CN109633400B - VDMOS vertical grid field effect transistor performance detection device - Google Patents

VDMOS vertical grid field effect transistor performance detection device Download PDF

Info

Publication number
CN109633400B
CN109633400B CN201811569791.4A CN201811569791A CN109633400B CN 109633400 B CN109633400 B CN 109633400B CN 201811569791 A CN201811569791 A CN 201811569791A CN 109633400 B CN109633400 B CN 109633400B
Authority
CN
China
Prior art keywords
fixedly connected
top end
circuit board
vdmos
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811569791.4A
Other languages
Chinese (zh)
Other versions
CN109633400A (en
Inventor
梅华斌
俞林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Snow Cloud Data Technology Co.,Ltd.
Original Assignee
Wuxi Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Institute of Technology filed Critical Wuxi Institute of Technology
Priority to CN201811569791.4A priority Critical patent/CN109633400B/en
Publication of CN109633400A publication Critical patent/CN109633400A/en
Application granted granted Critical
Publication of CN109633400B publication Critical patent/CN109633400B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2621Circuits therefor for testing field effect transistors, i.e. FET's

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to the technical field of transistor detection, in particular to a VDMOS vertical gate field effect transistor performance detection device, which comprises a circuit board and a transistor, wherein the top end of the circuit board is fixedly connected with a baffle, one side of the top end of the baffle is fixedly connected with a horizontally arranged heating wire, the top end of the circuit board is electrically connected with a steel wire, the other end of the steel wire is fixedly connected with a horizontally arranged pressing plate, the top end of the pressing plate is fixedly connected with a vertically arranged spring, and the top end of the spring is fixedly connected with the bottom end of the circuit board. Has huge economic benefit and wide market prospect, and is worth popularizing and using.

Description

VDMOS vertical grid field effect transistor performance detection device
Technical Field
The invention relates to the technical field of transistor detection, in particular to a VDMOS vertical gate field effect transistor performance detection device.
Background
The VDMOS is an ideal power device no matter in switch application or linear application, and is mainly used in motor speed regulation, inverter, UPS, electronic switch, hi-fi stereo, automobile electric appliance, electronic ballast, etc. it features near infinite static input impedance characteristic, very fast switching time, positive temperature coefficient of on-resistance, transconductance of approximate constant and high dV/dt, firstly, an N-type epitaxial layer grows on a heavily doped N + substrate, a channel is formed by the difference of the two lateral diffusion junction depths of a P-type base region and an N + source region, the two regions are implanted with respective doping impurities through a gate self-alignment process in the ion implantation process, therefore, there is an increasing demand for a VDMOS vertical gate field effect transistor performance detection apparatus.
Most VDMOS vertical grid field effect transistor performance detection devices in the existing market cannot test the stability of a transistor in a high-temperature state, cannot detect whether the transistor can normally operate in a bad working environment with poor heat dissipation, and have large difference between experimental parameters and actual used parameters.
Disclosure of Invention
The invention aims to provide a device for detecting the performance of a VDMOS vertical gate field effect transistor, so as to solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
the VDMOS vertical grid field effect transistor performance detection device comprises a circuit board and a transistor, wherein a baffle is fixedly connected to the top end of the circuit board, a horizontally arranged heating wire is fixedly connected to one side of the top end of the baffle, a steel wire is electrically connected to the top end of the circuit board, a horizontally arranged pressing plate is fixedly connected to the other end of the steel wire, a vertically arranged spring is fixedly connected to the top end of the pressing plate, the top end of the spring is fixedly connected with the bottom end of the circuit board, horizontally arranged pins are electrically connected to the front end of the transistor, bent rods are rotatably connected to the left side and the right side of the top end of the circuit board, a spring piece is fixedly connected to the inner side of each bent rod, the bottom end of the spring piece is fixedly connected with the top end of the circuit board, a horizontally arranged fixed block is fixedly connected to the, the other end of the metal wire is fixedly connected with a pull ring, the right side of the metal wire is fixedly connected with a limiting ring at the top end of the curved rod, and the inner side of the limiting ring is connected with the outer side of the metal wire in a sliding mode.
Preferably, one end surface of the baffle is arranged in an arc surface shape, and the arc surface end of the baffle is connected with the bottom end of the outer side of the transistor in a sliding mode.
Preferably, the outer side of the metal wire is connected with a spring clamp in a sliding mode, and the left end of the spring clamp is attached to the right end of the limiting ring.
Preferably, the axis of the heating wire and the center of the curved bar are located on the same vertical plane, and the heating wire is located right above the transistor.
Preferably, the quantity of steel wire is 3, the length of steel wire is equal, and the steel wire is evenly distributed on the top of clamp plate.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the stability test of the transistor in a high-temperature state is realized through the arranged electric heating wire, the bent rod and the metal wire, whether the transistor can normally operate in a severe working environment with poor heat dissipation can be detected, and the difference between experimental parameters and actual parameters is shortened.
2. According to the invention, the simple fixing of the pins is realized through the arranged steel wire, the pressing plate and the spring, the bending of the pins is reduced, the breakage is prevented, and the mechanical damage of the transistor in the detection process is avoided.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the installation structure of the baffle.
In the figure: 1-circuit board, 2-baffle, 3-electric heating wire, 4-steel wire, 5-pressing plate, 6-spring, 7-pin, 8-transistor, 9-curved bar, 10-spring piece, 11-fixed block, 12-metal wire, 13-pull ring, 14-spacing ring, 15-spring clip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
the VDMOS vertical grid field effect transistor performance detection device comprises a circuit board 1 and a transistor 8, wherein a baffle 2 is fixedly connected to the top end of the circuit board 1, a heating wire 3 which is horizontally arranged is fixedly connected to one side of the top end of the baffle 2, a steel wire 4 is electrically connected to the top end of the circuit board 1, a pressing plate 5 which is horizontally arranged is fixedly connected to the other end of the steel wire 4, a spring 6 which is vertically arranged is fixedly connected to the top end of the pressing plate 5, the top end of the spring 6 is fixedly connected with the bottom end of the circuit board 1, a pin 7 which is horizontally arranged is electrically connected to the front end of the transistor 8, bent rods 9 are rotatably connected to the left side and the right side of the top end of the circuit board 1, spring pieces 10 are fixedly connected to the inner sides of the bent rods 9, the bottom end of the spring pieces 10 is fixedly connected with the top end of, the right end of the fixed block 11 is fixedly connected with a metal wire 12, the other end of the metal wire 12 is fixedly connected with a pull ring 13, the right side is fixedly connected with a limit ring 14 at the top end of the curved rod 9, and the inner side of the limit ring 14 is connected with the outer side of the metal wire 12 in a sliding mode.
One end face of the baffle 2 is in an arc-surface-shaped arrangement, the arc-surface end of the baffle 2 is in sliding connection with the bottom end of the outer side of the transistor 8, the arrangement is favorable for protecting an internal circuit of the transistor 8 and reducing friction at the bottom end of the transistor 8, the outer side of the metal wire 12 is in sliding connection with the spring clamp 15, the left end of the spring clamp 15 is attached to the right end of the limiting ring 14, the arrangement is favorable for stabilizing the bent rod 9 and maintaining the downward pressing state of the heating wire 3, the axis of the heating wire 3 and the center of the bent rod 9 are positioned on the same vertical plane, the heating wire 3 is positioned right above the transistor 8, the arrangement is favorable for accurately pressing the heating wire 3 to heat the transistor 8, the number of the steel wires 4 is 3, the lengths of the steel wires 4 are equal, the steel wires 4 are uniformly distributed at the top end of the pressing plate 5, and the arrangement is favorable, reducing the bending of the leads 7.
The model of the heating wire 3 is MZFR-J1000W heating wire.
The working process is as follows: before the device is used, a power supply is connected, a pressing plate 5 is pressed upwards, a spring 6 is stressed and compressed, a steel wire 4 slides upwards to push a transistor 8 forwards, the spring 6 extends, the pressing plate 5 is bounced downwards, the steel wire 4 slides downwards to press a pin 7, simple fixing of the pin 7 is realized, bending of the pin 7 is reduced, fracture is prevented, mechanical damage of the transistor 8 in the detection process is avoided, a pull ring 13 is pulled rightwards, a metal wire 12 moves rightwards, a fixing block 11 drives a left-side bent rod 9 to rotate clockwise, the left-side bent rod 9 drives the fixing block 11 and the metal wire 12 to descend, a limiting ring 14 descends to drive the right-side bent rod 9 to rotate anticlockwise, one end of the bent rod 9 presses a heating wire 3, the bottom end of the heating wire 3 is attached to the top end of the transistor 8, the heating wire 3 is electrified to heat the transistor 8, stability test of the transistor in a high, shortening the gap between experimental parameters and parameters actually used.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

  1. VDMOS vertical gate field effect transistor performance detection device, including circuit board (1) and transistor (8), its characterized in that: the heating wire fixing structure is characterized in that a baffle (2) is fixedly connected to the top end of the circuit board (1), a heating wire (3) horizontally arranged is fixedly connected to one side of the top end of the baffle (2), a steel wire (4) is electrically connected to the top end of the circuit board (1), a pressing plate (5) horizontally arranged is fixedly connected to the other end of the steel wire (4), a vertically arranged spring (6) is fixedly connected to the top end of the pressing plate (5), the top end of the spring (6) is fixedly connected with the bottom end of the circuit board (1), a horizontally arranged pin (7) is electrically connected to the front end of the transistor (8), a bent rod (9) is rotatably connected to the left side and the right side of the top end of the circuit board (1), a spring piece (10) is fixedly connected to the inner side of the bent rod (9), the bottom end of the spring piece (10) is fixedly connected with the top end of the circuit board (1), and, the right-hand member fixedly connected with wire (12) of fixed block (11), the other end fixedly connected with pull ring (13) of wire (12), right side the top fixedly connected with spacing ring (14) of curved bar (9), and the inboard outside sliding connection of spacing ring (14) and wire (12).
  2. 2. The VDMOS vertical gate field effect transistor performance detection apparatus of claim 1, wherein: the inner end surface of the baffle (2) is arc-surface-shaped, and the arc-surface end of the baffle (2) is connected with the bottom end of the outer side of the transistor (8) in a sliding manner.
  3. 3. The VDMOS vertical gate field effect transistor performance detection apparatus of claim 1, wherein: the outside sliding connection of wire (12) has spring clamp (15), and the left end of spring clamp (15) and the right-hand member of spacing ring (14) are laminated mutually.
  4. 4. The VDMOS vertical gate field effect transistor performance detection apparatus of claim 1, wherein: the axis of the electric heating wire (3) and the center of the curved rod (9) are positioned on the same vertical plane, and the electric heating wire (3) is positioned right above the transistor (8).
  5. 5. The VDMOS vertical gate field effect transistor performance detection apparatus of claim 1, wherein: the quantity of steel wire (4) is 3, the length homogeneous phase of steel wire (4) equals, and steel wire (4) are evenly distributed on the top of clamp plate (5).
CN201811569791.4A 2018-12-21 2018-12-21 VDMOS vertical grid field effect transistor performance detection device Active CN109633400B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811569791.4A CN109633400B (en) 2018-12-21 2018-12-21 VDMOS vertical grid field effect transistor performance detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811569791.4A CN109633400B (en) 2018-12-21 2018-12-21 VDMOS vertical grid field effect transistor performance detection device

Publications (2)

Publication Number Publication Date
CN109633400A CN109633400A (en) 2019-04-16
CN109633400B true CN109633400B (en) 2020-10-09

Family

ID=66076191

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811569791.4A Active CN109633400B (en) 2018-12-21 2018-12-21 VDMOS vertical grid field effect transistor performance detection device

Country Status (1)

Country Link
CN (1) CN109633400B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412284A (en) * 1990-04-28 1992-01-16 Fujitsu Ltd Ic receptacle
US6914446B1 (en) * 2003-07-22 2005-07-05 Unisys Corporation Chip tester having a heat-exchanger with an extendable period of operation
CN2874502Y (en) * 2005-12-27 2007-02-28 鸿富锦精密工业(深圳)有限公司 Adhesive sheet element detection clamp
CN101363897A (en) * 2007-08-08 2009-02-11 中国科学院半导体研究所 Device and method for burn-in screening array device
CN102650676A (en) * 2012-05-02 2012-08-29 威力盟电子(苏州)有限公司 LED testing device and LED testing method
JP2013224891A (en) * 2012-04-23 2013-10-31 Denso Corp Inspection device
CN103499783A (en) * 2013-09-30 2014-01-08 贵州航天计量测试技术研究所 Diode testing device and use method thereof
CN106483439A (en) * 2015-08-31 2017-03-08 中芯国际集成电路制造(上海)有限公司 The self-heating effect evaluation method and self-heating effect evaluation system of ldmos transistor
CN106526442A (en) * 2015-09-09 2017-03-22 中芯国际集成电路制造(上海)有限公司 LDMOS transistor self-heating effect evaluation method and self-heating effect evaluation system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9347987B2 (en) * 2009-11-06 2016-05-24 Intel Corporation Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412284A (en) * 1990-04-28 1992-01-16 Fujitsu Ltd Ic receptacle
US6914446B1 (en) * 2003-07-22 2005-07-05 Unisys Corporation Chip tester having a heat-exchanger with an extendable period of operation
CN2874502Y (en) * 2005-12-27 2007-02-28 鸿富锦精密工业(深圳)有限公司 Adhesive sheet element detection clamp
CN101363897A (en) * 2007-08-08 2009-02-11 中国科学院半导体研究所 Device and method for burn-in screening array device
JP2013224891A (en) * 2012-04-23 2013-10-31 Denso Corp Inspection device
CN102650676A (en) * 2012-05-02 2012-08-29 威力盟电子(苏州)有限公司 LED testing device and LED testing method
CN103499783A (en) * 2013-09-30 2014-01-08 贵州航天计量测试技术研究所 Diode testing device and use method thereof
CN106483439A (en) * 2015-08-31 2017-03-08 中芯国际集成电路制造(上海)有限公司 The self-heating effect evaluation method and self-heating effect evaluation system of ldmos transistor
CN106526442A (en) * 2015-09-09 2017-03-22 中芯国际集成电路制造(上海)有限公司 LDMOS transistor self-heating effect evaluation method and self-heating effect evaluation system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
功率裸芯片的测试与老化筛选技术;刘林春 等;《电子产品可靠性与环境试验》;20071220;第25卷(第6期);全文 *

Also Published As

Publication number Publication date
CN109633400A (en) 2019-04-16

Similar Documents

Publication Publication Date Title
CN203415580U (en) Electrode structure of power semiconductor chip
CN203733570U (en) Heat dissipation device of high-frequency switching mode power supply transformer
JP5722466B2 (en) Probe device for measuring characteristics of solar cells
CN109633400B (en) VDMOS vertical grid field effect transistor performance detection device
CN106450363A (en) Tab-pressing position adjustment mechanism for formation of flexibly-packaged lithium battery
CN104368730A (en) Diode bending and shaping tool
CN206516412U (en) Temperature alarm type copper busbar
CN203850202U (en) Novel 6-10V clamping type isolation switch
CN204303710U (en) A kind of DC circuit breaker radiation conductive device reducing eddy current effect
CN202736911U (en) Bidirectional thyristor with symmetrical trigger current
CN102709101A (en) Contact structure of isolating switch
CN201478182U (en) Moving and static contacts connecting structure of indoor high-voltage earthing switch
CN212461247U (en) Limiting device for cable production line
CN204558399U (en) Novel breaker contact system
CN210607265U (en) Planar gate bipolar transistor structure for improving breakdown characteristic
CN204144644U (en) A kind of current-collector
CN203118519U (en) Large-area self- heat-dissipation copper busbar
CN203721604U (en) Isolating switch
CN206961820U (en) A kind of fine motion electrode of power semiconductor chip
CN202307903U (en) Radio frequency-lateral double-diffused metal-oxide semiconductor (RF-LDMOS) device structure without epitaxial layer
CN203931854U (en) Novel electric draw bail
CN204396740U (en) A kind of diode bends integer frock
CN208938839U (en) A kind of band-type brake and control integrated power supply
CN202025762U (en) High-speed thyristor with segmented width-changing involute multi-fingered amplifying gate structure
CN104399806B (en) High-voltage distribution box copper brace simple forming device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230928

Address after: B405, China Internet of Things International Innovation Park, No. 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000

Patentee after: Wuxi Snow Cloud Data Technology Co.,Ltd.

Address before: No. 1600, gaolang West Road, Binhu District, Wuxi City, Jiangsu Province

Patentee before: WUXI INSTITUTE OF TECHNOLOGY