CN108629397A - A kind of electronic tag and its manufacturing method - Google Patents
A kind of electronic tag and its manufacturing method Download PDFInfo
- Publication number
- CN108629397A CN108629397A CN201810410014.9A CN201810410014A CN108629397A CN 108629397 A CN108629397 A CN 108629397A CN 201810410014 A CN201810410014 A CN 201810410014A CN 108629397 A CN108629397 A CN 108629397A
- Authority
- CN
- China
- Prior art keywords
- coil
- chip
- tie point
- conductive
- electronic tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000004804 winding Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 36
- 239000002131 composite material Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000011135 tin Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 238000003825 pressing Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- UIFOTCALDQIDTI-UHFFFAOYSA-N arsanylidynenickel Chemical compound [As]#[Ni] UIFOTCALDQIDTI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The embodiment of the invention discloses a kind of electronic tag and its manufacturing method, which includes：Chip is provided with the first tie point and the second tie point on chip；Coil on chip, coil include the first conductive port and the second conductive port, and coil is that the spacing between wire winding in a ring and two circle conducting wire of arbitrary neighborhood is greater than or equal to the first default spacing；Encapsulated layer, encapsulated layer is for being packaged chip and coil so that the first conductive port is in electrical contact with the electrical contact of the first tie point and the second conductive port with the second tie point.Electronic tag provided in an embodiment of the present invention and its manufacturing method, using encapsulated layer potted coil and chip, pressing is corresponded to using the tie point for being physically in direct contact the conductive port and chip that make coil and realizes electrical contact conducting, without butt-joint equipment, reduce manufacturing cost and process, additionally it is possible to improve production efficiency.
Description
Technical field
The present embodiments relate to electronic label technology more particularly to a kind of electronic tag and its manufacturing methods.
Background technology
Smart card refers to a kind of contactless smart cards flake products containing chip and coil.The production system of existing smart card
Journey is after being packaged chip with chip on board packaged type or being packaged with module packaged type, then with machine butt-joint side
Formula adds tin welding mode that the copper wire butt-joint with insulated paint covering is electrically connected on the pad of chip, and smart card is formed with this
Agent structure.
However, the procedure for producing of existing smart card has the following problems：It must have specific butt-joint machinery equipment cooperation
It could realize production so that tedious process, production cost height, low production efficiency.
Invention content
A kind of electronic tag of offer of the embodiment of the present invention and its manufacturing method, to reduce production process and cost, and are improved
Production efficiency.
An embodiment of the present invention provides a kind of electronic tag, which includes：
Chip is provided with the first tie point and the second tie point on the chip；
Coil on the chip, the coil include the first conductive port and the second conductive port, the coil
Spacing between conducting wire described in wire winding in a ring and two circle of arbitrary neighborhood is greater than or equal to the first default spacing；
Encapsulated layer, the encapsulated layer is for being packaged the chip and the coil so that the described first conductive port
It is in electrical contact with second tie point with first tie point electrical contact and the second conductive port.
Further, the composition material for forming the conducting wire of the coil includes copper, aluminium, copper alloy or aluminium alloy.
Further, the conducting wire for forming the coil includes that the first conductor wire is led with the second of package first conductor wire
Electric layer, the resistivity of first conductor wire are less than the resistivity of second conductive layer.
Further, the composition material of first conductor wire includes copper, aluminium, copper alloy or aluminium alloy；Described second leads
The composition material of electric layer includes tin, silver, nickel, bazar metal or alloy.
Further, the described first default spacing is equal to 0.8mm.
The embodiment of the present invention additionally provides a kind of manufacturing method of electronic tag, the manufacturing method, including：
One chip is provided, the first tie point and the second tie point are provided on the chip；
A coil is provided, on the chip, the coil includes that the first conductive port and second is led for the coil setting
Electric port, the coil are that the spacing between conducting wire described in wire winding in a ring and two circle of arbitrary neighborhood is greater than or equal to the
One default spacing；
The chip and the coil are packaged so that the described first conductive port connects with the first tie point electricity
It touches and the second conductive port is in electrical contact with second tie point.
Electronic tag provided in an embodiment of the present invention and its manufacturing method are provided with the first tie point and second on chip and connect
Contact, it includes the first conductive port and the second conductive port to be located at the coil on chip, coil be wire winding in a ring and
Spacing between two circle conducting wire of arbitrary neighborhood is greater than or equal to the first default spacing, and encapsulated layer is for sealing chip and coil
Being filled with makes the first conductive port be in electrical contact with the second tie point with the electrical contact of the first tie point and the second conductive port.This hair
The electronic tag and its manufacturing method that bright embodiment provides are used physically directly using encapsulated layer potted coil and chip
Contact makes the conductive port of coil and the tie point of chip correspond to pressing realization electrical contact conducting, is not necessarily to butt-joint equipment, reduces
Manufacturing cost and process, additionally it is possible to improve production efficiency.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing does one and simply introduces, it should be apparent that, drawings in the following description are some embodiments of the invention, for this
For the those of ordinary skill of field, without creative efforts, others are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of schematic diagram of electronic tag provided in an embodiment of the present invention；
Fig. 2 is sectional views of the Fig. 1 along A-A'；
Fig. 3 is the sectional view of the conducting wire of electronic tag coil provided in an embodiment of the present invention；
Fig. 4 is the flow chart of electronic tag manufacturing method provided in an embodiment of the present invention.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, hereinafter with reference to attached in the embodiment of the present invention
Figure, technical scheme of the present invention is clearly and completely described by embodiment, it is clear that described embodiment is the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, shall fall within the protection scope of the present invention.
Refering to what is shown in Fig. 1, being a kind of schematic diagram of electronic tag provided in an embodiment of the present invention, Fig. 2 is Fig. 1 along A-A'
Sectional view.Electronic tag provided in this embodiment includes：Chip 10 is provided with the connection of the first tie point 11 and second on chip 10
Point 12；Coil 20 on chip 10, coil 20 include 21 and second conductive port 22 of the first conductive port, coil 20 be in
Spacing L1 between the wire winding and two circle conducting wire of arbitrary neighborhood of annular is greater than or equal to the first default spacing；Encapsulated layer 30,
Encapsulated layer 30 for chip 10 and coil 20 are packaged so that the first conductive 21 and first tie point 11 of port be in electrical contact, with
And second conductive 22 and second tie point 12 of port be in electrical contact.
In the present embodiment, chip 10 is any one suitable for applying the functional chip electronic tag, smart card to be
A type in electronic tag, does not limit chip type or function specifically in the present invention.It is provided on chip 10
First tie point 11 and the second tie point 12,11 and second tie point 12 of optional first tie point is pad, needs to illustrate
It is that similarly to the prior art, details are not described herein for the technique and process of setting tie point on chip 10.In addition, being set on chip 10
The position for the tie point set is related to 20 shape and structure of coil in order to which tie point is electrically connected with the conductive port of coil 20, chip
The quantity for the tie point being arranged on 10 is related to 20 quantity of coil, and there are two the coils 20 of conductive port to correspond to for typically one tool
Two tie points.
In the present embodiment, coil 20 is located on chip 10, and coil 20 includes 21 and second conductive port of the first conductive port
22, coil 20 is wire winding in a ring, then the both ends for forming the conducting wire of coil 20 are the first conductive port of coil 20
21 and the second conductive port 22.In the present embodiment, coil 20 is wire winding in a ring, and insulation is not enclosed with outside the conducting wire
Layer, the spacing L1 between two circle conducting wire of arbitrary neighborhood is greater than or equal to the first default spacing, thus can avoid adjacent two circles conducting wire
Between short circuit.Optional first default spacing is equal to 0.8mm, it should be noted that is led in two circle of arbitrary neighborhood that ensure that coil
On the basis of between line being not in short circuit problem, related practitioner can rationally be arranged in coil two circle conducting wire of arbitrary neighborhood it
Between spacing, in the present invention without specifically limiting.
In the present embodiment, encapsulated layer 30 is for being packaged chip 10 and coil 20 so that the first conductive port 21 and the
One tie point 11 is in electrical contact and the second conductive port 22 and second tie point 12 electrical contact.Specifically, being provided in the present embodiment
One chip 10 and a coil 20 with tie point；Coil 20 is placed on chip 10, wherein the conductive port of the first of coil 20
21 corresponding with the position of the first tie point 11 of chip 10 and coil 20 second conductive ports 22 connect with the second of chip 10
The position of contact 12 corresponds to；Encapsulated layer 30 is packaged chip 10 and coil 20, then the conductive port of the first of coil 20 21 with
First tie point 11 of chip 10, which is in direct contact, realizes the of the second conductive port 22 of electrical connection and coil 20 and chip 10
Two tie points 12 are in direct contact realization electrical connection.It should be noted that the knot that electronic tag chips 10 and coil 20 are electrically connected
Structure can be referred to as the antenna structure of electronic tag, and after completing encapsulation to antenna structure, electronic tag is according to its chips and line
The difference of circle function realizes that different functions, such as the electronic tag are chosen as smart card such as mass transit card, access card or bank card,
The electronic tag can also be a kind of any other electronic tag product, is not defined in the present invention to electronic tag.
Electronic tag provided in this embodiment is provided with the first tie point and the second tie point on chip, is located on chip
Coil include the first conductive port and the second conductive port, coil is wire winding in a ring and two circle conducting wire of arbitrary neighborhood
Between spacing be greater than or equal to the first default spacing, encapsulated layer is for being packaged chip and coil so that the first conducting end
Mouth and the electrical contact of the first tie point and the second conductive port and the electrical contact of the second tie point.Electronics mark provided in this embodiment
Label use encapsulated layer potted coil and chip in manufacturing process, using be physically in direct contact the conductive port for making coil and
The tie point of chip corresponds to pressing and realizes electrical contact conducting, is not necessarily to butt-joint equipment, reduces manufacturing cost and process, additionally it is possible to carry
High efficiency.
Optionally, the composition material for forming the conducting wire of coil 20 includes copper, aluminium, copper alloy or aluminium alloy.In the present embodiment,
The composition material for forming the conducting wire of coil 20 includes copper, aluminium, copper alloy or aluminium alloy, conducting wire do not use insulating layer and separation layer into
Row package, but conductive conducting wire coiling is directly formed into coil 20, reduce the manufacturing process of conducting wire, and adjacent
There are the short circuit problems that spacing L1 can also avoid coil 20 between two circle conducting wires.It will be understood by those skilled in the art that being formed
The conductive composition material of coil includes but not limited to above example, any one is suitable for being formed the conductive material of winding wire
Each fall within protection scope of the present invention.
The composition material for forming the conducting wire of coil 20 includes the conduction of copper, aluminium, copper alloy or aluminium alloy, then conducting wire and its first
Port 21 and the second conductive port 22 all have electric conductivity, are physically directly connect correspondingly, being used in electronic tag manufacturing process
The tie point correspondence pressing for touching the conductive port and chip 10 that make coil 20 can be realized as electrical contact conducting.In the prior art,
The butt-weld joint of butt-joint machine abolished by electric current the copper line surface of coil insulated paint covering and melt write layer so that coil copper wire
Butt-joint realizes the electrical connection of coil and chip on the pad of chip.Compared with prior art, the present embodiment is not necessarily to butt-joint machine
Without butt-joint process is carried out, reduces cost, reduces manufacturing process, accordingly improve formation efficiency.
As shown in figure 3, the optional conducting wire for forming coil 20 includes the first conductor wire 20a of the first conductor wire 20a and package
The resistivity of second conductive layer 20b, the first conductor wire 20a is less than the resistivity of the second conductive layer 20b.First in the present embodiment
The surface of conductor wire 20a wraps up the second conductive layer 20b, the second conductive layer 20b and the first conductor wire 20a and all has electric conductivity, then
After the first tie point electrical contact of the conductive port of the first of coil 20 and chip, the first tie point of chip passes through the second conductive layer
20b is electrically connected with the first conductor wire 20a realizations and the second tie point of the second conductive port of coil 20 and chip is in electrical contact
Afterwards, the second tie point of chip is electrically connected by the second conductive layer 20b with the first conductor wire 20a realizations.First conductor wire 20a's
Resistivity is less than the resistivity of the second conductive layer 20b, i.e. the electric conductivity of the first conductor wire 20a is better than leading for the second conductive layer 20b
Electrically, it is convenient for the transmission of electric signal in coil 20.
In addition, guarantor can also be played by wrapping up the second conductive layer 20b, the second conductive layer 20b on the surface of the first conductor wire 20a
The problems such as effect for protecting the first conductor wire 20a, coil caused by avoiding the first conductor wire 20a broken strings is breaking.
Optionally, the composition material of the first conductor wire 20a includes copper, aluminium, copper alloy or aluminium alloy；Second conductive layer 20b
Composition material include tin, silver, nickel, bazar metal or alloy.Copper, aluminium, copper alloy or aluminium alloy are chosen as composition material
The first conductor wire 20a resistivity it is relatively low, convenient for the transmission of electric signal in coil 20.Choose tin, silver, nickel, bazar metal or
Alloy is also conductive as the second conductive layer 20b of composition material, can realize the second conductive layer 20b and the first conductor wire
Conducting between 20a, the second conductive layer 20b being formed simultaneously, which also has, to be unlikely to deform and not oxidizable advantage, Neng Goubao
The first conductor wire 20a is protected to be damaged or break to avoid the first conductor wire 20a.
It will be understood by those skilled in the art that formed coil the first conductor wire composition material include but not limited to more than
The conductive material of example, any one the first conductor wire for being suitable for forming coil each falls within protection scope of the present invention, is formed
The composition material of second conductive layer of coil includes but not limited to above example, any one, which is suitable for forming the second of coil, leads
The conductive material of electric layer each falls within protection scope of the present invention.
Refering to what is shown in Fig. 4, being a kind of flow chart of the manufacturing method of electronic tag provided in an embodiment of the present invention, the electronics
Label manufacturing process can be used for making the electronic tag described in above-mentioned any embodiment.
Electronic tag manufacturing method provided in this embodiment includes：
Step 110 provides a chip, and the first tie point and the second tie point are provided on chip.Optional chip is arbitrary
A kind of chip can be applied to electronic tag, optional first tie point and the second tie point are the pad being arranged on chip.
Step 120 provides a coil, and coil is arranged on chip, and coil includes the first conductive port and the second conducting end
Mouthful, coil is that the spacing between wire winding in a ring and two circle conducting wire of arbitrary neighborhood is greater than or equal to the first default spacing.
Coil is arranged on chip, and the first conductive port of specific coil and the first tie point of chip are correspondingly arranged simultaneously
It is in contact, the second conductive port of coil is correspondingly arranged and is in contact with the second tie point of chip.Optional first default spacing
Equal to 0.8mm, it thus can avoid occurring short circuit in coil between two circle conducting wire of arbitrary neighborhood.The group of the optional conducting wire for forming coil
Include copper, aluminium, copper alloy or aluminium alloy at material.
The also optional conducting wire for forming coil includes the of the first conductor wire of the first conductor wire and package in other embodiments
Two conductive layers, the resistivity of the first conductor wire are less than the resistivity of the second conductive layer, then the second conductive layer and the first conductor wire electricity
Conducting, while the second conductive layer can also protect the first conductor wire to break or damage to avoid the first conductor wire.Optional first leads
The composition material of electric wire includes copper, aluminium, copper alloy or aluminium alloy；The composition material of second conductive layer includes tin, silver, nickel, nickeline
Alloy or alloy.
Step 130 is packaged chip and coil so that the first conductive port and the electrical contact of the first tie point, Yi Ji
Two conductive ports are in electrical contact with the second tie point.
After being packaged to chip and coil using encapsulated layer, chip and coil are realized and are physically in direct contact, specifically
Chip the first tie point under encapsulated layer effect using the be physically in direct contact realization and coil first conductive port
Electrical connection, the second tie point of chip use the second conducting end for being physically in direct contact realization and coil under encapsulated layer effect
The electrical connection of mouth.
Electronic tag manufacturing method provided in this embodiment is provided with the first tie point and the second tie point, position on chip
Include the first conductive port and the second conductive port in the coil on chip, coil is wire winding in a ring and arbitrary neighborhood
Spacing between two circle conducting wires is greater than or equal to the first default spacing, and encapsulated layer is for being packaged chip and coil so that the
One conductive port is in electrical contact with the first tie point and the second conductive port is in electrical contact with the second tie point.The present embodiment provides
Electronic tag manufacturing method, encapsulated layer potted coil and chip are used in manufacturing process, is made using being physically in direct contact
The conductive port of coil and the tie point of chip correspond to pressing and realize electrical contact conducting, are not necessarily to butt-joint equipment, reduce and be manufactured into
Sheet and process, additionally it is possible to improve production efficiency.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,
It readjusts, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although by above example to this
Invention is described in further detail, but the present invention is not limited only to above example, is not departing from present inventive concept
In the case of, can also include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (6)
1. a kind of electronic tag, which is characterized in that including：
Chip is provided with the first tie point and the second tie point on the chip；
Coil on the chip, the coil include the first conductive port and the second conductive port, the coil be in
Spacing between conducting wire described in the wire winding and two circle of arbitrary neighborhood of annular is greater than or equal to the first default spacing；
Encapsulated layer, the encapsulated layer is for being packaged the chip and the coil so that the described first conductive port and institute
It states the electrical contact of the first tie point and the second conductive port is in electrical contact with second tie point.
2. electronic tag according to claim 1, which is characterized in that the composition material for forming the conducting wire of the coil includes
Copper, aluminium, copper alloy or aluminium alloy.
3. electronic tag according to claim 1, which is characterized in that the conducting wire for forming the coil includes the first conductor wire
With the second conductive layer for wrapping up first conductor wire, the resistivity of first conductor wire is less than the electricity of second conductive layer
Resistance rate.
4. electronic tag according to claim 3, which is characterized in that the composition material of first conductor wire include copper,
Aluminium, copper alloy or aluminium alloy；The composition material of second conductive layer includes tin, silver, nickel, bazar metal or alloy.
5. electronic tag according to claim 1, which is characterized in that the first default spacing is equal to 0.8mm.
6. a kind of manufacturing method of electronic tag, which is characterized in that including：
One chip is provided, the first tie point and the second tie point are provided on the chip；
A coil is provided, on the chip, the coil includes the first conductive port and the second conducting end for the coil setting
Mouthful, the coil is that the spacing between conducting wire described in wire winding in a ring and two circle of arbitrary neighborhood is greater than or equal to first in advance
If spacing；
The chip and the coil are packaged so that the first conductive port with first tie point electrical contact, with
And the second conduction port is in electrical contact with second tie point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810410014.9A CN108629397A (en) | 2018-05-02 | 2018-05-02 | A kind of electronic tag and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810410014.9A CN108629397A (en) | 2018-05-02 | 2018-05-02 | A kind of electronic tag and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108629397A true CN108629397A (en) | 2018-10-09 |
Family
ID=63695281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810410014.9A Pending CN108629397A (en) | 2018-05-02 | 2018-05-02 | A kind of electronic tag and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108629397A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572336A (en) * | 2008-04-30 | 2009-11-04 | 深圳市华阳微电子有限公司 | Small-size electronic tag antenna and manufacture method thereof |
| CN102496582A (en) * | 2011-11-23 | 2012-06-13 | 佛山市顺德区德芯智能科技有限公司 | Method for manufacturing double-interface IC (integrated circuit) card |
| JP2013257633A (en) * | 2012-06-11 | 2013-12-26 | Renesas Electronics Corp | Rfid tag manufacturing method and rfid tag |
| US20160275391A1 (en) * | 2014-12-10 | 2016-09-22 | Texas Instruments Deutschland Gmbh | Miniature rfid tag with coil on ic package |
| CN106462792A (en) * | 2014-11-27 | 2017-02-22 | 株式会社村田制作所 | Rfic module and rfid tag equipped with same |
| CN208077229U (en) * | 2018-05-02 | 2018-11-09 | 上海真智电子标签技术有限公司 | A kind of electronic tag |
-
2018
- 2018-05-02 CN CN201810410014.9A patent/CN108629397A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572336A (en) * | 2008-04-30 | 2009-11-04 | 深圳市华阳微电子有限公司 | Small-size electronic tag antenna and manufacture method thereof |
| CN102496582A (en) * | 2011-11-23 | 2012-06-13 | 佛山市顺德区德芯智能科技有限公司 | Method for manufacturing double-interface IC (integrated circuit) card |
| JP2013257633A (en) * | 2012-06-11 | 2013-12-26 | Renesas Electronics Corp | Rfid tag manufacturing method and rfid tag |
| CN106462792A (en) * | 2014-11-27 | 2017-02-22 | 株式会社村田制作所 | Rfic module and rfid tag equipped with same |
| US20160275391A1 (en) * | 2014-12-10 | 2016-09-22 | Texas Instruments Deutschland Gmbh | Miniature rfid tag with coil on ic package |
| CN208077229U (en) * | 2018-05-02 | 2018-11-09 | 上海真智电子标签技术有限公司 | A kind of electronic tag |
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