CN102513632B - Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool - Google Patents
Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool Download PDFInfo
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- CN102513632B CN102513632B CN201110366572.8A CN201110366572A CN102513632B CN 102513632 B CN102513632 B CN 102513632B CN 201110366572 A CN201110366572 A CN 201110366572A CN 102513632 B CN102513632 B CN 102513632B
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Abstract
The invention discloses a preparation method oriented to a fine-grain diamond abrasive material single-layer soldering tool, which relates to the technical field of manufacturing of abrasive material grinding tools. The method comprises the following steps of: grinding the working surface of a substrate, and uniformly paving a solder alloy powder layer on the working surface; feeding the substrate into a vacuum furnace for performing primary soldering under a high-temperature vacuum condition; grinding the soldered surface to form a brazing alloy layer; spraying a layer of fine-grain diamond abrasive material onto the surface of the brazing alloy layer; feeding into the vacuum furnace, and performing secondary soldering under a high-temperature vacuum condition; and after secondary soldering, taking a test sample out to obtain a single-layer soldering tool product on which fine-grain diamonds are distributed uniformly and densely. A uniform, dense, equal-height and highly-exposed abrasive material distribution form is formed on the tool while a fine soldering process can cope with grain grit, so that the tool made with a novel method can have the comprehensive performance advantages of high processing accuracy, high processing efficiency, and long service life.
Description
Technical field
The present invention relates to the technical field that grinding materials and grinding tool manufactures, especially a kind of fine-grain diamond abrasive material single-layer soldering tool preparation method.
Background technology
In recent years, along with the development of Modern Manufacturing Technology, take grinding materials and grinding tool as the grinding of instrument, not only be applied to the manufacture field of large surplus heavy load, and constantly expand to the little surplus precision and ultra-precision machining field of high hard fragility difficult-to-machine material, such as in the Precision Machining of function ceramics, optical glass, the contour hard fragility difficult-to-machine material of quartz.In the Ultra-precision Turning of the hard fragility difficult-to-machine material of height, grinding, polishing are always as first-selected processing method.Grinding is that the lap tool effects on surface utilizing coating or pressure to be embedded with abrasive grain carries out finished machined.Polishing utilizes machinery, chemistry or electrochemical effect, and workpiece surface roughness is reduced, to obtain the processing method of bright flat surface, and the main abrasive grain using free state in processing.The drawback of this kind of processing method is that working (machining) efficiency is extremely low, for example (,) in astronomical instrument the Polishing machining time of optical glass used be the several months, even several years, such working (machining) efficiency and cost needs are all had higher requirement to modern manufacturing industry.Grinding is as the typical fabrication methods of Surface Machining, and emery wheel is the machining tool of its first-selection, and diamond relies on its high rigidity to be widely applied in grinding tool.The abrasive grain that grinding tool adopts is one of key factor determining the machining accuracy that emery wheel can reach.Grinding is for grinding and polishing, and the grinding dosage in its process is much bigger, and finishing determines final crudy.Along with the continuous lifting required crudy, working (machining) efficiency, the demand of fine-granularity diamond grinding tool is also increasing, and therefore Chinese scholars has carried out extensive research to diamond tool preparation.
Last century the nineties, abroad start to develop soldering mono-layer diamond concretion abrasive instrument, occur on diamond, solder and basal body interface when its starting point is mat high temperature brazing such as melt, infiltrate, spread, the interaction of chemical combination and so on fundamentally improves the triangular bond strength of abrasive material, solder and matrix.Domestic and international experts and scholars, by unremitting effort, have developed multiple mono-layer diamond doctor, and achieve desirable effect in the application.But with regard to current soldering tech, single layer soldering skive abrasive grain only concentrates on 140# with the diamond abrasive of thick (>104 μm), and the machining accuracy that can reach is restricted.In order to integrate, bond strength is high, abrasive particle exposure is high, tool surfaces chip space is abundant, life tools are long, environmental protection and all advantages such as machining accuracy is high, certainly will need to further investigate fine-granularity diamond single layer soldering technique.By the research to soldering processes, preparation has that abrasive particle is evenly arranged, the mono-layer diamond doctor of high proud exposure, high abrasive material hold feature, make diamond soldering appliance can adapt to the processing request of high hard fragility difficult-to-machine material, realize the accurate grinding processing of high working (machining) efficiency, high manufacturing accuracy.Therefore, diamond brazing emery wheel is applied to the accurate grinding processing of high hard fragility difficult-to-machine material, greatly certainly will improves the crudy that grinding can reach, and compress the consuming time of Polishing machining and cost, finally play the effect of " to grind Dai Yan ".
In the past because abrasive grain is comparatively thick, be easy to control single abrasive particle.Along with the continuous refinement of diamond grit, controlling abrasive grain locations becomes insoluble problem; Coarseness diamond brazing requirement for environmental conditions is very harsh, and fine-granularity diamond also must be deepened further for the requirement of soldering environmental condition, just Absorbable organic halogens soldering effect, finds economic brazing conditions reliably and will determine industrial-scale production prospect; Molten solder is thorough to the wetability research of fine-granularity diamond, and cause at the exposure of regulation and control abrasive material, arrangement mode, avoid the solution in the problems such as agglomerate grain overlap to seem awkward, the solution of problems all seems very urgent.
Summary of the invention
The object of the present invention is to provide a kind of new process for preparation soldering individual layer fine-granularity diamond grinding tool, while refinement soldering processes can tackle wear particle size, imparting instrument with the abrasive material of evenly intensive, contour distribution, high exposure arrangement pattern, thus can make the instrument made with new method can have machining accuracy, working (machining) efficiency and the combination property advantage in service life simultaneously.
Towards a single-layer soldering tool preparation method for fine-grain diamond abrasive material, it is characterized in that comprising following several step:
The first step: grinding process is carried out to the working face of matrix, uniform spreading one deck solder alloy powder on working face;
Second step: under the condition of high-temperature vacuum, the matrix with the solder alloy powder above-mentioned first step obtained is sent in vacuum drying oven and is carried out first time soldering;
3rd step: polish to the surface after above-mentioned second step soldering, forms solder layer;
4th step: in surperficial spreading one deck fine-grain diamond abrasive material of solder layer;
5th step: send in vacuum drying oven, carry out second time soldering under the condition of high-temperature vacuum;
6th step: after second time soldering, takes out sample and can obtain the evenly densely arranged single-layer soldering tool goods of fine-granularity diamond.
Preparation method of the present invention comprises following link:
1, expect processing characteristics adjustment abrasive grain, solder consumption, diamond consumption and brazing process parameter etc. according to grinding tool, and carry out the test of fine-granularity diamond single layer soldering with this;
2, select the characteristic elements such as wear particle concentration, abrasive particle spacing, abrasive particle contour, abrasive particle proud exposure as investigation target, by physico-chemical analysis instruments such as 3 D video microscope, ESEMs, brazed coupon is detected, the detection data of characteristic element are provided;
3, for obtained data analysis, judge whether abrasive particle distribution density, contour situation, proud exposure meet the requirements, with this to soldering processes adjusting and optimizing, repeating test, till the characteristic element data of sample are close to desired effects;
4, the high temperature brazing technique of diamond abrasive is established through test method.
The present invention is the following condition of main demand fulfillment in preparation process: vacuum brazing in vacuum drying oven, the vacuum <10 of vacuum drying oven
-2pa; Use the special active brazing filler metal alloy be made up of silver, copper and titanium elements, wherein the content of active element titanium is about 8%, the money base active solder of this independent development effectively prevent the fire damage of braze welding diamond, and graphitization and micro-crack do not appear in braze welding diamond surface; Mechanical experimental results shows that postwelding diamond keeps the mechanical property before welding substantially; Brazing temperature is between 920-950 DEG C, and temperature retention time is 6 to 30 minutes, is preferably 15 minutes.The goods obtained under meeting above condition: abrasive material bottom to the solder layer THICKNESS CONTROL of matrix surface at the 5-10% of abrasive material height; Abrasive material proud exposure has exceeded 50% of abrasive material height itself.
The present invention mainly for Abrasive Particle Size between 140/650#(21-104 μm) fine-grain diamond abrasive material.When abrasive species, granularity, bonding agent material and bond strength are determined, the distribution of fine-granularity diamond doctor Abrasive Grain is main adopts densely covered, even, individual layer arrangement.Preparation method of the present invention guarantees that diamond abrasive arrangement pattern meets even, intensive, contour arrangement rule.Diamond abrasive is evenly arranged, and guarantees that brazed coupon surface is without obvious diamond disappearance or accumulation; The contour arrangement of diamond abrasive.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the present invention towards fine-grain diamond abrasive material single-layer soldering tool process of preparing.
specific implementation method
Towards a single-layer soldering tool preparation method for fine-grain diamond abrasive material, comprise following several step:
The first step: as shown in Fig. 1 (a), Fig. 1 (b), carries out grinding process to the working face of matrix 1, uniform spreading one deck solder alloy powder 2 on working face;
Second step: under the condition of high-temperature vacuum, the matrix 1 with the solder alloy powder 2 above-mentioned first step obtained is sent in vacuum drying oven and is carried out first time soldering;
3rd step: as shown in Fig. 1 (c), polishes to the surface after above-mentioned second step soldering, forms solder layer 3;
4th step: as shown in Figure 1 (d) shows, in surperficial spreading one deck fine-grain diamond abrasive material 4 of solder layer 3;
5th step: send in vacuum drying oven, carry out second time soldering under the condition of high-temperature vacuum;
6th step: as shown in Fig. 1 (e), after second time soldering, takes out sample and can obtain the evenly densely arranged single-layer soldering tool goods of fine-granularity diamond.
The Abrasive Particle Size of fine-grain diamond abrasive material 4 of the present invention is between 140/650#.
Under elevated temperature in vacuo of the present invention, the vacuum of vacuum drying oven is <10
-2pa.
Under elevated temperature in vacuo of the present invention, brazing temperature is 920-950 DEG C.
The elevated temperature in vacuo lower heat time of the present invention is 6 to 30 minutes.
The elevated temperature in vacuo lower heat time of the present invention is 15 minutes.
1, the instructions for use according to user, instrument proposed and the processing object of instrument and machining dosage can Application Range, design tool appearance and size, working process parameter etc., and evaluate diamond abrasive granularity, abrasive grain placement density according to above key element;
2, be applicable to fine-granularity diamond individual layer high temperature vacuum brazing technique in strict accordance with of the present invention, the brazing filler metal alloy and the diamond abrasive that prepare certain mass are for subsequent use;
3, grinding process is carried out to tool work face, the solder layer of uniform spreading one deck certain mass on grinding tool working face.According to certain high temperature vacuum brazing technique, instrument is sent in vacuum drying oven and carry out first time soldering;
4, after soldering to solder layer surface finish, ensure that solder layer thickness is even, surfacing; At the intensive spreading one deck diamond abrasive in solder surface, remove the unnecessary diamond abrasive being deposited in solder surface;
5, the instrument of preparation is sent in vacuum drying oven, carry out second time soldering according to certain high temperature vacuum brazing technique; After soldering, take out sample and can obtain the evenly densely arranged single-layer soldering tool goods of fine-granularity diamond;
6, soldering effect is evaluated, improve if need, can adjust the consumption of diamond and solder, repeat above operation to improve soldering effect.Until after meeting the requirements, industrial-scale production can be organized by this.
Claims (5)
1., towards a single-layer soldering tool preparation method for fine-grain diamond abrasive material, it is characterized in that comprising following several step:
The first step: grinding process is carried out to the working face of matrix (1), the solder alloy powder (2) that uniform spreading one deck is made up of silver, copper and titanium elements on working face, wherein the content of active element titanium is about 8%;
Second step: under the condition of high-temperature vacuum, the matrix with solder alloy powder (2) the above-mentioned first step obtained (1) is sent in vacuum drying oven and is carried out first time soldering; Under described elevated temperature in vacuo, the vacuum of vacuum drying oven is < 10-2Pa;
3rd step: polish to the surface after above-mentioned second step soldering, forms solder layer (3);
4th step: surperficial spreading one deck fine-grain diamond abrasive material (4) of solder layer (3);
5th step: send in vacuum drying oven, carry out second time soldering under the condition of high-temperature vacuum; Under described elevated temperature in vacuo, the vacuum of vacuum drying oven is < 10
-2pa;
6th step: after second time soldering, takes out sample and can obtain the evenly densely arranged single-layer soldering tool goods of fine-granularity diamond.
2. the single-layer soldering tool preparation method towards fine-grain diamond abrasive material according to claim 1, is characterized in that the Abrasive Particle Size of above-mentioned fine-grain diamond abrasive material (4) is between 140-650#.
3. the single-layer soldering tool preparation method towards fine-grain diamond abrasive material according to claim 1, is characterized in that brazing temperature is 920-950 DEG C under above-mentioned elevated temperature in vacuo.
4. the single-layer soldering tool preparation method towards fine-grain diamond abrasive material according to claim 1, is characterized in that the above-mentioned elevated temperature in vacuo lower heat time is 6 to 30 minutes.
5. the single-layer soldering tool preparation method towards fine-grain diamond abrasive material according to claim 4, is characterized in that the above-mentioned elevated temperature in vacuo lower heat time is 15 minutes.
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| CN201110366572.8A CN102513632B (en) | 2011-11-18 | 2011-11-18 | Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool |
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| CN201110366572.8A CN102513632B (en) | 2011-11-18 | 2011-11-18 | Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool |
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| CN102513632B true CN102513632B (en) | 2015-03-25 |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104290047A (en) * | 2013-07-16 | 2015-01-21 | 宁波大华砂轮有限公司 | A preparation method for a single-layer brazing diamond grinding wheel |
| CN104117933B (en) * | 2014-06-20 | 2017-02-15 | 广东工业大学 | Flattop diamond brazing product and preparation method and application thereof |
| CN105499727B (en) * | 2015-12-09 | 2018-05-29 | 富耐克超硬材料股份有限公司 | A kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide tools |
| CN106625302A (en) * | 2016-11-30 | 2017-05-10 | 南京航空航天大学 | Manufacturing method and device of brazed diamond tool |
| CN106735778A (en) * | 2016-12-14 | 2017-05-31 | 青岛科技大学 | A kind of new method for making Study on Brazed Superabrasive Tools by arc cold-welding legal system |
| CN107520770B (en) * | 2017-05-04 | 2019-03-08 | 漳州职业技术学院 | A kind of wear-resisting skive preparation method of abrasive grain crystal orientation distribution |
| CN108993686A (en) * | 2018-07-18 | 2018-12-14 | 仲恺农业工程学院 | Hammer mills and preparation method thereof |
| CN109226920A (en) * | 2018-11-15 | 2019-01-18 | 蚌埠学院 | A kind of preparation method of brazed diamond tool |
| CN112247862B (en) * | 2020-10-23 | 2021-12-24 | 江苏韦尔博新材料科技有限公司 | Grinding wheel morphology with segmentation design, diamond grinding wheel with grinding wheel morphology and preparation process of diamond grinding wheel |
| CN113524058B (en) * | 2021-07-12 | 2022-05-03 | 华侨大学 | Single-layer diamond abrasive particle ordered arrangement brazing method for template-free furnace brazing |
| CN113618648B (en) * | 2021-08-18 | 2022-08-16 | 全立传感科技(南京)有限公司 | Preparation method of regular fine diamond particle grinding tool |
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