CN103093959A - Method for manufacturing multi-layer ceramic electronic parts - Google Patents
Method for manufacturing multi-layer ceramic electronic parts Download PDFInfo
- Publication number
- CN103093959A CN103093959A CN2012102112784A CN201210211278A CN103093959A CN 103093959 A CN103093959 A CN 103093959A CN 2012102112784 A CN2012102112784 A CN 2012102112784A CN 201210211278 A CN201210211278 A CN 201210211278A CN 103093959 A CN103093959 A CN 103093959A
- Authority
- CN
- China
- Prior art keywords
- outer electrode
- electrode
- sintered bodies
- metal
- ceramic sintered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The present invention relates to method for manufacturing multi-layer ceramic electronic parts, which comprises the following steps: preparing a sheet-shaped ceramic sintered part; forming a first outer electrode on the outer surface of the ceramic sintered part; forming a second outer electrode which comprises at least one conductive metal on the first outer electrode; and forming a metal coating through utilizing soldering paste which comprises at least one metal on the second outer electrode. The invention further provides a method for measuring another kind of multi-layer ceramic electronic part. The method for manufacturing the multi-layer ceramic electronic parts according to the embodiment of the invention comprises forming a copper (Cu) or nickel (Ni) coating on the outer electrode, thereby preventing plating solution penetration or outer electrode leaching by copper (Cu). Therefore, the multi-layer ceramic electronic components with high reliability can be manufactured.
Description
The cross reference of related application
It is on November 4th, 2011 that the application requires the date of application of Korea S Department of Intellectual Property, and application number is the priority of the korean patent application of 10-2011-0114229, and the disclosure of this korean patent application is incorporated in the application by reference.
Technical field
The present invention relates to a kind of manufacture method with laminated ceramic electronic component of good reliability.
Background technology
Usually, use the electronic component (such as capacitor, inductor, piezoelectric element, rheostat or thermistor) of ceramic material to comprise the ceramic sintered bodies that is formed by ceramic material, be formed on the internal electrode in ceramic sintered bodies, and be arranged on the surface of ceramic sintered bodies in order to be connected to the outer electrode of internal electrode.
In ceramic electron element, multilayer ceramic capacitor comprises a plurality of stacking dielectric layers, is arranged to have toward each other dielectric layer at the internal electrode of centre, and is electrically connected to the outer electrode of each internal electrode.
Due to advantages such as miniaturization, high power capacity, easy installation, multilayer ceramic capacitor has been widely used as the parts of mobile communication equipments such as computer, palmtop PC (PDA), mobile phone.
Recently, due to the increase to miniaturization of electronic products and multi-functional demand, chip element has tended to miniaturization and has become multi-functional.As a result, to the increase in demand of miniaturization, high power capacity multilayer ceramic capacitor.
In this case, begun by attempting realizing miniaturization, high power capacity multilayer ceramic capacitor by the thickness that reduces outer electrode not changing under the whole size of chip.
In addition, when laminated ceramic electronic component is installed in substrate (substrate), install for convenient, externally carry out nickel/tin (Ni/Sn) electroplating processes on electrode.
Described electroplating processes is undertaken by electro-deposition method, electro-plating method etc.In this case, because electroplate liquid in electroplating process infiltrates outer electrode or produces hydrogen, the reliability of laminated ceramic electronic component may descend.
In order to address the above problem, the present invention has designed a kind of solder(ing) paste of Direct Electroplating fusing to the method for outer electrode.In this case, the copper of outer electrode (Cu) can cause leaching phenomenon (leaching phenomenon) with the solder(ing) paste reaction of fusing, therefore causes the separation defective of outer electrode.
Summary of the invention
One aspect of the present invention provides a kind of manufacture method with laminated ceramic electronic component of good reliability.
According to an aspect of the present invention, provide a kind of manufacture method of laminated ceramic electronic component, the method comprises: preparation sheet shape ceramic sintered bodies (chip-shaped ceramic sintered body); Outer surface at described ceramic sintered bodies forms the first outer electrode; Form the second outer electrode that contains at least a conducting metal on described the first outer electrode; And the solder(ing) paste that contains at least a metal by use forms metal coating to described the second outer electrode.
Described the first outer electrode can contain at least a in the group of selecting free copper (Cu), nickel (Ni), silver (Ag) and silver-palladium (Ag-Pd) alloy composition.
The described at least a conducting metal that contains in described the second outer electrode comprises and selects at least a in the group that free copper (Cu) and nickel (Ni) forms.
The formation of described the second outer electrode can be undertaken by electro-plating method, and described solder(ing) paste can contain tin (Sn).
The formation of described metal coating can be undertaken by described the second outer electrode is immersed in the described solder(ing) paste that contains described at least a metal.
Described ceramic sintered bodies can prepare by replacing of a plurality of dielectric layers and internal electrode is stacking, and described outer electrode can be electrically connected to described internal electrode.
According to a further aspect in the invention, provide a kind of manufacture method of laminated ceramic electronic component, the method comprises: preparation sheet shape ceramic sintered bodies; Outer surface at described ceramic sintered bodies forms the first outer electrode; Form the second outer electrode that contains at least a conducting metal on described the first outer electrode; And form coating on described the second outer electrode.
Described the first outer electrode can contain at least a in the group of selecting free copper (Cu), nickel (Ni), silver (Ag) and silver-palladium (Ag-Pd) alloy composition.
The described at least a conducting metal that contains in described the second outer electrode comprises and selects at least a in the group that free copper (Cu) and nickel (Ni) forms.
The formation of described the second outer electrode can be undertaken by electro-plating method.
The formation of described coating can form nickel (Ni) layer and tin (Sn) layer successively by electro-plating method.
Described ceramic sintered bodies can prepare by replacing of a plurality of dielectric layers and internal electrode is stacking, and described outer electrode can be electrically connected to described internal electrode.
Description of drawings
From the detailed description below in conjunction with accompanying drawing, will more clearly understand above-mentioned aspect of the present invention and other side, feature and other advantage, wherein:
Fig. 1 is the flow chart that shows according to the embodiment of the present invention the laminated ceramic electronic component manufacture method.
Fig. 2 is the flow chart that shows according to another implementation of the invention the laminated ceramic electronic component manufacture method.
Fig. 3 is the perspective view that shows according to the embodiment of the present invention multilayer ceramic capacitor.
Fig. 4 is according to the embodiment of the present invention along the cutaway view of the A-A ' line in Fig. 3; And
Fig. 5 is according to another implementation of the invention along the cutaway view of the A-A ' line in Fig. 3.
Embodiment
Describe embodiments of the present invention in detail referring now to accompanying drawing.
Yet embodiments of the present invention can be modified to many different forms, and scope of the present invention should not be limited to the execution mode of setting forth here.Or rather, provide these execution modes to make the present invention with disclosed thorough and complete, and will convey to those skilled in the art to idea of the present invention fully.
In the accompanying drawings, the shape and size of parts can be exaggerated in order to know, and will specify same or similar parts with identical Reference numeral all the time.
Fig. 1 is the flow chart that shows according to the embodiment of the present invention the laminated ceramic electronic component manufacture method.
Fig. 3 is the perspective view that shows according to the embodiment of the present invention multilayer ceramic capacitor.
Fig. 4 is according to the embodiment of the present invention along the cutaway view of the A-A ' line in Fig. 3.
Referring to Fig. 1, Fig. 3 and Fig. 4, can comprise according to the manufacture method of the laminated ceramic electronic component of embodiment of the present invention: preparation sheet shape ceramic sintered bodies 10(S1); Outer surface at described ceramic sintered bodies 10 forms the first outer electrode 31a and 32a(S2); Form the second outer electrode 31b and the 32b(S3 that contains at least a conducting metal on described the first outer electrode 31a and 32a); And the solder(ing) paste that contains at least a metal by use upward forms metal coating 31c and 32c(S4 to described the second outer electrode 31b and 32b).
Hereinafter, will be described according to the manufacture method of embodiment of the present invention to laminated ceramic electronic component.Especially describe the preparation method of multilayer ceramic capacitor, but the present invention is not limited to this.
According to the embodiment of the present invention, in the manufacture method of multilayer ceramic capacitor, can prepare described shape ceramic sintered bodies 10(S1).
The shape of described ceramic sintered bodies 10 can be rectangular shape but be not limited to this.
The preparation of described shape ceramic sintered bodies 10 is not particularly limited, and can complete by the manufacture method of routine.
Or rather, after the slurry that contains ceramic powder and additive by use is prepared into ceramic substrate (ceramic green sheets), form the internal electrode pattern by the use conductive metal paste on ceramic substrate, thus can be by described shape ceramic sintered bodies 10 stacking and that sintering prepares with stacking the formation with sintering of ceramic substrate.
Described ceramic sintered bodies 10 can replacing stacking preparation the by a plurality of dielectric layers 1 and interior electrode layer 21 and 22.
Next, described the first outer electrode 31a and 32a can be formed on the outer surface of described ceramic sintered bodies 10.
Described the first outer electrode 31a and 32a can be by at least a formation the in copper (Cu), nickel (Ni), silver (Ag) and silver-palladium (Ag-Pd) alloy, but are not limited to this.
Described the first outer electrode 31a and 32a can form by using and fire conductive paste, described conductive paste is to prepare by adding glass dust (glass frit) at least a powder in the group of selecting free copper (Cu), nickel (Ni), silver (Ag) and silver-palladium (Ag-Pd) alloy composition, but is not limited to this.
The application process of described conductive paste is not particularly limited.For example can use immersion process.
According to the embodiment of the present invention, contain the described second outer electrode 31b of at least a conducting metal and 32b and can be formed on described the first outer electrode 31a and 32a upper (S3).
The conducting metal that contains in described the second outer electrode 31b and 32b can be at least a in copper (Cu) and nickel (Ni), but is not limited to this.
The formation of described the second outer electrode 31b and 32b can be undertaken by electro-plating method.
Because described the second outer electrode 31b and 32b form on described the first outer electrode 31a and 32a by described electro-plating method, even the solder(ing) paste that contains at least a metal by application as described metal coating 31c and 32c was formed into described the second outer electrode 31b and 32b when upper, can prevent the leaching of described the first outer electrode 31a and 32a, this will be described below.
The reliability of multilayer ceramic capacitor according to the embodiment of the present invention can be improved by preventing the leaching phenomenon.
Next, described metal coating 31c and 32c can contain the solder(ing) paste of at least a metal to described the second outer electrode 31b and upper form (S4) of 32b by application.
Can use any metal, be not particularly limited, as long as this metal can be as the metal coating 31c and the 32c that are formed on described the second outer electrode 31b and 32b, in order to described laminated ceramic electronic component is easy to be installed in substrate.For example, described metal can be tin (Sn).
In addition, the described solder(ing) paste that contains at least a metal can further contain nickel (Ni).
According to the manufacture method of the laminated ceramic electronic component of this execution mode of the present invention, when forming described metal coating 31c and 32c on described the second outer electrode 31b and 32b, do not use electro-plating method.
The method that forms described metal coating 31c and 32c on described the second outer electrode 31b and 32b is not particularly limited.For example described metal coating 31c and 32c can form by the second outer electrode 31b and 32b being immersed in the described solder(ing) paste that contains at least a metal.
Or rather, dipping method can be fixed on fixture (jig) by having the described ceramic sintered bodies 10 that the second outer electrode 31b and 32b form on it, and fixture is immersed in solder(ing) paste carries out.
When described electro-plating method was used as the method that forms described metal coating 31c and 32c on described the second outer electrode 31b and 32b, due to the thinness of outer electrode, outer electrode was fine and close not, and electroplate liquid may infiltrate the part of outer electrode.
Because described electroplate liquid infiltrates in outer electrode, deteriorated (deterioration) occurs in the reaction of electroplate liquid and internal electrode, the reliability of described laminated ceramic electronic component will reduce greatly.
In addition, in the situation that electroplate liquid infiltrates outer electrode or surrounds the weak part of ceramic post sintering when carrying out, due to the caused pressure of the hydrogen that produces in electroplating process, ceramic sintered bodies also the crack may occur when electroplating.
According to the embodiment of the present invention, for solving described problem, described metal coating 31c and 32c form by outer electrode 31b and 32b being immersed in the described solder(ing) paste that contains at least a metal, replace forming on the second outer electrode 31b and 32b by electro-plating method metal coating 31c and 32c.
Or rather, according to the embodiment of the present invention, even when the attenuation that significantly descends of the thickness of outer electrode, when described metal coating 31c and 32c externally form on electrode by dipping method, can prevent that like this metal penetration is to internal electrode.
Furtherly, because do not use electro-plating method, may not can be occured by the caused deteriorated problem of the reaction of molten metal and internal electrode.
Furtherly, according to the embodiment of the present invention, cause the crack occurring in ceramic sintered bodies 10 because can not produce the hydrogen of enough capacity, so the reliability of multi-layer ceramics sintered body can be improved greatly.
In addition, according to the embodiment of the present invention, the the second outer electrode 31b and the 32b that form by electro-plating method are present between the first outer electrode 31a and 32a and metal coating 31c and 32c, to prevent the leaching phenomenon occuring when metal coating 31c and 32c and the first outer electrode 31a and the 32a reaction, therefore can realize having the multilayer ceramic capacitor of good reliability.
In Fig. 3, outer electrode 31 and 32 comprises the first outer electrode 31a and 32a, the second outer electrode 31b and 32b, and metal coating 31c and the 32c that may form, but the present invention is not limited to this.
Fig. 2 is the flow chart that shows according to another implementation of the invention the laminated ceramic electronic component manufacture method.
Fig. 5 is according to another implementation of the invention along the cutaway view of the A-A ' line in Fig. 3.
Referring to Fig. 2 and Fig. 5, the manufacture method of the laminated ceramic electronic component of another execution mode can comprise according to the present invention: preparation sheet shape ceramic sintered bodies 10(S11); Form the first outer electrode 31a ' and 32a ' (S12) at the outer surface of ceramic sintered bodies 10; Form the second outer electrode 31b ' contain at least a conducting metal and 32b ' (S13) on the first outer electrode 31a ' and 32a '; Form coating 31c ', 32c ', 31d ' and 32d ' (S14) on the second outer electrode 31b ' and 32b '.
In the manufacture method of the laminated ceramic electronic component of another execution mode according to the present invention is described, compare the explanation of repetition with the manufacture method of the laminated ceramic electronic component of the execution mode previous according to the present invention and will omit at this.
In the process of formation coating 31c ', 32c ', 31d ' and 32d ' (S14), can form successively nickel (Ni) layer 31c ' and 32c ' and tin (Sn) layer 31d ' and 32d ' by electro-plating method on the second outer electrode 31b ' and 32b '.
When externally forming nickel (Ni) layer and tin (Sn) layer on electrode by electro-plating method, due to the thinness of outer electrode, outer electrode is densification not, and electroplate liquid may infiltrate the part of outer electrode.
Because electroplate liquid infiltrates in outer electrode, occur deterioratedly in the reaction of electroplate liquid and internal electrode, the reliability of described laminated ceramic electronic component will reduce greatly.
In addition, in the situation that electroplate liquid infiltrates outer electrode or surrounds the weak part of ceramic post sintering when carrying out, due to the caused pressure of the hydrogen that produces in electroplating process, ceramic sintered bodies also the crack may occur when electro-plating method.
Yet according to this execution mode of the present invention, nickel (Ni) layer 31c ' and 32c ' and tin (Sn) layer 31d ' and 32d ' form on the second outer electrode 31b ' and 32b ' by electro-plating method, and therefore, electroplate liquid can not infiltrate outer electrode.
Exactly, the the second outer electrode 31b ' and the 32b ' that form by electro-plating method are present between the first outer electrode 31a ' and 32a ' and nickel (Ni) layer and tin (Sn) layer 31c ', 32c ', 31d ' and 32d ', therefore, the second outer electrode 31b ' and 32b ' can be used as the barrier of opposing electroplate liquid.
Therefore, because prevent that electroplate liquid from infiltrating in the first outer electrode 31a ' and 32a ', so can produce the laminated ceramic electronic component with good reliability.
In addition, the second outer electrode 31b ' and 32b ' are as barrier, and the caused pressure of hydrogen that produces in the time of can preventing like this due to plating causes ceramic sintered bodies the crack to occur.
Ceramic sintered bodies 10 is stacked on by a plurality of dielectric layers 1 and wherein then carries out sintering step and obtain.Adjacent dielectric layer 1 is connected so that border therebetween may be not easy to be identified.
Ceramic dielectric layers 1 can be comprised of the ceramic material with high-k, but is not limited to this.For example, can use barium titanate (BaTiO
3) sill (barium titanate-based material), plumbous composite perofskite sill (lead composite perovskite-based material), strontium titanates (SrTiO
3) sill (strontium titanate-based material) etc.
The paired internal electrode 21 and 22 that will have an opposed polarity is arranged to therefore by dielectric layer 1, paired internal electrode 21 and 22 is isolated from each other along the stacking direction of dielectric layer 1 toward each other.
One end of single internal electrode alternately is exposed to the two ends of ceramic sintered bodies 10.
Being exposed to the internal electrode 21 of ceramic sintered bodies 10 ends and 22 end is electrically connected to the first outer electrode 31a ' and 32a '.
Hereinafter, each step of the manufacture method of the multilayer ceramic capacitor of another execution mode is described in detail according to the present invention, but the present invention is not limited to this.
At first, preparation multi-layered ceramic substrate.
Described ceramic substrate generates slurry by hybrid ceramic powder, binding agent and solvent, and allows described slurry to form by the sheet shape that knife coating (doctor blade method) formation has a few μ m thickness.
Further, internal electrode pattern (pattern) forms on the surface of ceramic substrate by using internal electrode cream.
Described internal electrode pattern can be passed through silk screen print method (screen printing method) and form.
Described internal electrode cream can be formed by the powder that nickel (Ni) or nickel (Ni) alloy form by disperse (dispersing) in organic binder bond and organic solvent.
Any organic binder bond well known by persons skilled in the art can use, but is not limited to this.For example, binding agents such as cellulose base resin, epoxy resin, aryl resin (aryl resin), acrylic resin, phenolic resins, unsaturated polyester resin, polycarbonate resin, polyamide, polyimide resin, alkyd resins, abietic resin can use.
In addition, any organic solvent well known by persons skilled in the art can use, but is not limited to this.For example, DEGMBE (butyl carbitol), butyl carbitol acetate (butyl carbitol acetate), turpentine oil (turpentine), α-Te invite that in bar, (α-terebineol), ethylene glycol monoethyl ether (ethyl cellosove), butyl phthalate (butyl phthalate) equal solvent can use.
Next, stacking and compression has internal electrode and forms ceramic substrate on it, so as will this stacking ceramic substrate and internal electrode be compressed together each other.
By this way, produce ceramic substrate and internal electrode cream and replace stacking ceramic storehouse (stack).
Next, described ceramic storehouse is cut into the zone of corresponding each capacitor.
The two ends that are exposed to ceramic storehouse that when in this case, carrying out described cutting technique, one end of permission the first and second outer electrode patterns replaces.
After this, the storehouse of cutting is for example made ceramic sintered bodies in about 1200 ℃ of roastings.
Described ceramic sintered bodies carries out surface finish in containing the bucket of water and polishing medium.
Described surface finish program can be carried out in the manufacture process of ceramic storehouse.
Next, can form the first outer electrode, described the first outer electrode is electrically connected to the internal electrode of the endmost surface that is exposed to ceramic sintered bodies.
The method of described formation outer electrode is not particularly limited, and can use conventional external electrode forming method.
Next, the second outer electrode can be formed on the first outer electrode by electro-plating method.
Described the second outer electrode can be used as the barrier of opposing electroplate liquid, and described the second outer electrode can contain at least a in copper (Cu) and nickel (Ni), is not limited to this.
Next, when being installed to multilayer ceramic capacitor in substrate, nickel (Ni) layer and tin (Sn) layer can be formed on the second outer electrode so that convenient the installation by electro-plating method.
In the manufacture method of according to the embodiment of the present invention laminated ceramic electronic component, even metal coating does not use electro-plating method to be formed on outer electrode or or nickel (Ni) layer and tin (Sn) layer be formed on outer electrode by electro-plating method, the second outer electrode that forms under metal coating or coating by electro-plating method can be as barrier, thereby realizes having the laminated ceramic electronic component of good reliability.
As mentioned above, the manufacture method of laminated ceramic electronic component according to the embodiment of the present invention can prevent the infiltration of electroplate liquid or the leaching of the outer electrode that formed by copper (Cu), described copper is formed by the copper on outer electrode (Cu) or nickel (Ni) coating, thereby can produce the laminated ceramic electronic component with good reliability.
Although illustrated and described the present invention in conjunction with execution mode, it will be appreciated by those skilled in the art that the various modifications and variations of the scope and spirit that do not depart from the claim that the present invention attaches all are fine.
Claims (16)
1. the manufacture method of a laminated ceramic electronic component, the method comprises:
Preparation sheet shape ceramic sintered bodies;
Outer surface at described ceramic sintered bodies forms the first outer electrode;
Form the second outer electrode that contains at least a conducting metal on described the first outer electrode; And
The solder(ing) paste that contains at least a metal by use forms metal coating to described the second outer electrode.
2. method according to claim 1, wherein, described the first outer electrode contains and selects at least a in the group that free copper, nickel, silver and silver-palladium alloy form.
3. method according to claim 1, wherein, the described at least a conducting metal that contains in described the second outer electrode comprises and selects at least a in the group that free copper and mickel forms.
4. method according to claim 1, wherein, the formation of described the second outer electrode is undertaken by electro-plating method.
5. method according to claim 1, wherein, described solder(ing) paste contains tin.
6. method according to claim 1, wherein, the formation of described metal coating is to be undertaken by described the second outer electrode is immersed in the described solder(ing) paste that contains described at least a metal.
7. method according to claim 1, wherein, described ceramic sintered bodies is to prepare by replacing of a plurality of dielectric layers and internal electrode is stacking.
8. method according to claim 7, wherein, be electrically connected to described outer electrode with described internal electrode.
9. the manufacture method of a laminated ceramic electronic component, the method comprises:
Preparation sheet shape ceramic sintered bodies;
Outer surface at described ceramic sintered bodies forms the first outer electrode;
Form the second outer electrode that contains at least a conducting metal on described the first outer electrode; And
Form coating on described the second outer electrode.
10. method according to claim 9, wherein, described the first outer electrode contains and selects at least a in the group that free copper, nickel, silver and silver-palladium alloy form.
11. method according to claim 9, wherein, the described at least a conducting metal that contains in described the second outer electrode comprises and selects at least a in the group that free copper and mickel forms.
12. method according to claim 9, wherein, the formation of described the second outer electrode is undertaken by electro-plating method.
13. method according to claim 9, wherein, the formation of described coating comprises and forms successively nickel dam and tin layer.
14. method according to claim 9, wherein, the formation of described coating is undertaken by electro-plating method.
15. method according to claim 9, wherein, described ceramic sintered bodies is to prepare by replacing of a plurality of dielectric layers and internal electrode is stacking.
16. method according to claim 15 wherein, is electrically connected to described outer electrode with described internal electrode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110114229A KR20130049296A (en) | 2011-11-04 | 2011-11-04 | Method for manufacturing multi-layer ceramic electronic parts |
| KR10-2011-0114229 | 2011-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103093959A true CN103093959A (en) | 2013-05-08 |
Family
ID=48206421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102112784A Pending CN103093959A (en) | 2011-11-04 | 2012-06-21 | Method for manufacturing multi-layer ceramic electronic parts |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013098533A (en) |
| KR (1) | KR20130049296A (en) |
| CN (1) | CN103093959A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104616889A (en) * | 2013-11-04 | 2015-05-13 | 三星电机株式会社 | Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part |
| CN108695067A (en) * | 2017-04-04 | 2018-10-23 | 三星电机株式会社 | Multi-layer capacitor and the method for manufacturing multi-layer capacitor |
| CN112185704A (en) * | 2019-07-04 | 2021-01-05 | 三星电机株式会社 | Multilayer ceramic capacitor |
| CN115172051A (en) * | 2018-09-06 | 2022-10-11 | 三星电机株式会社 | Multilayer ceramic capacitor |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101973442B1 (en) * | 2017-07-11 | 2019-04-29 | 삼성전기주식회사 | Multilayer ceramic capacitor and method for fabricating the same |
| US11011313B2 (en) | 2017-07-11 | 2021-05-18 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004241661A (en) * | 2003-02-06 | 2004-08-26 | Murata Mfg Co Ltd | Electronic component, and manufacturing method thereof |
| CN102115329A (en) * | 2009-12-31 | 2011-07-06 | 三星电机株式会社 | Dielectric ceramic composition and multilayer ceramic capacitor having the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09312236A (en) * | 1996-05-23 | 1997-12-02 | Matsushita Electric Ind Co Ltd | Manufacture of electronic component |
| JP2006128385A (en) * | 2004-10-28 | 2006-05-18 | Kyocera Corp | Ceramic electronic componentt and stacked ceramic capacitor |
-
2011
- 2011-11-04 KR KR1020110114229A patent/KR20130049296A/en not_active Application Discontinuation
-
2012
- 2012-06-19 JP JP2012137559A patent/JP2013098533A/en active Pending
- 2012-06-21 CN CN2012102112784A patent/CN103093959A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004241661A (en) * | 2003-02-06 | 2004-08-26 | Murata Mfg Co Ltd | Electronic component, and manufacturing method thereof |
| CN102115329A (en) * | 2009-12-31 | 2011-07-06 | 三星电机株式会社 | Dielectric ceramic composition and multilayer ceramic capacitor having the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104616889A (en) * | 2013-11-04 | 2015-05-13 | 三星电机株式会社 | Embedded multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part |
| CN104616889B (en) * | 2013-11-04 | 2018-02-02 | 三星电机株式会社 | The multilayer ceramic electronic component and printed circuit board (PCB) being embedded in plate |
| CN108695067A (en) * | 2017-04-04 | 2018-10-23 | 三星电机株式会社 | Multi-layer capacitor and the method for manufacturing multi-layer capacitor |
| CN115172051A (en) * | 2018-09-06 | 2022-10-11 | 三星电机株式会社 | Multilayer ceramic capacitor |
| CN112185704A (en) * | 2019-07-04 | 2021-01-05 | 三星电机株式会社 | Multilayer ceramic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013098533A (en) | 2013-05-20 |
| KR20130049296A (en) | 2013-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101079546B1 (en) | Multilayer ceramic capacitor | |
| CN103325567B (en) | Laminated ceramic electronic component and preparation method thereof | |
| US8390983B2 (en) | Multilayer ceramic capacitor | |
| KR101444536B1 (en) | Multi-Layered Ceramic Electronic Component And Manufacturing Method Thereof | |
| KR102139753B1 (en) | Ceramic electronic component and method of manufacturing the same | |
| US8345405B2 (en) | Multilayer ceramic capacitor | |
| US8310805B2 (en) | Multilayer ceramic electronic component including plating material of external terminal electrode disposed in voids of inner conductor and method for manufacturing the same | |
| CN100511507C (en) | Ceramic electronic component and manufacturing method thereof | |
| CN110993337B (en) | Multilayer ceramic electronic component | |
| CN101473387B (en) | Multilayered ceramic electronic part | |
| JP7188843B2 (en) | capacitor parts | |
| JP5301524B2 (en) | Multilayer ceramic capacitor and manufacturing method thereof | |
| CN103680947A (en) | Multilayer ceramic capacitor and method of manufacturing same | |
| CN103093959A (en) | Method for manufacturing multi-layer ceramic electronic parts | |
| JP5156805B2 (en) | Multilayer ceramic capacitor | |
| KR101751058B1 (en) | The multilayer ceramic capacitor and a fabricating method thereof | |
| US20130155573A1 (en) | Electronic component and manufacturing method thereof | |
| KR20140032212A (en) | Conductive resin composition and multilayer ceramic components having the same | |
| CN114464459A (en) | Ceramic electronic component | |
| JPWO2019059017A1 (en) | Ceramic substrate manufacturing method, ceramic substrate, and module | |
| CN114694963A (en) | Multilayer electronic component | |
| CN113764183A (en) | Electronic component and method of manufacturing the same | |
| US20140022693A1 (en) | Ceramic electronic component and method of manufacturing the same | |
| KR20230076443A (en) | Mutilayered electronic component | |
| CN114678215A (en) | Multilayer electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130508 |