CN103192188A - Packaging machine and packaging method for dual-interface card - Google Patents
Packaging machine and packaging method for dual-interface card Download PDFInfo
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- CN103192188A CN103192188A CN2013100922353A CN201310092235A CN103192188A CN 103192188 A CN103192188 A CN 103192188A CN 2013100922353 A CN2013100922353 A CN 2013100922353A CN 201310092235 A CN201310092235 A CN 201310092235A CN 103192188 A CN103192188 A CN 103192188A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000012937 correction Methods 0.000 claims abstract description 185
- 238000003466 welding Methods 0.000 claims abstract description 87
- 238000001514 detection method Methods 0.000 claims abstract description 59
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 38
- 238000012360 testing method Methods 0.000 claims description 35
- 238000005476 soldering Methods 0.000 claims description 32
- 238000005520 cutting process Methods 0.000 claims description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims description 19
- 239000002699 waste material Substances 0.000 claims description 15
- 238000002493 microarray Methods 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 11
- 235000015111 chews Nutrition 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 9
- 238000007599 discharging Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000002950 deficient Effects 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000003801 milling Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The invention discloses a packaging machine and a packaging method for a dual-interface card. The packaging machine comprises a card-in carrying arm, a Y-direction antenna correction group, a chip turning group, an antenna correction butt-welding group, a charge coupled device (CCD) detection group, a chip push-over group, a first non-contact detection group, a correction spot-welding group, a first hot-welding group, a second hot-welding group, a cold-welding group, a contact detection group, a second non-contact detection group and a cartridge group. By adoption of the scheme, the packaging machine packages a chip of the dual-interface card on the dual-interface card with an antenna selected mechanically or manually, achieves the technical effect of automatic packaging, and can be operated singly or operated by connecting with other equipment. During single operation, automatic card distribution operation and automatic packaging can be realized only by placing the card base with the selected antenna on a material-discharging conveying belt without manual operation, and the operation is flexible and convenient.
Description
Technical field
The present invention relates to the encapsulation technology of double-interface card, in particular, a kind of packaging machine of double-interface card and method for packing.
Background technology
Press the read-write mode of smart card, can be divided into Contact Type Ic Card and non-contact IC card, the function of top two kinds of cards is combined on the card, as double-interface card.
Existing machine all is the packaging machine of separate unit double-interface card on the market, be used for the two interfaces of encapsulation chip, it needs workman's manual operations, and need the other fit structure that increases to realize semi-automatic operation, speed is slow, welding is unstable, and the product fraction defective height, the defective products that cause producing are found untimely.
Therefore, there is defective in prior art, needs to improve.
Summary of the invention
Technical problem to be solved by this invention provides a kind of packaging machine and method for packing of double-interface card of novel automatic operation.
Technical scheme of the present invention is as follows: a kind of packaging machine of double-interface card, and it comprises with lower device: go into the card carrying arm, be transported to Y-direction antenna correction group for the double-interface card that will choose antenna; Y-direction antenna correction group is used for the Y-direction of the antenna of double-interface card is revised, and is sent to antenna correction butt-joint group; Chip turns to group, is used for taking out chip from the chip strip, and the Rotate 180 degree is transported to antenna correction butt-joint group with chip; Antenna correction butt-joint group be used for to be revised the directions X of the antenna of double-interface card, and antenna on the card base of chip and double-interface card is welded, and the double-interface card of microarray strip is sent to the CCD test set; The CCD test set is used for double-interface card to this microarray strip and carries out CCD and detect, detect by the time be sent to chip and push over group; Chip pushes over group, and it is parallel with double-interface card, is used for 90 degree are pushed in the position of chip on double-interface card, is sent to non-contact detection group for the first time; Whether non-contact detection group for the first time welds connection for detection of antenna and the chip of the good double-interface card of butt-joint, is sent to correction spot welding group when welding is connected; Revise the spot welding group, be used in the position that double-interface card pushes over chip, chip is revised, and the card base of chip and double-interface card is carried out spot welding, be sent to the first hot weld group; The first hot weld group is used for chip and card base are carried out hot weld, is sent to the second hot weld group; The second hot weld group is used for chip and card base are carried out hot weld, is sent to the cold welding group; The cold welding group is used for chip and card base are carried out cold welding, is sent to the contact test set; The contact test set for detection of to whether conducting after chip and the card base welding, is sent to non-contact detection group for the second time when conducting; Whether the non-contact detection group welds connection for detection of chip and card base for the second time, is sent to card casket group when welding is connected; Card casket group is used for collecting the double-interface card of finishing encapsulation; And conveyer belt, be used for finishing described transmission.
Preferably, described packaging machine also comprises and draws chip strip group, chip die cutting die and put chip strip group; Describedly draw chip strip group and described chip die cutting die, describedly put the assembly of chip strip and close, the described chip strip group of putting is used for putting the chip strip, the described chip strip group of drawing is drawn described chip strip for stepping, described chip die cutting die is used for the die-cut chip that obtains, and turns to group to use for described chip.
Preferably, described packaging machine also comprises the waste material casket, be used for the CCD test set detect not by the time, in first time during non-contact detection bond pads access failure, when the contact test set detects not conducting or in second time during non-contact detection bond pads access failure, double-interface card is sent to described waste material casket.
Preferably, in the described packaging machine, describedly go into the card carrying arm and comprise conveyance vacuum cup, conveyance upper and lower air cylinders, slide plate, driving servomotor, rail plate and conveyance base plate; Described conveyance vacuum cup is fixed in described conveyance upper and lower air cylinders, is used for by moving up and down, and picks up double-interface card; Described conveyance upper and lower air cylinders is fixed in described slide plate; Described slide plate is fixed on the rail plate; Described rail plate, described driving servomotor are separately fixed on the conveyance base plate; Described driving servomotor be used for to drive described slide plate and slides at described rail plate, moves to the position that picks up double-interface card thereby drive described conveyance vacuum cup, and the double-interface card that will choose antenna is transported to Y-direction antenna correction group.
Preferably, in the described packaging machine, described antenna correction butt-joint group comprises that two butt-joint upper and lower air cylinders, two butt-joint left and right sides cylinders, two left and right sides clamps, butt-joints are chewed and moves forward and backward that cylinder, two butt-joints are chewed, nitrogen chews fixed head and nitrogen is chewed; Described butt-joint upper and lower air cylinders, described butt-joint left and right sides cylinder respectively with the corresponding setting of described left and right sides clamp, one described butt-joint upper and lower air cylinders is used for driving a described left and right sides clamp and moves up and down, and a described butt-joint left and right sides cylinder is used for driving a described left and right sides clamp move left and right; Two described left and right sides clamps move up and down under two described butt-joint upper and lower air cylinders drive respectively, move left and right under two described butt-joint left and right sides cylinders drive then, move to the position of the directions X of the antenna of revising double-interface card, be used for revising simultaneously the directions X of two antennas; Described butt-joint is chewed and is fixedly set in described butt-joint and chews and move forward and backward cylinder, after directions X that be used for to revise the antenna of double-interface card is finished, chew in butt-joint and to move forward and backward cylinder and drive and to be moved to the butt-joint position, antenna on the card base of chip and double-interface card is welded; Described nitrogen is chewed and is fixed in described nitrogen and chews fixed head, is used for when welding two antenna welds being blown out nitrogen.
Preferably, in the described packaging machine, described chip turns to group to comprise and turns to left and right sides cylinder, turns to upper and lower air cylinders, rotating servo device, four are inhaled chip vacuum cups, four chip controls cylinders; The corresponding described chip controls cylinder of each described suction chip vacuum cup; Wherein, two described suction chip vacuum cups are used for drawing die-cut good chip under the control of two described chip controls cylinders; Described rotating servo device Rotate 180 degree drives move left and right down by the described left and right sides cylinder that turns to, and is moved up and down by described turning under the upper and lower air cylinders drive, is used for aligned position, and chip is delivered to antenna correction butt-joint group; And other two suction chip vacuum cups are drawn die-cut good chip under the control of other two chip controls cylinders, be used for waiting for that described rotating servo device continues the Rotate 180 degree.
Preferably, in the described packaging machine, described Y-direction antenna correction group comprises first clamping cylinder and first compact heap, and second clamping cylinder and second compact heap; Described first clamping cylinder is used for driving described first compact heap; Described second clamping cylinder is used for driving described second compact heap; Described first compact heap cooperates with described second compact heap, is used for the Y-direction of the antenna of double-interface card is revised.
Preferably, in the described packaging machine, described chip pushes over group and comprises that pushing away chuck, the chip correction right side before push cylinder before the chip correction, the chip correction pushes away push cylinder after chuck, the right push cylinder of chip correction, the chip correction, chip correction left side push cylinder, a chip correction left side and push away chuck, chip correction pusher chuck and chip correction working position; Push cylinder pushes away chuck before being used for driving described chip correction before the described chip correction, and it is pushed forward to the welding chip position; Push cylinder is used for driving described chip correction pusher chuck after the described chip correction, shifts it onto welding chip position backward; Push away chuck before the described chip correction and cooperate with described chip correction pusher chuck, be used for 90 degree are pushed in the position of chip on double-interface card; Described chip correction left side push cylinder is used for driving a described chip correction left side and pushes away chuck; The right push cylinder of described chip correction is used for driving the described chip correction right side and pushes away chuck; A described chip correction left side pushes away chuck and pushes away chuck with the described chip correction right side and cooperate, and is used for revising the chip position of bonding wire.
Preferably, in the described packaging machine, described correction spot welding group comprises Y-direction fine setting seat, X-direction fine setting seat, two left and right sides chip correction gas enclosure cylinders, two left and right sides chip correction folders, chip corrections folder upper and lower air cylinders, some soldering tip first stroke cylinder, some soldering tip second stroke cylinders and some soldering tips; Described some soldering tip second stroke cylinder is used for driving described some soldering tip and moves up and down, and holds chip by vacuum; The corresponding described left and right sides chip correction folder of each described left and right sides chip correction gas enclosure cylinder, described left and right sides chip correction gas enclosure cylinder is used for driving its corresponding described left and right sides chip correction folder move left and right; Described chip correction folder upper and lower air cylinders is used for driving simultaneously two left and right sides chip correction folders and moves up and down; Two described left and right sides chip correction folders match, and are used for chip is clamped in described some soldering tip; Described Y-direction is finely tuned seat, described X-direction fine setting seat is respectively applied to the relative position at Y-direction, X-direction fine setting chip and card base; Described some soldering tip first stroke cylinder is used for driving described some soldering tip, and the card base of chip and double-interface card is carried out spot welding.Preferably, in the described packaging machine, described card casket group comprises cuts somebody's hair, collects card card casket on push cylinder on the card, the card; Push cylinder be used for to drive on the described card and cuts somebody's hair on the described card, on push away double-interface card to described collection card card casket.
Another technical scheme of the present invention is, a kind of method for packing of double-interface card, and it may further comprise the steps: A1, go into the card carrying arm and will choose the double-interface card conveyance of antenna to Y-direction antenna correction group; A2, Y-direction antenna correction group are revised the Y-direction of the antenna of double-interface card, are sent to antenna correction butt-joint group; A3, chip turn to group to take out chip from the chip strip, the Rotate 180 degree is delivered to antenna correction butt-joint group with chip, revises the directions X of the antenna of double-interface card, antenna on the card base of chip and double-interface card is welded, the double-interface card of microarray strip is sent to the CCD test set; A4, CCD test set are carried out the CCD detection to the double-interface card of this microarray strip, and determine whether to detect and pass through, be then to be sent to chip to push over group; It is parallel with double-interface card that A5, chip push over group, and 90 degree are pushed in the position of chip on double-interface card, is sent to non-contact detection group for the first time; A6, for the first time whether the non-contact detection group antenna and the chip that detect the good double-interface card of butt-joint welds connection, is then to be sent to correction spot welding group; A7, correction spot welding group are pushed over chip at double-interface card position, chip is revised, and the card base of chip and double-interface card is carried out spot welding, order is sent to the first hot weld group and the second hot weld group, respectively chip and card base are carried out hot weld, be sent to the cold welding group then; A8, cold welding group are carried out cold welding to chip and card base, are sent to the contact test set; A9, contact test set detect whether conducting after chip and the welding of card base, are then to be sent to non-contact detection group for the second time; A10, non-contact detection group for the second time, whether detection chip welds connection with the card base, is then to be sent to card casket group.
Preferably, in the described method for packing, before the steps A 3, also carry out following steps A30: draw chip strip group and chip die cutting die, put the assembly of chip strip and close, put the chip strip, the chip strip is drawn in stepping then, by the die-cut chip that obtains of chip die cutting die, give chip and turn to group.
Preferably, in the described method for packing, in steps A 4, steps A 6, steps A 9, the steps A 10, also carry out following steps respectively: otherwise be sent to the waste material casket.
Adopt such scheme, the present invention is encapsulated into machine or manual having chosen on the double-interface card of antenna with the chip of double-interface card, has realized the technique effect of automation encapsulation, and it can be operated separately, also can connect machine operation with other equipment; When independent operation, a card base that only needs to have chosen line is positioned over the blowing transport tape, can realize automatic card operation, encapsulation automatically, need not people's hand operated, and flexible.
Description of drawings
Fig. 1 is the overall schematic of one embodiment of the present of invention;
Fig. 2 is part-structure enlarged diagram embodiment illustrated in fig. 1;
Fig. 3 goes into card carrying arm enlarged diagram for embodiment illustrated in fig. 1;
Fig. 4 is antenna correction butt-joint group schematic diagram embodiment illustrated in fig. 1;
Fig. 5 turns to the group enlarged diagram for chip embodiment illustrated in fig. 1;
Fig. 6 is Y-direction antenna correction group enlarged diagram embodiment illustrated in fig. 1;
Fig. 7 pushes over the group enlarged diagram for chip embodiment illustrated in fig. 1;
Fig. 8 is correction spot welding group enlarged diagram embodiment illustrated in fig. 1;
Fig. 9 is card casket group enlarged diagram embodiment illustrated in fig. 1;
Figure 10 is packaging machine chip strip and chip die cutting die direction of transfer enlarged diagram embodiment illustrated in fig. 1.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
One embodiment of the present of invention are, a kind of packaging machine of double-interface card, it comprises with lower device: go into card carrying arm, Y-direction antenna correction group, chip turn to group, antenna correction butt-joint group, CCD test set, chip push over group, for the first time the non-contact detection group, revise spot welding group, the first hot weld group, the second hot weld group, cold welding group, contact test set, non-contact detection group and card casket group for the second time.As Fig. 1, shown in 2, one embodiment of the present of invention include card carrying arm 101, Y-direction antenna correction group 102, antenna correction butt-joint group 103, chip turns to group 104, draw chip strip group 105, chip die cutting die 106, put chip strip group 107, CCD (charge-coupled image sensor also claims imageing sensor) test set 108, chip pushes over group 109, the first time, the non-contact detecting group 110, revise spot welding group 111, hot weld group 112, hot weld group 113, cold welding group 114, contact test set 115, the second time, the non-contact detection group 116, card casket group 117, waste material casket 118.
Go into the card carrying arm, be transported to Y-direction antenna correction group for the double-interface card that will choose antenna; For example, describedly go into the card carrying arm and comprise conveyance vacuum cup, conveyance upper and lower air cylinders, slide plate, driving servomotor, rail plate and conveyance base plate; Described conveyance vacuum cup is fixed in described conveyance upper and lower air cylinders, is used for by moving up and down, and picks up double-interface card; Described conveyance upper and lower air cylinders is fixed in described slide plate; Described slide plate is fixed on the rail plate; Described rail plate, described driving servomotor are separately fixed on the conveyance base plate; Described driving servomotor be used for to drive described slide plate and slides at described rail plate, moves to the position that picks up double-interface card thereby drive described conveyance vacuum cup, and the double-interface card that will choose antenna is transported to Y-direction antenna correction group.For example, as shown in Figure 3, go into the card carrying arm and comprise conveyance vacuum cup 201, conveyance upper and lower air cylinders 202, drive servomotor 203, rail plate 204, slide plate 205, conveyance base plate 206; Be fixed on rail plate 204 after conveyance vacuum cup 201, conveyance upper and lower air cylinders 202, slide plate 205 are connected, rail plate 204, driving servomotor 203 are separately fixed on the conveyance base plate 206.Conveyance vacuum cup 201 runs to take-up machine or the platform of plugging under the driving that drives servomotor 203, run down to by conveyance upper and lower air cylinders 202 and inhale card position card is picked up, and drives servomotor 203 counter-rotatings this moment and drives operation and get back to and put card position.Card is described double-interface card.
Y-direction antenna correction group is used for the Y-direction of the antenna of double-interface card is revised, and is sent to antenna correction butt-joint group; For example, described Y-direction antenna correction group comprises first clamping cylinder and first compact heap, and second clamping cylinder and second compact heap; Described first clamping cylinder is used for driving described first compact heap; Described second clamping cylinder is used for driving described second compact heap; Described first compact heap cooperates with described second compact heap, is used for the Y-direction of the antenna of double-interface card is revised.For example, as shown in Figure 6, Y-direction correction group comprises first clamping cylinder 501, first compact heap 502, second compact heap 503, second clamping cylinder 504; First compact heap 502 and second compact heap 503 are revised antenna respectively under first clamping cylinder 501 and second clamping cylinder 504 act on simultaneously.
Chip turns to group, is used for taking out chip from the chip strip, and the Rotate 180 degree is transported to antenna correction butt-joint group with chip; Perhaps, chip turns to group to take out the die-cut chip of finishing from the chip strip of handling.For example, described chip turns to group to comprise to turn to left and right sides cylinder, turn to upper and lower air cylinders, rotating servo device, four are inhaled chip vacuum cups, four chip controls cylinders; The corresponding described chip controls cylinder of each described suction chip vacuum cup; Wherein, two described suction chip vacuum cups are used for drawing die-cut good chip under the control of two described chip controls cylinders; Described rotating servo device Rotate 180 degree drives move left and right down by the described left and right sides cylinder that turns to, and is moved up and down by described turning under the upper and lower air cylinders drive, is used for aligned position, and chip is delivered to antenna correction butt-joint group; And other two suction chip vacuum cups are drawn die-cut good chip under the control of other two chip controls cylinders, be used for waiting for that described rotating servo device continues the Rotate 180 degree.For example, as shown in Figure 5, chip turns to group to comprise and turns to left and right sides cylinder 401, turns to upper and lower air cylinders 402, rotating servo device 403, four are inhaled chip vacuum cups 404, four chip controls cylinders 405; Two inhale chip vacuum cup 404 under the driving of two chip controls cylinders 405 from the chip mould, taking out die-cut good chip, rotating servo device 403 Rotate 180 degree were gone up antenna with the card base and were welded this moment, simultaneously other two inhale chip vacuum cups 404 under the driving of two chip controls cylinders 405 from the chip mould, taking out die-cut good chip.
Antenna correction butt-joint group be used for to be revised the directions X of the antenna of double-interface card, and antenna on the card base of chip and double-interface card is welded, and the double-interface card of microarray strip is sent to the CCD test set; For example, described antenna correction butt-joint group comprises that two butt-joint upper and lower air cylinders, two butt-joint left and right sides cylinders, two left and right sides clamps, butt-joints are chewed and moves forward and backward that cylinder, two butt-joints are chewed, nitrogen chews fixed head and nitrogen is chewed; Described butt-joint upper and lower air cylinders, described butt-joint left and right sides cylinder respectively with the corresponding setting of described left and right sides clamp, one described butt-joint upper and lower air cylinders is used for driving a described left and right sides clamp and moves up and down, and a described butt-joint left and right sides cylinder is used for driving a described left and right sides clamp move left and right; Two described left and right sides clamps move up and down under two described butt-joint upper and lower air cylinders drive respectively, move left and right under two described butt-joint left and right sides cylinders drive then, move to the position of the directions X of the antenna of revising double-interface card, be used for revising simultaneously the directions X of two antennas; Described butt-joint is chewed and is fixedly set in described butt-joint and chews and move forward and backward cylinder, after directions X that be used for to revise the antenna of double-interface card is finished, chew in butt-joint and to move forward and backward cylinder and drive and to be moved to the butt-joint position, antenna on the card base of chip and double-interface card is welded; Described nitrogen is chewed and is fixed in described nitrogen and chews fixed head, is used for when welding two antenna welds being blown out nitrogen.For example, as shown in Figure 4, antenna correction butt-joint group comprise butt-joint chew 301a and butt-joint chew 301b, butt-joint left and right sides clamp 302a and butt-joint left and right sides clamp 302b, nitrogen chew fixed head 303, butt-joint upper and lower air cylinders 304a and butt-joint upper and lower air cylinders 304b, butt-joint left and right sides cylinder 305a and butt-joint left and right sides cylinder 305b, butt-joint chew move forward and backward cylinder 306, nitrogen chews 307; Two butt-joint left and right sides clamps 302 push the back to revising aerial position simultaneously at two butt-joint upper and lower air cylinders 304, two butt-joint left and right sides cylinders 305 moves simultaneously and revised 2 aerial positions simultaneously this moment, and two butt-joints are chewed 301 and chewed in butt-joint and to move forward and backward cylinder 306 effects and be moved to butt-joint position and chip and carry out butt-joint while nitrogen and chew 307 pairs of two antenna welds and blow out nitrogen after the aerial position correction is finished.
The CCD test set is used for double-interface card to this microarray strip and carries out CCD and detect, detect by the time be sent to chip and push over group; The CCD test set detects antenna and whether the chip welding spot welding is qualified.
Chip pushes over group, and it is parallel with double-interface card, is used for 90 degree are pushed in the position of chip on double-interface card, is sent to non-contact detection group for the first time; For example, described chip pushes over group and comprises that pushing away chuck, the chip correction right side before push cylinder before the chip correction, the chip correction pushes away push cylinder after chuck, the right push cylinder of chip correction, the chip correction, chip correction left side push cylinder, a chip correction left side and push away chuck, chip correction pusher chuck and chip correction working position; Push cylinder pushes away chuck before being used for driving described chip correction before the described chip correction, and it is pushed forward to the welding chip position; Push cylinder is used for driving described chip correction pusher chuck after the described chip correction, shifts it onto welding chip position backward; Push away chuck before the described chip correction and cooperate with described chip correction pusher chuck, be used for 90 degree are pushed in the position of chip on double-interface card; Described chip correction left side push cylinder is used for driving a described chip correction left side and pushes away chuck; The right push cylinder of described chip correction is used for driving the described chip correction right side and pushes away chuck; A described chip correction left side pushes away chuck and pushes away chuck with the described chip correction right side and cooperate, and is used for revising the chip position of bonding wire.For example, as shown in Figure 7, chip pushes over group and comprises that pushing away chuck 602, the chip correction right side before push cylinder 601 before the chip correction, the chip correction pushes away push cylinder 605 after chuck 603, the right push cylinder 604 of chip correction, the chip correction, chip correction left side push cylinder 606, a chip correction left side and push away chuck 607, chip correction pusher chuck 608, chip correction working position 609; Push away before the chip correction under the effect of chuck 602 push cylinder 601 before the chip correction and be pushed forward to the welding chip position, chip correction this moment pusher chuck 608 is shifted the welding chip position onto backward under 605 effects of push cylinder after the chip correction, the chip correction right side pushed away chuck 603 and a chip correction left side and pushed away chuck 607 and revise the chip position of bonding wire respectively under the right push cylinder 604 of chip correction and push cylinder 606 effects of a chip correction left side this moment.
Whether non-contact detection group for the first time welds connection for detection of antenna and the chip of the good double-interface card of butt-joint, is sent to correction spot welding group when welding is connected; Non-contact detection group detection chip and antenna weld whether conducting.
Revise the spot welding group, be used in the position that double-interface card pushes over chip, chip is revised, and the card base of chip and double-interface card is carried out spot welding, be sent to the first hot weld group; For example, described correction spot welding group comprises Y-direction fine setting seat, X-direction fine setting seat, two left and right sides chip correction gas enclosure cylinders, two left and right sides chip correction folders, chip corrections folder upper and lower air cylinders, some soldering tip first stroke cylinder, some soldering tip second stroke cylinders and some soldering tips; Described some soldering tip second stroke cylinder is used for driving described some soldering tip and moves up and down, and holds chip by vacuum; The corresponding described left and right sides chip correction folder of each described left and right sides chip correction gas enclosure cylinder, described left and right sides chip correction gas enclosure cylinder is used for driving its corresponding described left and right sides chip correction folder move left and right; Described chip correction folder upper and lower air cylinders is used for driving simultaneously two left and right sides chip correction folders and moves up and down; Two described left and right sides chip correction folders match, and are used for chip is clamped in described some soldering tip; Described Y-direction is finely tuned seat, described X-direction fine setting seat is respectively applied to the relative position at Y-direction, X-direction fine setting chip and card base; Described some soldering tip first stroke cylinder is used for driving described some soldering tip, and the card base of chip and double-interface card is carried out spot welding.For example, as shown in Figure 8, revise the spot welding group and comprise Y-direction fine setting seat 701,702, two left and right sides chip correction gas enclosure cylinders 703 of X-direction fine setting seat, two left and right sides chip correction folders 704, chip corrections folder upper and lower air cylinders 705, some soldering tip first stroke cylinder 706, some soldering tip second stroke cylinder 707, some soldering tip 708; Put at first that soldering tip 708 is descending under the effect of a soldering tip second stroke cylinder 707 to hold chip by vacuum, two left and right sides chip correction folders 704 go downwards to chip position under the effect of chip correction folder upper and lower air cylinders 705 simultaneously, this moment, two left and right sides chip corrections folders 704 were clamped in chip on the soldering tip 708 under the effect of two left and right sides chip correction gas enclosure cylinders 703, put soldering tip first stroke cylinder 706 finishing after and will put soldering tip 708 microarray strips and be welded in the card foundation trench.Y-direction fine setting seat 701 and X-direction fine setting seat 702 can be finely tuned chips welding in the position of Ka Jinei.
The first hot weld group is used for chip and card base are carried out hot weld, is sent to the second hot weld group; The hot weld group adds thermal weld to the chip that point welds, by the heating and melting high-temp glue.
The second hot weld group is used for chip and card base are carried out hot weld, is sent to the cold welding group; Hot weld once is not enough to high-temp glue is melted, and has therefore adopted two hot weld groups.
The cold welding group is used for chip and card base are carried out cold welding, is sent to the contact test set; The cold welding group is cooled off fast to the high-temp glue after melting, thereby the good chip of hot weld is cooled off welding.
The contact test set for detection of to whether conducting after chip and the card base welding, is sent to non-contact detection group for the second time when conducting; The contact test set: the chip that butt welding connects detects.
Whether the non-contact detection group welds connection for detection of chip and card base for the second time, is sent to card casket group when welding is connected;
Card casket group is used for collecting the double-interface card of finishing encapsulation.For example, described card casket group comprises and cuts somebody's hair, collects card card casket on push cylinder on the card, the card; Push cylinder be used for to drive on the described card and cuts somebody's hair on the described card, on push away double-interface card to described collection card card casket.For example, as shown in Figure 9, card casket group comprises cuts somebody's hair 802, collects card card casket 803 on push cylinder 801, the card on the card.Preferably, card casket guide rail is set also, push cylinder drives to cut somebody's hair on the described card and moves up and down at card casket guide rail on the card, on push away and encapsulate the double-interface card finished to described collection card card casket.
And described packaging machine also comprises conveyer belt, be used for finishing above-mentioned all relate to the operation of transmission; Described transmission is to adopt described conveyer belt to finish.By described transmission bring finish above-mentioned all relate to the operation of transmission, the double-interface card order is sent to next device by operating process from a device; Preferably, described conveyer belt is a belt or metal track.
Preferably, described packaging machine also comprises and draws chip strip group, chip die cutting die and put chip strip group; Describedly draw chip strip group and described chip die cutting die, describedly put the assembly of chip strip and close, the described chip strip group of putting is used for putting the chip strip, the described chip strip group of drawing is drawn described chip strip for stepping, described chip die cutting die is used for the die-cut chip that obtains, turn to group to use for described chip, namely, put the chip strip by the described chip strip group of putting, draw the stepping of chip strip group to draw described chip strip by described then, by the die-cut chip that obtains of described chip die cutting die, turn to group to use for described chip.Wherein, put chip strip group, rotate by driven by motor chip strip dish the chip strip is sent to wait to draw the pulling of chip strip group.Draw chip strip group, pulling chip strip enters the chip die cutting die.The chip die cutting die carries out the chip on the chip strip die-cut.
Preferably, described packaging machine also comprises the waste material casket, be used for the CCD test set detect not by the time double-interface card is sent to described waste material casket, double-interface card is sent to described waste material casket in the first time during non-contact detection bond pads access failure, perhaps when the contact test set detects not conducting, double-interface card is sent to described waste material casket, or in second time during non-contact detection bond pads access failure, double-interface card is sent to described waste material casket.
And for example, as shown in figure 10, for packaging machine chip strip and chip die cutting die direction of transfer structure, it comprises, and chip turns to group 901, chip die cutting die 902, draws chip strip group 903, useless chip electric eye seat 904, chip scrap tep reel 905, the useless protective tapes dish 906 of chip, chip strip dish 907, strip aluminium support 908, punching chip detection group 909; Chip strip dish 907 blowings at first, strip enter punching chip detection group 909, enter chip die cutting die 902, enter and draw chip strip group 903, enter useless chip electric eye seat 904.The useless protective tapes dish 906 of chip scrap tep reel 905 and chip is collected chip scrap band and useless protective tapes respectively.In this structure, the chip that punches out from chip die cutting die 902 is delivered to the welding position after turning to group 901 Rotate 180 degree by chip.
In conjunction with being applied to above-mentioned arbitrary embodiment, further, embodiments of the invention can also be, a kind of method for packing of double-interface card, and it may further comprise the steps:
A1, go into double-interface card conveyance that the card carrying arm will choose antenna to Y-direction antenna correction group;
A2, Y-direction antenna correction group are revised the Y-direction of the antenna of double-interface card, are sent to antenna correction butt-joint group;
A3, chip turn to group to take out chip from the chip strip, the Rotate 180 degree is delivered to antenna correction butt-joint group with chip, revises the directions X of the antenna of double-interface card, antenna on the card base of chip and double-interface card is welded, the double-interface card of microarray strip is sent to the CCD test set; Preferably, before the steps A 3, also carry out following steps A30: draw chip strip group and chip die cutting die, put the assembly of chip strip and close, put the chip strip, the chip strip is drawn in stepping then, by the die-cut chip that obtains of chip die cutting die, gives chip and turns to group.
A4, CCD test set are carried out the CCD detection to the double-interface card of this microarray strip, and determine whether to detect and pass through, be then to be sent to chip to push over group; Preferably, otherwise be sent to the waste material casket.
It is parallel with double-interface card that A5, chip push over group, and 90 degree are pushed in the position of chip on double-interface card, is sent to non-contact detection group for the first time; Chip pushes over after group action finishes, and chip is vertical with card.
A6, for the first time whether the non-contact detection group antenna and the chip that detect the good double-interface card of butt-joint welds connection, is then to be sent to correction spot welding group; Preferably, otherwise be sent to the waste material casket.Non-contact detection is by instrument induction chip on-state, does not need to contact with chip or card; For example, whether connect by the instrument detection, spread out of a signal of telecommunication then.
A7, correction spot welding group are pushed over chip at double-interface card position, chip is revised, and the card base of chip and double-interface card carried out spot welding, order is sent to the first hot weld group and the second hot weld group, namely, be sent to the first hot weld group earlier and be sent to the second hot weld group again, the first hot weld group and the second hot weld group are carried out hot weld to chip and card base respectively according to priority, are sent to the cold welding group then.
A8, cold welding group are carried out cold welding to chip and card base, are sent to the contact test set.
A9, contact test set detect whether conducting after chip and the welding of card base, are then to be sent to non-contact detection group for the second time; Preferably, otherwise be sent to the waste material casket.
A10, non-contact detection group for the second time, whether detection chip welds connection with the card base, is then to be sent to card casket group.Preferably, otherwise be sent to the waste material casket.
An example is, described packaging machine comprises that the double-interface card sheet of having chosen antenna for conveyance goes into card carrying arm 101 to the feed belt group, the double-interface card sheet is transported to the feed belt group of each processing stations, be used for revising the Y-direction antenna correction group 102 of two interfaces antenna Y-direction antenna, be used for putting chip strip group 107 to what two interfaces chip strip reel supported, be used for two interfaces chip strip is punched out the chip die cutting die 106 of two interfaces chip, what be used for the stepping of chip strip draws chip strip group 105, the chip of directly delivering to the butt-joint position after the two interfaces chip that downcuts for liquidating is rotated turns to group 104, for the antenna correction butt-joint group 103 of will carry out butt-joint with the two interfaces chip that turns to group to bring from chip after the correction of double-interface card antenna directions X, whether be used for the crashing double-interface card antenna that welds and two interfaces chip welds the non-contact detection group 110 first time of connection, be used for that the 90 degree chip parallel with double-interface card pushed in the position of chip on double-interface card, two interfaces and push over group 109, be used for two interfaces chip is pushed over the correction spot welding group 111 that the position is revised and it and double-interface card card base are carried out spot welding on double-interface card, be used for hot weld group 112 and hot weld group 113 to two interfaces chip and double-interface card basic point postwelding, be used for the cold welding group 114 after two interfaces chip and the hot weld of double-interface card base, the contact test set 115 of conducting whether after being used for two interfaces chip and double-interface card base welded, non-contact detection group 116 second time after being used for two interfaces chip and double-interface card base welded, for the 117 card casket groups that double-interface card is collected, be used for two interfaces defective products is sticked into the waste material casket 118 that row is collected.
The invention provides for the production equipment that two interfaces chip is encapsulated on machine or the manual double-interface card sheet of having chosen antenna, it is the packaging machine of described double-interface card, this production equipment can be operated separately, the card base of having chosen line is positioned over the blowing transport tape realizes hair fastener operation, flexible.This production equipment also can connect machine with automatic take-up machine and dock, thereby realizes full-automatic groove milling, take-up, encapsulation, detection, integrated automatic running job.
Further, embodiments of the invention can also be each technical characterictic of the various embodiments described above, the packaging machine of the double-interface card that is combined to form mutually and method for packing.
Need to prove that above-mentioned each technical characterictic continues combination mutually, forms the various embodiment that do not enumerate in the above, all be considered as the scope of specification record of the present invention; And, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection domain of claims of the present invention.
Claims (10)
1. the packaging machine of a double-interface card is characterized in that, comprises with lower device:
Go into the card carrying arm, be transported to Y-direction antenna correction group for the double-interface card that will choose antenna;
Y-direction antenna correction group is used for the Y-direction of the antenna of double-interface card is revised, and is sent to antenna correction butt-joint group;
Chip turns to group, is used for taking out chip from the chip strip, and the Rotate 180 degree is transported to antenna correction butt-joint group with chip;
Antenna correction butt-joint group be used for to be revised the directions X of the antenna of double-interface card, and antenna on the card base of chip and double-interface card is welded, and the double-interface card of microarray strip is sent to the CCD test set;
The CCD test set is used for double-interface card to this microarray strip and carries out CCD and detect, detect by the time be sent to chip and push over group;
Chip pushes over group, and it is parallel with double-interface card, is used for 90 degree are pushed in the position of chip on double-interface card, is sent to non-contact detection group for the first time;
Whether non-contact detection group for the first time welds connection for detection of antenna and the chip of the good double-interface card of butt-joint, is sent to correction spot welding group when welding is connected;
Revise the spot welding group, be used in the position that double-interface card pushes over chip, chip is revised, and the card base of chip and double-interface card is carried out spot welding, be sent to the first hot weld group;
The first hot weld group is used for chip and card base are carried out hot weld, is sent to the second hot weld group;
The second hot weld group is used for chip and card base are carried out hot weld, is sent to the cold welding group;
The cold welding group is used for chip and card base are carried out cold welding, is sent to the contact test set;
The contact test set for detection of to whether conducting after chip and the card base welding, is sent to non-contact detection group for the second time when conducting;
Whether the non-contact detection group welds connection for detection of chip and card base for the second time, is sent to card casket group when welding is connected;
Card casket group is used for collecting the double-interface card of finishing encapsulation;
And conveyer belt, be used for finishing described transmission.
2. according to the described packaging machine of claim 1, it is characterized in that, describedly go into the card carrying arm and comprise conveyance vacuum cup, conveyance upper and lower air cylinders, slide plate, driving servomotor, rail plate and conveyance base plate;
Described conveyance vacuum cup is fixed in described conveyance upper and lower air cylinders, is used for by moving up and down, and picks up double-interface card;
Described conveyance upper and lower air cylinders is fixed in described slide plate;
Described slide plate is fixed on the rail plate;
Described rail plate, described driving servomotor are separately fixed on the conveyance base plate;
Described driving servomotor be used for to drive described slide plate and slides at described rail plate, moves to the position that picks up double-interface card thereby drive described conveyance vacuum cup, and the double-interface card that will choose antenna is transported to Y-direction antenna correction group.
3. according to the described packaging machine of claim 1, it is characterized in that described antenna correction butt-joint group comprises that two butt-joint upper and lower air cylinders, two butt-joint left and right sides cylinders, two left and right sides clamps, butt-joints are chewed and moves forward and backward that cylinder, two butt-joints are chewed, nitrogen chews fixed head and nitrogen is chewed;
Described butt-joint upper and lower air cylinders, described butt-joint left and right sides cylinder respectively with the corresponding setting of described left and right sides clamp, one described butt-joint upper and lower air cylinders is used for driving a described left and right sides clamp and moves up and down, and a described butt-joint left and right sides cylinder is used for driving a described left and right sides clamp move left and right;
Two described left and right sides clamps move up and down under two described butt-joint upper and lower air cylinders drive respectively, move left and right under two described butt-joint left and right sides cylinders drive then, move to the position of the directions X of the antenna of revising double-interface card, be used for revising simultaneously the directions X of two antennas;
Described butt-joint is chewed and is fixedly set in described butt-joint and chews and move forward and backward cylinder, after directions X that be used for to revise the antenna of double-interface card is finished, chew in butt-joint and to move forward and backward cylinder and drive and to be moved to the butt-joint position, antenna on the card base of chip and double-interface card is welded;
Described nitrogen is chewed and is fixed in described nitrogen and chews fixed head, is used for when welding two antenna welds being blown out nitrogen.
4. according to the described packaging machine of claim 1, it is characterized in that described chip turns to group to comprise and turns to left and right sides cylinder, turns to upper and lower air cylinders, rotating servo device, four are inhaled chip vacuum cups, four chip controls cylinders;
The corresponding described chip controls cylinder of each described suction chip vacuum cup;
Wherein, two described suction chip vacuum cups are used for drawing die-cut good chip under the control of two described chip controls cylinders;
Described rotating servo device Rotate 180 degree drives move left and right down by the described left and right sides cylinder that turns to, and is moved up and down by described turning under the upper and lower air cylinders drive, is used for aligned position, and chip is delivered to antenna correction butt-joint group;
And other two suction chip vacuum cups are drawn die-cut good chip under the control of other two chip controls cylinders, be used for waiting for that described rotating servo device continues the Rotate 180 degree.
5. according to the described packaging machine of claim 1, it is characterized in that described Y-direction antenna correction group comprises first clamping cylinder and first compact heap, and second clamping cylinder and second compact heap;
Described first clamping cylinder is used for driving described first compact heap;
Described second clamping cylinder is used for driving described second compact heap;
Described first compact heap cooperates with described second compact heap, is used for the Y-direction of the antenna of double-interface card is revised.
6. according to the described packaging machine of claim 1, it is characterized in that described chip pushes over group and comprises that pushing away chuck, the chip correction right side before push cylinder before the chip correction, the chip correction pushes away push cylinder after chuck, the right push cylinder of chip correction, the chip correction, chip correction left side push cylinder, a chip correction left side and push away chuck, chip correction pusher chuck and chip correction working position;
Push cylinder pushes away chuck before being used for driving described chip correction before the described chip correction, and it is pushed forward to the welding chip position;
Push cylinder is used for driving described chip correction pusher chuck after the described chip correction, shifts it onto welding chip position backward;
Push away chuck before the described chip correction and cooperate with described chip correction pusher chuck, be used for 90 degree are pushed in the position of chip on double-interface card;
Described chip correction left side push cylinder is used for driving a described chip correction left side and pushes away chuck;
The right push cylinder of described chip correction is used for driving the described chip correction right side and pushes away chuck;
A described chip correction left side pushes away chuck and pushes away chuck with the described chip correction right side and cooperate, and is used for revising the chip position of bonding wire.
7. according to the described packaging machine of claim 1, it is characterized in that described correction spot welding group comprises Y-direction fine setting seat, X-direction fine setting seat, two left and right sides chip correction gas enclosure cylinders, two left and right sides chip correction folders, chip corrections folder upper and lower air cylinders, some soldering tip first stroke cylinder, some soldering tip second stroke cylinders and some soldering tips;
Described some soldering tip second stroke cylinder is used for driving described some soldering tip and moves up and down, and holds chip by vacuum;
The corresponding described left and right sides chip correction folder of each described left and right sides chip correction gas enclosure cylinder, described left and right sides chip correction gas enclosure cylinder is used for driving its corresponding described left and right sides chip correction folder move left and right;
Described chip correction folder upper and lower air cylinders is used for driving simultaneously two left and right sides chip correction folders and moves up and down;
Two described left and right sides chip correction folders match, and are used for chip is clamped in described some soldering tip;
Described Y-direction is finely tuned seat, described X-direction fine setting seat is respectively applied to the relative position at Y-direction, X-direction fine setting chip and card base;
Described some soldering tip first stroke cylinder is used for driving described some soldering tip, and the card base of chip and double-interface card is carried out spot welding;
And/or described card casket group comprises cuts somebody's hair, collects card card casket on push cylinder on the card, the card;
Push cylinder be used for to drive on the described card and cuts somebody's hair on the described card, on push away double-interface card to described collection card card casket.
8. the method for packing of a double-interface card is characterized in that, may further comprise the steps:
A1, go into double-interface card conveyance that the card carrying arm will choose antenna to Y-direction antenna correction group;
A2, Y-direction antenna correction group are revised the Y-direction of the antenna of double-interface card, are sent to antenna correction butt-joint group;
A3, chip turn to group to take out chip from the chip strip, the Rotate 180 degree is delivered to antenna correction butt-joint group with chip, revises the directions X of the antenna of double-interface card, antenna on the card base of chip and double-interface card is welded, the double-interface card of microarray strip is sent to the CCD test set;
A4, CCD test set are carried out the CCD detection to the double-interface card of this microarray strip, and determine whether to detect and pass through, be then to be sent to chip to push over group;
It is parallel with double-interface card that A5, chip push over group, and 90 degree are pushed in the position of chip on double-interface card, is sent to non-contact detection group for the first time;
A6, for the first time whether the non-contact detection group antenna and the chip that detect the good double-interface card of butt-joint welds connection, is then to be sent to correction spot welding group;
A7, correction spot welding group are pushed over chip at double-interface card position, chip is revised, and the card base of chip and double-interface card is carried out spot welding, order is sent to the first hot weld group and the second hot weld group, respectively chip and card base are carried out hot weld, be sent to the cold welding group then;
A8, cold welding group are carried out cold welding to chip and card base, are sent to the contact test set;
A9, contact test set detect whether conducting after chip and the welding of card base, are then to be sent to non-contact detection group for the second time;
A10, non-contact detection group for the second time, whether detection chip welds connection with the card base, is then to be sent to card casket group.
9. described method for packing according to Claim 8, it is characterized in that, before the steps A 3, also carry out following steps A30: draw chip strip group and chip die cutting die, put the assembly of chip strip and close, put the chip strip, the chip strip is drawn in stepping then, by the die-cut chip that obtains of chip die cutting die, gives chip and turns to group.
10. according to the described method for packing of claim 9, it is characterized in that, in steps A 4, steps A 6, steps A 9, the steps A 10, also carry out following steps respectively: otherwise be sent to the waste material casket.
Priority Applications (1)
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| CN201310092235.3A CN103192188B (en) | 2013-03-21 | 2013-03-21 | A kind of packaging machine of double-interface card and method for packing |
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| CN201310092235.3A CN103192188B (en) | 2013-03-21 | 2013-03-21 | A kind of packaging machine of double-interface card and method for packing |
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| CN103192188A true CN103192188A (en) | 2013-07-10 |
| CN103192188B CN103192188B (en) | 2015-09-30 |
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| CN103515255A (en) * | 2013-09-23 | 2014-01-15 | 东莞市实创五金电子有限公司 | IC card chip glue dispensing and packaging all-in-one machine |
| CN104538319A (en) * | 2014-12-30 | 2015-04-22 | 东莞市锐祥智能卡科技有限公司 | Intelligent card packaging device and spot welding device and packaging method for intelligent card packaging device |
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| CN108565770A (en) * | 2018-04-03 | 2018-09-21 | 巨腾（内江）资讯配件有限公司 | A kind of automatic winding displacement apparatus and the automatic winding displacement technique using the device |
| CN112518766A (en) * | 2020-11-09 | 2021-03-19 | 宁波阅荷思山智能科技有限公司 | Magnetic control type precise anti-abrasion card distribution robot complete machine |
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| CN112518766A (en) * | 2020-11-09 | 2021-03-19 | 宁波阅荷思山智能科技有限公司 | Magnetic control type precise anti-abrasion card distribution robot complete machine |
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| CN103192188B (en) | 2015-09-30 |
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