CN102573295A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN102573295A CN102573295A CN2010106053752A CN201010605375A CN102573295A CN 102573295 A CN102573295 A CN 102573295A CN 2010106053752 A CN2010106053752 A CN 2010106053752A CN 201010605375 A CN201010605375 A CN 201010605375A CN 102573295 A CN102573295 A CN 102573295A
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- CN
- China
- Prior art keywords
- electronic component
- electronic
- circuit board
- electronic installation
- installation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to an electronic device. The electronic device comprises a circuit board, a first electronic component and at least one second electronic component which are arranged on the circuit board. A circuit layer is arranged on the circuit board; and the first electronic component is provided with at least two pins. The at least two pins of the first electronic component are respectively and electrically connected with the circuit layer. A containing space is formed by the first electronic component and the circuit board; and the at least one second electronic component is contained on the containing space and is electrically connected with the circuit layer.
Description
Technical field
The present invention relates to a kind of electronic installation, relate in particular to a kind of structure of electronic installation.
Background technology
Existing electronic installation when particularly on circuit board, control chip being set, needs to cooperate a plurality of electronic components such as resistance, electric capacity to use, to be used for filtering or to carry out relevant parameter compensation etc.But because the space of circuit board is limited, in order to reduce the shared space size of whole electronic installation, usually, these a plurality of electronic components can not be placed on the optimum position, and cause the signal of each electronic component to be disturbed, and then influence the stability of system.
Summary of the invention
In view of this, be necessary to provide the electronic installation of the little and stable performance of a kind of volume.
A kind of electronic installation comprises circuit board, is arranged on one first electronic component and at least one second electronic component on this circuit board.Have circuit layer on this circuit board, this first electronic component has at least two pins.At least two pins of this first electronic component are electrically connected with this circuit layer respectively.This first electronic component and this circuit board form a receiving space, and this at least one second electronic component is contained in this receiving space, and is electrically connected with this circuit layer.
This at least one second electronic component is contained in the receiving space of this first electronic component and the formation of this circuit board; I.e. this first electronic component and this at least one second electronic component stack is provided with; Thereby practiced thrift the space, and then reduced the volume of this electronic installation.And,, thereby make the performance of whole electronic installation more stable owing to the distance at this first electronic component and this at least one second electronic component interval reduces relatively.
Description of drawings
Fig. 1 is the generalized section of the electronic installation that provides of the embodiment of the invention.
The main element symbol description
First electronic component 20
Kink 261
Contact-making surface 262
Second electronic component 30
Receiving space 50
Embodiment
To combine accompanying drawing that the embodiment of the invention is done further to specify below.
See also Fig. 1, the electronic installation 100 that one embodiment of the invention provides.This electronic installation 100 comprises circuit board 10, be arranged on one first electronic component 20 and a plurality of second electronic component 30 and a plurality of electric conductor 40 on this circuit board 10.
This circuit board 10 is provided with circuit layer 11.
This first electronic component 20 and this a plurality of second electronic components 30 are arranged on this circuit board 10, and are electrically connected with this circuit layer 11.In the present embodiment, this first electronic component 20 is a SMD integrated chip, as, S O-8 electronic installation.This first electronic component 20 have one with this circuit board 10 facing surfaces 21, first side 22 adjacent with this surface 21, and with these first side, 22 second side surface opposite 23.This first electronic component 20 is provided with a plurality of pins 26.These a plurality of pins 26 are distributed on first side 22 and second side 23 of this first electronic component 20.Each pin 26 is drawn from the side of this first electronic component 20, and extends and form a kink 261 along the direction of vertical this first electronic component 20, and this kink 261 extends along the direction away from this first electronic component 20.This kink 261 has a contact-making surface 262, and this contact-making surface 262 is used for circuit layer and is electrically connected, and usually, this contact-making surface 262 is the plane, and parallel with the surface 21 on this first electronic component 20.
These a plurality of electric conductors 40 are separately positioned on pin 26 places of this first electronic component 20, and particularly, the contact-making surface 262 of the pin 26 of each first electronic component 20 is electrically connected with this circuit layer 11 through an electric conductor 40.This electric conductor 40 can be conducting metals such as tin cream, copper, silver.
This first electronic component 20 is electrically connected with circuit layer 11 through electric conductor 40, and forms a receiving space 50 with this circuit board 10.These a plurality of second electronic components 30 are contained in this receiving space 50 and are positioned at the below of this first electronic component 20, and, spaced apart between these a plurality of second electronic components 30 and this first electronic component 20.In the present embodiment, these a plurality of second electronic components 30 are two SMD electric capacity, and it directly is sticked on this circuit board 10.Certainly, this second electronic component 30 can be one, also can be three or more a plurality of.
In order to isolate this first electronic component 20 and these a plurality of second electronic components 30; Coating insulating material 60 on the surface 21 of this first electronic component 20; Certainly, this insulating material 60 also can be coated on the surface away from this circuit layer 11 of these a plurality of second electronic components 30.Certainly, in order to strengthen the heat dispersion of this first electronic component 20 and these a plurality of second electronic components 30, also can the surface 21 of this first electronic component 20 and/or this second electronic component 30 away from the surface of this circuit layer 11 on coating heat-conducting glue etc.
Certainly; When the pin of this first electronic component 20 26 is longer; Its also can be directly with this circuit board 10 on circuit layer 11 be electrically connected, form a receiving space 50 thereby this first electronic component 20 is matched with this circuit board 10, to be used to accommodate this a plurality of second electronic components 30.
These a plurality of second electronic components 30 are contained in the receiving space 50 of this first electronic component 20 and 10 formation of this circuit board; Promptly this first electronic component 20 is provided with these a plurality of second electronic component 30 stacks; Thereby practiced thrift the space, and then reduced the volume of this electronic installation.And,, thereby make the performance of whole electronic installation more stable owing to a plurality of second electronic components 30 of this first electronic component 20 and this distance at interval reduces relatively.
It is understandable that those skilled in the art also can do other variation in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.These all should be included within the present invention's scope required for protection according to the variation that the present invention's spirit is done.
Claims (8)
1. electronic installation; Comprise circuit board and be arranged at least one first electronic component and at least one second electronic component on this circuit board; Has circuit layer on this circuit board; This first electronic component has at least two pins, and at least two pins of this first electronic component are electrically connected with this circuit layer respectively, it is characterized in that:
Form a receiving space between this first electronic component and this circuit board, this at least one second electronic component is contained in this receiving space, and is electrically connected with this circuit layer.
2. electronic installation as claimed in claim 1 is characterized in that, this first electronic component is a SMD integrated chip.
3. electronic installation as claimed in claim 1 is characterized in that, this at least one second electronic component comprises SMD electric capacity, and it directly is sticked on this circuit board.
4. electronic installation as claimed in claim 1 is characterized in that this electronic installation further comprises a plurality of electric conductors, and a plurality of pins of this first electronic component are electrically connected with this circuit layer through these a plurality of electric conductors respectively.
5. electronic installation as claimed in claim 4 is characterized in that, this electric conductor is a tin cream.
6. electronic installation as claimed in claim 1 is characterized in that, and is spaced apart between this first electronic component and this at least one second electronic component.
7. electronic installation as claimed in claim 1 is characterized in that, has been arranged on heat-conducting glue between this first electronic component and this at least one second electronic component.
8. electronic installation as claimed in claim 1 is characterized in that, is provided with insulating material between this first electronic component and this at least one second electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106053752A CN102573295A (en) | 2010-12-25 | 2010-12-25 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106053752A CN102573295A (en) | 2010-12-25 | 2010-12-25 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102573295A true CN102573295A (en) | 2012-07-11 |
Family
ID=46417397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106053752A Pending CN102573295A (en) | 2010-12-25 | 2010-12-25 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102573295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107680917A (en) * | 2017-08-11 | 2018-02-09 | 华为技术有限公司 | A kind of plate level framework and preparation method thereof, mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020131254A1 (en) * | 1998-10-22 | 2002-09-19 | Schaper Leonard W. | Surface applied passives |
| JP2005311254A (en) * | 2004-04-26 | 2005-11-04 | Kyocera Corp | Wiring board and electronic device |
| US20060286822A1 (en) * | 2005-06-17 | 2006-12-21 | Jochen Thomas | Multi-chip device and method for producing a multi-chip device |
-
2010
- 2010-12-25 CN CN2010106053752A patent/CN102573295A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020131254A1 (en) * | 1998-10-22 | 2002-09-19 | Schaper Leonard W. | Surface applied passives |
| JP2005311254A (en) * | 2004-04-26 | 2005-11-04 | Kyocera Corp | Wiring board and electronic device |
| US20060286822A1 (en) * | 2005-06-17 | 2006-12-21 | Jochen Thomas | Multi-chip device and method for producing a multi-chip device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107680917A (en) * | 2017-08-11 | 2018-02-09 | 华为技术有限公司 | A kind of plate level framework and preparation method thereof, mobile terminal |
| WO2019029753A1 (en) * | 2017-08-11 | 2019-02-14 | 华为技术有限公司 | Board-level architecture, preparation method therefor, and mobile terminal |
| CN107680917B (en) * | 2017-08-11 | 2020-03-20 | 华为技术有限公司 | Board-level architecture, preparation method thereof and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |