CN102593333B - 发光装置封装及其制造方法 - Google Patents
发光装置封装及其制造方法 Download PDFInfo
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Abstract
本发明公开一种发光装置封装及其制造方法,该发光装置封装包括:其上设置有安装部和端子部的封装本体;安装在安装部上的发光装置芯片;电连接发光装置芯片的电极和端子部的接合线。该接合线包括从发光装置芯片上升至环峰的上升部以及连接环峰和端子部的延伸部。上升部上设置有沿着与上升部上升的方向相交的方向弯曲的第一弯折部。
Description
技术领域
本发明涉及发光装置封装及其制造方法。
背景技术
发光装置芯片,例如发光二极管(LED),是指通过构成穿过化合物半导体PN结的发光源而发出各种颜色光的半导体装置。LED具有的优势在于它使用寿命长、体积小、重量轻、光的方向性强以及驱动电压低。另外,LED可应用于各种领域,因为它们非常抗冲击和震动、不需要预热、驱动方式简单并且可以各种形式封装。
发光装置芯片(诸如LED)在安装于模架和由金属制成的引线框上之后通过封装工艺而制造成为发光装置封装。
发明内容
本发明提供包括具有高耐久性的接合线的发光装置封装以及该发光装置封装的制造方法。
其他方面会在下文的描述中部分地加以阐明,并且部分地从描述中显而易见,或者可通过实施所提出的实施方式而获知。
根据本发明的一方面,发光装置封装包括:封装本体,其上设置有安装部和端子部;发光装置芯片,其安装在安装部上;以及接合线,其电连接发光装置芯片的电极和端子部,其中接合线包括从发光装置芯片上升至环峰(loop peak)的上升部以及连接环峰和端子部的延伸部,其中,上升部上设置有沿着与上升部上升的方向相交的方向弯曲的第一弯折(kink)部。
延伸部可包括:跨接部,其从环峰朝着端子部延伸;以及下降部,其从跨接部朝着端子部下降并且具有接合至端子部的端部,其中,跨接部上设置有向下弯曲的第二弯折部。
接合线和发光装置芯片可以被透明封装层覆盖。
封装本体可包括形成空腔的上框以及在空腔下方形成一结构并允许安装部和端子部设置于其上的引线框,其中接合线和发光装置芯片被填充在空腔内的透明封装层覆盖。
根据本发明的另一方面,提供一种发光装置封装,包括:发光装置芯片;端子部;电连接发光装置芯片和端子部的接合线;以及覆盖发光装置芯片和接合线的透明封装层,其中接合线包括沿着与接合线延伸的方向相交的方向弯曲的弯折部。
接合线可形成连接发光装置芯片和端子部的导线环,并且弯折部可朝着导线环的内侧弯曲。
接合线可包括:从发光装置芯片上升至环峰的上升部、从环峰朝着端子部延伸的跨接部、以及从跨接部朝着端子部下降的下降部,其中弯折部设置在上升部和跨接部中的至少一个上。
根据本发明的另一方面,发光装置封装的制造方法包括:将发光装置芯片安装在封装本体的安装部上;通过降低供应导线的细管(capillary)并将导线的端部接合至发光装置芯片的电极焊盘而形成第一连接部;沿着上升路径升高细管,以便形成接合线的形状;通过朝着封装本体的端子部降低细管并将导线的另一端部接合至端子部而形成第二连接部;以及切断接合线,其中上升路径包括从穿过第一连接部的竖直基准线朝着端子部弯曲的至少一个突出路径。
接合线可包括从第一连接部朝着环峰向上延伸的上升部以及连接环峰和端子部的延伸部,其中上升路径包括分别对应于上升部和延伸部的第一上升路径和第二上升路径,其中突出路径设置在第一和第二上升路径中的至少一个上。
延伸部可包括:跨接部,其从环峰朝着端子部延伸;以及下降部,其从跨接部朝着端子部下降并且具有接合至端子部的端部,其中第二上升路径包括分别对应于跨接部和下降部的第三上升路径和第四上升路径,其中突出路径包括设置在第一上升路径上的第一突出路径和设置在第三上升路径上的第二突出路径。
第一上升路径的对应于环峰的端部可设置在关于竖直基准线与端子部相对的一侧。
附图说明
从以下结合附图对实施方式的描述,这些和/或其它方面将变得显而易见且更容易理解,附图中:
图1是根据本发明实施方式的发光装置封装的横截面图;
图2是示出图1中发光装置封装的接合线的详细横截面图;
图3是示出施加压缩应力时第一弯折部的运动的视图;
图4是示出施加膨胀应力时第一弯折部的运动的视图;
图5是示出施加膨胀应力时第二弯折部的运动的视图;
图6是示出施加压缩应力时第二弯折部的运动的视图;
图7是用于说明根据本发明实施方式的发光装置封装的制造方法的横截面图,示出了通过将导线接合至发光装置芯片的电极焊盘而形成第一连接部的情况;
图8是用于说明图7的方法的横截面图,示出了用于形成接合线形状的细管的上升路径;
图9是用于说明图7的方法的横截面图,示出了通过将导线接合至引线框的端子部而形成第二连接部的情况;以及
图10是用于说明图7的方法的横截面图,示出了形成第二连接部之后将导线切断的情况。
具体实施方式
下文将参照附图说明本发明的实施方式。在附图中,相同的参考标号表示相同的元件,并且为了清楚起见,可以扩大元件的尺寸或厚度。
图1是根据本发明实施方式的发光装置封装1的横截面图。参照图1,发光装置封装1可包括封装本体2,其中形成有安装发光装置芯片300的空腔3。
发光装置芯片300可以为发光二极管(LED)芯片。根据用于形成LED芯片的化合物半导体的材料,LED芯片可发出蓝光、绿光和红光。例如,蓝色LED芯片可包括有源层,该有源层包括通过交替设置GaN和InGaN而形成的多个量子阱层,并且由AlXGaYNZ化合物半导体形成的P型覆盖层和N型覆盖层可形成在有源层下方和上方。另外,LED芯片可发射没有颜色的紫外线(UV)光。虽然发光装置芯片300为图1所示的LED芯片,但本发明的实施方式不限于此。例如,发光装置芯片300可以为UV光电二极管芯片、激光二极管芯片、有机发光二极管芯片。
封装本体2可包括导电引线框200以及上框100。引线框200可包括其上安装有发光装置芯片300的安装部210以及通过利用导线接合电连接至发光装置芯片300的第一端子部220和第二端子部230。例如,第一和第二端子部220和230可分别通过接合线401和402连接至发光装置芯片300的阳极和阴极。第一和第二端子部220和230可超出上框100而部分地暴露以用作向发光装置芯片300供应电流的端子。引线框200可通过压制或蚀刻诸如铝或铜的导电金属板材料而制成。
上框100可以为通过例如嵌入成型(insert molding)耦接至引线框200的模架。上框100可以由例如电绝缘聚合物形成。上框100形成为凹形,通过该凹形露出安装部210以及第一和第二端子部220和230。因此,空腔3是形成在封装本体2中的。安装部210以及第一和第二端子部220和230构成位于空腔3下面的结构。
空腔3的内表面101可以为反射从发光装置芯片300发出的光的反射表面,以使光从发光装置封装1发出。为此,可将具有高光反射性的材料,例如,银(Ag)、铝(Al)、铂(Pt)、钛(Ti)、铬(Cr)或铜(Cu),涂覆或沉积在内表面101上。可替换地,可以接合由上述材料形成的板。可替换地,内表面101的至少一部分可以由引线框200形成。
因此,发光装置封装1被构造成使得发光装置芯片300设置在基本上为凹形的空腔3的底面上,并且封装本体2的内表面101用作用于反射光的反射部,以将光发射到发光装置封装1的外部。引线框200的安装部210以及第一和第二端子部220和230可在上框100下面露出,以用作发热表面。
由诸如硅的透明树脂形成的封装层500形成在空腔3内,以便保护发光装置芯片300以及接合线401和402不受外界影响。封装层500中可包含用于将发光装置芯片300发出的光转换成具有期望颜色的光的荧光材料。荧光材料可以由单一成分或者两种或多种成分的混合物构成。
图2是示出连接图1中的发光装置封装1的发光装置芯片300和第一端子部220的接合线401的详细横截面图。参照图2,接合线401包括:上升部410,其从发光装置芯片300朝着环峰412上升;以及延伸部440,其从环峰412朝着第一端子部220延伸且具有接合至第一端子部220的端部。上升部410的第一连接部411,即上升部410的与环峰412相对的端部,接合至发光装置芯片300,具体地接合至发光装置芯片300的阳极焊盘301。第二连接部431,即延伸部440的端部,接合至第一端子部220。虽然在图2中延伸部440包括从环峰412朝着第一端子部220延伸的跨接部420以及从跨接部420下降至第一端子部220的下降部430,但本实施方式不限于此。只要可以形成第二弯折部421,则第二弯折部421和第二连接部431之间的区域可具有一条或多条直线或曲线。
如果封装层500形成在整个空腔3内,则接合线401被埋置在封装层500中。一旦发光装置芯片300开始操作,接合线401和封装层500由于发光装置芯片300中产生热量而发生热膨胀。在这种情况下,由于接合线401和封装层500之间的热膨胀系数的差异,有应力施加于接合线401。这在发光装置芯片300停止操作和冷却时也会发生。如果由于接合线401和封装层500之间的热膨胀系数的差异而重复地施加膨胀应力和压缩应力,则第一和第二连接部411和431被迫分别与电极焊盘301和第一端子部220分离。另外,由于接合线401和封装层500之间的热膨胀系数的差异产生的应力,接合线401可能断裂。
为了降低由于施加于接合线401的应力而产生的导线断裂风险,发光装置封装1包括用于减小施加于接合线401的应力的弯折部。术语“弯折”表示弯曲的形状。弯折部沿着与接合线401延伸的方向相交的方向弯曲。弯折部可设置在接合线401的多个位置处。
参照图2,弯折部可包括设置在上升部410上的第一弯折部413。第一弯折部413沿着与上升部410上升的方向相交的方向弯曲。第一弯折部413在延伸部440延伸的方向上(即,朝着第一端子部220)弯曲。第一弯折部413朝着由接合线401形成的导线环的内侧弯曲。
如果发光装置芯片300重复地启动和停止操作,则膨胀应力和压缩应力重复地施加于接合线401。图3是示出施加压缩应力时第一弯折部413的运动的横截面图。参照图3,当压缩应力施加于接合线401时,第一弯折部413通过如虚线所示地收缩来吸收该压缩应力。图4是示出施加膨胀应力时第一弯折部413的运动的横截面图。参照图4,当膨胀应力施加于接合线401时,第一弯折部413通过如虚线所示地膨胀来吸收该膨胀应力。在图3和图4中,为了便于说明,压缩应力和膨胀应力简单地竖直施加于接合线401。然而,因为压缩应力和膨胀应力施加于整个接合线401,本领域技术人员应该理解,接合线401实际上可能以与图3和图4所示不同的形状变形。例如,虽然未示出,如果施加压缩应力,则第一弯折部413可以收缩,使得第一弯折部413和环峰412之间的区域在延伸部440延伸的方向上(即,朝着第一端子部220)倾斜。如果施加膨胀应力,则第一弯折部413可以膨胀,使得第一弯折部413和环峰412之间的区域在与延伸部440延伸的方向相反的方向上倾斜。
如上所述,由于第一弯折部413用作可以响应膨胀应力和压缩应力并帮助接合线401适当变形的缓冲部,所以可以降低接合线401本身断裂的风险。另外,由于膨胀应力和压缩应力被吸收,所以可以降低第一和第二连接部411和431分别与发光装置芯片300和第一端子部220分离的风险。
弯折部还可包括设置在延伸部440上的第二弯折部421。在图2中,第二弯折部421设置在跨接部420上。第二弯折部421沿着与延伸部440延伸的方向相交的方向弯曲。在图2中,第二弯折部421向下弯曲,即朝着由接合线401形成的导线环的内侧弯曲。当施加膨胀应力时,第二弯折部421如图5的虚线所示地膨胀,并且当施加压缩应力时,第二弯折部421如图6的虚线所示地收缩。同样,由于第二弯折部421用作可以响应压缩应力和膨胀应力并帮助接合线401适当变形的缓冲部,所以可以降低接合线401本身断裂的风险。另外,可以降低第一和第二连接部411和431分别与发光装置芯片300和第一端子部220分离的风险。
在图5和图6中,为了便于说明,压缩应力和膨胀应力简单地水平施加于接合线401。然而,本领域技术人员应该理解,接合线401实际上可能以与图5和图6所示不同的形状的变形。例如,当压缩应力施加于整个接合线401时,第一弯折部413可以收缩,使得第一弯折部413和环峰412之间的区域在延伸部440延伸的方向上倾斜。在这种情况下,第二弯折部421可以如图6的虚线所示地收缩。另外,当施加膨胀应力时,第一弯折部413可以膨胀,使得第一弯折部413和环峰412之间的区域在与延伸部440延伸的方向相反的方向上倾斜。在这种情况下,第二弯折部421可以如图5的虚线所示地膨胀。同样,由于第一弯折部413和第二弯折部421响应压缩应力或膨胀应力并且收缩或膨胀来吸收所述应力,所以可以降低接合线401本身断裂的风险或者第一和第二连接部411和431分别与发光装置芯片300和第一端子部220分离的风险。
弯折部可具有朝着导线环的内侧弯曲的形状,以便使接合线401形成的导线环占据的空间最小,但本实施方式不限于此。弯折部可具有朝着导线环的外侧弯曲或朝着导线环的内侧和外侧两侧弯曲的形状。虽然在图2中一个第一弯折部413和一个第二弯折部421设置在接合线401上,但本实施方式不限于此。如果必要,可设置两个或多个第一和第二弯折部413和421。当弧高(即,从发光装置芯片300到环峰412的高度)等于或大于约200μm时,弯折部的缓冲操作会非常有效。
虽然在上述实施方式中通过利用弯折部降低了膨胀应力和压缩应力,但本发明不限于此。膨胀应力和压缩应力还可能由于施加于发光装置封装1的外部冲击而产生,并且通过利用上述操作来降低由于外部冲击产生的应力,弯折部可以降低接合线401断裂的风险以及第一和第二连接部411和431分离的风险。
虽然以上说明了连接至第一端子部220的接合线401,但同样的说明适用于连接至第二端子部230的接合线402。
现在将说明发光装置封装1的制造方法。
首先,通过压制或蚀刻诸如铝或铜的金属板材料来形成其上设置有安装部210以及第一和第二端子部220和230的引线框200。可以执行清洁,以便在稍后说明的注射成型之前去除引线框200上的杂质。还可执行镀覆,以便改变引线框200的表面。将上框100耦接至引线框200。可通过使用诸如聚邻苯二甲酰邻苯二胺(PPA)或液晶聚合物(LCP)的聚合物利用嵌入成型等技术在引线框200上形成上框100。因此,如图1所示,获得其中形成有空腔3的封装本体2。引线框200构成位于空腔3下面的结构。将发光装置芯片300安装在安装部210上。可通过利用例如粘接剂将发光装置芯片300附接至安装部210。
图7是用于说明包括具有图2所示形状的接合线401的发光装置封装1的制造方法的横截面图。
参照图7,通过细管501供应导线502形式的诸如金或铜的导电材料。夹钳505选择性地允许或阻止导线502的供应。
如图7中的虚线所示,通过将放电电极503或加热单元移至靠近通过细管501供应的导线502的端部,导线502的端部熔化。于是,在导线502的端部上形成球504。然后,在夹钳505打开以便允许供应导线502的情况下,细管501降低以使球504接触电极焊盘301。在这种情况下,通过施加适当的负荷和超声波振动使球504接合电极焊盘301而形成第一连接部411。
接下来,升高细管501,以便形成接合线401的形状。
图8是用于说明发光装置封装1的制造方法的横截面图,示出了细管501的上升路径600。如图8所示,升高细管501以形成接合线401的形状。在细管501升高的同时,夹钳505保持打开以允许供应导线502。
细管501的上升路径600可包括第一上升路径610和第二上升路径620。第一和第二上升路径610和620可以分别为用于形成上升部410和延伸部440的路径。第二上升路径620可包括分别对应于跨接部420和下降部430的第三上升路径630和第四上升路径640。细管501的上升路径600包括从穿过第一连接部411的竖直基准线L朝着第一端子部220突出的至少一个突出路径。
参照图8,从竖直基准线L朝着第一端子部220突出的第一突出路径611设置在第一上升路径610上。第一突出路径611用于形成第一弯折部413。第一突出路径611可以由从竖直基准线L朝着第一端子部220延伸的路径613和从路径613向上延伸的路径614形成。路径614不必与竖直基准线L平行。第一上升路径610的端部612对应于环峰412。在完成接合之后,如果环峰412朝着第一端子部220倾斜,可将接合线401向下弯曲以接触引线框200。因此,为了防止完成接合之后环峰412朝着第一端子部220倾斜,将第一上升路径610的端部612设置在关于竖直基准线L与第一端子部220相对的一侧。
再次参照图8,从竖直基准线L朝着第一端子部220突出的第二突出路径621设置在第二上升路径620上,具体地设置在第三上升路径630上。第二突出路径621用于形成第二弯折部421。第二突出路径621可包括从对应于环峰412的端部612朝着第一端子部220倾斜上升的路径623以及在与第一端子部220相反的方向上从路径623倾斜上升的路径624。第三上升路径630的端部622成为跨接部420和下降部430之间的连接部。
如果细管501不再升高,则沿着图8中箭头A所示的曲线轨迹朝着第一端子部220降低细管501。在细管501降低的同时,夹钳505保持关闭以阻止导线502的供应。当细管501降低时,第一和第二上升路径610和620的导线502的一部分扩展,并且当导线502接触第一端子部220时,形成如图9所示的包括第一和第二弯折部413和421的接合线401形状。在这种情况下,通过施加适当的负荷和超声波振动使导线502接合至第一端子部220而形成第二连接部431。
接下来,如图10所示,当细管501上升同时被夹紧时,导线502被切断,从而完成连接接合线401的接合工艺。
以与以上所述相同的方式执行将接合线402连接至第二端子部230以及发光装置芯片300的阴极焊盘302的接合工艺。
当两个接合工艺都完成时,可执行在空腔3内形成封装层500的工艺。可通过向空腔3内注射透明树脂(例如,透明硅)并干燥和固化该透明树脂来形成封装层500。可在封装层500中分散用于将发光装置芯片300发出的光转换成期望颜色的光的荧光材料。可通过在空腔3内填充其中分散有荧光材料的透明树脂并干燥和固化该透明树脂来形成封装层500。
可利用上述方法制造包括接合线401和402的发光装置封装1,其中所述接合线上设置有至少一个弯折部。
虽然上述实施方式中说明了包括其中形成有空腔3的封装本体2的发光装置封装以及发光装置封装1的制造方法,但本发明不限于图1至图10所示的发光装置封装1以及发光装置封装1的制造方法的实施方式。例如,发光装置芯片300的阳极焊盘301和阴极焊盘302之一(例如,阴极焊盘302)可设置在发光装置芯片300的下面,以便直接电连接至安装部210。即,安装部210还可用作第二端子部230。在这种情况下,发光装置芯片300的阳极焊盘301和第一端子部220可利用接合线401彼此电连接。另外,例如,发光装置封装1不必包括空腔3。发光装置封装1可构造成使得发光装置芯片300安装在引线框200的安装部210上,发光装置芯片300以及端子部220和230利用接合线401和402而连接,并且形成覆盖发光装置芯片300以及接合线401和402的透明封装层500。在这种情况下,封装本体2可以由引线框200形成,并且可省去上框100。另外,封装本体2可以由引线框200以及支撑引线框200的上框100两者形成。即,只要封装本体包括其上安装有发光装置芯片的安装部以及至少一个端子部即可,本发明不限制封装本体的类型和结构。
尽管已经参照本发明的示例性实施方式示出并描述了本发明,但本领域技术人员应该理解,只要不背离所附权利要求所限定的本发明的精神和范围,可以在形式和细节方面做出各种修改。
Claims (13)
1.一种发光装置封装,包括:
封装本体,其上设置有安装部和端子部;
发光装置芯片,其安装在所述安装部上;以及
接合线,其电连接所述发光装置芯片的电极和所述端子部,
其中,所述接合线包括从所述发光装置芯片上升至环峰的上升部以及连接所述环峰和所述端子部的延伸部,
其中,所述上升部上设置有沿着与所述上升部上升的方向相交的方向弯曲的第一弯折部。
2.根据权利要求1所述的发光装置封装,其中,所述接合线和所述发光装置芯片被透明封装层覆盖。
3.根据权利要求1所述的发光装置封装,其中,所述封装本体包括形成空腔的上框以及在所述空腔下方形成一结构并允许所述安装部和所述端子部设置于其上的引线框,
其中,所述接合线和所述发光装置芯片被填充在所述空腔内的透明封装层覆盖。
4.根据权利要求1所述的发光装置封装,其中,所述延伸部包括:跨接部,其从所述环峰朝着所述端子部延伸;以及下降部,其从所述跨接部朝着所述端子部下降并且具有接合至所述端子部的端部,
其中,所述跨接部上设置有向下弯曲的第二弯折部。
5.根据权利要求4所述的发光装置封装,其中,所述接合线和所述发光装置芯片被透明封装层覆盖。
6.根据权利要求4所述的发光装置封装,其中,所述封装本体包括形成空腔的上框以及在所述空腔下方形成一结构并允许所述安装部和所述端子部设置于其上的引线框,
其中,所述接合线和所述发光装置芯片被填充在所述空腔内的透明封装层覆盖。
7.一种发光装置封装,包括:
发光装置芯片;
端子部;
接合线,其电连接所述发光装置芯片和所述端子部;以及
透明封装层,其覆盖所述发光装置芯片和所述接合线,
其中,所述接合线包括沿着与所述接合线延伸的方向相交的方向弯曲的弯折部。
8.根据权利要求7所述的发光装置封装,其中,所述接合线形成连接所述发光装置芯片和所述端子部的导线环,并且所述弯折部朝着所述导线环的内侧弯曲。
9.根据权利要求7所述的发光装置封装,其中,所述接合线包括:从所述发光装置芯片上升至环峰的上升部、从所述环峰朝着所述端子部延伸的跨接部、以及从所述跨接部朝着所述端子部下降的下降部,
其中,所述弯折部设置在所述上升部和所述跨接部中的至少一个上。
10.一种发光装置封装的制造方法,所述方法包括:
将发光装置芯片安装在封装本体的安装部上;
通过降低供应导线的细管并将所述导线的端部接合至所述发光装置芯片的电极焊盘而形成第一连接部;
沿着上升路径升高所述细管,以便形成接合线的形状;
通过朝着所述封装本体的端子部降低所述细管并将所述导线的另一端部接合至所述端子部而形成第二连接部;以及
切断所述导线,
其中,所述上升路径包括从穿过所述第一连接部的竖直基准线朝着所述端子部弯曲的第一突出路径和第二突出路径,
其中,所述接合线包括从所述第一连接部朝着环峰向上延伸的上升部以及连接所述环峰和所述端子部的延伸部,
其中,所述上升路径包括分别对应于所述上升部和所述延伸部的第一上升路径和第二上升路径,
其中,所述第一突出路径和第二突出路径分别设置在所述第一上升路径和第二上升路径上。
11.根据权利要求10所述的方法,其中,所述第一上升路径的对应于所述环峰的端部设置在关于所述竖直基准线与所述端子部相对的一侧。
12.根据权利要求10所述的方法,其中,所述延伸部包括:跨接部,其从所述环峰朝着所述端子部延伸;以及下降部,其从所述跨接部朝着所述端子部下降并且具有接合至所述端子部的端部,
其中,所述第二上升路径包括分别对应于所述跨接部和所述下降部的第三上升路径和第四上升路径,
其中,所述第二突出路径设置在所述第三上升路径上。
13.根据权利要求10所述的方法,其中,所述第一上升路径的对应于所述环峰的端部设置在关于所述竖直基准线与所述端子部相对的一侧。
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US20140374151A1 (en) * | 2013-06-24 | 2014-12-25 | Jia Lin Yap | Wire bonding method for flexible substrates |
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US20150263256A1 (en) * | 2014-03-14 | 2015-09-17 | Epistar Corporation | Light-emitting array |
US10026882B2 (en) * | 2014-10-07 | 2018-07-17 | Epistar Corporation | Using MEMS fabrication incorporating into LED device mounting and assembly |
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