CN104302110A - Method for producing keyboard circuit board - Google Patents
Method for producing keyboard circuit board Download PDFInfo
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- CN104302110A CN104302110A CN201410539587.3A CN201410539587A CN104302110A CN 104302110 A CN104302110 A CN 104302110A CN 201410539587 A CN201410539587 A CN 201410539587A CN 104302110 A CN104302110 A CN 104302110A
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Abstract
The invention discloses a method for producing a keyboard circuit board. The method includes the steps of (A) carrying out rough shape cutting; (B) forming inner-layer patterns; (C) carrying out inner-layer AOI; (D) carrying out oxidation/board pressing; (E) drilling holes; (F) carrying out copper electroless plating/total-board electroplating; (G) carrying out outer-layer dry filming; (H) carrying out pattern electroplating/outer-layer etching; (I) carrying out outer-layer AOI; (J) carrying out solder mask ink screen printing; (K) carrying out double-faced metal immersion; (L) carrying out second DF; (M) carrying out vertical single-faced electrogilding; (N) removing film; (O) processing the shape; (P) carrying out an electrical test; (Q) carrying out final inspection; (R) carrying out packaging; (S) carrying out delivery. According to the method for producing the keyboard circuit board, as the size of a circuit is increased during outer-layer pattern production filming, and compensating design is carried out on SMD PADs, the practical line width requirement is met, the distances between lines and the SMD PADs are increased, and the problem that solder mask bridges are located on the SMD PADs in a deviation mode is solved; in addition, two novel solder mask ink screen printing methods are adopted so that the gradient of the thickness of ink at the positions of the solder mask bridges relative to the SMD PADs can be reduced, and throwing dropping, caused by lateral erosion, of the solder mask bridges is reduced, or the solder mask bridges are effectively prevented from dropping by solidifying the solder mask bridges again; the hole position tolerance is strictly controlled, and the thickness of metal at button positions of the keyboard circuit board is increased through vertical electrogilding.
Description
Technical field
The present invention relates to printed circuit board (PCB), especially a kind of production method of computor-keyboard circuit board.
Background technology
In present electronic technology field, circuit board is as one of key element in electronic product, be widely used in the important events such as communication, space flight, notebook computer, and electronic product is all towards lightening future development, inner components characteristics of compact layout, therefore the distance between SMD PAD is very little, often occurs the problem of PAD in welding resistance bridge off normal in board production process.
In addition, there is welding resistance bridge (region between two SMD PAD is on welding resistance bridge) and come off and the problem of electricity gold thickness low LCL in the client of the manufacturer circuit board that often responds, the cause of this problem also need be analyzed from the technological process of production of available circuit plate, the existing technological process of production is: sawing sheet → inner figure → internal layer AOI → pressing plate → boring → heavy copper/electric plating of whole board → outer-layer film drying → graphic plating/skin etching → outer AOI → welding resistance oil (1 time)---turmeric---and 2nd DF(plating resist gold dry film)---level is electric golden---move back film → external form processing → electrical testing → inspection → packaging → shipment at end, in this technique, welding resistance oil is disposable printing, welding resistance bridge location is put to be of uniform thickness greatly with other position solder mask of circuit board, and the ink thickness that welding resistance bridge location is put is large relative to the gradient of SMD PAD, convex, the welding resistance bridge of this structure just easy got rid of because of lateral erosion or touched drop, finger-board is sternly manufactured with challenge to flow process to hole site tolerance, and during electrogilding, the too low finger-board that do not reach of the employing level golden production line thickness of electricity, by the thick requirement of the gold of key mapping, causes by key mapping reaction ineffective.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of production method of computor-keyboard circuit board.
The technical solution used in the present invention is:
A production method for keyboard pcb, comprises the following steps: A, sawing sheet; B, inner figure; C, internal layer AOI; D, brown/pressing plate; E, boring; F, heavy copper/electric plating of whole board; G, outer-layer film drying, produce circuit on the film at outer graphics and increase, and SMP PAD near line place uncompensation, and the monolateral compensation in other limit; H, graphic plating/skin etching; I, outer AOI; J, silk-screen welding resistance oil; K, turmeric (two-sided); L, 2nd DF(plating resist gold dry film); M, vertical electricity gold (one side); N, move back film; O, external form are processed; P, electrical testing; Q, eventually inspection; R, packaging; S, shipment.
First embodiment of described step J is, silk-screen welding resistance oil content is twice, and first time will be produced film welding resistance bridge Position Design one-tenth and be kept off oily PAD, thus welding resistance bridge location is put and do not printed off; Welding resistance bridge prints off by second time silk-screen, ensure other position welding resistance oil thickness like this, and welding resistance bridge location puts thickness relative thin, not easily gets rid of.
Second embodiment of described step J is comprise: J1, silk-screen welding resistance oil; J2, normal exposure first welding resistance bridge; J3, returns exposure second welding resistance bridge, and the second welding resistance bridge location is on the first welding resistance bridge and size is less than the first welding resistance bridge; J4, development; J5, return exposure.
Beneficial effect of the present invention:
The production method of circuit board of the present invention produces film wire sizes by increasing outer graphics, and Compensation Design is done to SMT PAD, thus reach actual linewidth requirement, increase line to the distance of SMD PAD, be beneficial to the making of circuit and improve PAD problem in welding resistance bridge off normal; In addition, adopt two kinds of silk screen printing welding resistance oil methods, to reduce the gradient of the relative SMD PAD of ink thickness that welding resistance bridge location is put, reduce lateral erosion to the impact of welding resistance bridge, or by again solidifying welding resistance bridge, improve welding resistance bridge silk-screen ability, effectively preventing welding resistance bridge from coming off; Strict control hole position of related features, improves Aligning degree and accuracy that finger-board presses key mapping; In addition, vertical electricity gold is adopted to thicken by key mapping gold thickness during electrogilding frequently flexible in touching with what reach by key mapping.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.
Fig. 1 is the production method flow chart of a kind of keyboard pcb of the present invention.
Embodiment
As shown in Figure 1, be the production method of a kind of keyboard pcb of the present invention, comprise the following steps:
A, sawing sheet;
B, inner figure;
C, internal layer AOI(automatic optics inspection);
D, brown/pressing plate;
For reaching thickness of slab 0.35mm requirement, control from following 3 flow processs
After D1, pressing plate, thickness is no more than 10.1Mil, adjustment pressing structure, and row's plate P sheet 106H*1 changes 106*1 structure into;
D2, plating FA control electroplating surface copper thickness 0.9-1.0MIL;
D3, large copper face green oil thickness control (one side) with 1.2+/-0.4Mil.
E, boring; This finger-board has super short groove 2.48x2.08 +/-0.05mm, and hole site tolerance sternly requires +/-1.5mil.Brand-new boring need be used during boring to chew, 2 pieces/folded, the dynamic </=0.5MIL of main shaft, hole is taken out T to the hole of copper 6.0mil and is bored slowly, and have CPK to control the hole bouncing of drilling tool 300MIL of diameter, control bottom plate depth is at 0.4-0.8mm;
F, heavy copper/electric plating of whole board; This finger-board is thin, need use thin plate frame during plate electricity;
G, outer-layer film drying, because SMD PAD spacing is little, be about 9.8mil, and folder 3.9 ± 0.8mil line, SMD PAD is to the minimum only 2.95mil of line.Probing into through applicant, particular design is carried out to the production film, namely produce film circuit at outer graphics and increase 0.2mil, SMP PAD near line place uncompensation, the monolateral compensation 1.0mil in other limit, thus increase line to the distance of SMD PAD, be beneficial to the making of circuit, improve PAD problem in welding resistance bridge off normal;
H, graphic plating/skin etching;
I, outer AOI;
J, silk-screen welding resistance oil; This step comprises two embodiments in the technical program, wherein:
First embodiment is, silk-screen welding resistance oil content is twice, and first time will be produced film welding resistance bridge Position Design one-tenth and be kept off oily PAD, thus welding resistance bridge location is put and do not printed off; Welding resistance bridge prints off by second time silk-screen, THICKNESS CONTROL 25-30UM; Exposure energy controls 9 lattice (upper limit). the method makes other position solder mask thickness of circuit board reach requirement, and welding resistance bridge location put only print once, relatively thin, welding resistance bridge can be solved and get rid of problem.
Second embodiment is, the minimum 5.9+/-1mil of SMT PAD spacing, and is designed with welding resistance bridge 3.5mil, and silk-screen welding resistance oil J comprises: J1, silk-screen welding resistance oil, adopts 36T twine print once, ink viscosity 160 ~ 170dpa.s; J2, normal exposure first welding resistance bridge, the first welding resistance bridge design 3.5mil, exposure energy 8 ~ 9 lattice; J3, returns exposure film: 2.0mil second welding resistance bridge, and only for the second welding resistance bridge exposure, other position is done and is in the light, exposure energy 8 ~ 9 lattice; J4, development, developer pressure 1.5kg, bridge location is downward, speed 2.5m/min; J5, return exposure, exposure energy 10 lattice.
K, turmeric; Two-sided turmeric (C/S face, S/S face), design in turmeric operation thick for the nickel 200u accomplishing customer requirement " (min); gold-plated process only electroplates the 50u " (min) of hard gold to customer requirement, this plate is thin, produce with the false plate of two boards therebetween, produce to be placed on false plate and fix with the green glue of ET-850;
L, 2nd DF(S/S face plating resist gold dry film), sky exposes to the sun, and does not need one side (S/S face) sky of electricity gold to expose to the sun, i.e. the whole plate exposure in S/S face, and another side (C/S face) needs electric golden normal exposure, and namely film figure has region of being in the light;
M, vertical electricity gold (C/S face electrogilding), extension plate, in the nickel cylinder time, by researcher's test plate (panel), adopts vertical electricity gold to thicken by key mapping gold thickness frequently flexible in touching with what reach by key mapping during electrogilding;
N, move back film;
O, external form are processed;
P, electrical testing, minimum SMD PAD wide 5.9mil, E-T cannot test according to normal capacity, need to use conducting resinl, and middle inspection must cross AOI;
Q, eventually inspection;
R, packaging;
S, shipment.
As mentioned above, the production method of circuit board of the present invention produces the wire sizes of the film by increasing outer graphics, and does Compensation Design to SMT PAD, thus increases line to the distance of SMD PAD, is beneficial to the making of circuit, improves PAD problem in welding resistance bridge off normal; In addition, adopt two kinds of silk screen printing welding resistance oil methods, to reduce gradient or the solidification welding resistance bridge of the relative SMD PAD of ink thickness that welding resistance bridge location is put, improve welding resistance bridge silk-screen ability, effectively prevent welding resistance bridge from coming off; Vertical electricity gold need be adopted during electrogilding to thicken by key mapping gold thickness to reach frequently flexible in touching by key mapping of finger-board.
The foregoing is only preferred embodiments of the present invention, the present invention is not limited to above-mentioned execution mode, as long as the technical scheme realizing the object of the invention with basic same approach all belongs within protection scope of the present invention.
Claims (3)
1. a production method for keyboard pcb, is characterized in that comprising the following steps: A, sawing sheet; B, inner figure; C, internal layer AOI; D, brown/pressing plate; E, boring; F, heavy copper/electric plating of whole board; G, outer-layer film drying, produce circuit on the film at outer graphics and increase, and SMP PAD near line place uncompensation, and the monolateral compensation in other limit; H, graphic plating/skin etching; I, outer AOI; J, silk-screen welding resistance oil; K, turmeric (two-sided); L, 2nd DF(plating resist gold dry film); M, vertical electricity gold (one side); N, move back film; O, external form are processed; P, electrical testing; Q, eventually inspection; R, packaging; S, shipment.
2. the production method of a kind of keyboard pcb according to claim 1, is characterized in that: in described step J, silk-screen welding resistance oil content is twice, and first time will be produced film welding resistance bridge Position Design one-tenth and be kept off oily PAD, thus welding resistance bridge location is put and do not printed off; Welding resistance bridge prints off by second time silk-screen.
3. the production method of a kind of keyboard pcb according to claim 1, is characterized in that: described step J comprises: J1, silk-screen welding resistance oil; J2, normal exposure first welding resistance bridge; J3, returns exposure second welding resistance bridge, and the second welding resistance bridge location is on the first welding resistance bridge and size is less than the first welding resistance bridge; J4, development; J5, return exposure.
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| CN201410539587.3A CN104302110B (en) | 2014-10-13 | 2014-10-13 | A kind of production method of keyboard pcb |
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| CN201410539587.3A CN104302110B (en) | 2014-10-13 | 2014-10-13 | A kind of production method of keyboard pcb |
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| CN104302110B CN104302110B (en) | 2017-07-04 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188281A (en) * | 2015-08-28 | 2015-12-23 | 涟水县苏杭科技有限公司 | Manufacturing method for dummy double-sided PCB |
| CN105338755A (en) * | 2015-11-23 | 2016-02-17 | 深圳崇达多层线路板有限公司 | Fabrication method of circuit board solder mask layer |
| CN105430933A (en) * | 2015-12-22 | 2016-03-23 | 江苏博敏电子有限公司 | Method for treating defects of half solder mask bridge in solder mask production process |
| CN106653571A (en) * | 2016-12-22 | 2017-05-10 | 重庆淳祥电子科技有限公司 | Keyboard circuit production technology |
| CN107889361A (en) * | 2017-11-15 | 2018-04-06 | 重庆市志益鑫电子科技有限公司 | Wiring board processing method |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN109890145A (en) * | 2019-03-14 | 2019-06-14 | 胜宏科技（惠州）股份有限公司 | A kind of keypad gold plating method |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN113993285A (en) * | 2021-11-02 | 2022-01-28 | 恩达电路(深圳)有限公司 | Production method of low-resistance test coil circuit board |
| CN114900963A (en) * | 2022-05-11 | 2022-08-12 | 格力电器（武汉）有限公司 | Production method and production device of remote controller PCB and storage medium |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188281A (en) * | 2015-08-28 | 2015-12-23 | 涟水县苏杭科技有限公司 | Manufacturing method for dummy double-sided PCB |
| CN105338755A (en) * | 2015-11-23 | 2016-02-17 | 深圳崇达多层线路板有限公司 | Fabrication method of circuit board solder mask layer |
| CN105338755B (en) * | 2015-11-23 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of production method of wiring board solder mask |
| CN105430933A (en) * | 2015-12-22 | 2016-03-23 | 江苏博敏电子有限公司 | Method for treating defects of half solder mask bridge in solder mask production process |
| CN106653571B (en) * | 2016-12-22 | 2019-04-02 | 重庆淳祥电子科技有限公司 | Keyboard circuit production technology |
| CN106653571A (en) * | 2016-12-22 | 2017-05-10 | 重庆淳祥电子科技有限公司 | Keyboard circuit production technology |
| CN107889361A (en) * | 2017-11-15 | 2018-04-06 | 重庆市志益鑫电子科技有限公司 | Wiring board processing method |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN109890145A (en) * | 2019-03-14 | 2019-06-14 | 胜宏科技（惠州）股份有限公司 | A kind of keypad gold plating method |
| CN109890145B (en) * | 2019-03-14 | 2021-11-23 | 胜宏科技（惠州）股份有限公司 | Key plate gold plating method |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN113993285A (en) * | 2021-11-02 | 2022-01-28 | 恩达电路(深圳)有限公司 | Production method of low-resistance test coil circuit board |
| CN114900963A (en) * | 2022-05-11 | 2022-08-12 | 格力电器（武汉）有限公司 | Production method and production device of remote controller PCB and storage medium |
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