CN102496582B - Method for manufacturing double-interface IC (integrated circuit) card - Google Patents

Abstract

The invention relates to a method for manufacturing a double-interface IC (integrated circuit) card. The method comprises the following steps of: a. etching or printing a coil on the front surface of a substrate, and etching or printing two connection points in the middle, wherein one connection point is connected with an end point in the coil, and a connecting wire, which extends to the back surface of the other connection point, is etched or printed on the back surface of the substrate at the outer end point of the coil; b. jumper wire treatment: punching holes in the substrate at the outer end point of the coil and the other connection point, and short-circuiting the outer end point of the coil and the other connection point through the connecting wire by using a conductive adhesive; c. respectively attaching a tin sheet on the two connection points on the front surface of the substrate by using the conductive adhesive; d. laminating a substrate surface layer, the substrate and a substrate bottom layer into an integral body; e. milling a connecting slot, which can expose the two tin sheets, in the substrate surface layer; f. putting an IC chip on the substrate surface layer, so that two input ports of the IC chip are respectively welded with the two tin sheets through wires; and g. packaging. The method has the advantages of simple process, high production efficiency and low manufacturing cost.

Description

A kind of manufacture method of double-interface IC card

Technical field

The present invention relates to a kind of manufacture method of double-interface IC card.

Background technology

The manufacture method of current double-interface IC card, is normally completed by following steps, and 1, on base material, arrange insulated coil and the two tin sheets that are connected with IC chip; 2, two end points of insulated coil are carried out to depainting processing, cause the position of welding with tin sheet, by welding procedure, be connected with two tin sheets respectively; 3, base material top layer, base material, base material bottom are laminated to integrative-structure; 4, groove milling on base material top layer, exposes tin sheet 5, IC chips welding, and two input ports are welded with two tin sheets respectively; 6, encapsulation., there are following two problems in the double-interface IC card that adopts this processing step to make: one,, with machinery implanted coil on base material, production efficiency is low; Two, two of coil end points and tin sheet must welds, make the end points of coil under high-temperature soldering effect, destroy insulating varnish, realize and being electrically connected to, welding procedure complexity; The problems referred to above directly have influence on production efficiency and manufacturing cost.

Summary of the invention

The object of the present invention is to provide the manufacture method of the double-interface IC card that a kind of technique is simple, production efficiency is high, cost of manufacture is low.

The object of the present invention is achieved like this: a kind of manufacture method of double-interface IC card, is characterized in that: comprise the following steps:

At base material (1) front-side etch or printed coil (2) and the tie point (30 that is connected with two input ports of IC chip (9) respectively in middle part etching or the printing of base material (1), 31), one of them tie point (30) is connected with the interior end points of coil (2), the outer end points (20) that is positioned at coil (2) at the back side of base material (1) is located etching or is printed with the connecting line (4) extending to the back side of another tie point (31), the outer end points (20) that is wherein positioned at coil (2) at base material (1) is located to locate to be drilled with in advance jumper hole with another tie point (31), after etching or printing, connecting line (4) is by the outer end points (20) of coil (2) and another tie point (31) short circuit,

B, on positive two tie points (30,31) of base material (1), with electroconductive binder, paste a tin sheet (5) respectively;

C, base material top layer (6), base material (1), base material bottom (7) are laminated to integrative-structure substrate layer laminate, base material (1) is positioned between base material top layer (6) and base material bottom (7);

D, on base material top layer (6), mill out the link slot (8) that can expose two tin sheets (5);

E, that IC chip (9) is arranged on to base material top layer (6) is upper, and two input ports of IC chip (9) are welded with two tin sheets (5) respectively by wire;

F, encapsulation.

Good effect of the present invention: substitute insulated coil by etching or printed coil, its coil is arranged faster simple, while being connected with tin sheet, can be directly bonding with electroconductive binder, relative welding procedure, technique is simple, production efficiency is high, and cost is low.

Accompanying drawing explanation

Fig. 1 is etching or the matrix structure schematic diagram that is printed with coil;

Fig. 2 is the structural representation before substrate layer laminate lamination;

Fig. 3 is the substrate layer laminate structural representation after groove milling;

Fig. 4 is IC chip welded structure schematic diagram;

Fig. 5 is double-interface IC card encapsulation figure;

Fig. 6 is etching or the large stretch of matrix structure schematic diagram that is printed with coil.

Embodiment

Below in conjunction with accompanying drawing, the embodiment of the manufacture method of double-interface IC card of the present invention is described in further detail.

As Figure 1-Figure 5, the manufacture method of double-interface IC card of the present invention, comprises the following steps:

A, tie point 30 and another tie point 31 of in base material 1 front-side etch or printed coil 2 and middle part etching or printing in base material 1 front, being connected with two input ports of IC chip 9 respectively, one of them tie point 30 is connected with the interior end points of coil 2, at the back side of base material 1, be positioned at the outer end points 20 places etching of coil 2 or be printed with the connecting line 4 extending to the back side of another tie point 31, wherein at base material 1, be positioned at outer end points 20 places of coil 2 and another tie point 31 places are drilled with jumper hole in advance, after etching or printing, connecting line 4 is by the outer end points of coil 2 20 and another tie point 31 short circuits,

B, on two tie points 30,31 in base material 1 front, with electroconductive binder, paste a tin sheet 5 respectively;

C, base material top layer 6, base material 1, base material bottom 7 are laminated to integrative-structure substrate layer laminate, base material 1 is between base material top layer 6 and base material bottom 7;

D, on base material top layer 6, mill out the link slot 8 that can expose two tin sheets 5;

E, IC chip 9 is arranged on base material top layer 6, two input ports that make IC chip 9 by wire respectively with 5 welding of two tin sheets;

F, encapsulation: during encapsulation, can directly encapsulate, also can after surface adds decorative layer, be packaged into again finished product.

Conventionally when making double-interface IC card, in order to realize mass production, farthest enhance productivity, base material 1 is all a very large-area material, is printed with many group coils 2 in the above, as shown in Figure 6, the processing step of general step a-d is all synchronously to complete on this large material, after completing, cut out the separate unit piece into IC-card size, then each separate unit piece is carried out to groove milling processing, upper production line and 9 welding of IC chip.

Claims (1)

1. a manufacture method for double-interface IC card, is characterized in that: comprise the following steps:

A, at base material (1) front-side etch or printed coil (2) and the tie point (30 that is connected with two input ports of IC chip (9) respectively in middle part etching or the printing of base material (1), 31), one of them tie point (30) is connected with the interior end points of coil (2), the outer end points (20) that is positioned at coil (2) at the back side of base material (1) is located etching or is printed with the connecting line (4) extending to the back side of another tie point (31), the outer end points (20) that is wherein positioned at coil (2) at base material (1) is located to locate to be drilled with in advance jumper hole with another tie point (31), after etching or printing, connecting line (4) is by the outer end points (20) of coil (2) and another tie point (31) short circuit,

B, on positive two tie points (30,31) of base material (1), with electroconductive binder, paste a tin sheet (5) respectively;

C, base material top layer (6), base material (1), base material bottom (7) are laminated to integrative-structure substrate layer laminate, base material (1) is positioned between base material top layer (6) and base material bottom (7);

D, on base material top layer (6), mill out the link slot (8) that can expose two tin sheets (5);

E, that IC chip (9) is arranged on to base material top layer (6) is upper, and two input ports of IC chip (9) are welded with two tin sheets (5) respectively by wire;

F, encapsulation.

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