CN102917303B - 塑料壳封装麦克风 - Google Patents
塑料壳封装麦克风 Download PDFInfo
- Publication number
- CN102917303B CN102917303B CN201210424495.1A CN201210424495A CN102917303B CN 102917303 B CN102917303 B CN 102917303B CN 201210424495 A CN201210424495 A CN 201210424495A CN 102917303 B CN102917303 B CN 102917303B
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- CN
- China
- Prior art keywords
- terminal
- plastic housing
- mems
- pcb board
- microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 241000218202 Coptis Species 0.000 claims description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 230000004907 flux Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010009 beating Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241001657258 Pachycare flavogriseum Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210424495.1A CN102917303B (zh) | 2012-10-30 | 2012-10-30 | 塑料壳封装麦克风 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210424495.1A CN102917303B (zh) | 2012-10-30 | 2012-10-30 | 塑料壳封装麦克风 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102917303A CN102917303A (zh) | 2013-02-06 |
CN102917303B true CN102917303B (zh) | 2015-03-18 |
Family
ID=47615503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210424495.1A Active CN102917303B (zh) | 2012-10-30 | 2012-10-30 | 塑料壳封装麦克风 |
Country Status (1)
Country | Link |
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CN (1) | CN102917303B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014118214B4 (de) * | 2014-12-09 | 2024-02-22 | Snaptrack, Inc. | Einfach herstellbares elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements |
CN105163256B (zh) * | 2015-09-29 | 2019-08-20 | 歌尔股份有限公司 | 具有柔性导通结构的mems装置 |
US10351419B2 (en) * | 2016-05-20 | 2019-07-16 | Invensense, Inc. | Integrated package containing MEMS acoustic sensor and pressure sensor |
CN106604190A (zh) * | 2017-01-13 | 2017-04-26 | 无锡红光微电子股份有限公司 | 一种mems麦克风封装结构 |
US10544040B2 (en) * | 2017-05-05 | 2020-01-28 | Dunan Microstaq, Inc. | Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment |
CN108055604A (zh) * | 2017-12-07 | 2018-05-18 | 钰太芯微电子科技(上海)有限公司 | 一种背腔增强的麦克风结构及电子设备 |
CN108336044B (zh) * | 2018-01-25 | 2019-10-08 | 山西宇翔信息技术有限公司 | 一种基于沟槽介质隔离的双极集成电路芯片 |
CN109379650B (zh) * | 2018-10-18 | 2020-04-14 | 深圳康佳电子科技有限公司 | 一种麦克风减震结构及麦克风设备 |
CN109704270B (zh) * | 2018-12-29 | 2021-09-24 | 无锡韦尔半导体有限公司 | 五金件、微机电传感器封装结构及制造方法 |
US20200385263A1 (en) * | 2019-06-06 | 2020-12-10 | Solid State System Co., Ltd. | Package structure of micro-electro-mechanical-system (mems) microphone package and packaging method thereof |
CN110769357A (zh) * | 2019-10-30 | 2020-02-07 | 通用微(深圳)科技有限公司 | 一种采用引线框架塑料壳的麦克风封装结构 |
CN113891198A (zh) * | 2020-07-03 | 2022-01-04 | 加高电子股份有限公司 | 麦克风结构 |
CN114136433A (zh) * | 2021-12-02 | 2022-03-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | 一种基于mems麦克风阵列的脉冲声波信号探测*** |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101132655A (zh) * | 2006-08-24 | 2008-02-27 | 美律实业股份有限公司 | 微机电麦克风封装结构与封装方法 |
CN201165468Y (zh) * | 2008-03-03 | 2008-12-17 | 歌尔声学股份有限公司 | Mems麦克风封装结构 |
CN101415138A (zh) * | 2008-11-14 | 2009-04-22 | 瑞声声学科技(深圳)有限公司 | Mems换能器封装结构 |
CN201550275U (zh) * | 2009-09-28 | 2010-08-11 | 瑞声声学科技(常州)有限公司 | Mems麦克风 |
-
2012
- 2012-10-30 CN CN201210424495.1A patent/CN102917303B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101132655A (zh) * | 2006-08-24 | 2008-02-27 | 美律实业股份有限公司 | 微机电麦克风封装结构与封装方法 |
CN201165468Y (zh) * | 2008-03-03 | 2008-12-17 | 歌尔声学股份有限公司 | Mems麦克风封装结构 |
CN101415138A (zh) * | 2008-11-14 | 2009-04-22 | 瑞声声学科技(深圳)有限公司 | Mems换能器封装结构 |
CN201550275U (zh) * | 2009-09-28 | 2010-08-11 | 瑞声声学科技(常州)有限公司 | Mems麦克风 |
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Publication number | Publication date |
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CN102917303A (zh) | 2013-02-06 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Yunlong Inventor after: Wu Guanghua Inventor after: Liu Jinfeng Inventor after: Zhu Cuifang Inventor before: Wang Yunlong Inventor before: Liu Jinfeng Inventor before: Zhu Cuifang |
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COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG YUNLONG LIU JINFENG ZHU CUIFANG TO: WANG YUNLONG WU GUANGHUA LIU JINFENG ZHU CUIFANG |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Microphone packaged by plastic casing Effective date of registration: 20160526 Granted publication date: 20150318 Pledgee: Wuxi Industrial Development Group Pledgor: Wuxi Xinao Micro Sensor Technology Co.,Ltd. Registration number: 2016320000007 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231226 Address after: 214000 No. 15, Xinzhou Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jinri Technology (Wuxi) Co.,Ltd. Address before: No.1 YONGGU Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Xinao Micro Sensor Technology Co.,Ltd. |