CN104070467B - Micro-sword grinding product and its preparation method and application - Google Patents
Micro-sword grinding product and its preparation method and application Download PDFInfo
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- CN104070467B CN104070467B CN201410279777.6A CN201410279777A CN104070467B CN 104070467 B CN104070467 B CN 104070467B CN 201410279777 A CN201410279777 A CN 201410279777A CN 104070467 B CN104070467 B CN 104070467B
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Abstract
The present invention relates to a kind of micro-sword grinding product, including diamond particles, one of them plane of described diamond particles is provided with some recessed microdefects, thus forms the micro-sword of grinding in this plane.The invention still further relates to the preparation method of said products, use pulse laser to go out recessed microdefect at a planar etch of diamond particles.The invention still further relates to the application of said products.The present invention etches microdefect in the plane of diamond particles thus forms the micro-sword being largely used to grinding, the diamond abrasive grain participating in grinding is no longer the form of individual particle, multiple micro-swords simultaneously participate in grinding, improve grinding efficiency, increasing machining accuracy, the diamond abrasive grain simultaneously participating in grinding is micro-broken mode, can be continuously updated the grinding sword made new advances during grinding, it is significantly reduced the grinding time, improves working (machining) efficiency.Present invention can apply to diamond brazing goods.
Description
Technical field
The present invention relates to a kind of micro-sword grinding product and its preparation method and application.
Background technology
Owing to diamond forms the height of protrusion higher than diamond particles 50% when soldering, brazed diamond tool has than other such as metallic bond sintered diamond tool, resin bonding agent diamond instrument, ceramic bond diamond instrument and the higher sharpness of plating diamond tool, be conducive to the working (machining) efficiency of raising instrument, and the metallurgical binding that during soldering, diamond and brazing alloy are formed makes the bond strength diamond tool also above other bonding agent of diamond, it is ensured that instrument has the preferable life-span.
But the manufacture of the diamond grinding tool of the current fine-grained orderly soldering of diamond fine grained there is also bigger difficulty, on the one hand it is owing to the thickness of ordered arrangement technology and brazing filler metal alloy layer is difficult to control to, on the other hand, when high temperature brazing, diamond surface defines the thick interfacial reaction layer of a few micrometers and graphitic layers, the exposure surface of diamond there is also a certain degree of graphitization, and this makes fine-granularity diamond intensity reduce substantially；And, the diamond grinding tool of fine grit, abrasive grain diameter is a few micrometers or even submicron-scale, is conducive to obtaining less surface roughness and subsurface stratum damage, but fine grit emery wheel chip space is little, easily blocks；Less to the hold of abrasive particle in combination with agent, abrasive particle is easy to fall off, and abrasion of grinding wheel is big, causes the change of abrasive grain layer pattern, affects the raising of surface precision, and fine grit emery wheel generally requires periodic shaping and dressing in using, and this can increase process time and cost.Therefore the diamond brazing diamond tool of coarseness is applied more.
The wear form of the diamond abrasive grain in skive of the prior art has three kinds: 1, abrasion abrasion；2, micro-broken；3, block fracture.The abrasion easy thing grinding tool rust of abrasion, need to often repair；Block fracture, easily affects the life-span of grinding.And in diamond grinding tool of the prior art, diamond abrasive grain participates in grinding is the diamond of individual particle, and the granule of soldering diamond is bigger, and machining accuracy is restricted.
Summary of the invention
In order to overcome above-mentioned technical problem, it is an object of the invention to provide high micro-sword grinding product of a kind of machining accuracy and its preparation method and application.
The technical solution adopted in the present invention is:
A kind of micro-sword grinding product, including diamond particles, one of them plane of described diamond particles is provided with some recessed microdefects, thus forms the micro-sword of grinding in this plane.
Further improvement as technique scheme, some uniform solderings of diamond particles with complete crystal formation at matrix surface thus form the diamond particles structure of monolayer, the intensity of the complete crystal formation diamond of coarseness is high, graphitization impact is relatively small, easily carry out ordered arrangement, is therefore suitably applied in this.Each diamond particles is provided with the plane matrix dorsad and at grade or the most at grade of microdefect, thus form product surface, described product surface is parallel or substantially parallel with matrix surface, is conducive to when goods and product surface are used for processing and repairing improving machining accuracy and surface quality.
As the further improvement of technique scheme, described microdefect includes that uniform micropore, the diameter of each micropore and the degree of depth are 0.015～0.035mm, and the spacing between micropore is 0.01～0.1mm.
As the further improvement of technique scheme, described microdefect includes uniform microflute.
As the further improvement of technique scheme, described microflute is substantially in " V " type, and cell wall angle angle is 10～80, and each width of mini longitudinal channels is 0.015～0.035mm, and the degree of depth is 0.015～0.055mm.
As the further improvement of technique scheme, described microdefect is the combination of micropore and microflute.The diameter of each micropore and the degree of depth are 0.010～0.040mm, and the spacing between micropore is 0.01～0.15mm, and microflute is substantially in " V " type, and cell wall angle angle is 10～80, and each width of mini longitudinal channels is 0.015～0.035mm, and the degree of depth is 0.015～0.055mm.
The present invention also provides for the preparation method of a kind of micro-sword grinding product, uses pulse laser (nanosecond, psec, femtosecond isopulse laser instrument) to go out recessed microdefect at a planar etch of diamond particles, makes this plane form micro-sword of grinding.
Further improvement as technique scheme, in the way of ordered arrangement, some diamond particles are distributed in matrix surface then soldering, make diamond particles needs to etch the plane of microdefect at grade or the most at grade, thus form the product surface of flat-top, and product surface is parallel or substantially parallel with matrix surface..
The present invention also provides for a kind of emery wheel, and the plane being provided with microdefect in above-mentioned micro-sword grinding product forms grinding face.
The present invention also provides for a kind of grinding wheel dressing pen, and the finishing face contacted with emery wheel is the plane being provided with microdefect in above-mentioned micro-sword goods.
The invention has the beneficial effects as follows: the present invention etches microdefect in the plane of diamond particles thus forms the micro-sword being largely used to grinding, the diamond abrasive grain participating in grinding is no longer the form of individual particle, multiple micro-swords simultaneously participate in grinding, improve grinding efficiency, increasing machining accuracy, the diamond abrasive grain simultaneously participating in grinding is micro-broken mode, can be continuously updated the grinding sword made new advances during grinding, it is significantly reduced the grinding time, improves working (machining) efficiency.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the front view of first embodiment of the invention；
Fig. 2 is the generalized section of first embodiment of the invention；
Fig. 3 is the schematic diagram of first embodiment diamond particles；
Fig. 4 is the schematic diagram of the second embodiment diamond particles；
Fig. 5 is the schematic diagram of the 3rd embodiment diamond particles；
Fig. 6 is the sectional view of microflute in second and third embodiments；
Fig. 7 is the schematic diagram of fourth embodiment of the invention；
Fig. 8 is the top view of fourth embodiment of the invention.
Detailed description of the invention
Emery wheel as shown in Figure 1 to Figure 3, including a pedestal 101, pedestal 101 surface is fixedly connected with polylith matrix 201, each circular layout of matrix 201.Each matrix 201 is provided with a diamond monolayer, and this diamond monolayer is made up of some diamond particles 301 with complete crystal formation.The granularity of diamond particles 301 is 18/20 to 70/80 mesh, and the area of matrix 201 surface distributed diamond particles 301 accounts for 30～80%.
The preparation method of this emery wheel is as follows:
(1) select common iron as matrix 201, by smooth for matrix 201 Surface Machining, make a plane；
(2) one layer of silver-based brazing alloy powder of binding agent even spread is used on matrix 201 surface；
(3) use the method for ordered arrangement that the synthetic diamond particles 301 of complete crystal formation is evenly distributed on the surface of matrix 201；
(4) the goods soldering after (1) (2) (3) being handled well.After soldering, the end face of diamond particles 301 matrix 201 dorsad of complete crystal formation is coplanar or the most coplanar thus form product surface, and this product surface is parallel with matrix 201 surface or less parallel；
(5) using diamond lap dish that the diamond composition surface after soldering is ground processing, the diamond composition of the flat-top being achieved in that can obtain higher flatness, flatness and conforming surface flat-top；
(6) pulse laser (nanosecond) is used to carry out controlled lithography at product surface, the micropore 401 of a series of rectangular array of topside etch at diamond particles 301, the diameter of micropore 401 and the degree of depth are 0.025～0.035mm, and the spacing between micropore 401 is 0.1mm；
(7) after micropore 401 has etched, each matrix 201 is arranged on pedestal 101, and makes the product surface of each matrix 201 correspondence coplanar or the most coplanar, thus form the grinding face with micro-sword.
Difference among emery wheel as shown in Figure 4, with first embodiment is mesh number and the form of microdefect of diamond particles.In this embodiment, diamond particles 302 is 30/35 mesh, microdefect is crisscross microflute 501, microflute 501 is formed by pulse laser (psec) etching, each microflute 501 width is 0.02～0.025mm, and the degree of depth is 0.02～0.025mm, and microflute 501 is substantially in " V " type, cell wall angle angle is 25～80, as shown in Figure 6.
Difference among emery wheel as shown in Figure 5, with first embodiment is mesh number and the form of microdefect of diamond particles.In this embodiment, diamond particles 303 is 40/50～70/80 mesh, microdefect is crisscross microflute 502 and the micropore 402 of rectangular array combines, micropore 402 and microflute 502 are formed by pulse laser (femtosecond) etching, each microflute 502 width is 0.015～0.018mm, the degree of depth is 0.015～0.018mm, and microflute is substantially in " V " type, cell wall angle angle was 10～80 (as shown in Figure 6), the diameter of micropore 402 and the degree of depth are 0.02～0.025mm, and the spacing between micropore 402 is 0.05mm.
Grinding wheel dressing pen as shown in Figure 7 and Figure 8, the matrix 2 including penholder 1, being connected to pen arm end and soldering diamond particles 304 on matrix, the manufacture method of this grinding wheel dressing pen is as follows:
(1) select common iron as matrix 2, by smooth for matrix 2 Surface Machining, make a plane；
(2) one layer of nickel-based brazing alloy powder of binding agent even spread is used on matrix 2 surface；
(3) use the method for ordered arrangement that the synthetic diamond particles 304 of complete crystal formation is evenly distributed on the surface of matrix 1；
(4) the goods soldering after (1) (2) (3) being handled well.After soldering, the end face of diamond particles 304 matrix 2 dorsad of complete crystal formation is coplanar or the most coplanar thus form product surface, and this product surface is parallel with matrix surface or less parallel；
(5) using diamond lap dish that the diamond composition surface after soldering is ground processing, the diamond composition of the flat-top being achieved in that can obtain higher flatness, flatness and conforming surface flat-top.
(6) pulse laser is used to carry out controlled lithography at product surface, the micropore of a series of rectangular array of topside etch at diamond particles 304 and crisscross microflute, form structure as shown in Figure 5；
(7) matrix 2 is arranged on penholder 1, makes product surface form the finishing face contacted with emery wheel.
The above is the preferred embodiment of the present invention, and it is not intended that limiting the scope of the invention.
Claims (9)
1. a micro-sword grinding product, including diamond particles, it is characterized in that: one of them plane of described diamond particles is provided with some recessed microdefects, thus form the micro-sword of grinding in this plane, some uniform solderings of diamond particles with complete crystal formation at matrix surface thus form the diamond particles structure of monolayer, each diamond particles is provided with the plane matrix dorsad and at grade or the most at grade of microdefect, thus forming product surface, described product surface is parallel or substantially parallel with matrix surface.
Micro-sword grinding product the most according to claim 1, it is characterised in that: described microdefect includes uniform micropore.
Micro-sword grinding product the most according to claim 1, it is characterised in that: described microdefect includes uniform microflute.
Micro-sword grinding product the most according to claim 3, it is characterised in that: described microflute is substantially in " V " type, and cell wall angle angle is 10～80.
Micro-sword grinding product the most according to claim 1, it is characterised in that: described microdefect is the combination of micropore and microflute.
6. the preparation method of the micro-sword grinding product according to any one of a claim 1 to 5, it is characterised in that: use pulse laser to go out recessed microdefect at a planar etch of diamond particles, make this plane form micro-sword of grinding.
Preparation method the most according to claim 6, it is characterized in that: in the way of ordered arrangement, some diamond particles are distributed in matrix surface then soldering, make diamond particles needs to etch the plane of microdefect at grade or the most at grade, thus form the product surface of flat-top, and product surface is parallel or substantially parallel with matrix surface.
8. an emery wheel, it is characterised in that: including the goods as according to any one of claim 1 to 5, the plane being provided with microdefect in goods forms grinding face.
9. a grinding wheel dressing pen, it is characterised in that: the finishing face contacted with emery wheel is the plane being provided with microdefect in goods according to any one of claim 1 to 5.
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| CN107378813A (en) * | 2017-09-08 | 2017-11-24 | 广东工业大学 | A kind of emery wheel processing method |
| CN107775193B (en) * | 2017-10-24 | 2019-07-19 | 长沙理工大学 | A kind of method and system of double light beam laser soldering diamond |
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| CN108747858B (en) * | 2018-06-13 | 2020-04-03 | 长沙理工大学 | Preparation method of ordered micro-groove structure PCD grinding wheel capable of machining positive rake angle |
| CN109894989B (en) * | 2019-04-10 | 2019-12-13 | 贵州大学 | Novel laser structured diamond abrasive particle polishing pad and abrasive particle structuring method thereof |
| CN110561272A (en) * | 2019-10-23 | 2019-12-13 | 无锡市兰天金刚石有限责任公司 | Superhard tool for dressing grinding wheel and preparation method thereof |
| CN111962118B (en) * | 2020-07-09 | 2023-02-17 | 中南大学 | High-performance electroplated diamond tool and preparation method and application thereof |
| CN113618648B (en) * | 2021-08-18 | 2022-08-16 | 全立传感科技(南京)有限公司 | Preparation method of regular fine diamond particle grinding tool |
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