CN101835346B - Nickel-gold electroplating process of PCB - Google Patents
Nickel-gold electroplating process of PCB Download PDFInfo
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- CN101835346B CN101835346B CN 201010160132 CN201010160132A CN101835346B CN 101835346 B CN101835346 B CN 101835346B CN 201010160132 CN201010160132 CN 201010160132 CN 201010160132 A CN201010160132 A CN 201010160132A CN 101835346 B CN101835346 B CN 101835346B
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Abstract
The invention relates to a nickel-gold electroplating process of a PCB, which comprises the following steps of: (1) preparing a PCB substrate; (2) making an outer circuit, an electric brush part and an electroplating connecting line of the PCB; (3) making a photosensitive soldering-resistant layer; (4) making a non-nickel-gold electroplating region protection layer; (5) electroplating nickel and gold; (6) removing the non-nickel-gold electroplating region protection layer; (7) removing the electroplating connecting line; (8) repairing an electroplating connecting line region; and (9) removing a process edge. In the nickel-gold electroplating process, the electric brush part on the process edge is communicated with a non-marginal to-be-electroplated region by the designed electroplating connecting line to electroplate a non-marginal region on the PCB, the electroplating connecting line is removed after nickel-gold electroplating, and the electroplating connecting line region is repaired to avoid the problem of electroplating connecting line residue and ensure the reliability of the PCB. Meanwhile, the non-marginal to-be-electroplated region and the electroplating connecting line can be freely selected according to actual needs. Accordingly, the nickel-gold electroplating process has high practicability.
Description
Technical field
The present invention relates to a kind of manufacture craft of printed circuit board, more particularly, relate to a kind of nickel-gold electroplating process of printed circuit board.
Background technology
Printed circuit board, i.e. pcb board, the abbreviation of English (Printed Circuit Board).For avoiding the generation of problems such as printed circuit board oxidation before the encapsulation components and parts, pollution, need protect processing to the surface of printed circuit board, i.e. surface treatment.The surface treatment that printed circuit board is commonly used has technologies such as hot air leveling, immersion Ni/Au, chemistry silver, chemical tin, organic protective film, electronickelling gold.
In the surface treatment of printed circuit board, nickel-gold electroplating process is one of important surface treatment.The nickel-gold electroplating process of printed circuit board is to utilize the electrolytic cell principle; With the zone to be plated (being plating piece) of printed circuit board as negative electrode, at the electroplating surface nickel dam and the gold layer of printed circuit board, therefore; If will be at the surperficial enterprising electroplating nickel gold of printed circuit board; Then the gold-plated zone on the printed circuit board must be connected with electroplate lead wire, makes gold-plated zone and the negative electrode conducting of motor-generator set on the printed circuit board through electroplate lead wire, thereby realizes the electronickelling gold of printed circuit board.
When the zone of wanting electronickelling gold be whole printed circuit board surface, or when wanting the zone of electronickelling gold to be positioned at the surperficial edge of printed circuit board; Can be at the edge designs electroplate lead wire of printed circuit board, thus realize the whole plate electronickelling gold or the fringe region electronickelling gold of printed circuit board.But; If the zone of electronickelling gold is not the edge that is positioned at the printed circuit board surface; But be positioned at the surperficial non-fringe region of printed circuit board (being the interior zone on printed circuit board surface); Owing to want the zone of electronickelling gold to be positioned at the surperficial non-fringe region of printed circuit board, so conventional printed circuit board nickel-gold electroplating process can't design the required electroplate lead wire of electronickelling gold on the zone that want the electronickelling gold; Therefore, conventional printed circuit board nickel-gold electroplating process can't be realized the electronickelling gold of the non-fringe region of printed circuit board.
Summary of the invention
The technical problem that the present invention will solve provides a kind of nickel-gold electroplating process of printed circuit board, and this nickel-gold electroplating process can carry out the electronickelling gold to the non-fringe region on printed circuit board surface.
In order to solve the problems of the technologies described above, the technical scheme that the present invention adopts is following:
A kind of nickel-gold electroplating process of printed circuit board may further comprise the steps:
(1) prepare the PCB substrate: above-mentioned PCB substrate is individual layer PCB substrate or multi-layer PCB substrate, and above-mentioned PCB substrate is provided with encapsulation welding tray and electroplated nickel gold zone, and above-mentioned electroplated nickel gold zone is positioned at the non-fringe region of PCB substrate surface;
When preparing the PCB substrate, said multi-layer PCB substrate accomplishes by conventional printed circuit board flow process that internal layer circuit is made, different line layer pressing, holes then and through electroless copper, electro-coppering flow process, realizes the interlayer line conduction;
(2) make printed circuit board outer-layer circuit, brush position and plating line: the PCB substrate is divided into printed circuit board zone and technology limit; Pass through etching mode; In the printed circuit board zone, make printed circuit board outer-layer circuit (being conventional line); On the technology limit, make the brush position; On printed circuit board zone and technology limit, make and electroplate line, an end of above-mentioned plating line and the golden regional conducting of electroplated nickel, the other end of plating line and above-mentioned brush position (this brush position can with motor-generator set conducting) conducting;
The manufacture craft of said plating line is following: on printed circuit board zone and technology limit; Preestablish and electroplate the line zone; One end in above-mentioned plating line zone is positioned at electroplated nickel gold zone, electroplates the other end in line zone and the brush position on the technology limit and joins; Then; Covering the last layer protective layer on the printed circuit board outer-layer circuit, on the brush position and on the plating line zone; Then, the copper layer of unprotect layer region on the PCB substrate is etched away, last; With on the outer-layer circuit, on the brush position and electroplate the protective layer stripping on the line zone, thereby accomplish the making of electroplating line;
Be not etched owing to electroplate the copper layer in intersection region territory on the PCB substrate, so the copper layer of electroplating the line zone constitutes electroplates line; Be positioned at electroplated nickel gold zone owing to electroplate an end in line zone again; Electroplating the other end in line zone and the brush position on the technology limit joins; So, an end and the regional conducting of electroplated nickel gold of electroplating line, the other end and the position conducting of above-mentioned brush of electroplating line;
Said protective layer can form through pasting the dry film mode, and when moving back film, employing is moved back film liquid dry film is stripped;
Said protective layer also can form through the electrotinning mode, and promptly protective layer is the electrotinning layer, and when moving back film, employing is moved back the tin mode electrotinning layer is stripped;
(3) make photosensitive solder resist layer: at first; Printing one deck photosensitive solder resist layer on the printed circuit board zone of PCB substrate; Above-mentioned photosensitive solder resist layer is divided into exposure area and territory, non-exposed area, and territory, above-mentioned non-exposed area comprises electroplated nickel gold zone, encapsulation welding tray and plating line zone, and the zone of removing the territory, non-exposed area is the exposure area; That is to say that the zone of removing territories, non-exposed area such as electroplated nickel gold zone, encapsulation welding tray and plating line zone is the exposure area; Then, make public through the photosensitive solder resist layer of the film to the exposure area, the photosensitive solder resist layer in territories, non-exposed area such as electroplated nickel gold zone, encapsulation welding tray and plating line zone does not make public, also removes through visualization way;
When above-mentioned PCB substrate was the multi-layer PCB substrate, the plug-in unit installing hole of multi-layer PCB substrate belonged to the territory, non-exposed area, and when making public, the photosensitive solder resist layer on the plug-in unit installing hole does not make public, also removes through visualization way;
(4) make electroless nickel gold locality protection layer: after accomplishing the making of photosensitive solder resist layer, on above-mentioned electroplated nickel gold zone and the zone beyond the brush position, cover one deck dry film, thereby form one deck dry film protective layer in electroless nickel gold zone;
(5) electronickelling gold: the brush position on the PCB substrate is electrically connected with the brush of motor-generator set, realizes the conducting between " motor-generator set-brush-brush position-plating line-electronickelling gold zone ", then, the electronickelling gold is carried out in the gold of the electroplated nickel on PCB substrate zone;
(6) remove electroless nickel gold locality protection layer: after accomplishing the electronickelling gold, employing is moved back film liquid the dry film protective layer on the electroless nickel gold zone is removed;
(7) remove the plating line: on the PCB substrate of electroplating beyond the line zone, cover last layer dry film protective layer, remove electroplate lead wire through etching mode; Then, film liquid stripping dry film protective layer is moved back in employing;
(8) repair plating line zone:, make the photosensitive solder resist layer on the PCB substrate repair complete electroplating printing one deck photosensitive solder resist layer on the line zone;
(9) remove the technology limit: adopt gong machine or punch press that technology limit and top brush position thereof are removed, thereby accomplished the electronickelling gold of the non-fringe region in printed circuit board surface.
The present invention's beneficial effect against existing technologies is; Nickel-gold electroplating process of the present invention is electroplated line through design, makes the regional conducting of electroplated nickel gold at brush position and non-edge on the technology limit, thereby has realized that the electronickelling of non-fringe region is golden on the printed circuit board; And behind the electronickelling gold of accomplishing non-fringe region on the printed circuit board; To electroplate line and remove, and repair, thereby avoid electroplating the residual problem of line electroplating the line zone; Guaranteed the reliability of printed circuit board, also made the more good of printed circuit board outward appearance.Simultaneously, above-mentioned non-edge-plated nickel gold zone, plating line can freely be selected according to actual needs, and therefore, its feasibility of nickel-gold electroplating process of the present invention is high.
In addition; Nickel-gold electroplating process of the present invention has avoided all plated on circuit surface nickel gold of printed circuit board to handle; Only the non-fringe region that needs the electronickelling gold is carried out the processing of electronickelling gold, thereby effectively reduce the consumption of precious metal nickel, golden resource, reduced cost; And environmental protection more reaches the purpose of cleaner production.
Under the situation of no new equipment investment; Nickel-gold electroplating process of the present invention has been realized the electronickelling gold of non-fringe region on the printed circuit board; Therefore; Nickel-gold electroplating process vast market prospect of the present invention, nickel-gold electroplating process of the present invention are specially adapted to the electronickelling gold of the non-fringe region of the intensive printed circuit board of circuit.
Description of drawings
Fig. 1 is the flow chart of the preferred embodiment of the present invention 1;
Fig. 2 is the structural representation of PCB substrate in the preferred embodiment of the present invention 1;
Fig. 3 is the structural representation of PCB substrate when the plating line completes in the preferred embodiment of the present invention 1;
Fig. 4 is the structural representation of the preferred embodiment of the present invention 1 when electroplating;
Fig. 5 is that the preferred embodiment of the present invention 1 is at the structural representation of repairing after electroplating the line zone;
Fig. 6 is the structural representation of the preferred embodiment of the present invention 1 after removing the technology limit;
Fig. 7 is the structural representation of PCB substrate in the preferred embodiment of the present invention 2.
Embodiment
To shown in Figure 6, the nickel-gold electroplating process of printed circuit board in this preferred embodiment may further comprise the steps like Fig. 1:
(1) prepare PCB substrate 1: as shown in Figure 2, above-mentioned PCB substrate 1 is an individual layer PCB substrate, and above-mentioned PCB substrate 1 is provided with encapsulation welding tray 2 and electroplated nickel gold zone 3, and above-mentioned electroplated nickel gold zone 3 is positioned at the non-fringe region on PCB substrate 1 surface;
(2) make printed circuit board outer- layer circuit 4,5, brush position 6 and plating line 7: as shown in Figure 3, PCB substrate 1 is divided into printed circuit board zone 11 and technology limit 12, the line of demarcation on printed circuit board zone 11 and technology limit 12 is 13; Through etching mode, in printed circuit board zone 11, make printed circuit board outer- layer circuit 4,5, above-mentioned outer- layer circuit 4,5 is a conventional line, on technology limit 12, makes brush position 6; On printed circuit board zone 11 and technology limit 12, make and electroplate line 7, an end of above-mentioned plating line 7 and regional 3 conductings of electroplated nickel gold, the other end and 6 conductings of above-mentioned brush position of electroplating line 7;
The manufacture craft of above-mentioned plating line 7 is following: on printed circuit board zone 11 and technology limit 12; Preestablish and electroplate line zone 70; One end in above-mentioned plating line zone 70 is positioned at electroplated nickel gold zone 3, electroplates the other end in line zone 70 and the brush position 6 on the technology limit 12 and joins; Then; Covering the last layer protective layer on the printed circuit board outer- layer circuit 4,5, on the brush position 6 and on the plating line zone 70; Then, the copper layer of unprotect layer region on the PCB substrate 1 is etched away, last; With the protective layer stripping on the outer- layer circuit 4,5, on the brush position 6 and on the plating line regional 70, thereby accomplish the making of electroplating line 7; Above-mentioned protective layer can form through pasting the dry film mode, and when moving back film, employing is moved back film liquid dry film is stripped;
(3) make photosensitive solder resist layer: at first; Printing one deck photosensitive solder resist layer on the printed circuit board zone 11 of PCB substrate 1; Above-mentioned photosensitive solder resist layer is divided into exposure area and territory, non-exposed area, and territory, above-mentioned non-exposed area comprises electroplated nickel gold zone 3, encapsulation welding tray 2 and electroplates line zone 70; Then, make public through the photosensitive solder resist layer of the film to the exposure area, the photosensitive solder resist layer in territories, non-exposed area such as electroplated nickel gold zone 3, encapsulation welding tray 2 and plating line zone 70 does not make public, also removes through visualization way;
(4) make electroless nickel gold locality protection layer 8: after accomplishing the making of photosensitive solder resist layer; On above-mentioned electroplated nickel gold zone 3 and the zone beyond the brush position 6, cover one deck dry film protective layer 8; As shown in Figure 4, thus one deck dry film protective layer 8 formed in electroless nickel gold zone;
(5) electronickelling gold: as shown in Figure 4; Brush position 6 on the PCB substrate 1 is electrically connected with the brush 90 of motor-generator set 9; Realize the conducting between " motor-generator set 9-brush 90-brush position 6-electroplates line 7-electronickelling gold zone 3 "; Then, the electronickelling gold is carried out in the gold of the electroplated nickel on the PCB substrate 1 zone 3;
(6) remove electroless nickel gold locality protection layer 8: after accomplishing the electronickelling gold, employing is moved back film liquid the dry film protective layer 8 on the electroless nickel gold zone is removed;
(7) remove plating line 7: on the PCB substrate of electroplating beyond the line zone 70 1, cover the last layer dry film, through etching mode removal electroplate lead wire 7; Then, film liquid stripping dry film is moved back in employing;
(8) repair plating line zone 70: electroplating printing one deck photosensitive solder resist layer on the line zone 70, making the photosensitive solder resist layer reparation on the PCB substrate 1 complete, as shown in Figure 5;
(9) remove technology limit 12: adopt gong machine or punch press that technology limit 12 and top brush position 6 thereof are removed, as shown in Figure 6, thus the electronickelling of having accomplished the non-fringe region in printed circuit board surface is golden.
As shown in Figure 7; PCB substrate 1 is the multi-layer PCB substrate among the embodiment 2; Above-mentioned multi-layer PCB substrate before making printed circuit board outer-layer circuit, brush position and electroplating line, is accomplished internal layer circuit making, different line layer pressing by conventional printed circuit board flow process; Hole then and, realize the interlayer line conduction through electroless copper, electro-coppering flow process; When making photosensitive solder resist layer, the plug-in unit installing hole 10 of above-mentioned multi-layer PCB substrate belongs to the territory, non-exposed area, and when making public, the photosensitive solder resist layer on the plug-in unit installing hole 10 does not make public, also removes through visualization way.
Claims (4)
1. the nickel-gold electroplating process of a printed circuit board may further comprise the steps:
(1) prepare the PCB substrate: above-mentioned PCB substrate is individual layer PCB substrate or multi-layer PCB substrate, and above-mentioned PCB substrate is provided with encapsulation welding tray and electroplated nickel gold zone, and above-mentioned electroplated nickel gold zone is positioned at the non-fringe region of PCB substrate surface;
When preparing the PCB substrate, said multi-layer PCB substrate accomplishes by conventional printed circuit board flow process that internal layer circuit is made, different line layer pressing, holes then and through electroless copper, electro-coppering flow process, realizes the interlayer line conduction;
(2) make printed circuit board outer-layer circuit, brush position and plating line: the PCB substrate is divided into printed circuit board zone and technology limit; Pass through etching mode; In the printed circuit board zone, make the printed circuit board outer-layer circuit; On the technology limit, make the brush position; On printed circuit board zone and technology limit, make and electroplate line, an end of above-mentioned plating line and the regional conducting of electroplated nickel gold, the other end and the position conducting of above-mentioned brush of electroplating line;
(3) make photosensitive solder resist layer: at first; Printing one deck photosensitive solder resist layer on the printed circuit board zone of PCB substrate; Above-mentioned photosensitive solder resist layer is divided into exposure area and territory, non-exposed area, and territory, above-mentioned non-exposed area comprises electroplated nickel gold zone, encapsulation welding tray and plating line zone; Then, make public through the photosensitive solder resist layer of the film to the exposure area, the photosensitive solder resist layer in territory, non-exposed area does not make public, also removes through visualization way;
When making photosensitive solder resist layer, the plug-in unit installing hole of above-mentioned multi-layer PCB substrate belongs to the territory, non-exposed area, and when making public, the photosensitive solder resist layer on the plug-in unit installing hole does not make public, also removes through visualization way;
(4) make electroless nickel gold locality protection layer: after accomplishing the making of photosensitive solder resist layer, on above-mentioned electroplated nickel gold zone and the zone beyond the brush position, cover one deck dry film, thereby form one deck dry film protective layer in electroless nickel gold zone;
(5) electronickelling gold: the brush position on the PCB substrate is electrically connected with the brush of motor-generator set, realizes the conducting between " motor-generator set-brush-brush position-plating line-electronickelling gold zone ", then, the electronickelling gold is carried out in the gold of the electroplated nickel on PCB substrate zone;
(6) remove electroless nickel gold locality protection layer: after accomplishing the electronickelling gold, employing is moved back film liquid the dry film protective layer on the electroless nickel gold zone is removed;
(7) remove the plating line: on the PCB substrate of electroplating beyond the line zone, cover last layer dry film protective layer, remove electroplate lead wire through etching mode; Then, film liquid stripping dry film protective layer is moved back in employing.
(8) repair plating line zone:, make the photosensitive solder resist layer on the PCB substrate repair complete electroplating printing one deck photosensitive solder resist layer on the line zone;
(9) remove the technology limit: adopt gong machine or punch press that technology limit and top brush position thereof are removed, thereby accomplished the electronickelling gold of the non-fringe region in printed circuit board surface.
2. the nickel-gold electroplating process of printed circuit board as claimed in claim 1; It is characterized in that: the manufacture craft of said plating line is following: on printed circuit board zone and technology limit; Preestablish and electroplate the line zone; One end in above-mentioned plating line zone is positioned at electroplated nickel gold zone, electroplates the other end in line zone and the brush position on the technology limit and joins; Then; Covering the last layer protective layer on the printed circuit board outer-layer circuit, on the brush position and on the plating line zone; Then, the copper layer of unprotect layer region on the PCB substrate is etched away, last; With on the outer-layer circuit, on the brush position and electroplate the protective layer stripping on the line zone, thereby accomplish the making of electroplating line.
3. the nickel-gold electroplating process of printed circuit board as claimed in claim 2 is characterized in that: said protective layer forms through pasting the dry film mode, when moving back film, adopts and moves back film liquid dry film is stripped.
4. the nickel-gold electroplating process of printed circuit board as claimed in claim 2, it is characterized in that: said protective layer forms through the electrotinning mode, and promptly protective layer is the electrotinning layer, when moving back film, adopts and moves back the tin mode electrotinning layer is stripped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010160132 CN101835346B (en) | 2010-04-24 | 2010-04-24 | Nickel-gold electroplating process of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010160132 CN101835346B (en) | 2010-04-24 | 2010-04-24 | Nickel-gold electroplating process of PCB |
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| Publication Number | Publication Date |
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| CN101835346A CN101835346A (en) | 2010-09-15 |
| CN101835346B true CN101835346B (en) | 2012-02-22 |
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| CN 201010160132 Expired - Fee Related CN101835346B (en) | 2010-04-24 | 2010-04-24 | Nickel-gold electroplating process of PCB |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056417A (en) * | 2010-11-24 | 2011-05-11 | 深南电路有限公司 | Process for manufacturing partially gold-plated board |
| CN102045951B (en) * | 2010-11-29 | 2012-10-17 | 上海申和热磁电子有限公司 | Metal surface plated nickel/gold treatment method of ceramic metalized substrate and manufactured ceramic metalized substrate |
| CN102026491B (en) * | 2010-12-07 | 2012-05-09 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102436954A (en) * | 2011-09-30 | 2012-05-02 | 常州市协和电路板有限公司 | Electric appliance key-press plate and production method thereof |
| CN103060870B (en) * | 2012-12-25 | 2016-02-10 | 江苏省宜兴电子器件总厂 | A kind of ceramic LGA package casing pad selective electroplating technique |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
| CN103118495B (en) * | 2013-01-29 | 2016-08-10 | 惠州中京电子科技股份有限公司 | A kind of pcb board processing technology |
| CN104952376B (en) * | 2015-06-12 | 2017-07-28 | 信丰福昌发电子有限公司 | It is a kind of to improve the technique that dot oozes golden short circuit away from LED lamp panel |
| CN107920427B (en) * | 2016-10-09 | 2020-07-14 | 北大方正集团有限公司 | Preparation method of metal connection structure of circuit board and printed circuit board |
| CN107222980B (en) * | 2017-07-13 | 2023-09-08 | 广州市安旭特电子有限公司 | Method for connecting sensor and printed circuit board by using soldering |
| CN110106537A (en) * | 2019-06-26 | 2019-08-09 | 浙江金卓首饰有限公司 | A kind of preparation method of the electroforming solution being used to prepare the hard gold of 3D and the hard gold of 3D |
| CN110565133A (en) * | 2019-08-27 | 2019-12-13 | 东莞康源电子有限公司 | method for manufacturing low-roughness electroplated nickel and gold |
| CN116347783B (en) * | 2023-05-30 | 2023-08-15 | 苏州晶晟微纳半导体科技有限公司 | Repair method for scratching and falling off miniaturized bonding pads of PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201234401Y (en) * | 2008-01-14 | 2009-05-06 | 王勇铎 | Nickel partial electroplating printed circuit board |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
-
2010
- 2010-04-24 CN CN 201010160132 patent/CN101835346B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201234401Y (en) * | 2008-01-14 | 2009-05-06 | 王勇铎 | Nickel partial electroplating printed circuit board |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
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| CN101835346A (en) | 2010-09-15 |
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