CN102650676A - LED testing device and LED testing method - Google Patents
LED testing device and LED testing method Download PDFInfo
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- CN102650676A CN102650676A CN2012101330404A CN201210133040A CN102650676A CN 102650676 A CN102650676 A CN 102650676A CN 2012101330404 A CN2012101330404 A CN 2012101330404A CN 201210133040 A CN201210133040 A CN 201210133040A CN 102650676 A CN102650676 A CN 102650676A
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Abstract
The invention provides an LED testing device and an LED testing method which are used for testing LEDs in a board connecting state. The LED testing device comprises a testing circuit board and a pressing mechanism; the testing circuit board comprises a first surface and a second surface; a plurality of pairs of testing pads are arranged on the first surface, wherein each pair of testing pads comprises an anodal testing pad and a cathodic testing pad; the testing circuit board further comprises an anodal access point and a cathodic access point; the pressing mechanism comprises a pressing part; the pressing part is used for pressing an LED connecting board so as to ensure that anodal pins and cathodic pins of a plurality of LEDs are tightly contacted with the anodal testing pads and the cathodic testing pads respectively, and a power supply is connected to the anodal access point and the cathodic access point so as to drive the LEDs in a board connecting state, so that all the LEDs can be detected, the yield of LED products that leave factories can be ensured, and further, not only can accuracy and no loss in testing be ensured, but also the problem that test samples are rejected in the prior art can be avoided.
Description
Technical field
The present invention relates to the proving installation of electron production operation, relate in particular to proving installation and the LED method of testing of LED.
Background technology
In the prior art, LED is used widely at lighting field, particularly along with the fast development of lcd technology; LED has obtained using more widely as the backlight of display panels; Its reason is, compares with cold cathode ray tube, and the low in energy consumption and life-span of LED is long.
The manufacturer of LED can extract the heat-resisting test that sample segment carries out LED usually after having produced large batch of LED, to confirm the yield of this LED in batches; Common way is, the LED lamp bar of finished product is processed in plurality of LEDs and circuit board collocation, then LED lamp bar carried out heat-resisting test; But; Thereby in the process of making LED lamp bar, might cause the damage of LED to cause test result to depart from actual yield, and, after finishing test, all do to scrap processing as the LED of specimen; So, also caused the waste of resource.
Summary of the invention
The object of the present invention is to provide a kind of new LED method of testing, and be the LED proving installation of realizing that this LED method of testing is designed, can examine rather than adopt the mode of draw samples test entirely the LED under the connecting plate state.
The present invention provides a kind of LED proving installation; This LED proving installation is used to test the LED under the connecting plate state; This LED proving installation comprises: testing circuit board, have first surface and with the first surface opposing second surface, many testing cushion is arranged at this first surface; Each comprises an anodal testing cushion and a negative pole testing cushion to testing cushion; When the LED under this connecting plate state of test, anodal pin and negative pole pin that this LED connecting plate is positioned over the plurality of LEDs on this first surface and this connecting plate correspond respectively to anodal testing cushion and negative pole testing cushion, and this testing circuit board also comprises anodal access point and negative pole access point; This positive pole access point connects anodal testing cushion, and this negative pole access point connects the negative pole testing cushion; Laminating mechanism; This laminating mechanism comprises pressing portion; This pressing portion is used for when the following LED of test connecting plate state, pushing this LED connecting plate makes anodal pin and negative pole the pin closely anodal testing cushion of contact and the negative pole testing cushion respectively of this this plurality of LEDs, thereby and drives the LED under this connecting plate state through access power supply to this positive pole access point and this negative pole access point.
Preferably, these many first surfaces that testing cushion are arranged in this testing circuit board with the mode of array.
Preferably; The edge of the first surface of this testing circuit board is provided with two relative strip projections; These two strip projections are parallel to each other with the anodal testing cushion of each row or the negative pole testing cushion of each row respectively, and anodal access point and negative pole access point are arranged at respectively on these two strip projections.
Preferably, corresponding each row testing cushion is provided with an anodal access point and a negative pole access point, and this positive pole access point connects all anodal testing cushion of this row, and this negative pole access point connects all negative pole testing cushion of this row.
Preferably; These many first surfaces that testing cushion are arranged in this testing circuit board with the mode of array; And the anodal testing cushion of each row and the negative pole testing cushion of each row attach the conducting resinl of a strip respectively, and the conducting resinl of this strip covers all anodal testing cushion of these row or all negative pole testing cushion that should be listed as.
Preferably, all attach conducting resinl on each anodal testing cushion and each the negative pole testing cushion.
Preferably, this conducting resinl is a high-temperature resistant conducting glue.
Preferably, when this testing circuit board is provided with a plurality of location structures and is used for as the LED of test under this connecting plate state, make the anodal pin of this plurality of LEDs and negative pole pin correspond respectively to anodal testing cushion and negative pole testing cushion.
Preferably, this pressing portion comprises that pressing is dull and stereotyped, and the strip slot to make way is offered in the position of dull and stereotyped corresponding each the row LED of this pressing.
Preferably, the second surface in this testing circuit board is provided with heating arrangement.
The present invention also provides a kind of LED method of testing, and this method comprises: step 1: the LED under the connecting plate state was imitated reflow soldering; Step 2, cooling; Step 3 is carried out the step of lighting test under the normal temperature to the LED under this connecting plate state; Step 4 heats the LED under this connecting plate state and reaches specified temp, and lights the step of test under this specified temp environment the LED under this connecting plate state being carried out; Step 5 finishes test; Wherein, in step 3 and step 4, use aforesaid LED proving installation.
Utilize LED proving installation of the present invention and LED method of testing directly to test to the LED under the connecting plate state; So; Can detect each LEDs, the yield when guaranteeing the LED product export is than the mode of the sample testing of available technology adopting; The present invention both guaranteed the accuracy of test and do not had consume, need not scrap processing as in the prior art specimen being done.
Below in embodiment, be described in detail detailed features of the present invention and advantage; Its content is enough to make those skilled in the art to understand technology contents of the present invention and implements according to this; And according to content, claim and the diagram that this instructions disclosed, those skilled in the art can understand purpose and the advantage that the present invention is correlated with easily.
Description of drawings
Fig. 1 is the LED test flow chart;
Fig. 2 is the side-looking structural representation of the LED proving installation of one embodiment of the invention;
Fig. 3 is the structural representation of first surface of the testing circuit board of one embodiment of the invention;
Fig. 4 is the schematic side view of the LED under one embodiment of the invention test connecting plate state;
Fig. 5 is the plan structure synoptic diagram of pressing portion;
Fig. 6 is the structural representation of first surface of the testing circuit board of another embodiment of the present invention;
Fig. 7 is the schematic side view of the LED under another embodiment of the present invention test connecting plate state;
Fig. 8 is the structural representation of first surface of the testing circuit board of third embodiment of the invention;
Fig. 9 is the structural representation of first surface of the testing circuit board of fourth embodiment of the invention.
Embodiment
For making the object of the invention, structure, characteristic and function thereof there are further understanding, cooperate embodiment to specify as follows now.
As shown in Figure 1; Be the LED test flow chart; The present invention provides the method for testing of a kind of LED, is used to test the LED under the connecting plate state, and so-called connecting plate state is meant in the encapsulation process of LED; Plurality of LEDs with the arrangement mode of array be arranged in package support and LED as yet not from the package support many cut down, this LED method of testing comprises the steps:
Step 1: the LED under the connecting plate state was imitated reflow soldering; The so-called reflow soldering of imitating is meant that the temperature of simulation reflow soldering places this temperature environment special time with the LED under this connecting plate state; Usually test LED yield wants elder generation plurality of LEDs and circuit board collocation to be processed the LED lamp bar of finished product; The purpose of this step 1 is that the temperature environment when LED lamp bar is made in simulation guarantees the accuracy of testing.
In step 3 and step 5, the LED that fails to light is marked.
Fig. 2 is the side-looking structural representation of the LED proving installation 1000 of one embodiment of the invention, is used to test the LED under the connecting plate state, and this LED proving installation 1000 has testing circuit board 10 and laminating mechanism 20.
Please refer to Fig. 2, testing circuit board 10 have first surface 11 and with first surface 11 opposing second surface 12, this LED proving installation 1000 has base 30, said testing circuit board 10 is fixed on this base 30 through fixed sturcture 31.
In an embodiment; The height of this fixed sturcture 31 can be regulated; Thus, can regulate the distance of 30 of this testing circuit board 10 and bases, in step 4; Can this LED proving installation be clamped on the heating plate; Make heating plate between this testing circuit board 10 and base 30, can regulate the clamping degree of this LED proving installation and this heating plate through regulating this fixed sturcture 31, the heat of heating plate can conduct to this testing circuit board 10 and conduct to the LED under the connecting plate state through testing circuit board 10.
Fig. 3 is the structural representation of first surface 11 of the testing circuit board 10 of one embodiment of the invention; Fig. 4 is the schematic side view of the LED under one embodiment of the invention test connecting plate state; Please be simultaneously with reference to figure 2, Fig. 3 and Fig. 4, many first surfaces 11 that testing cushion 100 are arranged in this testing circuit board 10 with the mode of array.
Certainly; These many arrangement modes to testing cushion 100 are not limited to the arrangement mode of array; These many arrangement modes to testing cushion 100 are identical with the arrangement mode that this plurality of LEDs is arranged on the connecting plate, design this many arrangement modes to testing cushion 100 according to the arrangement mode of the plurality of LEDs on the connecting plate.
Each comprises an anodal testing cushion 110 and a negative pole testing cushion 120 to testing cushion 100; First surface 11 in this testing circuit board 10 is provided with a plurality of location structures 300; Be used for when the LED520 under this connecting plate state of test, making the anodal pin 521 of this plurality of LEDs 520 and negative pole pin 522 correspond respectively to anodal testing cushion 110 and negative pole testing cushion 120.
In an embodiment; This location structure 300 is a reference column; Corresponding, LED connecting plate 510 is provided with pilot hole, corresponds respectively to anodal testing cushion 110 and negative pole testing cushion 120 through anodal pin 521 and the negative pole pin 522 that makes pilot hole and cooperating of reference column this plurality of LEDs 520.
Laminating mechanism 20 comprises pressing portion 21; This pressing portion 21 is used for when the LED under the test connecting plate state, pushing this LED connecting plate 510; Make the anodal pin 521 and the negative pole pin 522 of this this plurality of LEDs 520 closely contact anodal testing cushion 110 and negative pole testing cushion 120 respectively; This testing circuit board 10 also comprises anodal access point 210 and negative pole access point 220, and this positive pole access point 210 connects anodal testing cushion 110, and this negative pole access point 220 connects negative pole testing cushion 120; Thereby and drive the LED520 under this connecting plate state through inserting power supply to this positive pole access point 210 and this negative pole access point 220.
Fig. 5 is the plan structure synoptic diagram of pressing portion 21; Usually; The flatness of LED connecting plate self is not fine; Can exist when the pin of the LED on the LED connecting plate contacts with testing cushion and can not guarantee that all pins all fully touch the risk of testing cushion; Pushing this LED connecting plate 510 through pressing portion 21 can be so that the anodal pin 521 of this plurality of LEDs 520 and negative pole pin 522 closely anodal testing cushion 110 of contact and negative pole testing cushion 120 respectively, and this pressing portion 21 is dull and stereotyped for pressing, and strip slot to make way 211 is offered in the position of dull and stereotyped corresponding each the row LED of this pressing; Thereby avoid the pressing flat board to damage LED by pressure; The blank space of utilizing this pressing flat board to push this LED connecting plate 510, so-called blank space is meant the zone that LED is not set on the LED connecting plate, can be so that the anodal pin 521 of this plurality of LEDs 520 and negative pole pin 522 closely contact anodal testing cushion 110 and negative pole testing cushion 120 respectively.
Fig. 6 is the structural representation of first surface 11 ' of the testing circuit board 10 ' of another embodiment of the present invention, sees also Fig. 6, many first surfaces 11 ' that testing cushion 100 ' are arranged in this testing circuit board 10 ' with the mode of array.
Certainly; These many arrangement modes to testing cushion 100 ' are not limited to the arrangement mode of array; These many arrangement modes to testing cushion 100 ' are identical with the arrangement mode that this plurality of LEDs is arranged on the connecting plate, design this many arrangement modes to testing cushion 100 ' according to the arrangement mode of the plurality of LEDs on the connecting plate.
Each comprises an anodal testing cushion 110 ' and a negative pole testing cushion 120 ' to testing cushion 100 '; First surface 11 ' in this testing circuit board 10 ' is provided with a plurality of location structures 300 '; Be used for when the LED520 under this connecting plate state of test, making the anodal pin 521 of this plurality of LEDs 520 and negative pole pin 522 correspond respectively to anodal testing cushion 110 ' and negative pole testing cushion 120 '.
In an embodiment; This location structure 300 ' is a reference column; Corresponding; LED connecting plate 510 is provided with pilot hole, corresponds respectively to anodal testing cushion 110 ' and negative pole testing cushion 120 ' through anodal pin 521 and the negative pole pin 522 that makes pilot hole and cooperating of reference column this plurality of LEDs 520.
Edge in the first surface 11 ' of this testing circuit board 10 ' is provided with two relative strip projections 610 ' and 620 '; These two strip projections 610 ' and 620 ' are parallel to each other with the anodal testing cushion of each row or the negative pole testing cushion of each row respectively, and anodal access point 210 ' is arranged at and negative pole access point 220 ' is arranged at respectively on these two strip projections 610 ' and 620 '.
In an embodiment; Corresponding each row testing cushion is provided with an anodal access point 210 ' and a negative pole access point 220 '; This positive pole access point 210 ' connects all anodal testing cushion 110 ' of this row, and this negative pole access point 220 ' connects all negative pole testing cushion 120 ' of this row.
By this, when execution in step 3 or step 4, the staff is the LED520 on the driving LED connecting plate 510 line by line, reaches economize on electricity, avoids the purpose of omission.
Fig. 7 is the schematic side view of the LED under another embodiment of the present invention test connecting plate state; Please be simultaneously with reference to figure 2, Fig. 6 and Fig. 7; Laminating mechanism 20 comprises pressing portion 21; This pressing portion 21 is used for when the LED under the test connecting plate state, pushing this LED connecting plate 510, makes the anodal pin 521 of this plurality of LEDs 520 and negative pole pin 522 closely contact anodal testing cushion 110 ' and negative pole testing cushion 120 ' respectively.
This laminating mechanism 20 also comprises pressing handle 22, and the staff can control the up-down of this pressing portion 21 through operating this pressing handle 22.
In an embodiment, these two strip projections 610 ' and 620 ' and this testing circuit board 10 ' one-body molded.
Fig. 8 is the structural representation of first surface of the testing circuit board of third embodiment of the invention; Be with the difference of first embodiment (being Fig. 3); The anodal testing cushion 110 of each row on this testing circuit board and the negative pole testing cushion 120 of each row attach the conducting resinl 400 of a strip respectively, and the conducting resinl 400 of this strip covers all anodal testing cushion 110 of these row or all negative pole testing cushion 120 that should be listed as.
Fig. 9 is the structural representation of first surface of the testing circuit board of fourth embodiment of the invention; Be with the difference of second embodiment (being Fig. 6), all attach conducting resinl 400 ' on each anodal testing cushion 110 ' and each the negative pole testing cushion 120 ' on this testing circuit board.
For make the LED proving installation can execution in step 3 again can execution in step 4, preferred, the conducting resinl 400 of this strip and conducting resinl 400 ' are high-temperature resistant conducting glue.
Conducting resinl had not only made pin and the testing cushion of LED fully contact but also play the effect of conduction, heat conduction.
Certainly, so still be the mode of attaching conducting resinl of Fig. 9 to selecting Fig. 8, the present invention does not limit.
For make this LED proving installation can execution in step 3 again can execution in step 4, can heating arrangement directly be set in the second surface of this testing circuit board, when execution in step 4, utilize this heating arrangement heating and heat conducted to testing circuit board.
Utilize LED proving installation of the present invention and LED method of testing directly to test to the LED under the connecting plate state; So; Can detect each LEDs, the yield when guaranteeing the LED product export is than the mode of the sample testing of available technology adopting; The present invention both guaranteed the accuracy of test and do not had consume, need not scrap processing as in the prior art specimen being done.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is merely the example of embodiment of the present invention.Must be pointed out that the embodiment that has disclosed does not limit scope of the present invention.On the contrary, change and retouching not breaking away from the spirit and scope of the present invention to be done all belong to scope of patent protection of the present invention.
Claims (11)
1. a LED proving installation is characterized in that, this LED proving installation is used to test the LED under the connecting plate state, and this LED proving installation comprises:
Testing circuit board; Have first surface and with the first surface opposing second surface; Many testing cushion is arranged at this first surface, each comprises an anodal testing cushion and a negative pole testing cushion to testing cushion, when the LED under this connecting plate state of test; Anodal pin and negative pole pin that this LED connecting plate is positioned over the plurality of LEDs on this first surface and this connecting plate correspond respectively to anodal testing cushion and negative pole testing cushion; This testing circuit board also comprises anodal access point and negative pole access point, and this positive pole access point connects anodal testing cushion, and this negative pole access point connects the negative pole testing cushion;
Laminating mechanism; This laminating mechanism comprises pressing portion; This pressing portion is used for when the following LED of test connecting plate state, pushing this LED connecting plate makes anodal pin and negative pole the pin closely anodal testing cushion of contact and the negative pole testing cushion respectively of this this plurality of LEDs, thereby and drives the LED under this connecting plate state through access power supply to this positive pole access point and this negative pole access point.
2. LED proving installation as claimed in claim 1 is characterized in that, these many first surfaces that testing cushion are arranged in this testing circuit board with the mode of array.
3. LED proving installation as claimed in claim 2; It is characterized in that; The edge of the first surface of this testing circuit board is provided with two relative strip projections; These two strip projections are parallel to each other with the anodal testing cushion of each row or the negative pole testing cushion of each row respectively, and anodal access point and negative pole access point are arranged at respectively on these two strip projections.
4. like claim 2 or 3 described LED proving installations; It is characterized in that; Corresponding each row testing cushion is provided with an anodal access point and a negative pole access point, and this positive pole access point connects all anodal testing cushion of this row, and this negative pole access point connects all negative pole testing cushion of this row.
5. LED proving installation as claimed in claim 1; It is characterized in that; These many first surfaces that testing cushion are arranged in this testing circuit board with the mode of array; And the anodal testing cushion of each row and the negative pole testing cushion of each row attach the conducting resinl of a strip respectively, and the conducting resinl of this strip covers all anodal testing cushion of these row or all negative pole testing cushion that should be listed as.
6. LED proving installation as claimed in claim 1 is characterized in that, all attaches conducting resinl on each anodal testing cushion and each the negative pole testing cushion.
7. like claim 5 or 6 described LED proving installations, it is characterized in that this conducting resinl is a high-temperature resistant conducting glue.
8. LED proving installation as claimed in claim 1; It is characterized in that; When this testing circuit board is provided with a plurality of location structures and is used for as the LED of test under this connecting plate state, make the anodal pin of this plurality of LEDs and negative pole pin correspond respectively to anodal testing cushion and negative pole testing cushion.
9. LED proving installation as claimed in claim 1 is characterized in that, this pressing portion comprises that pressing is dull and stereotyped, and the strip slot to make way is offered in the position of dull and stereotyped corresponding each the row LED of this pressing.
10. LED proving installation as claimed in claim 1 is characterized in that, is provided with heating arrangement in the second surface of this testing circuit board.
11. a LED method of testing is characterized in that, this method comprises:
Step 1: the LED under the connecting plate state was imitated reflow soldering;
Step 2, cooling;
Step 3 is carried out the step of lighting test under the normal temperature to the LED under this connecting plate state;
Step 4 heats the LED under this connecting plate state and reaches specified temp, and lights the step of test under this specified temp environment the LED under this connecting plate state being carried out;
Step 5 finishes test;
Wherein, in step 3 and step 4, use like the described LED proving installation of any claim of claim 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101330404A CN102650676A (en) | 2012-05-02 | 2012-05-02 | LED testing device and LED testing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101330404A CN102650676A (en) | 2012-05-02 | 2012-05-02 | LED testing device and LED testing method |
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| CN102650676A true CN102650676A (en) | 2012-08-29 |
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| CN2012101330404A Pending CN102650676A (en) | 2012-05-02 | 2012-05-02 | LED testing device and LED testing method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102798739A (en) * | 2012-09-06 | 2012-11-28 | 杭州士兰集成电路有限公司 | IC (Integrated Circuit) plastic-package body voltage withstand test clamp and test methods |
| CN105866708A (en) * | 2016-05-20 | 2016-08-17 | 台龙电子（昆山）有限公司 | Overall-plate efficient lighting fixture |
| CN105866707A (en) * | 2016-05-20 | 2016-08-17 | 台龙电子（昆山）有限公司 | Overall-plate constant-temperature lighting fixture |
| CN106356435A (en) * | 2015-07-13 | 2017-01-25 | 广东德力光电有限公司 | Flip-chip pressing machine and flip-chip light-emitting diode packaging method |
| CN109633400A (en) * | 2018-12-21 | 2019-04-16 | 无锡职业技术学院 | VDMOS vertical gate field-effect transistor performance detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109633400A (en) * | 2018-12-21 | 2019-04-16 | 无锡职业技术学院 | VDMOS vertical gate field-effect transistor performance detection device |
| CN109633400B (en) * | 2018-12-21 | 2020-10-09 | 无锡职业技术学院 | VDMOS vertical grid field effect transistor performance detection device |
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Application publication date: 20120829 |