CN102837136A - Parallel seam welding process and apparatus of special-shaped structure packaging housing - Google Patents
Parallel seam welding process and apparatus of special-shaped structure packaging housing Download PDFInfo
- Publication number
- CN102837136A CN102837136A CN2012103344242A CN201210334424A CN102837136A CN 102837136 A CN102837136 A CN 102837136A CN 2012103344242 A CN2012103344242 A CN 2012103344242A CN 201210334424 A CN201210334424 A CN 201210334424A CN 102837136 A CN102837136 A CN 102837136A
- Authority
- CN
- China
- Prior art keywords
- soldering
- sealing
- seam welding
- parallel seam
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The invention provides a parallel seam welding process and a parallel seam welding apparatus of a special-shaped structure packaging housing. The parallel seam welding process is characterized in that the special-shaped structure housing which is originally processed in the manner of laser seaming is changed to be packaged by utilizing a parallel seam welding process for the first time by the means of improvements and tests that a welding wheel is machined and improved, a seal welding die is precisely adjusted, and the rail configuration of a welded wheel rail exceeds a limit and the like, thereby guaranteeing appearance, sealing property and other various indexes. According to the invention, the basic seal welding requirement is met, and the good appearance and the excellent sealing property are realized, so that the quality and the long-term reliability of a product are greatly improved.
Description
Technical field
The present invention relates to the soldering and sealing of hydrid integrated circuit metal shell sealing, relate in particular to the parallel seam welding of a kind of polymorphic structure package casing in the encapsulation technology field.
Background technology
The mass of IC design and manufacturing has proposed very high requirement to the back road treatment technology of device.Especially in air-tightness soldering and sealing, not only need good air-tightness, high welding efficiency, and the outward appearance of device also proposed new demand; For the air-tightness soldering and sealing of device, be laser soldering and sealing, stored energy welding and parallel seam welding by people's extensive use at present.Wherein stored energy welding and parallel seam welding are to belong to solder technology efficiently, and its welding airtightness of parallel seam welding is better than stored energy welding, with regard to welding efficiency and product appearance, is superior to Laser Welding again.Because parallel seam welding has high efficiency, high-air-tightness, good characteristics such as weld appearance; In batch process, used widely; But because some polymorphic structure package casing is not suitable for parallel seam welding and stored energy welding, all adopt the process of laser soldering and sealing to encapsulate in the past, product hermeticity is difficult to reach the GJB548 requirement; And weld seam is coarse, and outward appearance is very ugly.
Summary of the invention
The objective of the invention is to overcome the shortcoming of existing laser sealing technique; A kind of polymorphic structure package casing parallel seam welding technology and device are provided; Not only satisfied the basic soldering and sealing requirement of different in nature construction packages shell, and surmounted and broken through the soldering and sealing mode and the limit of traditional parallel seam welding, made its sealing and soldering and sealing outward appearance obtain very big improvement; All reach the GJB548 requirement, improved reliability of products.
Shown in Fig. 2-1 and Fig. 2-2, the package lead of conventional structure housing vertically downward or in horizontal direction, lead-in wire and cover plate are in both sides, and two diagonal angles of housing upper surface do not have " ear ".
And my H3205S6A1F of company product polymorphic structure housing; With shown in Fig. 1-2, the bilateral lead-in wire bends towards the housing upper surface from side, lead pitch side edge thereof close like Fig. 1-1; Lead-in wire and cover plate are at homonymy and exceed plane, cover plate place; Respectively there is a mounting flange (annotate: flange is " ear ", and is as follows) at two diagonal angles of housing upper surface, are in same plane with cover plate.Adopt the parallel seam welding encapsulation can have following difficult point for this polymorphic structure housing of my company:
1., bilateral lead-in wire bends towards the housing upper surface from side, lead pitch side edge thereof close, electrode wheel is easy to run into the bilateral lead-in wire during soldering and sealing.
2., lead-in wire and cover plate are at homonymy and exceed plane, cover plate place, lead ends can withstand on the wheel shaft of electrode wheel during soldering and sealing, electrode wheel can't be rolled more can't be near side edge thereof.
3., two of the housing upper surface diagonal angles respectively have one fixing " ear "; Be in same plane with cover plate; And the electrode wheel of parallel seam sealing machine is " eight " font; Tradition soldering and sealing requires the soldering and sealing edge not allow barrier, or barrier is lower by 1 to 2mm than weld seam at least, so the special construction of this product can't satisfy with parallel seam welding technology.
This polymorphic structure housing adopts parallel seam sealing machine to carry out soldering and sealing, just must solve above three aspect difficult problems.Through ruminating over and testing, found out " a kind of polymorphic structure package casing parallel seam welding technology and device ", a difficult problem is readily solved.
Concrete technology and the device of realizing the object of the invention are:
1, to difficult point 1., the track setting of soldering and sealing mould and electrode wheel is adjusted.Earlier soldering and sealing mould is carried out accurate adjustment, make it along X, Y direction zero deflection, symmetrical fully all around, promptly the center of product center, mold center and two weldering wheel lines definitely overlaps; With more than the track setting value coarse adjustment to 95 (0.095in), this problem solves then.And mould does not have high accuracy adjustment requirement during conventional soldering and sealing, and track is set in 70~80, and promptly 0.07~0.08in is interval, shown in Fig. 3-1.
2, to difficult point 2., electrode wheel is processed improvement.Withstand the position of lead-in wire at the electrode wheel wheel shaft and open the groove that a 2mm is wide, 2mm is dark, lead ends is in the flute profile, this problem solves.And the conventional structure package lead vertically downward or in horizontal direction, Endless upwards withstands the wheel shaft phenomenon, need not improve to the wheel shaft fluting.Shown in Fig. 3-1.
3,3. to difficult point; Must adopt the outer of electrode wheel to weld; Could eliminate the obstruction of " ear " butt welding wheel, set when track and be fine-tuning to the limit 100~103 (promptly during 0.100~0.103in) interval, the outer of electrode wheel just rolls across from the handing-over position of cover plate both sides and ear; Both avoided the two collision, more solved " ear " position and side edge thereof soldering and sealing.And the central area of weldering wheel is used in conventional soldering and sealing, and track is set in 70~80, and promptly 0.07~0.08in is interval, never adopts the limit of weldering wheel outer to carry out soldering and sealing.Shown in Fig. 3-1.
The concrete soldering and sealing parameter of this polymorphic structure package casing is as shown in the table:
Advantage of the present invention is following:
The present invention improves through the processing of butt welding wheel; Soldering and sealing mould is accurately adjusted; The butt welding wheel track is provided with series such as breaking through the limit and improves and test; Adopt technology of the present invention that the special construction shell of original employing laser soldering and sealing is encapsulated first; Soldering and sealing appearance looks elegant, weld seam are thin and level and smooth, good airproof performance, high, easy simple to operate of soldering and sealing efficient; Guaranteed that each item indexs such as outward appearance and sealing satisfy the GJB548 requirement, once encapsulated qualification rate and reach more than 99% (during former Laser Welding qualification rate only about 60%); The one man operation, per hour soldering and sealing is about 70, has improved production efficiency (the necessary people's contraposition of Laser Welding, people welding, per hour soldering and sealing is about 30); Guaranteed the q&r of product, for company practices thrift surplus the cost 20 ten thousand yuan.In recent years, this technology has been widely used in the encapsulation of H3205S6A1F, for the encapsulation of the type metal shell mass is laid a good foundation.
Description of drawings
Fig. 1-the 1st, polymorphic structure package casing sketch map of the present invention.
Fig. 1-2 is the vertical view of Fig. 1-1.
Fig. 2-the 1st, conventional structure package casing sketch map.
Fig. 2-the 2nd, Fig. 2-the 1st, vertical view.
Fig. 3-the 1st, conventional structure package casing soldering and sealing sketch map.
Fig. 3-the 2nd, polymorphic structure package casing soldering and sealing sketch map of the present invention.
The specific embodiment
Shown in Fig. 3-2, at first the X of accurate adjustment soldering and sealing mould 6, Y direction knob guarantee all around symmetry fully, and promptly the center of product center, mold center and two weldering wheel lines definitely overlaps, and track is preset in 96~99 (0.096~0.099 inches); Open the groove 7 that a 2mm is wide, 2mm is dark at the position that the wheel shaft 4 of soldering and sealing electrode wheel withstands lead-in wire 1 then, lead ends is in the flute profile; Finely tune track at last and be set to 100~103 (promptly 0.100~0.103 inches), carry out soldering and sealing, can avoid " ear " 3, cover plate 2 and base and " ear " 3 are welded together with the outer of soldering and sealing face 5.
During encapsulation, must product be placed on the center of mould according to technological requirement, the cover plate contraposition is accurate; No crooked, with clamp cover plate is compressed simultaneously, lifted up when preventing product soldering and sealing and the cover plate displacement; Soldering and sealing speed is little, if sparking can in time be taken measures to guarantee the soldering and sealing quality.
Claims (3)
1. polymorphic structure package casing parallel seam welding technology and device; It is characterized in that X, Y direction knob through the accurate adjustment soldering and sealing mould; Make it along X, Y direction zero deflection; Symmetrical fully all around, the center of product center, mold center and two weldering wheel lines is definitely overlapped, then with more than the coarse adjustment to 95 of track setting value; Withstand the position fluting (7) of lead-in wire (1) at the wheel shaft (4) of soldering and sealing electrode wheel, lead ends is in the groove; The adjustment track is set to the limit 100~103; Soldering and sealing is carried out in outer with electrode wheel soldering and sealing face (5), and cover plate (2) and base and flange (3) are welded together.
2. a kind of polymorphic structure package casing parallel seam welding technology as claimed in claim 1 and device; It is characterized in that the polymorphic structure package casing is meant: bilateral lead-in wire (1) bends towards the housing upper surface from side; Lead-in wire (1) is apart from the side edge thereof close; Lead-in wire (1) and cover plate (2) are at homonymy and exceed plane, cover plate place, and respectively there is a mounting flange (3) at two diagonal angles of housing upper surface and is in same plane with cover plate (2).
3. a kind of polymorphic structure package casing parallel seam welding technology as claimed in claim 1 and device, it is characterized in that encapsulating pressure is 13N, and the encapsulation electric current is 0.65KA, and motor head speed is 3.5mm/Sec, and pulse width is 2ms, nitrogen pressure is 0.4~0.6Mpa.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210334424.2A CN102837136B (en) | 2012-09-11 | 2012-09-11 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210334424.2A CN102837136B (en) | 2012-09-11 | 2012-09-11 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102837136A true CN102837136A (en) | 2012-12-26 |
CN102837136B CN102837136B (en) | 2014-08-27 |
Family
ID=47365002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210334424.2A Active CN102837136B (en) | 2012-09-11 | 2012-09-11 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102837136B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104148795A (en) * | 2014-08-23 | 2014-11-19 | 华东光电集成器件研究所 | Parallel seam welding packaging device |
CN105414848A (en) * | 2015-12-18 | 2016-03-23 | 安徽华东光电技术研究所 | Parallel seam welding tool structure |
CN107969083A (en) * | 2017-11-07 | 2018-04-27 | 兴勤(宜昌)电子有限公司 | A kind of battery temperature module production method and application |
CN114211148A (en) * | 2021-12-17 | 2022-03-22 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Micro-electronic packaging automatic alignment parallel sealing and welding mechanism under high vacuum state |
CN115781115A (en) * | 2022-11-17 | 2023-03-14 | 青岛航天半导体研究所有限公司 | Parallel seam welding method for fan-shaped shell |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110197792B (en) * | 2019-06-04 | 2020-11-10 | 陕西华经微电子股份有限公司 | Method for packaging bilaterally-symmetrical convex polygonal tube shell with even number of sides |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0098176A2 (en) * | 1982-06-30 | 1984-01-11 | Fujitsu Limited | The packaging of semiconductor chips |
JPH0274054A (en) * | 1988-09-09 | 1990-03-14 | Nec Kyushu Ltd | Sealing method of semiconductor device |
JPH0358450A (en) * | 1989-07-26 | 1991-03-13 | Nec Kyushu Ltd | Ceramic package of semiconductor device |
JPH07147342A (en) * | 1993-11-24 | 1995-06-06 | Hitachi Ltd | Method and apparatus for seam welding as well as electronic component |
KR20000015289A (en) * | 1998-08-28 | 2000-03-15 | 구자홍 | Core welding device of ceramic ic package using laser |
JP2001085596A (en) * | 1999-09-14 | 2001-03-30 | Nippon Avionics Co Ltd | Stepped package |
JP3832414B2 (en) * | 2002-10-10 | 2006-10-11 | 住友金属鉱山株式会社 | Hermetic seal cap |
CN102064791A (en) * | 2010-10-21 | 2011-05-18 | 南京中电熊猫晶体科技有限公司 | Surface mounting type quartz crystal resonator metal seal welding electrode |
JP2011119338A (en) * | 2009-12-01 | 2011-06-16 | Misuzu Kogyo:Kk | Method of joining metal member, and joined metal member unit |
-
2012
- 2012-09-11 CN CN201210334424.2A patent/CN102837136B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0098176A2 (en) * | 1982-06-30 | 1984-01-11 | Fujitsu Limited | The packaging of semiconductor chips |
JPH0274054A (en) * | 1988-09-09 | 1990-03-14 | Nec Kyushu Ltd | Sealing method of semiconductor device |
JPH0358450A (en) * | 1989-07-26 | 1991-03-13 | Nec Kyushu Ltd | Ceramic package of semiconductor device |
JPH07147342A (en) * | 1993-11-24 | 1995-06-06 | Hitachi Ltd | Method and apparatus for seam welding as well as electronic component |
KR20000015289A (en) * | 1998-08-28 | 2000-03-15 | 구자홍 | Core welding device of ceramic ic package using laser |
JP2001085596A (en) * | 1999-09-14 | 2001-03-30 | Nippon Avionics Co Ltd | Stepped package |
JP3832414B2 (en) * | 2002-10-10 | 2006-10-11 | 住友金属鉱山株式会社 | Hermetic seal cap |
JP2011119338A (en) * | 2009-12-01 | 2011-06-16 | Misuzu Kogyo:Kk | Method of joining metal member, and joined metal member unit |
CN102064791A (en) * | 2010-10-21 | 2011-05-18 | 南京中电熊猫晶体科技有限公司 | Surface mounting type quartz crystal resonator metal seal welding electrode |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104148795A (en) * | 2014-08-23 | 2014-11-19 | 华东光电集成器件研究所 | Parallel seam welding packaging device |
CN105414848A (en) * | 2015-12-18 | 2016-03-23 | 安徽华东光电技术研究所 | Parallel seam welding tool structure |
CN107969083A (en) * | 2017-11-07 | 2018-04-27 | 兴勤(宜昌)电子有限公司 | A kind of battery temperature module production method and application |
CN107969083B (en) * | 2017-11-07 | 2023-11-10 | 兴勤(宜昌)电子有限公司 | Manufacturing method and application of battery temperature module |
CN114211148A (en) * | 2021-12-17 | 2022-03-22 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Micro-electronic packaging automatic alignment parallel sealing and welding mechanism under high vacuum state |
CN115781115A (en) * | 2022-11-17 | 2023-03-14 | 青岛航天半导体研究所有限公司 | Parallel seam welding method for fan-shaped shell |
Also Published As
Publication number | Publication date |
---|---|
CN102837136B (en) | 2014-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102837136B (en) | Parallel seam welding process and apparatus of special-shaped structure packaging housing | |
CN102623428A (en) | Semiconductor module | |
US8823151B2 (en) | Semiconductor device | |
CN106378567B (en) | A kind of parallel seam welding frock clamp | |
CN104952808A (en) | Presetting gold-tin cover plate and manufacturing method thereof | |
CN204045599U (en) | A kind of dual chip high back-pressure plastic package power diode | |
CN204160040U (en) | A kind of ultrasonic wave rapid welding equipment | |
CN104576407A (en) | Lead frame pipe pin end face tinned packaging method and packaging structure | |
CN103606539A (en) | Frame-based flat package adopting opening-optimization technology and manufacturing process thereof | |
CN208538856U (en) | A kind of GaN base concatenated power device | |
CN1252806C (en) | Preparation method of gastight packaged cover plate for integrated curcuit | |
JP2016184757A (en) | Semiconductor device | |
CN203631527U (en) | Parallel seam welding encapsulation shell | |
CN105097755A (en) | Method of singularizing packages and leadframe | |
CN210245488U (en) | Non-contact type upper and lower chip packaging structure | |
CN104538368A (en) | Three-dimensional stacking packaging structure based on secondary plastic packaging technology and preparing method thereof | |
CN205303443U (en) | A highly reliable tube for encapsulating semiconductor device | |
CN105990298A (en) | Chip packaging structure and preparation method thereof | |
CN209515637U (en) | A kind of power module architectures | |
CN103594458A (en) | Lining plate structure | |
CN202749361U (en) | High-power whole wafer insulated gate bipolar transistor (IGBT) ceramic packaging structure | |
TW201822322A (en) | Flip-chip package rectification/protection diode element with multiple chip stacks capable of reducing the height of diode element and extending the number of flip-chips based on voltage resistance requirements | |
CN109545759A (en) | A kind of power module architectures and its manufacturing method | |
CN204946889U (en) | A kind of package frame structure | |
CN205231050U (en) | Lead frame pin copper bridge type packaging structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |