CN102914497A - Bond strength measurement device - Google Patents
Bond strength measurement device Download PDFInfo
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- CN102914497A CN102914497A CN2012104096038A CN201210409603A CN102914497A CN 102914497 A CN102914497 A CN 102914497A CN 2012104096038 A CN2012104096038 A CN 2012104096038A CN 201210409603 A CN201210409603 A CN 201210409603A CN 102914497 A CN102914497 A CN 102914497A
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- bond strength
- strength measurement
- bearing table
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Abstract
The invention provides a bond strength measurement device. The bond strength measurement device comprises a metal base (5); a metal upright column (4) is arranged on the base (5); and a screw hole is formed in the upper end of the upright column (4). A aluminum bearing table (3) is connected above the upright column (4); a screw rod (3a) is arranged under the bearing table (3) and is in connection match with the screw hole formed in the upper end of the upright column (4); a pair of magnets (2) for absorbing a tube are arranged above the bearing table (3) and are embedded at the upper end plane of the bearing table (3); and the upper surfaces of the magnets are lower than the upper end plane of the bearing table (3). According to the technical proposal of the invention, a metal tube shell is fixed by magnet absorption method, the use is convenient, and the tube and the gold-plated layers of pins are not damaged. The bond strength measurement device has the advantages of being capable of comprehensively implementing the bond lead tension test to the parallel seam welding encapsulation circuit of a thick film HIC metal housing circuit, not being limited by tube shapes and housing sizes, and being capable of performing bond tension detection to a metal housing encapsulation circuit.
Description
Technical field
The present invention relates to a kind of proving installation of integrated circuit, particularly for to the gold wire bonding tensile test of thick film circuit packed by metal casing class HIC circuit and the proving installation of Si-Al wire bonding pulling force.
Background technology
It is most popular pilot project in the thick film HIC circuit that the bonding pulling force detects, and it can detect the inefficacy welding in the circuit effectively.It is that circuit under test is installed on the slide holder that the bonding pulling force detects, microscopically by the crochet hook on the tensiometer with circuit in bonding wire break (destructiveness) or do not break (non-destructive), the energy of crochet hook vibration makes pulling force sensor produce deformation and demonstrate corresponding value of thrust by display screen after changing into electric signal, reach the measurement bond strength, detect the test objective of bonding quality.
Along with electronic product to the improving constantly of high reliability request, a lot of hydrid integrated circuits all require bonding line to make 100% non-destructive tensile test.The slide holder of existing bonding tensiometer random arrangement can only clamping chip substrate, can't be fixed clamping to the circuit that substrate is bonded in Can inside.Such as the inner bonding lead strain of need test Can, take for a long time to manage the method that leg is inserted foam-rubber cushion before, waste time and energy.May make the pipe leg bending phenomenon occur because misoperation cause pipe leg unbalance stress in the plug process, serious even can cause scrapping of circuit.During circuit test bonding wire pulling force, mobile inconvenience the situation that crochet hook bumps silk easily occurs, and the same sponge can not be used for a long time.By the understanding to the bonding device for testing tensile force of other similar tensile test equipment, mostly take the corresponding shell cavity size of step-graded, adjust location gap by turn-knob slide holder horizontal level a pair of screw rod in correspondence with each other and realize clamping to Can.Inconvenient during use, also may make Gold plated Layer the scar mark occur rubbing because the clamping tension destroys the shell Gold plated Layer during use, affect last finished product appearance visual inspection, cause scrapping of circuit.And, when being used, the fixedly clamping of circular metal shell or other special-shaped shell (such as pipe leg four row horizontally-arrangeds) seems very inconvenient.In a word, the defective of existing bonding device for testing tensile force structure function, can not be comprehensively convenient, fast, safe realization is to the bonding tensile test of thick film metal shell encapsulation class HIC circuit.
Summary of the invention
Purpose of the present invention is exactly in order to solve existing bond strength measurement mechanism, at the shortcoming of the easy damage shell Gold plated Layer of clamping electric circuit metal shell, a kind of convenient, fast, the safe circuit bond strength measurement mechanism that provides.
The technical solution used in the present invention is as follows:
A kind of bond strength measurement mechanism is characterized in that comprising a base, and base is provided with column, the column upper end is provided with screw, a wafer-supporting platform is set above the column, and the screw rod that wafer-supporting platform arranges is connected cooperation with the screw of column upper end, is provided with the magnet of absorption shell above the wafer-supporting platform.
On the basis of technique scheme, following further technical scheme can be arranged:
Magnet is embedded in the groove of wafer-supporting platform upper surface, and the upper surface of magnet is lower than the wafer-supporting platform upper surface.
Described wafer-supporting platform is that alumina based material is made.
Described wafer-supporting platform is rectangle or circle.
Technical scheme of the present invention, it is the technology requirement according to tensile test, structure and performance situation in conjunction with the bonding tension tester, consider that the Can material is similar pure iron, take the fixing means fixing metal shell of magnet adsorption, thereby realize thick film HIC packed by metal casing circuit is carried out the bonding tensile test.
Consider the size of shell cavity size, the height of cavity is made height-adjustable slide holder, the general as far as possible alumina based material of slide holder is made, magnet is embedded on the aluminium matter slide holder, should guarantees that magnet is little and be lower than susceptor surface, do not rub when guaranteeing to use and hinder shell base Gold plated Layer.
Because wafer-supporting platform and tautness meter are used in conjunction with, its width is less than the width between the elongated shape pin of Can, and the shell of being convenient to Multiple Type is placed on the slide holder.Be circular such as the shell profile, the slide holder respective design be circle.Can according to the needs of circuit, select to change required applicable slide holder and be installed on the base.By the height (Z-direction) between knob Luo bolt adjustment tensiometer crochet hook and circuit, base is circular annular knurl line, and the convenient operation person manually adjusts X-axis, Y direction.
The present invention compared with prior art, its remarkable advantage is:
Can round Realization carry out the bonding wire tensile test to thick film HIC metal shell circuit parallel seam welding encapsulation class road, has not managed hull shape system restriction, not limited by shell sizes, just can carry out the effect that the bonding pulling force detects to packed by metal casing class circuit without clamping.
Description of drawings
Fig. 1 is front view of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the vertical view of circular shell and wafer-supporting platform.
Embodiment
As shown in Figure 1, a kind of bond strength measurement mechanism provided by the invention comprises a metab 5, and base 5 is provided with metal upright post 4, and column 4 upper ends are provided with screw.An aluminium matter wafer-supporting platform 3 that is connected is set on column 4, be provided with screw rod 3a below the wafer-supporting platform 3, it is connected cooperation with the screw of column 4 upper ends, be provided with the magnet 2 of a pair of absorption shell above the wafer-supporting platform 3, magnet 2 is embedded in wafer-supporting platform 3 upper surfaces, and the upper surface of magnet is lower than wafer-supporting platform 3 upper surfaces.
Referring to shown in Figure 2, rectangle wafer-supporting platform 3 is adsorbed on the medium position of Can 1 by magnet 2, and the pin 6 of Can both sides is respectively in the wafer-supporting platform both sides, does not contact with wafer-supporting platform.
If Can is circular, then adopt circular wafer-supporting platform, as shown in Figure 3.
Using method of the present invention:
Step 1: choose suitable slide holder according to the metal shell shape system of bonding pulling force circuit to be measured and the size of physical dimension;
Step 2: be installed in the slide holder of choosing on the base of frock by threaded engagement;
Step 3: the circuit that will need to test the bonding pulling force is put down gently on slide holder, and the magnet that is embedded in the slide holder end face is absorbed and fixed at Can on the slide holder;
Step 4: frock is placed on the bonding tension tester worktable together with circuit, and with reference to the crochet hook position on the tensiometer, fine setting slide holder height is in order to carry out the lead strain test;
Step 5: the tensiometer parameter is set, below microscopically is aimed at the tensiometer crochet hook required test lead, presses touching button, finish the Bonding tensile test.
Claims (4)
1. bond strength measurement mechanism, it is characterized in that comprising a base (5), base (5) is provided with column (4), column (4) upper end is provided with screw, a wafer-supporting platform (3) is set above the column (4), the screw rod (3a) that wafer-supporting platform (3) arranges is connected cooperation with the screw of column (4) upper end, is provided with the magnet (2) of absorption shell above the wafer-supporting platform (3).
2. a kind of bond strength measurement mechanism according to claim 1, it is characterized in that: magnet (2) is embedded in the groove of wafer-supporting platform (3) upper surface, and the upper surface of magnet is lower than wafer-supporting platform (3) upper surface.
3. a kind of bond strength measurement mechanism according to claim 1 and 2 is characterized in that: described wafer-supporting platform (3) is rectangle or circle.
4. a kind of bond strength measurement mechanism according to claim 3, it is characterized in that: described wafer-supporting platform (3) is made for alumina based material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104096038A CN102914497A (en) | 2012-10-24 | 2012-10-24 | Bond strength measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104096038A CN102914497A (en) | 2012-10-24 | 2012-10-24 | Bond strength measurement device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102914497A true CN102914497A (en) | 2013-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104096038A Pending CN102914497A (en) | 2012-10-24 | 2012-10-24 | Bond strength measurement device |
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| CN (1) | CN102914497A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196827A (en) * | 2013-03-25 | 2013-07-10 | 奥瑞金包装股份有限公司 | Device and method for detecting adhesive force of surface of film-coated iron |
| CN103308197A (en) * | 2013-06-15 | 2013-09-18 | 中国计量学院 | Clamping device for plant leaf surface physical parameter detection sensor |
| CN106053339A (en) * | 2016-06-07 | 2016-10-26 | 西安向阳航天材料股份有限公司 | Estimation method of bonding strength of mechanical composite tubes |
| CN112179731A (en) * | 2020-09-17 | 2021-01-05 | 长江存储科技有限责任公司 | Sample preparation method, stress detection method and sample to be detected |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3678738A (en) * | 1970-08-06 | 1972-07-25 | Gen Motors Corp | Test device for trim assemblies |
| CN2729901Y (en) * | 2004-09-03 | 2005-09-28 | 清华大学 | Appearance test device of double-row direct insertion type package chip |
| CN2842732Y (en) * | 2004-03-15 | 2006-11-29 | 雅马哈株式会社 | Semiconductor element and wafer level chip size package having it |
| CN101650294A (en) * | 2009-08-28 | 2010-02-17 | 陕西科技大学 | Method for testing bond strength of materials |
-
2012
- 2012-10-24 CN CN2012104096038A patent/CN102914497A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3678738A (en) * | 1970-08-06 | 1972-07-25 | Gen Motors Corp | Test device for trim assemblies |
| CN2842732Y (en) * | 2004-03-15 | 2006-11-29 | 雅马哈株式会社 | Semiconductor element and wafer level chip size package having it |
| CN2729901Y (en) * | 2004-09-03 | 2005-09-28 | 清华大学 | Appearance test device of double-row direct insertion type package chip |
| CN101650294A (en) * | 2009-08-28 | 2010-02-17 | 陕西科技大学 | Method for testing bond strength of materials |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196827A (en) * | 2013-03-25 | 2013-07-10 | 奥瑞金包装股份有限公司 | Device and method for detecting adhesive force of surface of film-coated iron |
| CN103308197A (en) * | 2013-06-15 | 2013-09-18 | 中国计量学院 | Clamping device for plant leaf surface physical parameter detection sensor |
| CN103308197B (en) * | 2013-06-15 | 2015-05-27 | 中国计量学院 | Clamping device for plant leaf surface physical parameter detection sensor |
| CN106053339A (en) * | 2016-06-07 | 2016-10-26 | 西安向阳航天材料股份有限公司 | Estimation method of bonding strength of mechanical composite tubes |
| CN106053339B (en) * | 2016-06-07 | 2019-02-05 | 西安向阳航天材料股份有限公司 | A kind of evaluation method of mechanical multiple tube bond strength |
| CN112179731A (en) * | 2020-09-17 | 2021-01-05 | 长江存储科技有限责任公司 | Sample preparation method, stress detection method and sample to be detected |
| CN112179731B (en) * | 2020-09-17 | 2021-11-12 | 长江存储科技有限责任公司 | Sample preparation method, stress detection method and sample to be detected |
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Application publication date: 20130206 |