CN102543893B - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
- Publication number
- CN102543893B CN102543893B CN201010625100.5A CN201010625100A CN102543893B CN 102543893 B CN102543893 B CN 102543893B CN 201010625100 A CN201010625100 A CN 201010625100A CN 102543893 B CN102543893 B CN 102543893B
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- CN
- China
- Prior art keywords
- solder bump
- stove
- carboxylic acid
- acid gas
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010625100.5A CN102543893B (zh) | 2010-12-17 | 2010-12-17 | 半导体器件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010625100.5A CN102543893B (zh) | 2010-12-17 | 2010-12-17 | 半导体器件的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102543893A CN102543893A (zh) | 2012-07-04 |
CN102543893B true CN102543893B (zh) | 2014-12-17 |
Family
ID=46350430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010625100.5A Active CN102543893B (zh) | 2010-12-17 | 2010-12-17 | 半导体器件的制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN102543893B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3547809A4 (en) * | 2016-11-22 | 2020-07-08 | Senju Metal Industry Co., Ltd | BRAZING PROCESS |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105458433B (zh) * | 2016-01-20 | 2017-08-29 | 福建中科晶创光电科技有限公司 | 一种微型固体激光器多段温度焊接的封装装置及封装方法 |
CN109877411A (zh) * | 2019-04-10 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | 无助焊剂的微电路焊接组装方法 |
CN113036573B (zh) * | 2021-02-25 | 2023-04-18 | 福建富鑫达电子有限公司 | 一种压接电线接头的方法及装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5992729A (en) * | 1996-10-02 | 1999-11-30 | Mcnc | Tacking processes and systems for soldering |
US6344407B1 (en) * | 1999-12-20 | 2002-02-05 | Fujitsu Limited | Method of manufacturing solder bumps and solder joints using formic acid |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6858941B2 (en) * | 2000-12-07 | 2005-02-22 | International Business Machines Corporation | Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
-
2010
- 2010-12-17 CN CN201010625100.5A patent/CN102543893B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5992729A (en) * | 1996-10-02 | 1999-11-30 | Mcnc | Tacking processes and systems for soldering |
US6344407B1 (en) * | 1999-12-20 | 2002-02-05 | Fujitsu Limited | Method of manufacturing solder bumps and solder joints using formic acid |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3547809A4 (en) * | 2016-11-22 | 2020-07-08 | Senju Metal Industry Co., Ltd | BRAZING PROCESS |
Also Published As
Publication number | Publication date |
---|---|
CN102543893A (zh) | 2012-07-04 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170801 Address after: Tokyo, Japan Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Patentee before: Toshiba Corp. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Patentee before: Japanese businessman Panjaya Co.,Ltd. Address after: Tokyo, Japan Patentee after: Kaixia Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211231 Address after: Tokyo, Japan Patentee after: Japanese businessman Panjaya Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |