CN201846474U - 硅麦克风 - Google Patents
硅麦克风 Download PDFInfo
- Publication number
- CN201846474U CN201846474U CN2010205574724U CN201020557472U CN201846474U CN 201846474 U CN201846474 U CN 201846474U CN 2010205574724 U CN2010205574724 U CN 2010205574724U CN 201020557472 U CN201020557472 U CN 201020557472U CN 201846474 U CN201846474 U CN 201846474U
- Authority
- CN
- China
- Prior art keywords
- board substrate
- wiring board
- silicon microphone
- metal
- conductive rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 239000000084 colloidal system Substances 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims description 23
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205574724U CN201846474U (zh) | 2010-10-12 | 2010-10-12 | 硅麦克风 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205574724U CN201846474U (zh) | 2010-10-12 | 2010-10-12 | 硅麦克风 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201846474U true CN201846474U (zh) | 2011-05-25 |
Family
ID=44041347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205574724U Expired - Lifetime CN201846474U (zh) | 2010-10-12 | 2010-10-12 | 硅麦克风 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201846474U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103260125A (zh) * | 2013-04-12 | 2013-08-21 | 日月光半导体制造股份有限公司 | 芯片封装结构及其制造方法 |
CN103548361A (zh) * | 2011-09-09 | 2014-01-29 | 欧姆龙株式会社 | 半导体装置及麦克风 |
CN113194369A (zh) * | 2021-03-25 | 2021-07-30 | 闻泰通讯股份有限公司 | 一种麦克风 |
-
2010
- 2010-10-12 CN CN2010205574724U patent/CN201846474U/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103548361A (zh) * | 2011-09-09 | 2014-01-29 | 欧姆龙株式会社 | 半导体装置及麦克风 |
CN103548361B (zh) * | 2011-09-09 | 2016-12-14 | 欧姆龙株式会社 | 半导体装置及麦克风 |
CN103260125A (zh) * | 2013-04-12 | 2013-08-21 | 日月光半导体制造股份有限公司 | 芯片封装结构及其制造方法 |
CN103260125B (zh) * | 2013-04-12 | 2017-06-06 | 日月光半导体制造股份有限公司 | 芯片封装结构及其制造方法 |
CN113194369A (zh) * | 2021-03-25 | 2021-07-30 | 闻泰通讯股份有限公司 | 一种麦克风 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110525 |