CN105499727B - A kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide tools - Google Patents

A kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide tools Download PDF

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Publication number
CN105499727B
CN105499727B CN201510908725.5A CN201510908725A CN105499727B CN 105499727 B CN105499727 B CN 105499727B CN 201510908725 A CN201510908725 A CN 201510908725A CN 105499727 B CN105499727 B CN 105499727B
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solder
sintered carbide
soldering
matrix
carbide tools
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CN105499727A (en
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李和鑫
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Funik Ultrahard Material Co Ltd
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Funik Ultrahard Material Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention relates to a kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide toolses, belong to superhard material brazing technical field.The preparation method of the soldering sintered carbide tools of the present invention includes:The first prewelding matrix is formed on matrix by the first solder powder is uniformly distributed, the second prewelding matrix is formed on the first prewelding matrix by the second solder powder is uniformly distributed, super hard abrasive is laid on the second prewelding matrix, be brazed to get;The first solder powder grain size is more than the second solder powder grain size.The preparation method of the soldering sintered carbide tools of the present invention makes solder distribution more uniform, avoids and realizes being uniformly distributed for solder by multiple cloth in the prior art, reduces cloth number, improve production efficiency.And due to the promotion of the solder cloth uniformity, product qualified rate is made to be increased to 98% by original 85 90%, reduces the raw material since product qualified rate is low and brings and the waste in man-hour, reduces production cost.

Description

A kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide tools
Technical field
The present invention relates to a kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide toolses, belong to superhard material brazing skill Art field.
Background technology
At present soldering sintered carbide tools as a kind of new sintered carbide tools progressively embody its in the application excellent More performance is also had an optimistic view of by more and more enterprises, on the whole technological process Datong District of each enterprise's production soldering sintered carbide tools Small difference.As soldering sintered carbide tools main raw material(s) --- metal powder solder, the general solder granularity used at present be The mesh of 80 mesh~200, since the super hard abrasive granularity used in doctor portioned product is in 25~60#, so in the production process It needs to be uniformly distributed with solder 3 times or even 6 times can be only achieved technological requirement, not only repeated work, be also easy to cause solder distribution thick It spends uneven, very big influence is also resulted in the stability of product quality.
The content of the invention
It should it is an object of the invention to provide a kind of preparation method of the efficient soldering sintered carbide tools of cloth and use Method soldering sintered carbide tools obtained.
In order to achieve the goal above, the technical solution of the preparation method of the soldering sintered carbide tools of the present invention is as follows:
A kind of preparation method for being brazed sintered carbide tools, including:Is formed on matrix by the first solder powder is uniformly distributed One prewelding matrix forms the second prewelding matrix by the second solder powder is uniformly distributed, by super hard abrasive on the first prewelding matrix Be laid on the second prewelding matrix, be brazed to get;The first solder powder grain size is more than the second solder powder grain size.
The first solder powder grain size is 30-60 mesh.
The second solder powder grain size is 80-120 mesh.
The super hard abrasive grain size is 25-60 mesh.
The super hard abrasive is one or more of diamond, glomerocryst CBN, polycrystalline CBN.
First solder powder and the second solder powder are made with the following method:Metal powder is uniformly mixed, It is cooled to room temperature at a temperature of 950-1100 DEG C with the speed of 5-10 DEG C/s, spherical shape solder grain is made.
The metal powder is made of two or more in copper, tin, nickel, silver, phosphorus, titanium, chromium.Further, metal powder By any one in nickel, copper with any one in chromium, tin according to mass ratio 3:1 is mixed to get.
The soldering carries out under the atmosphere of argon gas or nitrogen, and the temperature of soldering is 960-1150 DEG C, the time of soldering For 5-20min.Holding time is more preferably 10min.
The thickness of first solder powder is 0.05-0.2mm, and the thickness of second solder powder is 0.05- 0.2mm。
Described matrix surface scribbles glue-line, i.e., the gluing on matrix, and the first solder powder is sprinkling upon matrix surface completes First solder powder is in the laying of matrix surface.Solder can be uniformly fixed to matrix surface by glue-line.
The technical solution of the soldering sintered carbide tools of the present invention is as follows:
A kind of soldering sintered carbide tools, is prepared using the above method.
The larger solder of particle is first dispensed in base by the preparation method of the soldering sintered carbide tools of the present invention by twice of cloth Then body surface face dispenses the smaller solder of particle, little particle solder can so be made to easily enter the formation of bulky grain solder In gap, solder distribution is more uniform, avoids and realizes being uniformly distributed for solder by multiple cloth in the prior art, reduces Cloth number, improves production efficiency.Cloth number can be reduced to by the preparation method of the soldering sintered carbide tools of the present invention Twice, cloth material process used time when monolithic instrument manufactures, 3min is reduced to by original 10min, single daily output product volume is by original It is 30-35 pieces that the 17-20 pieces come, which increase, and production efficiency improves nearly 1 times, and due to the promotion of the solder cloth uniformity, makes Product qualified rate is increased to 98% by original 85-90%, reduces the raw material since product qualified rate is low and brings and man-hour Waste, reduce production cost.
Specific embodiment
Technical scheme is further detailed with reference to specific embodiment.
Embodiment 1
The solder of the present embodiment is nickel chromium triangle solder, is made by the following method:By nickel, chromium metal powder according to mass ratio 3: 1 ratio is uniformly mixed in batch mixer, is then heated to 1060 DEG C of temperature, is cooled to room temperature, obtained with the speed of 10 DEG C/s To spherical solder grain.
The pre-brazed position of matrix surface to be brazed is cleaned out, the ball of one layer of 30 mesh is uniformly dispensed at pre-brazed position Shape solder grain, the thickness of first layer solder is 0.12mm, obtains the first prewelding matrix, one layer is dispensed on the first prewelding matrix The spherical solder grain of 80 purposes, the thickness of second layer solder is 0.08mm, the second prewelding matrix is obtained, then in the second prewelding base The super hard abrasive diamond particles of 25/30 mesh are dispensed on body, at 1080 DEG C be brazed 10min to get.
Embodiment 2
The solder of the present embodiment is copper chromium solder, is made by the following method:By copper, chromium metal powder according to mass ratio 3: 1 ratio is uniformly mixed in batch mixer, at a temperature of being then heated to 1050 DEG C, is cooled to room temperature with the speed of 10 DEG C/s, Obtain spherical solder grain.
The pre-brazed position of matrix surface to be brazed is cleaned out, the ball of one layer of 40 mesh is uniformly dispensed at pre-brazed position Shape solder grain, the thickness of first layer solder is 0.11mm, obtains the first prewelding matrix, one layer is dispensed on the first prewelding matrix The spherical solder grain of 80 purposes, the thickness of second layer solder is 0.08mm, the second prewelding matrix is obtained, then in the second prewelding base The super hard abrasive diamond particles of 30/40 mesh are dispensed on body, at 1070 DEG C be brazed 10min to get.
Embodiment 3
The solder of the present embodiment is nickel tin solder, is made by the following method:By nickel, tin metal powder according to mass ratio 3: 1 ratio is uniformly mixed in batch mixer, at a temperature of being then heated to 1030 DEG C, is cooled to room temperature with the speed of 8 DEG C/s, Obtain spherical solder grain.
The pre-brazed position of matrix surface to be brazed is cleaned out, the ball of one layer of 60 mesh is uniformly dispensed at pre-brazed position Shape solder grain, the thickness of first layer solder is 0.09mm, obtains the first prewelding matrix, one layer is dispensed on the first prewelding matrix The spherical solder grain of 120 purposes, the thickness of second layer solder is 0.07mm, the second prewelding matrix is obtained, then in the second prewelding The super hard abrasive diamond particles of 40/50 mesh are dispensed on matrix, at 1050 DEG C be brazed 10min to get.
Comparative example 1
Using general solder copper silver solder of the prior art, solder granularity is 100 mesh, and diamond abrasive chooses granularity and is The abrasive material of 25/30 mesh, then dispenses solder in matrix surface to be brazed, and solder after brazing has the hold of diamond abrasive grain It is required that solder can not be met to the hold of diamond abrasive grain, it is necessary to repeat to dispense 6 solder ability due to dispensing a solder Reach requirement, super hard abrasive diamond particles dispensed in into solder surface, carried out at 1050 DEG C soldering 10min to get.
Comparative example 2
Using general solder copper silver solder of the prior art, solder granularity is 100 mesh, and diamond abrasive chooses granularity and is The abrasive material of 30/40 mesh, then dispenses solder in matrix surface to be brazed, and solder after brazing has the hold of diamond abrasive grain It is required that solder can not be met to the hold of diamond abrasive grain, it is necessary to repeat to dispense 5 solder ability due to dispensing a solder Reach requirement, super hard abrasive diamond particles dispensed in into solder surface, carried out at 1050 DEG C soldering 10min to get.
Comparative example 3
Using general solder copper silver solder of the prior art, solder granularity is 100 mesh, and diamond abrasive chooses granularity and is The abrasive material of 40/50 mesh, then dispenses solder in matrix surface to be brazed, and solder after brazing has the hold of diamond abrasive grain It is required that solder can not be met to the hold of diamond abrasive grain, it is necessary to repeat to dispense 4 solder ability due to dispensing a solder Reach requirement, super hard abrasive diamond particles dispensed in into solder surface, carried out at 1030 DEG C soldering 10min to get.
Comparative example 4
Using general solder copper silver solder of the prior art, solder granularity is 100 mesh, and diamond abrasive chooses granularity and is The abrasive material of 60/80 mesh, then dispenses solder in matrix surface to be brazed, and solder after brazing has the hold of diamond abrasive grain It is required that solder can not be met to the hold of diamond abrasive grain, it is necessary to repeat to dispense 1-2 solder just due to dispensing a solder Requirement can be reached, super hard abrasive diamond particles are dispensed in into solder surface, carried out at 1030 DEG C soldering 10min to get.
Test example
The corresponding cloth solder number of super hard abrasive of different size in embodiment 1-3 and comparative example 1-4 is counted, is tied Fruit is as shown in table 1.
Cloth solder number comparison in table 1 embodiment 1-4 and comparative example 1-4
Monolithic used time, single yield during to being brazed sintered carbide tools preparation in embodiment 1-3 and comparative example 1-4, finished product close Lattice rate is tested, and the results are shown in Table 2.
Sintered carbide tools is brazed in table 2 embodiment 1-3 and comparative example 1-4 and prepares production efficiency comparison
As can be seen from Table 1, the cloth of solder when the preparation method of soldering sintered carbide tools of the invention reduces soldering Number, is reduced to 2 times, and the solder uniformity coefficient on cloth is greatly improved by original 4-6 times.
As can be seen from Table 2, the preparation method of soldering sintered carbide tools of the invention reduces cloth when monolithic instrument manufactures The material process used time is reduced to 5min by original 20min, and single daily output product volume is increased by original 18-30 pieces as 50, raw Production efficiency improves 2 times or so, and due to the promotion of the solder cloth uniformity, makes product qualified rate by original 85-90% 98% is increased to, reduces the raw material since product qualified rate is low and brings and the waste in man-hour, reduces production cost.This hair Bright method greatly reduces labor intensity, shortens production hour, improves production efficiency, and improves the finished product of product Quality.

Claims (7)

1. a kind of preparation method for being brazed sintered carbide tools, it is characterised in that:Including:First solder powder is uniformly distributed in matrix The first prewelding matrix of upper formation forms the second prewelding matrix by the second solder powder is uniformly distributed on the first prewelding matrix, will Super hard abrasive is laid on the second prewelding matrix, be brazed to get;
The first solder powder grain size is 30-60 mesh;
The second solder powder grain size is 80-120 mesh;
The super hard abrasive grain size is 25-60 mesh.
2. the preparation method of soldering sintered carbide tools according to claim 1, it is characterised in that:First solder powder and Second solder powder is made with the following method:Metal powder is uniformly mixed, with 5-10 at a temperature of 950-1100 DEG C DEG C/speed of s is cooled to room temperature, spherical shape solder grain is made.
3. the preparation method of soldering sintered carbide tools according to claim 2, it is characterised in that:The metal powder by copper, Two or more compositions in tin, nickel, silver, phosphorus, titanium, chromium.
4. the preparation method of soldering sintered carbide tools according to claim 1, it is characterised in that:The soldering in argon gas or It is carried out under the atmosphere of nitrogen, the temperature of soldering is 960-1150 DEG C, and the time of soldering is 5-20min.
5. the preparation method of soldering sintered carbide tools according to claim 1, it is characterised in that:First solder powder Thickness is 0.05-0.2mm, and the thickness of second solder powder is 0.05-0.2mm.
6. the preparation method of soldering sintered carbide tools according to claim 1, it is characterised in that:Described matrix surface scribbles glue Layer.
7. a kind of soldering sintered carbide tools, which is characterized in that be prepared into using method as claimed in any one of claims 1 to 6 It arrives.
CN201510908725.5A 2015-12-09 2015-12-09 A kind of preparation method for being brazed sintered carbide tools and soldering sintered carbide tools Active CN105499727B (en)

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Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN106737244B (en) * 2016-12-29 2019-07-09 富耐克超硬材料股份有限公司 A kind of Study on Brazed Superabrasive Tools and preparation method thereof
CN109590918A (en) * 2019-01-09 2019-04-09 苏州科技大学 A kind of method of amorphous CuNi based active solder brazed diamond tool
CN112247863B (en) * 2020-10-23 2022-05-13 江苏韦尔博新材料科技有限公司 Remanufacturing process of brazed diamond grinding wheel
CN112264954A (en) * 2020-10-23 2021-01-26 江苏韦尔博新材料科技有限公司 Micro-impression tooth plate

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EP1125668A2 (en) * 2000-02-16 2001-08-22 ASAOKA Co., Ltd. Wire-saw and method for manufacturing the same
CN102513632A (en) * 2011-11-18 2012-06-27 南京航空航天大学 Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool
CN102896387A (en) * 2012-09-21 2013-01-30 南京航空航天大学 Super-hard abrasive brazing tool distributing technology
CN104057404A (en) * 2014-06-19 2014-09-24 南京航空航天大学 Three-dimensional cooperative distribution method for various grinding materials for preparing superhard tool

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1125668A2 (en) * 2000-02-16 2001-08-22 ASAOKA Co., Ltd. Wire-saw and method for manufacturing the same
CN102513632A (en) * 2011-11-18 2012-06-27 南京航空航天大学 Preparation method oriented to fine-grain diamond abrasive material single-layer soldering tool
CN102896387A (en) * 2012-09-21 2013-01-30 南京航空航天大学 Super-hard abrasive brazing tool distributing technology
CN104057404A (en) * 2014-06-19 2014-09-24 南京航空航天大学 Three-dimensional cooperative distribution method for various grinding materials for preparing superhard tool

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