CN102585721A - 用于发光器件的粘合剂膜和使用该膜制造led封装件的方法 - Google Patents
用于发光器件的粘合剂膜和使用该膜制造led封装件的方法 Download PDFInfo
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- CN102585721A CN102585721A CN2012100103367A CN201210010336A CN102585721A CN 102585721 A CN102585721 A CN 102585721A CN 2012100103367 A CN2012100103367 A CN 2012100103367A CN 201210010336 A CN201210010336 A CN 201210010336A CN 102585721 A CN102585721 A CN 102585721A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0004162 | 2011-01-14 | ||
KR1020110004162A KR20120082714A (ko) | 2011-01-14 | 2011-01-14 | 발광소자용 접착필름 및 이를 이용한 발광다이오드 패키지 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102585721A true CN102585721A (zh) | 2012-07-18 |
CN102585721B CN102585721B (zh) | 2015-02-18 |
Family
ID=45464431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210010336.7A Expired - Fee Related CN102585721B (zh) | 2011-01-14 | 2012-01-13 | 用于发光器件的粘合剂膜和使用该膜制造led封装件的方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120181571A1 (zh) |
EP (1) | EP2477225A3 (zh) |
KR (1) | KR20120082714A (zh) |
CN (1) | CN102585721B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103579523A (zh) * | 2012-07-27 | 2014-02-12 | 三星显示有限公司 | 供体基片、有机发光显示装置及其制造方法 |
CN113980586A (zh) * | 2014-11-01 | 2022-01-28 | 三星Sdi株式会社 | 粘合剂膜以及包含粘合剂膜的显示部件 |
CN114181638A (zh) * | 2021-11-24 | 2022-03-15 | 江苏萍升源电子科技有限公司 | 一种高透性光学uv固化胶带 |
US11999879B2 (en) | 2015-06-30 | 2024-06-04 | Samsung Sdi Co., Ltd. | Adhesive film and display member comprising the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US9299887B2 (en) * | 2013-03-15 | 2016-03-29 | Nthdegree Technologies Worldwide Inc. | Ultra-thin printed LED layer removed from substrate |
JP6765804B2 (ja) * | 2014-11-28 | 2020-10-07 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
JP6788131B2 (ja) | 2017-05-02 | 2020-11-18 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | Ledストリップの固定 |
KR102155811B1 (ko) * | 2018-11-12 | 2020-09-15 | 주식회사 대현에스티 | 방열 점착제의 제조방법 및 이를 포함하는 방열 테이프 |
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- 2012-01-13 US US13/350,516 patent/US20120181571A1/en not_active Abandoned
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US6878435B2 (en) * | 2001-07-19 | 2005-04-12 | Korea Advanced Institute Of Science And Technology | High adhesion triple layered anisotropic conductive adhesive film |
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CN103579523A (zh) * | 2012-07-27 | 2014-02-12 | 三星显示有限公司 | 供体基片、有机发光显示装置及其制造方法 |
CN113980586A (zh) * | 2014-11-01 | 2022-01-28 | 三星Sdi株式会社 | 粘合剂膜以及包含粘合剂膜的显示部件 |
CN113980586B (zh) * | 2014-11-01 | 2024-02-23 | 三星Sdi株式会社 | 粘合剂膜以及包含粘合剂膜的显示部件 |
US11999879B2 (en) | 2015-06-30 | 2024-06-04 | Samsung Sdi Co., Ltd. | Adhesive film and display member comprising the same |
CN114181638A (zh) * | 2021-11-24 | 2022-03-15 | 江苏萍升源电子科技有限公司 | 一种高透性光学uv固化胶带 |
Also Published As
Publication number | Publication date |
---|---|
KR20120082714A (ko) | 2012-07-24 |
CN102585721B (zh) | 2015-02-18 |
EP2477225A3 (en) | 2014-10-29 |
US20120181571A1 (en) | 2012-07-19 |
EP2477225A2 (en) | 2012-07-18 |
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