200839902 九、發明說明： 【發明所屬之技術領域】 本發明係關於—種黏著半導體晶片之裝置，尤係關於- 種用於半導體封裝製程中之黏晶（die bonding)裝置。 【先前技術】 於正個半導體封裝製程中，緊接於晶圓切割後之製程為 黏晶（或稱為固晶、上片或黏片）製程，其係將晶圓上因切割 ； 〔切開後之各獨立晶粒依序取放至導線架或基板上，並藉 由銀膠或膠帶將導線架及晶粒相互穩固結合。 、曾圖1係一習知黏晶機之主要機構示意圖。基板5由輸送 V轨19左邊進料端載入，被依序載入之複數個基板5係由 進料夾爪Π往輸送導轨19之出料端傳送。基板5會經過 •裝黏膠之,主射筒狀容器8及點膠頭9下方，容器8内之黏 膠會經由點膠頭9吐出於基板5上各單元。另外，取放機 構11會依序拿取晶圓15上之晶粒10，該晶圓15係固定於 / —薄膜上’而藉由擴張機構12使薄膜拉伸而將晶粒10彼 此距離拉開。被取放機構π拿起之晶粒會移到輸送導 執19端，並往下運動直至將晶粒1〇固定於基板5上之膠 材。 由於晶粒10固定於基板5上需要花費較多之時間，尤其 疋對於較大面積之晶粒10更是需要較多之時間才能使膠材 合適地擠出於四m將膠材換為聚乙ϋ胺（Pc>iyimide) 材質之膠帶則每個晶粒1〇需要更多之時間，約需要壓合2 私才此有效結合晶粒丨0與基板5，因此很明顯晶粒⑺ -5- 200839902 壓，過程會成為該習知黏晶機之瓶頸動作，亦即每小時產 f量⑽t per hour; UPH)會受到影響而降低。當使用廢帶 '、、、結合晶粒10與基板5之物質時，每小時產出量甚至低於 Ϊ 2 0 〇 個。 習知點晶機除了單糾間產量不佳外，其所利之進料 ，爪17受到基板5_間題之嚴重考驗。尤其當從事於多 晶=封裝（multi-chip package; MCM)時，薄型之基板，在 黏者百顆晶粒後受到烘烤溫度影響會產生翹曲。該些進料 夹爪17疋以接力方式交替傳輸至出料端，基板5趣曲經常 造成進料夹爪17交替換手時無法正讀夾緊而定位，因此造 成基板5與輸送導軌19間碰撞而卡料，甚至基板5上晶粒 10因到傷或晶崩而需要報廢。 综上所述，封裝設備市場上亟需要一種能顯著提昇單位 ㈣產里之黏者半導體晶片的裝置，並且還要降低黏晶製 程中不該有的停機率及報廢率。 【發明内容】 本發明之目的係提供一種黏著半導體晶片之裝置，盆係 藉由多軌進料及輸送導線架或基板，並同時進行導線架或 土板之加/皿 > 此藉由多軌輸送線間之交替進行黏晶動 作’就能有效省去基板溫昇之等待時間，進而提升該裝置 之單位時間產量。 本發明之另一目的係提供一種具預壓及後壓之分段壓合 晶粒功能之黏晶裝詈，批> 置執订後壓之主壓合模組又包含多個 壓合頭’故可同時壓合多個晶粒與基板充分結合，因此能 -6- 200839902 有效提升該裝置之單位時間產量。 本發明之另-目的係提供-種沒有交接傳送動作之進料 輸送的黏晶裝置，可避免基板傳送過程中被卡料或遭干涉 之風險。 / 為達上述目的，本發明揭示一種黏著半導體晶片之穿 置，係用於將半導體晶片黏著固定於封裝载體^封裝設 備，該封裝載體包括基板或導線架。該裝晉白人十 又 ,㈣送單元、-第二進料輸送單元、一預壓二：= 合模組’其中該第-進料輸送單元及該第二進料輸送單元 係輪替傳送基板至該預壓模組處。該預壓模組會將複數個 半導體晶片依序放置於已送至定位之基板表面或基板上已 、 固定之晶粒表面，並施加壓力使該半導體晶片與該基板初 ' 步結合。然後該主壓合模組中複數個壓合頭會同時觸壓該 複數個半導體晶片，並使該複數個半導體晶片與該基板或 已固定之該晶粒緊密結合。 、 【實施方式】 圖2係本發明黏著半導體晶片之裝置之立體圖。黏著半 V體晶片之裝置20主要包含物料傳送模組29、預壓模組 24及主壓合模組25。物料傳送模組29包括至少第一進料 輸送單元291及第二進料輸送單元292，該兩輸送單元（本 發明並不限於兩輸送單元，多個輸送單年亦為本發明之主 張）係輪替傳送基板80或導線架至該預壓模組24處。當第 一進料輸送單元291及第二進料輸送單元292其中一者在 預壓椒組24處與晶粒間進行初步之結合固定，同時另一已 200839902 卸料之輸送單元可回到左邊之進料端承载 =待預壓模…複數個晶粒依序點合於:基板 動作S T片基板8G之輸送單元可進行基板之加溫 =作。如此精由多軌輸送線間之交替進行“過程，就能 ^痛去基板溫昇之特時間，進而提升該裝置Μ之單位 ¥間產量。由^第―進料輸送單元291或第二進料輸送單 疋292係直接將基板8G傳送至預壓模虹^處，因此沒有 交接傳送之動作會造成切或干涉之駿，尤其適用於薄 型或魅曲1較大之基板8〇。 預壓模組24中有取放機構241會依序拿取晶圓上之晶 粒，該晶圓係固定於一薄膜上’而藉由擴張模組27使薄膜 拉伸而將晶粒彼此距離拉伸帛來。被取放機構241拿起之 晶粒會移到輸送導軌19端’並往下運動直至將晶粒固定於 第一進料輸送單元291或第二進料輸送單元292上之基板 8〇表面4於後續有主壓合模組25可完成晶粒與基板 間之充分結合，因此取放機構241只要將晶粒初步固定於 基板80表面即可’意即緊接著之傳送動作令晶粒與基板間 不會有相對位移，相較於習知技術就不需要花費太長時間 而w成生產瓶頸。於擴張模組27之上方有晶圓視覺單元23 可確認各晶粒於擴張模组27上之位置與角度。又預壓視覺 模組22係設於第一進料輸送單元291及第二進料輸送單元 292行經路線上，其可以確認黏晶前基板8〇之位置與角 度，或是確認基板80上各單元是否有不良之記號。 經過預壓模組24初步固定晶粒後之基板8〇會直接送到BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for attaching a semiconductor wafer, and more particularly to a die bonding device for use in a semiconductor packaging process. [Prior Art] In a semiconductor packaging process, the process immediately after wafer dicing is a process of die bonding (or called die bonding, top film or adhesive film), which is based on cutting on the wafer; The subsequent independent dies are sequentially placed on the lead frame or the substrate, and the lead frame and the dies are firmly bonded to each other by silver glue or tape. Fig. 1 is a schematic diagram of the main mechanism of a conventional die-bonding machine. The substrate 5 is loaded by the feeding end on the left side of the conveying V-track 19, and a plurality of substrates 5 sequentially loaded are conveyed from the feeding jaws to the discharge end of the conveying guide 19. The substrate 5 passes through the adhesive, the main cylindrical container 8 and the dispensing head 9, and the adhesive in the container 8 is discharged through the dispensing head 9 to the units on the substrate 5. In addition, the pick-and-place mechanism 11 sequentially takes the die 10 on the wafer 15, which is fixed on the film, and stretches the film by the expansion mechanism 12 to pull the die 10 away from each other. open. The die picked up by the pick-and-place mechanism π is moved to the end of the conveyance guide 19, and moved downward until the die 1 is fixed to the substrate 5 on the substrate. Since it takes a lot of time for the die 10 to be fixed on the substrate 5, in particular, it takes more time for the die 10 of a larger area to properly extrude the glue into four m to change the glue into a poly. The tape of acetamidine (Pc>iyimide) requires more time for each die, and it takes about 2 nips to effectively combine the grain 丨0 with the substrate 5, so it is obvious that the grain (7) -5 - 200839902 Pressure, the process will become the bottleneck action of the conventional die-bonding machine, that is, the amount of production per hour (10) t per hour; UPH) will be affected and reduced. When the waste belt ', , and the material of the crystal grain 10 and the substrate 5 are used, the output per hour is even lower than Ϊ 20 〇. In addition to the poor yield of the single-correction machine, the conventional spot crystal machine has a serious test of the feed of the substrate 5_. Especially when working in a multi-chip package (MCM), a thin substrate is warped by the baking temperature after a hundred grains of the die. The feeding jaws 17疋 are alternately transmitted to the discharging end by relay, and the substrate 5 often causes the feeding jaws 17 to be displaced when the hand is replaced, thereby causing the substrate 5 and the conveying guide 19 to be positioned. Colliding and jamming, even the die 10 on the substrate 5 needs to be scrapped due to injury or crystal collapse. In summary, there is a need in the packaging equipment market for a device that can significantly increase the adhesive semiconductor wafers in the unit (4), and also reduce the downtime and scrap rate that should not be in the die bonding process. SUMMARY OF THE INVENTION An object of the present invention is to provide a device for bonding a semiconductor wafer by multi-track feeding and transporting a lead frame or a substrate, and simultaneously performing a lead frame or an earth plate addition/dish; The alternating die-carrying action between the rail conveyor lines can effectively save the waiting time of the substrate temperature rise, thereby increasing the unit time output of the device. Another object of the present invention is to provide a die attaching device with a pre-pressed and post-pressed segmented die-grain function, and the main press-compression module of the post-pressing and pressing press further comprises a plurality of press-fit heads. 'Therefore, a plurality of dies can be pressed together at the same time to fully integrate with the substrate, so that -6-200839902 can effectively increase the unit time production of the device. Another object of the present invention is to provide a die bonding apparatus that does not have a transfer operation for the transfer operation, thereby avoiding the risk of jamming or interference during substrate transfer. In order to achieve the above object, the present invention discloses an adhesive semiconductor wafer for attaching and fixing a semiconductor wafer to a package carrier, the package carrier comprising a substrate or a lead frame. The loading white white ten, (4) sending unit, - second feeding conveying unit, a pre-pressing two: = combined module 'where the first-feed conveying unit and the second feeding conveying unit are rotating the transfer substrate To the preloading module. The pre-pressing module sequentially places a plurality of semiconductor wafers on the surface of the fixed or fixed die that has been sent to the surface of the substrate or the substrate, and applies pressure to bond the semiconductor wafer to the substrate. Then, the plurality of bonding heads in the main compression module simultaneously touch the plurality of semiconductor wafers and tightly bond the plurality of semiconductor wafers to the substrate or the fixed crystal grains. [Embodiment] FIG. 2 is a perspective view of an apparatus for adhering a semiconductor wafer of the present invention. The device 20 for attaching a half V-body wafer mainly comprises a material transfer module 29, a pre-press module 24 and a main press-fit module 25. The material transfer module 29 includes at least a first feed transport unit 291 and a second feed transport unit 292. The two transport units (the present invention is not limited to two transport units, and multiple transport single years are also claimed in the present invention). The transfer substrate 80 or lead frame is rotated to the pre-press module 24. When one of the first feed conveying unit 291 and the second feed conveying unit 292 is initially combined with the grain at the pre-pressing pepper group 24, another conveying unit that has been unloaded at 200839902 can return to the left. Feeding end bearing = to be pre-compressed ... a plurality of crystal grains are sequentially clicked on: substrate operation ST film substrate 8G transport unit can perform substrate heating = work. In this way, the process of “multiple-track transfer lines” can be used to “make a painful time for the temperature rise of the substrate, thereby increasing the output of the unit.” The feed-feed unit 291 or the second feed The material conveying unit 292 directly conveys the substrate 8G to the pre-pressing mold rainbow, so that the action of no transfer and transfer causes the cutting or interference, especially for the thin substrate or the larger substrate 8〇. In the module 24, the pick-and-place mechanism 241 sequentially takes the die on the wafer, and the wafer is fixed on a film, and the film is stretched by the expansion module 27 to stretch the die from each other. The substrate picked up by the pick-and-place mechanism 241 will move to the end of the transport rail 19 and move downward until the substrate 8 is fixed to the first feed transport unit 291 or the second feed transport unit 292. The surface 4 of the crucible has a sufficient bonding between the die and the substrate in the subsequent main pressing and pressing module 25, so that the pick-and-place mechanism 241 can be preliminarily fixed on the surface of the substrate 80, that is, the transfer operation is followed. There is no relative displacement between the particles and the substrate, which is not required compared to conventional techniques. It takes too long to become a production bottleneck. Above the expansion module 27, the wafer vision unit 23 can confirm the position and angle of each die on the expansion module 27. The pre-compression vision module 22 is The first feed conveying unit 291 and the second feeding conveying unit 292 travel on the route, which can confirm the position and angle of the front substrate 8黏, or confirm whether each unit on the substrate 80 has a bad mark. After the module 24 is initially fixed, the substrate 8 is directly sent to the substrate.
S -8- 200839902 主壓合模組25下方’或經過轉接輸送單元293而將基板80 :晶粒移到複數個壓合頭251〜254位置處，緊接著該些壓 口頭25 1〜254會再施加適當力量於晶粒表面，藉此就能使 各對應之晶粒與基板8〇充分結合。 圖3所示，為旎使本發明更廣泛地應用於多晶粒封 :’或基板需要置放於彈匣才能進料之實際生產需求，於 衣置20之進料端及出料端可分別設置彈匿進料模組^及 彈匣出料模組26。 」4⑷係本發明物料傳送模挺29之示意圖。第一進料輸 送單元291將原本在進料位置之基板8〇2移至_位置之 預壓頭241下方，晶粒1〇經過預壓頭241施加適當壓力後 初步固疋於基8〇2’之表面。此時第二進料輸送單元292 =已承載並加熱—基板謝，並待基板8G2，傳送至轉接輸送 單一 93後該已適备力口熱之基板8〇1會被移送預麼位置 處（如虛線基板801，所示）。另第二進料輸送單元292會將 已完成預❹驟之基板直接料至壓合位置處，或經過平 移後才運抵壓合位置，壓合位置處之壓合頭251〜254合再 施加適當力量於晶粒表面，藉此難使各對應之晶粒料 板803充分結合。 圖4⑻係本發明另一物料傳送模组29，之示意圖。為能減 少裝置20之所佔面積（f00tprint)，可將轉接輪送單元綱 直接設置於麼合位置處，並可於第一進料輪送單元291及 二進料輸送單元292間往返，例如：於虛線表示之轉接輸 送單元294,和轉接輸送單元294間轉換。S -8- 200839902 under the main press-fit module 25 or through the transfer transport unit 293 to move the substrate 80: the die to a plurality of press heads 251 to 254, followed by the pressure heads 25 1 to 254 A suitable force is applied to the surface of the die, whereby the corresponding die can be sufficiently bonded to the substrate 8A. As shown in FIG. 3, in order to make the present invention more widely applied to a multi-die seal: 'or the actual production demand for the substrate to be placed in the magazine to be fed, the feed end and the discharge end of the garment 20 can be The ballistic feed module ^ and the magazine discharge module 26 are separately provided. 4(4) is a schematic view of the material transfer mold 29 of the present invention. The first feed conveying unit 291 moves the substrate 8〇2 originally at the feeding position to the pre-injection head 241 of the _ position, and the die 1〇 is preliminarily fixed to the base 8〇2 after applying the appropriate pressure through the pre-injection head 241. 'The surface. At this time, the second feed conveying unit 292=has been carried and heated-substrate, and is to be transferred to the substrate 8G2, and after the transfer to the transfer unit 93, the substrate 8〇1 which has been properly heated is transferred to the pre-position. (as shown by the dashed substrate 801). The second feed conveying unit 292 directly feeds the substrate that has completed the pre-compression to the pressing position, or passes the translation to the pressing position, and the pressing heads 251 to 254 at the pressing position are reapplied. Appropriate force on the surface of the die, thereby making it difficult to fully bond the respective die plates 803. Figure 4 (8) is a schematic view of another material transfer module 29 of the present invention. In order to reduce the area occupied by the device 20 (f00tprint), the transfer wheel unit can be directly disposed at the position of the combination, and can be reciprocated between the first feed transfer unit 291 and the two feed delivery unit 292. For example, the transfer conveying unit 294 indicated by a broken line and the transfer conveying unit 294 are switched.
S -9- 200839902 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1係一習知黏晶機之主要機構示意圖； 圖2係本發明黏著半導體晶片之裝置之立體圖； 圖3係本發明黏著半導體晶片之裝置之上視圖；以及 圖4(a)〜4(b)係本發明物料傳送模組之示意圖。 【主要元件符號說明】 5 基板 9 點膠頭 11 取放機構 15 晶圓 19 輸送導執 21堆疊進料模組 23晶圓視覺單元 25主壓合模組 27擴張模組 29、29’物料傳送模組 251〜254壓合頭 292第二進料輸送單元 8 容器 10 晶粒 12 擴張機構 17 進料夾爪 20黏著半導體晶片之裝置 22 預壓視覺單元 24 預壓模組 26彈匣出料模組 28彈匣進料模組 241 預壓頭 291第一進料輸送單元 293 、 294 、 294, 轉接輸送單元 200839902 80 80卜 801，、802、802*、803 基板 -11 -The technical content and technical features of the present invention are disclosed above, but those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a main mechanism of a conventional die bonder; FIG. 2 is a perspective view of a device for attaching a semiconductor wafer of the present invention; FIG. 3 is a top view of the device for attaching a semiconductor wafer of the present invention; (a) to 4(b) are schematic views of the material transfer module of the present invention. [Main component symbol description] 5 Substrate 9 Dispensing head 11 Pick and place mechanism 15 Wafer 19 Conveying guide 21 Stacking feeding module 23 Wafer vision unit 25 Main pressing module 27 Expansion module 29, 29' Material transfer Module 251~254 press head 292 second feed conveying unit 8 container 10 die 12 expansion mechanism 17 feeding jaw 20 bonding semiconductor wafer device 22 pre-pressing visual unit 24 pre-pressing module 26 spring ejection die Group 28 magazine feeding module 241 pre-injection head 291 first feeding conveying unit 293, 294, 294, transfer conveying unit 200839902 80 80 801, 802, 802*, 803 substrate-11 -