CN102754196A - 利用传输电介质的板化封装 - Google Patents
利用传输电介质的板化封装 Download PDFInfo
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- CN102754196A CN102754196A CN201180008475XA CN201180008475A CN102754196A CN 102754196 A CN102754196 A CN 102754196A CN 201180008475X A CN201180008475X A CN 201180008475XA CN 201180008475 A CN201180008475 A CN 201180008475A CN 102754196 A CN102754196 A CN 102754196A
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US30512210P | 2010-02-16 | 2010-02-16 | |
US61/305,122 | 2010-02-16 | ||
US12/985,212 US20110198762A1 (en) | 2010-02-16 | 2011-01-05 | Panelized packaging with transferred dielectric |
US12/985,212 | 2011-01-05 | ||
PCT/US2011/025124 WO2011103211A1 (en) | 2010-02-16 | 2011-02-16 | Panelized packaging with transferred dielectric |
Publications (2)
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CN102754196A true CN102754196A (zh) | 2012-10-24 |
CN102754196B CN102754196B (zh) | 2016-02-03 |
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CN201180008475.XA Active CN102754196B (zh) | 2010-02-16 | 2011-02-16 | 利用传输电介质的板化封装 |
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Country | Link |
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US (2) | US20110198762A1 (zh) |
CN (1) | CN102754196B (zh) |
SG (2) | SG182712A1 (zh) |
WO (1) | WO2011103211A1 (zh) |
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CN104037138A (zh) * | 2013-03-06 | 2014-09-10 | 新科金朋有限公司 | 形成超高密度嵌入式半导体管芯封装的半导体器件和方法 |
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Also Published As
Publication number | Publication date |
---|---|
SG182712A1 (en) | 2012-09-27 |
SG10201503498XA (en) | 2015-06-29 |
US20110198762A1 (en) | 2011-08-18 |
CN102754196B (zh) | 2016-02-03 |
WO2011103211A1 (en) | 2011-08-25 |
US20140225271A1 (en) | 2014-08-14 |
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