CN102482794A - 镀锡层的耐热剥离性优良的Cu-Ni-Si系合金镀锡条 - Google Patents
镀锡层的耐热剥离性优良的Cu-Ni-Si系合金镀锡条 Download PDFInfo
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- CN102482794A CN102482794A CN2009801611885A CN200980161188A CN102482794A CN 102482794 A CN102482794 A CN 102482794A CN 2009801611885 A CN2009801611885 A CN 2009801611885A CN 200980161188 A CN200980161188 A CN 200980161188A CN 102482794 A CN102482794 A CN 102482794A
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- Prior art keywords
- concentration
- coating
- copper alloy
- plating
- alloy
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 29
- 239000000956 alloy Substances 0.000 title claims abstract description 29
- 238000007747 plating Methods 0.000 title abstract description 46
- 238000000926 separation method Methods 0.000 title abstract 2
- 239000010949 copper Substances 0.000 claims abstract description 74
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 63
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 229910052718 tin Inorganic materials 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 5
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 claims description 100
- 238000000576 coating method Methods 0.000 claims description 100
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000011135 tin Substances 0.000 description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 41
- 239000002184 metal Substances 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 39
- 239000000758 substrate Substances 0.000 description 32
- 238000010438 heat treatment Methods 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 11
- 230000032683 aging Effects 0.000 description 10
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 10
- 229910017755 Cu-Sn Inorganic materials 0.000 description 9
- 229910017927 Cu—Sn Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000005554 pickling Methods 0.000 description 8
- 229910052725 zinc Inorganic materials 0.000 description 8
- 229910000905 alloy phase Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000006104 solid solution Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 229910018098 Ni-Si Inorganic materials 0.000 description 3
- 229910018529 Ni—Si Inorganic materials 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000004993 emission spectroscopy Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 240000003936 Plumbago auriculata Species 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 108700036934 congenital Sucrase-isomaltase deficiency Proteins 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2009/067100 WO2011039875A1 (ja) | 2009-09-30 | 2009-09-30 | すずめっきの耐熱剥離性に優れるCu-Ni-Si系合金すずめっき条 |
Publications (2)
Publication Number | Publication Date |
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CN102482794A true CN102482794A (zh) | 2012-05-30 |
CN102482794B CN102482794B (zh) | 2014-10-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200980161188.5A Active CN102482794B (zh) | 2009-09-30 | 2009-09-30 | 镀锡层的耐热剥离性优良的Cu-Ni-Si系合金镀锡条 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2011039875A1 (zh) |
KR (1) | KR101356258B1 (zh) |
CN (1) | CN102482794B (zh) |
WO (1) | WO2011039875A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107018624A (zh) * | 2016-01-04 | 2017-08-04 | Jx金属株式会社 | 表面处理铜箔 |
CN109891005A (zh) * | 2017-06-08 | 2019-06-14 | 株式会社豊山 | 用于电气或电子部件和汽车部件的铜合金的镀锡方法以及由其制造的铜合金的镀锡材料 |
CN110669959A (zh) * | 2019-10-25 | 2020-01-10 | 宁夏中色新材料有限公司 | 一种弹性青铜合金及其制备方法 |
CN113454252A (zh) * | 2019-03-28 | 2021-09-28 | 古河电气工业株式会社 | 铜合金条材及其制造方法、使用其的电阻器用电阻材料以及电阻器 |
CN115298334A (zh) * | 2020-03-19 | 2022-11-04 | 三菱综合材料株式会社 | Cu-Ni-Si系铜合金板、带镀膜的Cu-Ni-Si系铜合金板及它们的制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5986822B2 (ja) * | 2012-06-21 | 2016-09-06 | 三菱伸銅株式会社 | Cu−Ni−Si系銅合金Snめっき板及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1840718A (zh) * | 2005-03-29 | 2006-10-04 | 日矿金属加工株式会社 | Cu-Ni-Si-Zn系合金镀锡条 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3906472B2 (ja) * | 1996-02-05 | 2007-04-18 | 三菱伸銅株式会社 | Niメッキ密着性に優れた銅合金 |
TW200706662A (en) | 2005-03-29 | 2007-02-16 | Nippon Mining Co | Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof |
JP2007039789A (ja) * | 2005-03-29 | 2007-02-15 | Nikko Kinzoku Kk | すずめっきの耐熱剥離性に優れるCu−Ni−Si−Zn−Sn系合金条およびそのすずめっき条 |
JP2006307336A (ja) * | 2005-03-29 | 2006-11-09 | Nikko Kinzoku Kk | Cu−Ni−Si−Zn系合金Snめっき条 |
JP4489738B2 (ja) * | 2005-08-31 | 2010-06-23 | 日鉱金属株式会社 | Cu−Ni−Si−Zn系合金すずめっき条 |
-
2009
- 2009-09-30 WO PCT/JP2009/067100 patent/WO2011039875A1/ja active Application Filing
- 2009-09-30 KR KR1020127001034A patent/KR101356258B1/ko active IP Right Grant
- 2009-09-30 JP JP2011534012A patent/JPWO2011039875A1/ja active Pending
- 2009-09-30 CN CN200980161188.5A patent/CN102482794B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1840718A (zh) * | 2005-03-29 | 2006-10-04 | 日矿金属加工株式会社 | Cu-Ni-Si-Zn系合金镀锡条 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107018624A (zh) * | 2016-01-04 | 2017-08-04 | Jx金属株式会社 | 表面处理铜箔 |
CN107018624B (zh) * | 2016-01-04 | 2019-05-07 | Jx金属株式会社 | 表面处理铜箔 |
CN109891005A (zh) * | 2017-06-08 | 2019-06-14 | 株式会社豊山 | 用于电气或电子部件和汽车部件的铜合金的镀锡方法以及由其制造的铜合金的镀锡材料 |
CN109891005B (zh) * | 2017-06-08 | 2021-06-08 | 株式会社豊山 | 用于电气或电子部件和汽车部件的铜合金的镀锡方法以及由其制造的铜合金的镀锡材料 |
US11542606B2 (en) | 2017-06-08 | 2023-01-03 | Poongsan Corporation | Method of tin-plating copper alloy for electric or electronic parts and automobile parts and tin-plating material of copper alloy manufactured therefrom |
CN113454252A (zh) * | 2019-03-28 | 2021-09-28 | 古河电气工业株式会社 | 铜合金条材及其制造方法、使用其的电阻器用电阻材料以及电阻器 |
CN110669959A (zh) * | 2019-10-25 | 2020-01-10 | 宁夏中色新材料有限公司 | 一种弹性青铜合金及其制备方法 |
CN115298334A (zh) * | 2020-03-19 | 2022-11-04 | 三菱综合材料株式会社 | Cu-Ni-Si系铜合金板、带镀膜的Cu-Ni-Si系铜合金板及它们的制造方法 |
CN115298334B (zh) * | 2020-03-19 | 2024-02-06 | 三菱综合材料株式会社 | Cu-Ni-Si系铜合金板、带镀膜的Cu-Ni-Si系铜合金板及它们的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20120023185A (ko) | 2012-03-12 |
CN102482794B (zh) | 2014-10-22 |
JPWO2011039875A1 (ja) | 2013-02-21 |
WO2011039875A1 (ja) | 2011-04-07 |
KR101356258B1 (ko) | 2014-01-28 |
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Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
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Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |