strip, detect by time be sent to chip and push over group; Whether CCD test set detection antenna welds with chip welding spot qualified.
Chip pushes over group, and it is parallel with double-interface card, for the position of chip on double-interface card is pushed over 90 degree, is sent to first time non-contact detection group; Such as, described chip push over group comprise chip correction before push cylinder, push away chuck before chip correction, the chip correction right side pushes away chuck, the right push cylinder of chip correction, push cylinder, the left push cylinder of chip correction, a chip correction left side push away chuck, chip correction pusher chuck and chip correction working position after chip correction; Before described chip correction, push cylinder pushes away chuck before driving described chip correction, is pushed forward to welding chip position; After described chip correction, push cylinder is for driving described chip correction pusher chuck, shifts it onto welding chip position backward; Push away chuck before described chip correction to coordinate with described chip correction pusher chuck, for the position of chip on double-interface card is pushed over 90 degree; The left push cylinder of described chip correction pushes away chuck for driving a described chip correction left side; The right push cylinder of described chip correction pushes away chuck for driving the described chip correction right side; A described chip correction left side pushes away chuck and pushes away chuck with the described chip correction right side and coordinate, for revising chip soldering line position.Such as, as shown in Figure 7, chip push over group comprise chip correction before push cylinder 601, push away chuck 602 before chip correction, the chip correction right side pushes away chuck 603, the right push cylinder of chip correction 604, push cylinder 605, the left push cylinder 606 of chip correction, a chip correction left side push away chuck 607, chip correction pusher chuck 608, chip correction working position 609 after chip correction; Welding chip position is pushed forward under pushing away the effect of chuck 602 push cylinder 601 before chip correction before chip correction, now chip correction pusher chuck 608 push cylinder 605 after chip correction shifts welding chip position onto under acting on backward, and the now chip correction right side pushes away chuck 603 and a chip correction left side and pushes away chuck 607 and under the right push cylinder of chip correction 604 and the left push cylinder 606 of chip correction act on, revise chip soldering line position respectively.
Whether non-contact detection group, weld connection for the antenna detecting the good double-interface card of butt-joint with chip for the first time, is sent to revises spot welding group when welding and connecting; The whether conducting of non-contact detection group detection chip and sky wire bonding.
Revise spot welding group, for pushing over the position of chip on double-interface card, chip is revised, and the card base of chip and double-interface card is carried out spot welding, be sent to the first hot weld group; Such as, described correction spot welding group comprises Y-direction fine tuning seat, X presss from both sides upper and lower air cylinders, spot welding head first stroke cylinder, spot welding head second stroke cylinder and spot welding head to fine tuning seat, about two chip correction gas enclosure cylinders, about two chip correction folders, chip corrections; Described spot welding head second stroke cylinder moves up and down for driving described spot welding head, and holds chip by vacuum; Chip correction folder in left and right described in left and right chip correction gas enclosure cylinder correspondence one described in each, described left and right chip correction gas enclosure cylinder moves left and right for driving the described left and right chip correction folder corresponding to it; Described chip correction folder upper and lower air cylinders is used for driving about two chip correction folders to move up and down simultaneously; Two described left and right chip correction folders match, for chip is clamped in described spot welding head; Described Y-direction fine tuning seat, described X are respectively used at Y-direction, X to the relative position of finely tuning chip and card base to fine tuning seat; The card base of chip and double-interface card, for driving described spot welding head, is carried out spot welding by described spot welding head first stroke cylinder.Such as, as shown in Figure 8, revise spot welding group and comprise Y-direction fine tuning seat 701, X to fine tuning seat about 702, two chip correction gas enclosure cylinders about 703, two chip correction folders 704, chip correction folder upper and lower air cylinders 705, spot welding head first stroke cylinder 706, spot welding head second stroke cylinder 707, spot welding head 708; First spot welding head 708 is descending under the effect of spot welding head second stroke cylinder 707 holds chip by vacuum, about two chip correction folders 704 go downwards to chip position under the effect of chip correction folder upper and lower air cylinders 705 simultaneously, now chip is clamped on spot welding head 708 by about two chip correction folders 704 under the effect of about two chip correction gas enclosure cylinders 703, and after completing, spot welding head 708 microarray strip is welded in card foundation trench by spot welding head first stroke cylinder 706.Y-direction fine tuning seat 701 and X can finely tune the position of chips welding at Ka Jinei to fine tuning seat 702.
First hot weld group, for carrying out hot weld to chip and card base, is sent to the second hot weld group; The chip that hot weld group to point welds carries out adding thermal weld, by heating and melting high-temp glue.
Second hot weld group, for carrying out hot weld to chip and card base, is sent to cold welding group; Hot weld is once not enough to high-temp glue to melt, and therefore have employed two hot weld groups.
Cold welding group, for carrying out cold welding to chip and card base, is sent to contact measurement group; Cold welding group cools fast to the high-temp glue after thawing, thus the chip good to hot weld carries out cooling welding.
Contact measurement group, for detect chip weld with card base after whether conducting, be sent to non-contact detection group for the second time when conducting; Contact measurement group: the chip that butt welding connects detects.
Whether second time non-contact detection group, weld connection for detection chip with card base, be sent to card casket group when welding and connecting;
Card casket group, for having collected the double-interface card of encapsulation.Such as, described card casket group comprises on push cylinder on card, card and cuts somebody's hair, collects card casket; On described card, push cylinder is cut somebody's hair for driving on described card, above pushes away double-interface card to described collection card casket.Such as, as shown in Figure 9, card casket group comprises and card is cut somebody's hair by push cylinder 801, card 802, collects card casket 803.Preferably, also arrange card casket guide rail, on card, push cylinder drives described card cuts somebody's hair and to move up and down at card casket guide rail, above pushes away the double-interface card that encapsulated to described collection card casket.
Further, described packaging machine also comprises conveyer belt, for completing above-mentioned all operations relating to transmission; Described transmission adopts described conveyer belt to complete.Bring above-mentioned all operations relating to transmission by described transmission, double-interface card order has been sent to next device by operating process from a device; Preferably, described conveyer belt is a belt or metal track.
Preferably, described packaging machine also comprise draw chip material strip group, chip die cutting die with put chip material strip group; Described draw chip material strip group and described chip die cutting die, described in put the assembly of chip material strip and close, described chip material strip group of putting is for putting chip material strip, described chip material strip group of drawing draws described chip material strip for stepping, described chip die cutting die obtains chip for die-cut, group is turned to for described chip, namely, chip material strip is put by described chip material strip group of putting, then the stepping of chip material strip group is drawn to draw described chip material strip by described, obtain chip by described chip die cutting die is die-cut, turn to group for described chip.Wherein, put chip material strip group, by the rotation of driven by motor chip material strip dish, chip material strip is sent chip material strip group to be drawn and pull.Draw chip material strip group, pull chip material strip to enter chip die cutting die.Chip die cutting die, is undertaken die-cut by the chip on chip material strip.
Preferably, described packaging machine also comprises waste material casket, for CCD test set detect not by time double-interface card is sent to described waste material casket, when first time non-contact detection bond pads access failure, double-interface card is sent to described waste material casket, or double-interface card is sent to described waste material casket when contact measurement group detects non-conducting, or when second time non-contact detection bond pads access failure, double-interface card is sent to described waste material casket.
And for example, as shown in Figure 10, for packaging machine chip material strip and chip die cutting die direction of transfer structure, it comprises, and chip turns to group 901, chip die cutting die 902, draws chip material strip group 903, useless chip electric eye seat 904, chip scrap tep reel 905, chip give up protecting glue tep reel 906, chip material strip dish 907, material strip aluminium support 908, punching chip detection group 909; First chip material strip dish 907 blowing, material strip enters punching chip detection group 909, enters chip die cutting die 902, enters and draw chip material strip group 903, enter useless chip electric eye seat 904.Chip scrap tep reel 905 and the chip protecting glue tep reel 906 that gives up collects chip scrap band and useless protective tapes respectively.In this structure, after the chip punched out from chip die cutting die 902 turns to group 901 to revolve turnback by chip, deliver to welding position.
Connected applications is in above-mentioned any embodiment, and further, embodiments of the invention can also be, a kind of method for packing of double-interface card, and it comprises the following steps:
A1, enter card carrying arm and the double-interface card having chosen antenna is transported to Y-direction antenna correction group;
A2, the Y-direction of Y-direction antenna correction group to the antenna of double-interface card are revised, and are sent to antenna correction butt-joint group;
A3, chip turn to group to take out chip from chip material strip, revolve turnback, chip is delivered to antenna correction butt-joint group, revise the X-direction of the antenna of double-interface card, chip is welded with antenna on the card base of double-interface card, the double-interface card of microarray strip is sent to CCD test set; Preferably, before steps A 3, also perform following steps A30: draw chip material strip group and chip die cutting die, put the assembly of chip material strip and close, put chip material strip, then chip material strip is drawn in stepping, obtains chip, give chip and turn to group by chip die cutting die is die-cut.
A4, CCD test set carries out CCD detection to the double-interface card of this microarray strip, determines whether that detection is passed through, is, is sent to chip and pushes over group; Preferably, otherwise be sent to waste material casket.
It is parallel with double-interface card that A5, chip push over group, and the position of chip on double-interface card is pushed over 90 degree, is sent to first time non-contact detection group; Chip pushes over after group action completes, and chip is vertical with card.
Whether the antenna that A6, for the first time non-contact detection group detect the good double-interface card of butt-joint welds connection with chip, is, is sent to and revises spot welding group; Preferably, otherwise be sent to waste material casket.Non-contact detection is by instrument induction chip on-state, does not need to contact with chip or card; Such as, detected by instrument and whether connect, then spread out of a signal of telecommunication.
A7, correction spot welding group push over the position of chip on double-interface card, chip is revised, and the card base of chip and double-interface card is carried out spot welding, order is sent to the first hot weld group and the second hot weld group, namely, first be sent to the first hot weld group and be sent to the second hot weld group again, the first hot weld group and the second hot weld group carry out hot weld to chip and card base respectively according to priority, are then sent to cold welding group.
A8, cold welding group carry out cold welding to chip and card base, are sent to contact measurement group.
Whether conducting after A9, contact measurement group detect and weld with card base chip, is, is sent to non-contact detection group for the second time; Preferably, otherwise be sent to waste material casket.
A10, second time non-contact detection group, whether detection chip welds connection with card base, is, is sent to card casket group.Preferably, otherwise be sent to waste material casket.
An example is, described packaging machine comprises and enters card carrying arm 101 for transporting the double-interface card sheet having chosen antenna to feed belt group, double-interface card sheet is transported to the feed belt group of each processing stations, for revising the Y-direction antenna correction group 102 of two interfaces antenna Y-direction antenna, chip material strip group 107 is put for what support two interface chip material strip reel, for punching out the chip die cutting die 106 of two interface chip to two interface chip material strip, chip material strip group 105 is drawn for the stepping of chip material strip, the chip directly delivering to butt-joint position after the two interface chips cut for liquidating rotate turns to group 104, for carrying out the antenna correction butt-joint group 103 of butt-joint by after the correction of double-interface card antenna X-direction with the two interface chips turning to group to bring from chip, whether the double-interface card antenna welded for crashing and two interface chip weld the first time non-contact detection group 110 of connection, group 109 is pushed over for pushing over 90 degree of chips parallel with double-interface card to the position of two interface chip on double-interface card, for revising and the correction spot welding group 111 of it and double-interface card card base being carried out spot welding the position of pushing over of two interface chip on double-interface card, for to the hot weld group 112 of two interface chip and double-interface card basic point postwelding and hot weld group 113, for to the cold welding group 114 after two interface chip and the hot weld of double-interface card base, for the contact measurement group 115 of whether conducting after welding with double-interface card base two interface chip, for the second time non-contact detection group 116 after welding with double-interface card base two interface chip, for the card casket group 117 of collecting double-interface card, for the waste material casket 118 collected two interfaces defective products card.
The invention provides for two interface chip being encapsulated into machine or the manual production equipment chosen on the double-interface card sheet of antenna, the i.e. packaging machine of described double-interface card, this production equipment can operate separately, the card base having chosen line is positioned over blowing transport tape realize hair fastener run, flexible.This production equipment also can connect machine with automatic take-up machine and dock, thus realizes full-automatic groove milling, take-up, encapsulation, detection, integration running job automatically.
Further, embodiments of the invention can also be, each technical characteristic of the various embodiments described above, the packaging machine of the double-interface card be mutually combined to form and method for packing.
It should be noted that, above-mentioned each technical characteristic continues combination mutually, is formed not in above-named various embodiment, is all considered as the scope that description of the present invention is recorded; Further, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (10)
1. a packaging machine for double-interface card, is characterized in that, comprises with lower device:
Enter card carrying arm, for the double-interface card having chosen antenna being transported to Y-direction antenna correction group;
Y-direction antenna correction group, the Y-direction for the antenna to double-interface card is revised, and is sent to antenna correction butt-joint group;
Chip turns to group, for taking out chip from chip material strip, revolving turnback, chip being transported to antenna correction butt-joint group;
Antenna correction butt-joint group, for revising the X-direction of the antenna of double-interface card, welding chip with antenna on the card base of double-interface card, the double-interface card of microarray strip is sent to CCD test set;
CCD test set, for carrying out CCD detection to the double-interface card of this microarray strip, detect by time be sent to chip and push over group;
Chip pushes over group, and it is parallel with double-interface card, for the position of chip on double-interface card is pushed over 90 degree, is sent to first time non-contact detection group;
Whether non-contact detection group, weld connection for the antenna detecting the good double-interface card of butt-joint with chip for the first time, is sent to revises spot welding group when welding and connecting;
Revise spot welding group, for pushing over the position of chip on double-interface card, chip is revised, and the card base of chip and double-interface card is carried out spot welding, be sent to the first hot weld group;
First hot weld group, for carrying out hot weld to chip and card base, is sent to the second hot weld group;
Second hot weld group, for carrying out hot weld to chip and card base, is sent to cold welding group;
Cold welding group, for carrying out cold welding to chip and card base, is sent to contact measurement group;
Contact measurement group, for detect chip weld with card base after whether conducting, be sent to non-contact detection group for the second time when conducting;
Whether second time non-contact detection group, weld connection for detection chip with card base, be sent to card casket group when welding and connecting;
Card casket group, for having collected the double-interface card of encapsulation;
And conveyer belt, for completing described transmission.
2. packaging machine according to claim 1, is characterized in that, described in enter card carrying arm and comprise conveyance vacuum cup, conveyance upper and lower air cylinders, slide plate, driving servomotor, rail plate and conveyance base plate;
Described conveyance vacuum cup is fixed on described conveyance upper and lower air cylinders, for by moving up and down, picks up double-interface card;
Described conveyance upper and lower air cylinders is fixed on described slide plate;
Described slide plate is fixed on rail plate;
Described rail plate, described driving servomotor are separately fixed on conveyance base plate;
Described driving servomotor slides on described rail plate for driving described slide plate, thus drives described conveyance vacuum cup to move to the position picking up double-interface card, and the double-interface card having chosen antenna is transported to Y-direction antenna correction group.
3. packaging machine according to claim 1, it is characterized in that, described antenna correction butt-joint group comprises two butt-joint upper and lower air cylinders, two butt-joint left and right cylinders, about two clamps, butt-joint mouths move forward and backward cylinder, two butt-joint mouths, nitrogen mouth fixed head and nitrogen mouths;
Described butt-joint upper and lower air cylinders, described butt-joint left and right cylinder are corresponding with described left and right clamp respectively to be arranged, butt-joint upper and lower air cylinders described in one moves up and down for driving left and right clamp described in, and butt-joint left and right cylinder described in moves left and right for driving left and right clamp described in;
Two described left and right clamps move up and down respectively under two described butt-joint upper and lower air cylinders drive, then move left and right under two described butt-joint left and right cylinders drive, move to the position of the X-direction of the antenna revising double-interface card, for revising the X-direction of two antennas simultaneously;
Described butt-joint mouth is fixedly installed on described butt-joint mouth and moves forward and backward cylinder, after completing for the X-direction of the antenna revising double-interface card, move forward and backward cylinder drive at butt-joint mouth and be moved to butt-joint position, chip is welded with antenna on the card base of double-interface card;
Described nitrogen mouth is fixed on described nitrogen mouth fixed head, for blowing out nitrogen when welding to two antenna welds.
4. packaging machine according to claim 1, it is characterized in that, described chip turns to group to comprise and turns to left and right cylinder, turn to upper and lower air cylinders, rotating servo device, four inhale chip vacuum sucker, four chip controls cylinders;
Chip controls cylinder described in chip vacuum sucker correspondence one is inhaled described in each;
Wherein, two described suction chip vacuum suckers are used under the control of two described chip controls cylinders, draw die-cut good chip;
Described rotating servo device revolves turnback, by described turn to left and right cylinder to drive under move left and right, and by described turn to upper and lower air cylinders to drive under move up and down, for aligned position, chip is delivered to antenna correction butt-joint group;
Further, other two suction chip vacuum suckers draw die-cut good chip, for waiting for that described rotating servo device continues to revolve turnback under the control of other two chip controls cylinders.
5. packaging machine according to claim 1, it is characterized in that, described Y-direction antenna correction group comprises the first compression cylinder and the first compact heap, and the second compression cylinder and the second compact heap;
Described first compression cylinder is for driving described first compact heap;
Described second compression cylinder is for driving described second compact heap;
Described first compact heap coordinates with described second compact heap, and the Y-direction for the antenna to double-interface card is revised.
6. packaging machine according to claim 1, it is characterized in that, described chip push over group comprise chip correction before push cylinder, push away chuck before chip correction, the chip correction right side pushes away chuck, the right push cylinder of chip correction, push cylinder, the left push cylinder of chip correction, a chip correction left side push away chuck, chip correction pusher chuck and chip correction working position after chip correction;
Before described chip correction, push cylinder pushes away chuck before driving described chip correction, is pushed forward to welding chip position;
After described chip correction, push cylinder is for driving described chip correction pusher chuck, shifts it onto welding chip position backward;
Push away chuck before described chip correction to coordinate with described chip correction pusher chuck, for the position of chip on double-interface card is pushed over 90 degree;
The left push cylinder of described chip correction pushes away chuck for driving a described chip correction left side;
The right push cylinder of described chip correction pushes away chuck for driving the described chip correction right side;
A described chip correction left side pushes away chuck and pushes away chuck with the described chip correction right side and coordinate, for revising chip soldering line position.
7. packaging machine according to claim 1, it is characterized in that, described correction spot welding group comprises Y-direction fine tuning seat, X presss from both sides upper and lower air cylinders, spot welding head first stroke cylinder, spot welding head second stroke cylinder and spot welding head to fine tuning seat, about two chip correction gas enclosure cylinders, about two chip correction folders, chip corrections;
Described spot welding head second stroke cylinder moves up and down for driving described spot welding head, and holds chip by vacuum;
Chip correction folder in left and right described in left and right chip correction gas enclosure cylinder correspondence one described in each, described left and right chip correction gas enclosure cylinder moves left and right for driving the described left and right chip correction folder corresponding to it;
Described chip correction folder upper and lower air cylinders is used for driving about two chip correction folders to move up and down simultaneously;
Two described left and right chip correction folders match, for chip is clamped in described spot welding head;
Described Y-direction fine tuning seat, described X are respectively used at Y-direction, X to the relative position of finely tuning chip and card base to fine tuning seat;
The card base of chip and double-interface card, for driving described spot welding head, is carried out spot welding by described spot welding head first stroke cylinder;
And/or described card casket group comprises on push cylinder on card, card cuts somebody's hair, collects card casket;
On described card, push cylinder is cut somebody's hair for driving on described card, above pushes away double-interface card to described collection card casket.
8. a method for packing for double-interface card, is characterized in that, comprises the following steps:
A1, enter card carrying arm and the double-interface card having chosen antenna is transported to Y-direction antenna correction group;
A2, the Y-direction of Y-direction antenna correction group to the antenna of double-interface card are revised, and are sent to antenna correction butt-joint group;
A3, chip turn to group to take out chip from chip material strip, revolve turnback, chip is delivered to antenna correction butt-joint group, revise the X-direction of the antenna of double-interface card, chip is welded with antenna on the card base of double-interface card, the double-interface card of microarray strip is sent to CCD test set;
A4, CCD test set carries out CCD detection to the double-interface card of this microarray strip, determines whether that detection is passed through, is, is sent to chip and pushes over group;
It is parallel with double-interface card that A5, chip push over group, and the position of chip on double-interface card is pushed over 90 degree, is sent to first time non-contact detection group;
Whether the antenna that A6, for the first time non-contact detection group detect the good double-interface card of butt-joint welds connection with chip, is, is sent to and revises spot welding group;
A7, correction spot welding group push over the position of chip on double-interface card, revise chip, and the card base of chip and double-interface card is carried out spot welding, order is sent to the first hot weld group and the second hot weld group, respectively hot weld is carried out to chip and card base, be then sent to cold welding group;
A8, cold welding group carry out cold welding to chip and card base, are sent to contact measurement group;
Whether conducting after A9, contact measurement group detect and weld with card base chip, is, is sent to non-contact detection group for the second time;
A10, second time non-contact detection group, whether detection chip welds connection with card base, is, is sent to card casket group.
9. method for packing according to claim 8, it is characterized in that, before steps A 3, also perform following steps A30: draw chip material strip group and chip die cutting die, put the assembly of chip material strip and close, put chip material strip, then chip material strip is drawn in stepping, obtains chip, give chip and turn to group by chip die cutting die is die-cut.
10. method for packing according to claim 9, is characterized in that, in steps A 4, steps A 6, steps A 9, steps A 10, also perform following steps respectively: otherwise be sent to waste material casket.
Priority Applications (1)
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| CN201310092235.3A CN103192188B (en) | 2013-03-21 | 2013-03-21 | A kind of packaging machine of double-interface card and method for packing |
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| CN201310092235.3A CN103192188B (en) | 2013-03-21 | 2013-03-21 | A kind of packaging machine of double-interface card and method for packing |
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| CN103192188B true CN103192188B (en) | 2015-09-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103515255B (en) * | 2013-09-23 | 2016-04-20 | 东莞市深方伟智能科技有限公司 | IC card chip point glue packing integral machine |
| CN104723028B (en) * | 2014-06-25 | 2018-02-06 | 广东曙光自动化设备股份有限公司 | The production method and equipment of a kind of double-interface card |
| CN104538319B (en) * | 2014-12-30 | 2017-04-05 | 东莞市锐祥智能卡科技有限公司 | The packaging system and its spot welding device of a kind of smart card and method for packing |
| CN104715270B (en) * | 2015-03-14 | 2017-10-03 | 广州明森科技股份有限公司 | One kind is stacked to write chip apparatus |
| CN105537968B (en) * | 2016-03-07 | 2017-11-07 | 深圳市华鑫精工机械技术有限公司 | A kind of INLAY full-automatic production methods |
| CN108565770A (en) * | 2018-04-03 | 2018-09-21 | 巨腾（内江）资讯配件有限公司 | A kind of automatic winding displacement apparatus and the automatic winding displacement technique using the device |
| CN112518766B (en) * | 2020-11-09 | 2022-09-02 | 宁波阅荷思山智能科技有限公司 | Magnetic control type precise anti-abrasion card distribution robot complete machine |
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