CN102837136B - Parallel seam welding process and apparatus of special-shaped structure packaging housing - Google Patents
Parallel seam welding process and apparatus of special-shaped structure packaging housing Download PDFInfo
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- CN102837136B CN102837136B CN201210334424.2A CN201210334424A CN102837136B CN 102837136 B CN102837136 B CN 102837136B CN 201210334424 A CN201210334424 A CN 201210334424A CN 102837136 B CN102837136 B CN 102837136B
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Abstract
The invention provides a parallel seam welding process and a parallel seam welding apparatus of a special-shaped structure packaging housing. The parallel seam welding process is characterized in that the special-shaped structure housing which is originally processed in the manner of laser seaming is changed to be packaged by utilizing a parallel seam welding process for the first time by the means of improvements and tests that a welding wheel is machined and improved, a seal welding die is precisely adjusted, and the rail configuration of a welded wheel rail exceeds a limit and the like, thereby guaranteeing appearance, sealing property and other various indexes. According to the invention, the basic seal welding requirement is met, and the good appearance and the excellent sealing property are realized, so that the quality and the long-term reliability of a product are greatly improved.
Description
Technical field
The present invention relates to the soldering and sealing of hydrid integrated circuit metal shell sealing, relate in particular to the parallel seam welding of a kind of polymorphic structure package casing in encapsulation technology field.
Background technology
The mass of IC design and manufacture has proposed very high requirement to device Hou road treatment technology.Especially in air-tightness soldering and sealing, not only needing has good air-tightness, high welding efficiency, and the outward appearance of device has also been proposed to new demand; For the air-tightness soldering and sealing of device, be Laser seal welding, stored energy welding and parallel seam welding by people's extensive use at present.Wherein stored energy welding and parallel seam welding are to belong to efficient solder technology, and its welding airtightness of parallel seam welding is better than stored energy welding, is better than again Laser Welding with regard to welding efficiency and product appearance.Because parallel seam welding has the features such as high efficiency, high-air-tightness, good weld appearance, in batch production, be widely used, but because some polymorphic structure package casing is not suitable for parallel seam welding and stored energy welding, all adopted in the past the process of Laser seal welding to encapsulate, product hermeticity is difficult to reach GJB548 requirement, and weld seam is coarse, outward appearance is very ugly.
Summary of the invention
The object of the invention is to overcome the shortcoming of existing Laser seal welding technology, a kind of polymorphic structure package casing parallel seam welding technique and device are provided, not only meet the basic soldering and sealing requirement of different in nature construction packages shell, and surmount and broken through soldering and sealing mode and the limit of traditional parallel seam welding, make its sealing and soldering and sealing outward appearance obtain very big improvement, all reach GJB548 requirement, improved the reliability of product.
As shown in Fig. 2-1 and Fig. 2-2, the package lead of conventional structure housing vertically downward or in horizontal direction, lead-in wire is with cover plate in both sides, and two diagonal angles of housing upper surface do not have " ear ".
And my H3205S6A1F of company product polymorphic structure housing, as shown in Fig. 1-1 and Fig. 1-2, bilateral lead-in wire bends towards housing upper surface from housing side, lead pitch side edge thereof distance is very near, lead-in wire and cover plate are at homonymy and exceed cover plate place plane, respectively there is a mounting flange (note: flange is " ear ", as follows) at two diagonal angles of housing upper surface, with cover plate in same plane.Adopt parallel seam welding encapsulation can have following difficult point for this polymorphic structure housing of my company:
1., bilateral lead-in wire bends towards housing upper surface from housing side, lead pitch side edge thereof distance is very near, when soldering and sealing, electrode wheel is easy to encounter bilateral lead-in wire.
2., lead-in wire and cover plate are at homonymy and exceed cover plate place plane, when soldering and sealing, lead ends can withstand on the wheel shaft of electrode wheel, electrode wheel cannot be rolled and more cannot approach side edge thereof.
3., two of housing upper surface diagonal angles respectively have one fixing " ear ", with cover plate in same plane, and the electrode wheel of parallel seam sealing machine is " eight " font, tradition soldering and sealing requires soldering and sealing edge not allow barrier, or barrier is at least low by 1 to 2mm than weld seam, so the special construction of this product cannot meet by parallel seam welding technique.
This polymorphic structure housing adopts parallel seam sealing machine to carry out soldering and sealing, just must solve an above three aspects: difficult problem.Through ruminating over and testing, find out " a kind of polymorphic structure package casing parallel seam welding technique and device ", a difficult problem is readily solved.
Concrete technology and the device of realizing the object of the invention are:
1, for difficult point 1., the track setting of soldering and sealing mould and electrode wheel is adjusted.First soldering and sealing mould is carried out to accurate adjustment, make it along X, Y-direction zero deflection, full symmetric all around, the center of product center, mold center and two welding wheel lines definitely overlaps; Then track is set value to coarse adjustment to 95(0.095in) more than, this problem solves.And mould is adjusted requirement without high accuracy when conventional soldering and sealing, track is set in 70～80, i.e. 0.07～0.08in interval, as shown in Fig. 3-1.
2, for difficult point 2., electrode wheel is processed to improvement.Withstand the position of lead-in wire at electrode wheel wheel shaft and open the groove that a 2mm is wide, 2mm is dark, make lead ends in flute profile, this problem solves.And conventional structure package lead vertically downward or in horizontal direction, Endless upwards withstands wheel shaft phenomenon, need not improve to wheel shaft fluting.As shown in Fig. 3-1.
3, for difficult point 3., must adopt the outer of electrode wheel to weld, could eliminate " ear " obstruction to welding wheel, in the time that track setting is fine-tuning to the limit 100～103 (i.e. 0.100～0.103in) interval, the outer of electrode wheel just rolls across from the handing-over position of cover plate both sides and ear, both avoided the two bump against, more solved " ear " position and side edge thereof soldering and sealing.And conventional soldering and sealing is used the central area of welding wheel, track is set in 70～80, i.e. 0.07～0.08in interval never adopted the limit of welding wheel outer to carry out soldering and sealing.As shown in Fig. 3-1.
The concrete soldering and sealing parameter of this polymorphic structure package casing is as shown in the table:
Advantage of the present invention is as follows:
The present invention is by welding wheel, processing improves; To soldering and sealing mould accurate adjustment; Butt welding wheel track arranges series such as breaking through the limit and improves and test, adopt first technique of the present invention to encapsulate the special construction shell of original employing Laser seal welding, soldering and sealing appearance looks elegant, weld seam are thin and level and smooth, good airproof performance, soldering and sealing efficiency are high, simple to operate easy to learn, ensure that the indices such as outward appearance and sealing meets GJB548 requirement, once encapsulated qualification rate and reach more than 99% (only 60% left and right of qualification rate when former Laser Welding); One man operation, 70 left and right of soldering and sealing per hour, have improved production efficiency (the necessary people's contraposition of Laser Welding, people's welding, 30 left and right of soldering and sealing per hour); Having ensured the q&r of product, is cost-saving more than 20 ten thousand yuan of company.In recent years, this technique has been widely used in the encapsulation of H3205S6A1F, for the encapsulation of the type metal shell mass is laid a good foundation.
Brief description of the drawings
Fig. 1-1st, polymorphic structure package casing schematic diagram of the present invention.
Fig. 1-2 is the top view of Fig. 1-1.
Fig. 2-1st, conventional structure package casing schematic diagram.
Fig. 2-2nd, Fig. 2-1st, top view.
Fig. 3-1st, conventional structure package casing soldering and sealing schematic diagram.
Fig. 3-2nd, polymorphic structure package casing soldering and sealing schematic diagram of the present invention.
Detailed description of the invention
As shown in Fig. 3-2, first the X of accurate adjustment soldering and sealing mould 6, Y-direction knob, ensure full symmetric all around, the center of product center, mold center and two welding wheel lines definitely overlaps, and track is preset in to 96～99 (0.096～0.099 inches); The wheel shaft 4 of then taking turns at weld electrode withstands the position of lead-in wire 1 and opens the groove 7 that a 2mm is wide, 2mm is dark, makes lead ends in flute profile; Finally finely tune track and be set to 100～103 (0.100～0.103 inches), carry out soldering and sealing with the outer of soldering and sealing face 5, can avoid " ear " 3, cover plate 2 and base and " ear " 3 are welded together.
When encapsulation, product must be placed on to the center of mould according to technological requirement, cover plate contraposition is accurate, without crooked, with clamp, cover plate is compressed simultaneously, while preventing product soldering and sealing, lift up and cover plate displacement, soldering and sealing speed is little, if sparking can take measures to ensure soldering and sealing quality in time.
Claims (3)
1. a polymorphic structure package casing parallel seam welding technique, it is characterized in that X, Y-direction knob by accurate adjustment soldering and sealing mould, make it along X, Y-direction zero deflection, full symmetric all around, the center of product center, mold center and two welding wheel lines is definitely overlapped, then track is set value to coarse adjustment to more than 0.095in; The position fluting (7) that withstands lead-in wire (1) at the wheel shaft (4) of weld electrode wheel, makes lead ends in groove; Adjust track and be set to the limit 0.100～0.103in; Carry out soldering and sealing with the outer of electrode wheel soldering and sealing face (5), cover plate (2) and base and flange (3) are welded together.
2. a kind of polymorphic structure package casing parallel seam welding technique as claimed in claim 1, it is characterized in that polymorphic structure package casing refers to: bilateral lead-in wire (1) bends towards housing upper surface from housing side, lead-in wire (1) and cover plate (2) are at homonymy and exceed cover plate place plane, two diagonal angles of housing upper surface respectively have a mounting flange (3) and with cover plate (2) in same plane.
3. a kind of polymorphic structure package casing parallel seam welding technique as claimed in claim 1, it is characterized in that encapsulating pressure is 13N, and encapsulation electric current is 0.65KA, and motor head speed is 3.5mm/Sec, and pulse width is 2ms, nitrogen pressure is 0.4～0.6Mpa.
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| CN201210334424.2A CN102837136B (en) | 2012-09-11 | 2012-09-11 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
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| CN201210334424.2A CN102837136B (en) | 2012-09-11 | 2012-09-11 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
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| CN102837136A CN102837136A (en) | 2012-12-26 |
| CN102837136B true CN102837136B (en) | 2014-08-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197792A (en) * | 2019-06-04 | 2019-09-03 | 陕西华经微电子股份有限公司 | Number of edges is the bilateral symmetry convex polygon case package method of even number |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148795A (en) * | 2014-08-23 | 2014-11-19 | 华东光电集成器件研究所 | Parallel seam welding packaging device |
| CN105414848A (en) * | 2015-12-18 | 2016-03-23 | 安徽华东光电技术研究所 | Parallel seam welding tool structure |
| CN107969083B (en) * | 2017-11-07 | 2023-11-10 | 兴勤（宜昌）电子有限公司 | Manufacturing method and application of battery temperature module |
| CN114211148B (en) * | 2021-12-17 | 2023-07-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Automatic alignment parallel sealing and welding mechanism for microelectronic package under high vacuum state |
| CN115781115B (en) * | 2022-11-17 | 2024-06-14 | 青岛航天半导体研究所有限公司 | Parallel seam welding method for fan-shaped shell |
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| EP0098176A2 (en) * | 1982-06-30 | 1984-01-11 | Fujitsu Limited | The packaging of semiconductor chips |
| JP3832414B2 (en) * | 2002-10-10 | 2006-10-11 | 住友金属鉱山株式会社 | Hermetic seal cap |
| CN102064791A (en) * | 2010-10-21 | 2011-05-18 | 南京中电熊猫晶体科技有限公司 | Surface mounting type quartz crystal resonator metal seal welding electrode |
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| JPH0274054A (en) * | 1988-09-09 | 1990-03-14 | Nec Kyushu Ltd | Sealing method of semiconductor device |
| JPH0358450A (en) * | 1989-07-26 | 1991-03-13 | Nec Kyushu Ltd | Ceramic package of semiconductor device |
| JPH07147342A (en) * | 1993-11-24 | 1995-06-06 | Hitachi Ltd | Method and apparatus for seam welding as well as electronic component |
| KR20000015289A (en) * | 1998-08-28 | 2000-03-15 | 구자홍 | Core welding device of ceramic ic package using laser |
| JP2001085596A (en) * | 1999-09-14 | 2001-03-30 | Nippon Avionics Co Ltd | Stepped package |
| JP2011119338A (en) * | 2009-12-01 | 2011-06-16 | Misuzu Kogyo:Kk | Method of joining metal member, and joined metal member unit |
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- 2012-09-11 CN CN201210334424.2A patent/CN102837136B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0098176A2 (en) * | 1982-06-30 | 1984-01-11 | Fujitsu Limited | The packaging of semiconductor chips |
| JP3832414B2 (en) * | 2002-10-10 | 2006-10-11 | 住友金属鉱山株式会社 | Hermetic seal cap |
| CN102064791A (en) * | 2010-10-21 | 2011-05-18 | 南京中电熊猫晶体科技有限公司 | Surface mounting type quartz crystal resonator metal seal welding electrode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197792A (en) * | 2019-06-04 | 2019-09-03 | 陕西华经微电子股份有限公司 | Number of edges is the bilateral symmetry convex polygon case package method of even number |
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| CN102837136A (en) | 2012-12-26 |
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