CN103187322A - 充分成型的扇出 - Google Patents
充分成型的扇出 Download PDFInfo
- Publication number
- CN103187322A CN103187322A CN201210311793XA CN201210311793A CN103187322A CN 103187322 A CN103187322 A CN 103187322A CN 201210311793X A CN201210311793X A CN 201210311793XA CN 201210311793 A CN201210311793 A CN 201210311793A CN 103187322 A CN103187322 A CN 103187322A
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- Prior art keywords
- core unit
- moulding compound
- fan
- transistor core
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- LFVVNPBBFUSSHL-UHFFFAOYSA-N alexidine Chemical compound CCCCC(CC)CNC(=N)NC(=N)NCCCCCCNC(=N)NC(=N)NCC(CC)CCCC LFVVNPBBFUSSHL-UHFFFAOYSA-N 0.000 description 3
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/341,654 | 2011-12-30 | ||
US13/341,654 US8604600B2 (en) | 2011-12-30 | 2011-12-30 | Fully molded fan-out |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103187322A true CN103187322A (zh) | 2013-07-03 |
CN103187322B CN103187322B (zh) | 2016-12-21 |
Family
ID=48678422
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210311793.XA Active CN103187322B (zh) | 2011-12-30 | 2012-08-29 | 充分成型的扇出 |
CN201280069322.0A Active CN104115263B (zh) | 2011-12-30 | 2012-12-28 | 管芯向上的充分成型的扇出型晶片级封装 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280069322.0A Active CN104115263B (zh) | 2011-12-30 | 2012-12-28 | 管芯向上的充分成型的扇出型晶片级封装 |
Country Status (4)
Country | Link |
---|---|
US (2) | US8604600B2 (zh) |
CN (2) | CN103187322B (zh) |
SG (2) | SG11201404309VA (zh) |
WO (1) | WO2013102137A2 (zh) |
Cited By (11)
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---|---|---|---|---|
CN103745937A (zh) * | 2014-02-08 | 2014-04-23 | 华进半导体封装先导技术研发中心有限公司 | 扇出型圆片级封装的制作工艺 |
CN105023837A (zh) * | 2014-04-28 | 2015-11-04 | 台湾积体电路制造股份有限公司 | 划线结构及其形成方法 |
WO2017075929A1 (zh) * | 2015-11-03 | 2017-05-11 | 中芯长电半导体(江阴)有限公司 | 一种扇出型封装结构及其制作方法 |
CN106796892A (zh) * | 2014-08-26 | 2017-05-31 | 德卡技术股份有限公司 | 用于包括唯一标识符的封装体的正面封装级别序列化 |
CN107481941A (zh) * | 2017-07-28 | 2017-12-15 | 华进半导体封装先导技术研发中心有限公司 | 一种控制扇出式***级封装翘曲的方法 |
CN108307661A (zh) * | 2015-11-20 | 2018-07-20 | 德卡科技公司 | 全模制的微型化半导体模块 |
CN109494162A (zh) * | 2017-09-11 | 2019-03-19 | 日月光半导体制造股份有限公司 | 多模件扇出型封装及工艺 |
WO2020238914A1 (zh) * | 2019-05-27 | 2020-12-03 | 广东工业大学 | 一种高密度线路嵌入转移的扇出型封装结构及其制作方法 |
CN112652584A (zh) * | 2020-12-22 | 2021-04-13 | 东莞记忆存储科技有限公司 | 一种dram芯片封装结构及其加工工艺方法 |
CN112652585A (zh) * | 2020-12-22 | 2021-04-13 | 东莞记忆存储科技有限公司 | 一种芯片封装结构及其加工工艺方法 |
US11189500B2 (en) | 2018-11-20 | 2021-11-30 | AT&S (Chongqing) Company Limited | Method of manufacturing a component carrier with an embedded cluster and the component carrier |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7569422B2 (en) | 2006-08-11 | 2009-08-04 | Megica Corporation | Chip package and method for fabricating the same |
US9177926B2 (en) | 2011-12-30 | 2015-11-03 | Deca Technologies Inc | Semiconductor device and method comprising thickened redistribution layers |
US20110198762A1 (en) * | 2010-02-16 | 2011-08-18 | Deca Technologies Inc. | Panelized packaging with transferred dielectric |
US10373870B2 (en) | 2010-02-16 | 2019-08-06 | Deca Technologies Inc. | Semiconductor device and method of packaging |
US9576919B2 (en) | 2011-12-30 | 2017-02-21 | Deca Technologies Inc. | Semiconductor device and method comprising redistribution layers |
US10050004B2 (en) | 2015-11-20 | 2018-08-14 | Deca Technologies Inc. | Fully molded peripheral package on package device |
US9831170B2 (en) * | 2011-12-30 | 2017-11-28 | Deca Technologies, Inc. | Fully molded miniaturized semiconductor module |
US9613830B2 (en) | 2011-12-30 | 2017-04-04 | Deca Technologies Inc. | Fully molded peripheral package on package device |
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CN104115263B (zh) | 2017-06-13 |
WO2013102137A2 (en) | 2013-07-04 |
SG11201404307TA (en) | 2014-10-30 |
US20130244376A1 (en) | 2013-09-19 |
CN104115263A (zh) | 2014-10-22 |
US8835230B2 (en) | 2014-09-16 |
US8604600B2 (en) | 2013-12-10 |
US20130168849A1 (en) | 2013-07-04 |
SG11201404309VA (en) | 2014-10-30 |
CN103187322B (zh) | 2016-12-21 |
WO2013102137A3 (en) | 2015-06-18 |
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