CN103160216B - 各向异性导电膜和半导体装置 - Google Patents

各向异性导电膜和半导体装置 Download PDF

Info

Publication number
CN103160216B
CN103160216B CN201210253668.8A CN201210253668A CN103160216B CN 103160216 B CN103160216 B CN 103160216B CN 201210253668 A CN201210253668 A CN 201210253668A CN 103160216 B CN103160216 B CN 103160216B
Authority
CN
China
Prior art keywords
conductive film
anisotropic conductive
resin
weight parts
tricyclodecane dimethanol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210253668.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN103160216A (zh
Inventor
高连助
奇惠秀
鱼东善
李吉镛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guo Dujianduansucai
Original Assignee
Cheil Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Industries Inc filed Critical Cheil Industries Inc
Publication of CN103160216A publication Critical patent/CN103160216A/zh
Application granted granted Critical
Publication of CN103160216B publication Critical patent/CN103160216B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201210253668.8A 2011-12-16 2012-07-20 各向异性导电膜和半导体装置 Active CN103160216B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110136328A KR101355854B1 (ko) 2011-12-16 2011-12-16 이방성 도전 필름
KR10-2011-0136328 2011-12-16

Publications (2)

Publication Number Publication Date
CN103160216A CN103160216A (zh) 2013-06-19
CN103160216B true CN103160216B (zh) 2015-03-11

Family

ID=48583759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210253668.8A Active CN103160216B (zh) 2011-12-16 2012-07-20 各向异性导电膜和半导体装置

Country Status (3)

Country Link
KR (1) KR101355854B1 (ko)
CN (1) CN103160216B (ko)
TW (1) TWI464230B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6238655B2 (ja) * 2013-09-12 2017-11-29 デクセリアルズ株式会社 接続構造体、及び異方性導電接着剤
CN110964468A (zh) * 2019-12-18 2020-04-07 西安英诺维特新材料有限公司 一种单组分丙烯酸树脂导电胶黏剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7348079B2 (en) * 2002-12-03 2008-03-25 Fujifilm Corporation Magnetic recording medium
CN101241207A (zh) * 2008-03-13 2008-08-13 长兴光学材料（苏州）有限公司 反射膜

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
KR101289511B1 (ko) * 2006-10-27 2013-07-24 주식회사 씨씨텍 자외선 경화형 접착제, 그를 이용한 휴대폰 키패드 구조 및키를 휴대폰의 키패드에 접착시키는 방법
TWI354807B (en) * 2007-06-12 2011-12-21 Eternal Chemical Co Ltd Optical film
TW200937043A (en) * 2008-02-29 2009-09-01 Eternal Chemical Co Ltd Brightness enhancement reflective film
CN104059547B (zh) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
KR101246683B1 (ko) * 2009-12-14 2013-03-21 제일모직주식회사 상용성이 향상된 이방도전성 필름용 조성물 및 이로부터 형성된 필름
KR101202045B1 (ko) * 2009-12-24 2012-11-16 제일모직주식회사 저온 속경화형 이방 전도성 필름용 조성물 및 이를 이용한 저온 속경화형 이방 전도성 필름

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7348079B2 (en) * 2002-12-03 2008-03-25 Fujifilm Corporation Magnetic recording medium
CN101241207A (zh) * 2008-03-13 2008-08-13 长兴光学材料（苏州）有限公司 反射膜

Also Published As

Publication number Publication date
CN103160216A (zh) 2013-06-19
KR20130068890A (ko) 2013-06-26
TW201326353A (zh) 2013-07-01
KR101355854B1 (ko) 2014-01-29
TWI464230B (zh) 2014-12-11

Similar Documents

Publication Publication Date Title
CN103122221B (zh) 具有改善的预粘合加工性的各向异性导电膜和半导体装置
KR20150032538A (ko) 점착성 시트
CN103965793B (zh) 各向异性导电膜和半导体装置
KR20220143862A (ko) 점착제 조성물, 점착 시트 및 접합체
TWI596176B (zh) 各向異性導電膜組成物、各向異性導電膜以及半導體元件
CN103160216B (zh) 各向异性导电膜和半导体装置
TWI484504B (zh) 向異性導電膜、其製備方法、及壓製電路端子之方法
US20130140083A1 (en) Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheet
JP6337630B2 (ja) 回路接続材料及び回路接続構造体
TWI587761B (zh) 接著劑組成物、膜狀接著劑、接著片、電路連接體、電路構件的連接方法、接著劑組成物的使用、膜狀接著劑的使用及接著片的使用
CN103805081B (zh) 各向异性导电膜和半导体装置
US9263372B2 (en) Anisotropic conductive film and semiconductor device
KR101582000B1 (ko) 다공성 점착 물품의 제조 방법
KR101403863B1 (ko) 이방성 도전 필름
TW202202589A (zh) 導電性黏結劑，電路連接結構及電路連接結構的製造方法
EP4194198A1 (en) Electrically peelable adhesive sheet and bonded body

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20191202

Address after: Seoul, South Kerean

Patentee after: GUKTOH CHEMICAL Co.,Ltd.

Address before: Han Guojingjidao

Patentee before: Samsung SDI Co.,Ltd.

Effective date of registration: 20191202

Address after: Han Guojingjidao

Patentee after: Samsung SDI Co.,Ltd.

Address before: Han Guoqingshangbeidao

Patentee before: CHEIL INDUSTRIES Inc.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220914

Address after: Gyeonggi Do, South Korea

Patentee after: Guo Dujianduansucai

Address before: Seoul, South Kerean

Patentee before: GUKTOH CHEMICAL Co.,Ltd.