CN111586981A - Design and manufacturing method of integrated coupling printed board - Google Patents
Design and manufacturing method of integrated coupling printed board Download PDFInfo
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- CN111586981A CN111586981A CN202010465751.6A CN202010465751A CN111586981A CN 111586981 A CN111586981 A CN 111586981A CN 202010465751 A CN202010465751 A CN 202010465751A CN 111586981 A CN111586981 A CN 111586981A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Abstract
The invention discloses a design and manufacturing method of an integrated coupling printed board, which comprises the following steps: s1, drilling holes on the aluminum plate, and plugging the drilled holes on the aluminum plate with resin; s2, manufacturing an optical waveguide layer; s3, manufacturing a substrate, namely pressing the optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer, and manufacturing the aluminum plate by magnetron sputtering when holes directly drilled on the aluminum plate are metallized; s4, copper deposition and electroplating, performing copper deposition processing on the holes which are plugged by resin and drilled again on the aluminum plate through a chemical copper deposition process, and thickening a plating layer; s5, transferring the pattern, and forming the circuit in the outer layer high-frequency substrate pattern by adopting laser direct writing type photoetching equipment; s6, alkaline etching; s7, printing green oil; and S8, character printing, S9, outline processing, and cutting the substrate by high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board. Compared with the traditional technology, the design and manufacturing method of the integrated coupling printed board provided by the invention has the advantages of compact structure, simplicity in manufacturing and convenience for integration with other circuits.
Description
Technical Field
The invention belongs to the field of integrated coupling printed boards, and particularly relates to a design and manufacturing method of an integrated coupling printed board.
Background
The fifth generation communication technology is dedicated to constructing an ecosystem of information and communication technology, is one of the hottest subjects in the industry at present, and is different from the previous 2G, 3G and 4G, 5G is not only the upgrading and updating of mobile communication technology, but also the driving platform of the future digital world and the infrastructure for the development of the internet of things, a new world in full connection is really created, and the main characteristics of the 5G network to provide services include large bandwidth, low time delay and mass connection, so that new requirements on the aspects of bandwidth, capacity, time delay and networking flexibility of an antenna base station are provided. How to meet the bearing requirements of 5G different services by erecting a new 5G base station is a great challenge to a 5G base station network. The bandwidth of the antenna of the base station under the 5G technology is undoubtedly the first key index of the 5G load, the increase of the bandwidth requires the working frequency of the antenna base station, and the working frequency of the antenna base station under the previous 4G technology is generally 800M-2300 MHZ. The coupling printed board for the communication base station antenna under the 5G technology develops towards higher frequency, miniaturization direction and densification. The 5G spectrum is divided into two regions FR1 and FR2, FR being the meaning of Frequency Range. The frequency range of FR1 is 450MHz to 6GHz, 2.6GHz, 3.5GHz, 4.5GHz, 6GHz, also called Sub6G (less than 6 GHz) is opened at home at present, the frequency range of FR2 is 24GHz to 52GHz, most of the electromagnetic wave wavelengths of the frequency spectrum are in millimeter level, therefore, the frequency range is also called millimeter wave, and the frequency range used by the current base station construction is FR1, namely Sub 6G.
In the prior art, a reflecting plate and a coupling standard network board in a communication base station antenna are designed in a split mode, the structure is complex, the manufacturing is complex, and other circuits are inconvenient to integrate when the antenna is used, so that a design and manufacturing method of an integrated coupling printed board is provided.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a design and manufacturing method of an integrated coupling printed board.
In order to achieve the purpose, the invention provides the following technical scheme:
a design and manufacturing method of an integrated coupling printed board comprises the following steps:
s1, drilling holes on the aluminum plate, and plugging the drilled holes on the aluminum plate with resin; after the aluminum plate is drilled, a volcanic ash grinding plate and anodic oxidation are adopted as pretreatment, and after a high-temperature adhesive tape is pasted on one surface of the aluminum plate, vacuum resin hole plugging is performed from the other surface.
S2, manufacturing an optical waveguide layer, wherein the optical waveguide layer sequentially comprises a lower wrapping layer pattern, a core layer pattern and an upper wrapping layer pattern;
s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer, and designing three types of holes on the substrate, wherein the three types of holes are a PTH grounding hole, a non-metallized hole and a metallized hole for connecting a wiring; the aluminum plate is made by magnetron sputtering when being directly metallized;
s4, copper deposition, wherein the substrate is subjected to copper deposition processing through a chemical copper deposition process, so that the inner core layer of the optical waveguide layer is connected with the outer layer circuit, and the chemical copper deposition layer in the hole is thickened in a VCP or pulse plating mode;
s5, transferring the pattern, and forming the circuit in the outer layer high-frequency substrate pattern by adopting laser direct writing type photoetching equipment;
s6, alkaline etching, wherein a rectangular opening required by the high-precision rectangular positioning micro-groove is formed on the copper foil layer on the upper surface of the printed circuit board substrate by adopting an alkaline etching process;
s7, printing green oil, covering ink on the optical waveguide layer, then manufacturing a required solder mask pattern by adopting laser direct writing type photoetching equipment, emulsifying a photosensitive film in a region where laser polymerization reaction does not occur through sodium carbonate developing solution, and removing the green oil of the unexposed part, wherein the pH value of the sodium carbonate developing solution is 9-13;
and S8, character printing, namely, printing corresponding characters on the surface of the printed board through a screen printer, and drying the printed characters through an oven after printing.
And S9, processing the shape, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board.
Preferably, after the aluminum plate is drilled in step S1, a volcanic ash grinding plate and anodic oxidation are used as pretreatment, the volcanic ash concentration is 15-25%, and the anodic oxidation: placing the aluminum plate in an electrolyte solution for electrifying treatment, and forming an aluminum oxide film on the surface of the aluminum plate by using electrolysis, wherein the thickness of the anodic oxide film is as follows: 5-30 um. The anodic oxidation can improve the corrosion resistance and the wear resistance, the array type formed on the surface is similar to a honeycomb structure, the surface roughness is improved, and the bonding force of PP on the surface is facilitated. After the high-temperature adhesive tape is pasted on one surface of the aluminum plate, the hole is plugged from the other surface by vacuum resin.
Preferably, the PTH ground via in step S3 is plated with a via by magnetron sputtering, the non-plated via is formed before forming to prevent process machining from biting into an aluminum base in the via, and the plated via connected to the trace is formed by drilling a hole in an aluminum plate and filling resin into the hole.
Preferably, the optical waveguide layer in step S2 is subjected to laser direct writing lithography by attaching a special dry film for LDI, and is developed to complete the fabrication of the lower cladding layer pattern; the core layer graph mainly comprises a core layer circuit and a core layer inclined plane, laser direct writing type photoetching and developing are completed by pasting a special dry film for LDI, and an exposure negative film of the core layer inclined plane is a gray mask; the manufacture of the upper wrapping layer graph is completed by pasting a special dry film for LDI, laser direct writing type photoetching and developing, and the upper wrapping layer corresponding to the inclined plane of the core layer needs to be developed and removed so as to expose the inclined plane of the core layer.
Preferably, in the electroless copper plating process in step S4, the clamping plate is subjected to copper plating by using an electroless copper plating solution, and the electroless copper plating solution contains a mixture of copper sulfate, sodium hydroxide, formaldehyde and EDTA.
Preferably, the magnetron sputtering manufacturing in step S3 specifically includes:
1) performing sputtering pretreatment, namely cleaning and soaking an aluminum plate for 6min by an ultrasonic wave groove through the power of an ultrasonic cleaner of 2KW, drying the aluminum plate by two sections of hot air (85 +/-5 ℃) for 12min and one section of cold air (85 +/-5 ℃), placing the cleaned FR4 plate separation plate in a sealed storage box, manufacturing a sputtering coating after an oven for 120 +/-30 min, and finishing the sputtering coating within 4 hours;
2) sputtering to coat film, adopting magnetron sputtering high-speed low-temperature sputtering method to coat film on the aluminum plate, vacuum packaging after coating film to seal, and instantly disassembling and assembling to electroplate in the electroplating process.
Preferably, the specific requirement of the magnetron sputtering process is that the vacuum degree is 1.3 × 10-3And introducing inert gas argon in a vacuum state of Pa, applying high-voltage direct current between the substrate and the metal target, exciting the inert gas by electrons generated by glow discharge to generate plasma, and bombing atoms of the metal target by the plasma to deposit on the aluminum plate.
Preferably, the sputtering machine is characterized in that the control parameter of the coating condition of the sputtering machine is that the vacuum degree is 1.3 × 10 when the sputtering starts-3Pa, sputtering current: titanium 15A, copper 15A; the heating temperature of the coating cavity is set to be 100 ℃; sputtering a titanium layer with the set thickness of 200 nm; the copper layer is set to be 1100nm thick.
Preferably, the pH of the sodium carbonate developer in step S7 is 9-13.
The invention has the technical effects and advantages that: compared with the traditional technology, the design and manufacturing method of the integrated coupling printed board provided by the invention has the advantages of compact structure, simplicity in manufacturing and convenience for integration with other circuits.
Drawings
Fig. 1 is a flowchart of a method for designing and manufacturing an integrated coupling printed board according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a design and manufacturing method of an integrated coupling printed board as shown in figure 1
A design and manufacturing method of an integrated coupling printed board comprises the following steps:
s1, drilling holes on the aluminum plate, and plugging the drilled holes on the aluminum plate with resin; after the aluminum plate is drilled, a volcanic ash grinding plate and anodic oxidation are adopted as pretreatment, and after a high-temperature adhesive tape is pasted on one surface of the aluminum plate, vacuum resin hole plugging is performed from the other surface.
S2, manufacturing an optical waveguide layer, wherein the optical waveguide layer sequentially comprises a lower wrapping layer pattern, a core layer pattern and an upper wrapping layer pattern;
s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer, and designing three types of holes on the substrate, wherein the three types of holes are a PTH grounding hole, a non-metallized hole and a metallized hole for connecting a wiring; the aluminum plate is made by magnetron sputtering when being directly metallized;
s4, copper deposition, wherein the substrate is subjected to copper deposition processing through a chemical copper deposition process, so that the inner core layer of the optical waveguide layer is connected with the outer layer circuit, and the chemical copper deposition layer in the hole is thickened in a VCP or pulse plating mode;
s5, transferring the pattern, and forming the circuit in the outer layer high-frequency substrate pattern by adopting laser direct writing type photoetching equipment;
s6, alkaline etching, wherein a rectangular opening required by the high-precision rectangular positioning micro-groove is formed on the copper foil layer on the upper surface of the printed circuit board substrate by adopting an alkaline etching process;
s7, printing green oil, covering ink on the optical waveguide layer, then manufacturing a required solder mask pattern by adopting laser direct writing type photoetching equipment, emulsifying a photosensitive film in a region where laser polymerization reaction does not occur through sodium carbonate developing solution, and removing the green oil of the unexposed part, wherein the pH value of the sodium carbonate developing solution is 9-13;
and S8, character printing, namely, printing corresponding characters on the surface of the printed board through a screen printer, and drying the printed characters through an oven after printing.
And S9, processing the shape, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board.
Wherein, after the aluminum plate is drilled in the step S1, the volcanic ash grinding plate and the anodic oxidation are adopted as pretreatment, the volcanic ash concentration is 15-25%, and the anodic oxidation: placing the aluminum plate in an electrolyte solution for electrifying treatment, and forming an aluminum oxide film on the surface of the aluminum plate by using electrolysis, wherein the thickness of the anodic oxide film is as follows: 5-30 um. The anodic oxidation can improve the corrosion resistance and the wear resistance, the array type formed on the surface is similar to a honeycomb structure, the surface roughness is improved, and the bonding force of PP on the surface is facilitated. After the high-temperature adhesive tape is pasted on one surface of the aluminum plate, the hole is plugged from the other surface by vacuum resin.
And step S3, making a hole metallization for the PTH grounding hole in a magnetron sputtering mode, placing the non-metallized hole before molding to prevent the process from corroding the aluminum base in the hole, and making a through hole in a mode of drilling and filling resin in the aluminum plate for the metallized hole connected with the routing.
Wherein, the optical waveguide layer in the step S2 is subjected to laser direct writing type lithography by attaching a special dry film for LDI, and development to complete the fabrication of the lower cladding layer pattern; the core layer graph mainly comprises a core layer circuit and a core layer inclined plane, laser direct writing type photoetching and developing are completed by pasting a special dry film for LDI, and an exposure negative film of the core layer inclined plane is a gray mask; the manufacture of the upper wrapping layer graph is completed by pasting a special dry film for LDI, laser direct writing type photoetching and developing, and the upper wrapping layer corresponding to the inclined plane of the core layer needs to be developed and removed so as to expose the inclined plane of the core layer.
In the chemical copper deposition process in step S4, a chemical copper deposition solution is used to perform copper deposition processing on the clamping plate, and the chemical copper deposition solution contains a mixture of copper sulfate, sodium hydroxide, formaldehyde, and EDTA.
The magnetron sputtering manufacturing in the step S3 specifically includes:
1) performing sputtering pretreatment, namely cleaning and soaking an aluminum plate for 6min by an ultrasonic wave groove through the power of an ultrasonic cleaner of 2KW, drying the aluminum plate by two sections of hot air (85 +/-5 ℃) for 12min and one section of cold air (85 +/-5 ℃), placing the cleaned FR4 plate separation plate in a sealed storage box, manufacturing a sputtering coating after an oven for 120 +/-30 min, and finishing the sputtering coating within 4 hours;
2) sputtering to coat film, adopting magnetron sputtering high-speed low-temperature sputtering method to coat film on the aluminum plate, vacuum packaging after coating film to seal, and instantly disassembling and assembling to electroplate in the electroplating process.
Wherein the magnetron sputtering process specifically requires that the vacuum degree is 1.3 × 10-3And introducing inert gas argon in a vacuum state of Pa, applying high-voltage direct current between the substrate and the metal target, exciting the inert gas by electrons generated by glow discharge to generate plasma, and bombing atoms of the metal target by the plasma to deposit on the aluminum plate.
Wherein the sputtering machine is characterized in that the sputtering condition control parameter of the sputtering machine is that the vacuum degree is 1.3 × 10 when the sputtering starts-3Pa, sputtering current: titanium 15A, copper 15A; the heating temperature of the coating cavity is set to be 100 ℃; sputtering a titanium layer with the set thickness of 200 nm; the copper layer is set to be 1100nm thick.
Wherein the pH value of the sodium carbonate developing solution in the step S7 is 9-13.
In summary, the following steps: compared with the traditional technology, the design and manufacturing method of the integrated coupling printed board provided by the invention has the advantages of compact structure, simplicity in manufacturing and convenience for integration with other circuits.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. A design and manufacturing method of an integrated coupling printed board is characterized in that: the method comprises the following steps:
s1, drilling holes on the aluminum plate, and plugging the drilled holes on the aluminum plate with resin; after the aluminum plate is drilled, a volcanic ash grinding plate and anodic oxidation are adopted as pretreatment, and after a high-temperature adhesive tape is pasted on one surface of the aluminum plate, vacuum resin hole plugging is performed from the other surface of the aluminum plate;
s2, manufacturing an optical waveguide layer, wherein the optical waveguide layer sequentially comprises a lower wrapping layer pattern, a core layer pattern and an upper wrapping layer pattern from bottom to top;
s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer to form a high-frequency substrate, and designing three types of holes on the high-frequency substrate, wherein the three types of holes are a PTH grounding hole, an unmetallized hole and a metalized hole for connecting a wiring; wherein, the aluminum plate is made by magnetron sputtering when being directly metallized;
s4, depositing copper, namely, performing copper deposition processing on the substrate manufactured in the step S3 through a chemical copper deposition process to connect the inner core layer of the optical waveguide layer with the outer layer circuit, and thickening the chemical copper deposition layer in the hole in a VCP or pulse electroplating mode;
s5, transferring the pattern, and forming the circuit in the outer layer high-frequency substrate pattern by adopting laser direct writing type photoetching equipment to form the printed circuit board substrate;
s6, alkaline etching, wherein a rectangular opening required by the high-precision rectangular positioning micro-groove is formed on the copper foil layer on the upper surface of the printed circuit board substrate by adopting an alkaline etching process;
s7, printing green oil, covering ink on the optical waveguide layer, then manufacturing a required solder mask pattern by adopting laser direct writing type photoetching equipment, emulsifying a photosensitive film in a region where laser polymerization reaction does not occur through sodium carbonate developing solution, and removing the green oil of the unexposed part, wherein the pH value of the sodium carbonate developing solution is 9-13;
s8, character printing, namely, printing corresponding characters on the surface of the printed board through a screen printer, and drying the printed characters through an oven after printing;
and S9, processing the shape, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board.
2. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: step S1, after the aluminum plate is drilled, performing pretreatment by using a volcanic ash grinding plate and anodic oxidation, wherein the volcanic ash concentration is 15-25%, and the anodic oxidation: placing the aluminum plate in an electrolyte solution for electrifying treatment, and forming an aluminum oxide film on the surface of the aluminum plate by using electrolysis, wherein the thickness of the anodic oxide film is as follows: 5-30 um; the anodic oxidation can improve the corrosion resistance and the wear resistance, the array type formed on the surface is similar to a honeycomb structure, the surface roughness is improved, and the bonding force of PP on the surface is facilitated; after the high-temperature adhesive tape is pasted on one surface of the aluminum plate, the hole is plugged from the other surface by vacuum resin.
3. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: and S3, making holes and metallizing the PTH grounding hole in a magnetron sputtering mode, wherein the non-metallized hole is made before molding in order to prevent the aluminum base in the hole from being corroded in the process processing, and the metallized hole connected with the wiring is made in a through hole drilling mode in a mode that the aluminum plate is drilled and filled with resin.
4. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: the optical waveguide layer in the step S2 is subjected to laser direct writing type photoetching and development by pasting a special dry film for LDI, so that the lower packaging layer graph is manufactured; the core layer graph mainly comprises a core layer circuit and a core layer inclined plane, laser direct writing type photoetching and developing are completed by pasting a special dry film for LDI, and an exposure negative film of the core layer inclined plane is a gray mask; the manufacture of the upper wrapping layer graph is completed by pasting a special dry film for LDI, laser direct writing type photoetching and developing, and the upper wrapping layer corresponding to the inclined plane of the core layer needs to be developed and removed so as to expose the inclined plane of the core layer.
5. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: in the chemical copper deposition process in step S4, a chemical copper deposition solution is used to perform copper deposition processing on the clamping plate, and the chemical copper deposition solution contains a mixture of copper sulfate, sodium hydroxide, formaldehyde, and EDTA.
6. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: the magnetron sputtering manufacturing in the step S3 specifically includes:
1) performing sputtering pretreatment, namely cleaning and soaking an aluminum plate for 6min by an ultrasonic wave groove through the power of an ultrasonic cleaner of 2KW, drying the aluminum plate by two sections of hot air (85 +/-5 ℃) for 12min and one section of cold air (85 +/-5 ℃), placing the cleaned FR4 plate separation plate in a sealed storage box, manufacturing a sputtering coating after an oven for 120 +/-30 min, and finishing the sputtering coating within 4 hours;
2) sputtering to coat film, adopting magnetron sputtering high-speed low-temperature sputtering method to coat film on the aluminum plate, vacuum packaging after coating film to seal, and instantly disassembling and assembling to electroplate in the electroplating process.
7. The design and manufacturing method of the integrated coupling printed board as claimed in claim 6, wherein the magnetron sputtering process specifically requires a vacuum degree of 1.3 × 10-3And introducing inert gas argon in a vacuum state of Pa, applying high-voltage direct current between the substrate and the metal target, exciting the inert gas by electrons generated by glow discharge to generate plasma, and bombing atoms of the metal target by the plasma to deposit on the aluminum plate.
8. The method for designing and manufacturing an integrated coupling printed board according to claim 7, wherein: of the sputterThe control parameter of the coating condition is that the vacuum degree is 1.3 × 10 at the beginning of sputtering-3Pa, sputtering current: titanium 15A, copper 15A; the heating temperature of the coating cavity is set to be 100 ℃; sputtering a titanium layer with the set thickness of 200 nm; the copper layer is set to be 1100nm thick.
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| CN112739015A (en) * | 2020-12-08 | 2021-04-30 | 深圳市祺利电子有限公司 | Manufacturing method of circuit board resistance welding half plug hole |
| CN113438818A (en) * | 2021-06-18 | 2021-09-24 | 东莞美维电路有限公司 | Preparation process of gold-copper connecting circuit of PCB |
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| CN114126201B (en) * | 2021-12-01 | 2023-07-28 | 广德东风电子有限公司 | PCB based on pulse VCP electroplating and preparation method thereof |
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