CN103165763A - 发光二极管的制造方法 - Google Patents
发光二极管的制造方法 Download PDFInfo
- Publication number
- CN103165763A CN103165763A CN2011104172234A CN201110417223A CN103165763A CN 103165763 A CN103165763 A CN 103165763A CN 2011104172234 A CN2011104172234 A CN 2011104172234A CN 201110417223 A CN201110417223 A CN 201110417223A CN 103165763 A CN103165763 A CN 103165763A
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- Prior art keywords
- layer
- light
- emitting diode
- barrier layer
- manufacture method
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000004888 barrier function Effects 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 36
- 230000000903 blocking effect Effects 0.000 abstract 10
- 238000007789 sealing Methods 0.000 abstract 3
- 230000000694 effects Effects 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 32
- 238000006073 displacement reaction Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 241000700159 Rattus Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 240000003380 Passiflora rubra Species 0.000 description 1
- 210000000007 bat wing Anatomy 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
Description
10 | 基板 |
20 | 电极层 |
21 | 第一电极 |
22 | 第二电极 |
30 | 阻挡层 |
31 | 凹部 |
40 | LED芯片 |
50 | 荧光粉层 |
60 | 透镜 |
61 | 凸状部 |
62 | 凹状部 |
70 | 胶针 |
100 | 发光二极管 |
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110417223.4A CN103165763B (zh) | 2011-12-14 | 2011-12-14 | 发光二极管的制造方法 |
TW100146433A TWI538256B (zh) | 2011-12-14 | 2011-12-15 | 發光二極體的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110417223.4A CN103165763B (zh) | 2011-12-14 | 2011-12-14 | 发光二极管的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103165763A true CN103165763A (zh) | 2013-06-19 |
CN103165763B CN103165763B (zh) | 2015-07-08 |
Family
ID=48588685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110417223.4A Active CN103165763B (zh) | 2011-12-14 | 2011-12-14 | 发光二极管的制造方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103165763B (zh) |
TW (1) | TWI538256B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109659416A (zh) * | 2018-11-09 | 2019-04-19 | 惠州市华星光电技术有限公司 | 显示组件、点胶装置及显示装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101975190B1 (ko) * | 2013-06-28 | 2019-05-07 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
TWI688128B (zh) | 2016-10-06 | 2020-03-11 | 隆達電子股份有限公司 | 發光二極體晶片級封裝結構及直下式背光模組 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1340864A (zh) * | 2000-09-01 | 2002-03-20 | 西铁城电子股份有限公司 | 表面装配型发光二极管及其制造方法 |
CN1393942A (zh) * | 2001-06-11 | 2003-01-29 | 株式会社西铁城电子 | 发光器件及其制造方法 |
US20060078246A1 (en) * | 2004-10-07 | 2006-04-13 | Towa Corporation | Transparent member, optical device using transparent member and method of manufacturing optical device |
CN1945868A (zh) * | 2005-09-27 | 2007-04-11 | Lg电子株式会社 | 发光器件组件和使用这种发光器件组件的背光单元 |
CN101097985A (zh) * | 2007-07-25 | 2008-01-02 | 友达光电股份有限公司 | 封装件及其制造方法 |
US20090137073A1 (en) * | 2005-02-23 | 2009-05-28 | Samsung Electro-Mechanics Co., Ltd | Light emitting diode package and fabrication method thereof |
CN101452986A (zh) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | 白光发光二极管器件的封装结构和方法 |
US20100182792A1 (en) * | 2009-01-22 | 2010-07-22 | TCST Tech Co . , Ltd. | Leak-Proof LED Base Structure |
CN102024710A (zh) * | 2009-09-18 | 2011-04-20 | 展晶科技(深圳)有限公司 | 光电元件的制造方法、封装结构及其封装装置 |
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2011
- 2011-12-14 CN CN201110417223.4A patent/CN103165763B/zh active Active
- 2011-12-15 TW TW100146433A patent/TWI538256B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1340864A (zh) * | 2000-09-01 | 2002-03-20 | 西铁城电子股份有限公司 | 表面装配型发光二极管及其制造方法 |
CN1393942A (zh) * | 2001-06-11 | 2003-01-29 | 株式会社西铁城电子 | 发光器件及其制造方法 |
US20060078246A1 (en) * | 2004-10-07 | 2006-04-13 | Towa Corporation | Transparent member, optical device using transparent member and method of manufacturing optical device |
US20090137073A1 (en) * | 2005-02-23 | 2009-05-28 | Samsung Electro-Mechanics Co., Ltd | Light emitting diode package and fabrication method thereof |
CN1945868A (zh) * | 2005-09-27 | 2007-04-11 | Lg电子株式会社 | 发光器件组件和使用这种发光器件组件的背光单元 |
CN101097985A (zh) * | 2007-07-25 | 2008-01-02 | 友达光电股份有限公司 | 封装件及其制造方法 |
CN101452986A (zh) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | 白光发光二极管器件的封装结构和方法 |
US20100182792A1 (en) * | 2009-01-22 | 2010-07-22 | TCST Tech Co . , Ltd. | Leak-Proof LED Base Structure |
CN102024710A (zh) * | 2009-09-18 | 2011-04-20 | 展晶科技(深圳)有限公司 | 光电元件的制造方法、封装结构及其封装装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109659416A (zh) * | 2018-11-09 | 2019-04-19 | 惠州市华星光电技术有限公司 | 显示组件、点胶装置及显示装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201324870A (zh) | 2013-06-16 |
CN103165763B (zh) | 2015-07-08 |
TWI538256B (zh) | 2016-06-11 |
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Free format text: FORMER OWNER: ADVANCED OPTOELECTRONIC TECHNOLOGY INC. Effective date: 20150521 Owner name: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: ZHANJING TECHNOLOGY (SHENZHEN) CO., LTD. Effective date: 20150521 |
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Effective date of registration: 20150521 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two Applicant before: ZHANJING Technology (Shenzhen) Co.,Ltd. Applicant before: Advanced Optoelectronic Technology Inc. |
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Effective date of registration: 20170511 Address after: Qian Zhen San Yi River two Avenue, Xinhui District, Guangdong 529000 division hedge tail city in Jiangmen Province Patentee after: Jiangmen Yuequan Electric Appliance Co.,Ltd. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170511 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Patentee before: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing method of light emitting diode Effective date of registration: 20220927 Granted publication date: 20150708 Pledgee: Industrial and Commercial Bank of China Limited Jiangmen Xinhui sub branch Pledgor: Jiangmen Yuequan Electric Appliance Co.,Ltd. Registration number: Y2022980016467 |