CN103094256B - 一种封装*** - Google Patents
一种封装*** Download PDFInfo
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- CN103094256B CN103094256B CN201110351244.0A CN201110351244A CN103094256B CN 103094256 B CN103094256 B CN 103094256B CN 201110351244 A CN201110351244 A CN 201110351244A CN 103094256 B CN103094256 B CN 103094256B
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- shielding
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- 239000000758 substrate Substances 0.000 claims abstract description 130
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 229920003023 plastic Polymers 0.000 claims description 38
- 239000003292 glue Substances 0.000 claims description 36
- 238000004806 packaging method and process Methods 0.000 claims description 35
- 239000000945 filler Substances 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000000084 colloidal system Substances 0.000 claims description 9
- 229910000531 Co alloy Inorganic materials 0.000 claims description 7
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 7
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 239000011859 microparticle Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910001074 Lay pewter Inorganic materials 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 14
- 230000005672 electromagnetic field Effects 0.000 description 13
- 230000000875 corresponding effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110351244.0A CN103094256B (zh) | 2011-11-08 | 2011-11-08 | 一种封装*** |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110351244.0A CN103094256B (zh) | 2011-11-08 | 2011-11-08 | 一种封装*** |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103094256A CN103094256A (zh) | 2013-05-08 |
CN103094256B true CN103094256B (zh) | 2015-12-02 |
Family
ID=48206653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110351244.0A Active CN103094256B (zh) | 2011-11-08 | 2011-11-08 | 一种封装*** |
Country Status (1)
Country | Link |
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CN (1) | CN103094256B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI632844B (zh) * | 2017-03-13 | 2018-08-11 | 景碩科技股份有限公司 | Anti-electromagnetic interference shielding device and manufacturing method thereof |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103400813B (zh) * | 2013-08-02 | 2015-10-28 | 华进半导体封装先导技术研发中心有限公司 | 柔性基板封装结构及其封灌方法 |
CN103594432B (zh) * | 2013-10-31 | 2016-03-16 | 中国科学院微电子研究所 | 一种刚柔结合板的三维封装散热结构 |
CN103594433B (zh) * | 2013-10-31 | 2016-02-10 | 中国科学院微电子研究所 | 一种制作刚柔结合板的三维封装散热结构的方法 |
CN103560119B (zh) * | 2013-11-05 | 2016-06-01 | 华进半导体封装先导技术研发中心有限公司 | 用于多屏蔽芯片的三维柔性基板封装结构及制作方法 |
CN103560125B (zh) * | 2013-11-05 | 2016-09-21 | 华进半导体封装先导技术研发中心有限公司 | 三维柔性基板电磁屏蔽封装结构及制作方法 |
CN103730446B (zh) * | 2014-01-09 | 2016-08-17 | 华进半导体封装先导技术研发中心有限公司 | 基于刚柔结合印刷电路板三维封装结构的互连结构和制作方法 |
CN104244686A (zh) * | 2014-09-05 | 2014-12-24 | 中国科学院微电子研究所 | 一种封装方法及电子***产品 |
CN105828588B (zh) * | 2015-04-30 | 2018-04-20 | 维沃移动通信有限公司 | 一种移动终端和用于改善其显示屏emc性能的装置 |
KR102639101B1 (ko) * | 2017-02-24 | 2024-02-22 | 에스케이하이닉스 주식회사 | 전자기간섭 차폐 구조를 갖는 반도체 패키지 |
CN109511224B (zh) * | 2018-12-29 | 2022-03-01 | 上海乐今通信技术有限公司 | 一种印刷电路板 |
CN109803523B (zh) * | 2019-02-23 | 2021-01-29 | 华为技术有限公司 | 一种封装屏蔽结构及电子设备 |
US10733136B1 (en) * | 2019-03-01 | 2020-08-04 | Western Digital Technologies, Inc. | Vertical surface mount type C USB connector |
CN117690878B (zh) * | 2024-02-03 | 2024-04-05 | 江门市和美精艺电子有限公司 | 一种基于柔性基板的fbga封装结构 |
Citations (6)
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---|---|---|---|---|
US5345205A (en) * | 1990-04-05 | 1994-09-06 | General Electric Company | Compact high density interconnected microwave system |
JP2004128418A (ja) * | 2002-10-07 | 2004-04-22 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
CN101090080A (zh) * | 2006-06-13 | 2007-12-19 | 日月光半导体制造股份有限公司 | 多芯片堆叠的封装方法及其封装结构 |
CN101150122A (zh) * | 2007-10-30 | 2008-03-26 | 日月光半导体制造股份有限公司 | 具有电磁屏蔽功能的半导体封装结构 |
CN1756474B (zh) * | 2004-09-28 | 2011-04-20 | 夏普株式会社 | 射频模块及其制造方法 |
CN101317268B (zh) * | 2006-09-15 | 2011-06-22 | 香港应用科技研究院有限公司 | 具有emi屏蔽的叠层多芯片封装 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001217388A (ja) * | 2000-02-01 | 2001-08-10 | Sony Corp | 電子装置およびその製造方法 |
-
2011
- 2011-11-08 CN CN201110351244.0A patent/CN103094256B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5345205A (en) * | 1990-04-05 | 1994-09-06 | General Electric Company | Compact high density interconnected microwave system |
JP2004128418A (ja) * | 2002-10-07 | 2004-04-22 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
CN1756474B (zh) * | 2004-09-28 | 2011-04-20 | 夏普株式会社 | 射频模块及其制造方法 |
CN101090080A (zh) * | 2006-06-13 | 2007-12-19 | 日月光半导体制造股份有限公司 | 多芯片堆叠的封装方法及其封装结构 |
CN101317268B (zh) * | 2006-09-15 | 2011-06-22 | 香港应用科技研究院有限公司 | 具有emi屏蔽的叠层多芯片封装 |
CN101150122A (zh) * | 2007-10-30 | 2008-03-26 | 日月光半导体制造股份有限公司 | 具有电磁屏蔽功能的半导体封装结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI632844B (zh) * | 2017-03-13 | 2018-08-11 | 景碩科技股份有限公司 | Anti-electromagnetic interference shielding device and manufacturing method thereof |
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CN103094256A (zh) | 2013-05-08 |
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Owner name: NATIONAL CENTER FOR ADVANCED PACKAGING Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20150305 |
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Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 214135 WUXI, JIANGSU PROVINCE |
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Effective date of registration: 20150305 Address after: 214135 Jiangsu province Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Applicant after: National Center for Advanced Packaging Co.,Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Applicant before: Institute of Microelectronics of the Chinese Academy of Sciences |
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Effective date of registration: 20170818 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: 214135 Jiangsu province Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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Effective date of registration: 20191206 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co.,Ltd. |