CN101636514B - 印刷基板端子 - Google Patents
印刷基板端子 Download PDFInfo
- Publication number
- CN101636514B CN101636514B CN2008800086630A CN200880008663A CN101636514B CN 101636514 B CN101636514 B CN 101636514B CN 2008800086630 A CN2008800086630 A CN 2008800086630A CN 200880008663 A CN200880008663 A CN 200880008663A CN 101636514 B CN101636514 B CN 101636514B
- Authority
- CN
- China
- Prior art keywords
- copper alloy
- printed board
- board terminal
- scolder
- quality
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 36
- 239000000956 alloy Substances 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 45
- 238000004080 punching Methods 0.000 claims description 22
- 238000009434 installation Methods 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 abstract description 39
- 239000000463 material Substances 0.000 abstract description 15
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000011148 porous material Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 229910001369 Brass Inorganic materials 0.000 description 12
- 239000010951 brass Substances 0.000 description 12
- 230000000630 rising effect Effects 0.000 description 10
- 229910052718 tin Inorganic materials 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910020816 Sn Pb Inorganic materials 0.000 description 5
- 229910020922 Sn-Pb Inorganic materials 0.000 description 5
- 229910008783 Sn—Pb Inorganic materials 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000003490 calendering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910017755 Cu-Sn Inorganic materials 0.000 description 2
- 229910017927 Cu—Sn Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 240000003936 Plumbago auriculata Species 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229940037003 alum Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP075466/2007 | 2007-03-22 | ||
JP2007075466 | 2007-03-22 | ||
PCT/JP2008/055303 WO2008114868A1 (ja) | 2007-03-22 | 2008-03-21 | プリント基板端子用Snめっき銅合金材 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101636514A CN101636514A (zh) | 2010-01-27 |
CN101636514B true CN101636514B (zh) | 2011-04-20 |
Family
ID=39765968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800086630A Active CN101636514B (zh) | 2007-03-22 | 2008-03-21 | 印刷基板端子 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5373598B2 (zh) |
KR (1) | KR101155360B1 (zh) |
CN (1) | CN101636514B (zh) |
TW (1) | TW200844267A (zh) |
WO (1) | WO2008114868A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5490594B2 (ja) * | 2010-03-31 | 2014-05-14 | Jx日鉱日石金属株式会社 | 電池接続タブ材料用Cu−Zn系合金条 |
JP4888586B2 (ja) * | 2010-06-18 | 2012-02-29 | 日立電線株式会社 | 圧延銅箔 |
JP5140171B2 (ja) * | 2011-03-18 | 2013-02-06 | Jx日鉱日石金属株式会社 | 充電用電池タブ材に用いられる銅合金条 |
CN102230107A (zh) * | 2011-06-28 | 2011-11-02 | 安徽精诚铜业股份有限公司 | 抗磁性服辅类黄铜带及其生产工艺 |
JP5417523B1 (ja) * | 2012-12-28 | 2014-02-19 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子 |
EP3020837A4 (en) * | 2013-07-10 | 2017-02-15 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical equipment, copper alloy thin sheet for electronic/electrical equipment, conductive component for electronic/electrical equipment, and terminal |
CN107309522B (zh) * | 2017-06-12 | 2020-10-23 | 湖北三江航天险峰电子信息有限公司 | 一种微波组件引脚搭焊印制板的焊接方法 |
CN108172614A (zh) * | 2017-11-29 | 2018-06-15 | 苏州诺纳可电子科技有限公司 | 一种电子三极管 |
CN108155154A (zh) * | 2017-11-29 | 2018-06-12 | 苏州诺纳可电子科技有限公司 | 一种三极管 |
CN112643162B (zh) * | 2020-11-30 | 2022-06-28 | 浙江福达合金材料科技有限公司 | 一种工业用插头插座触头组件的焊接方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3105392B2 (ja) * | 1994-03-18 | 2000-10-30 | 同和鉱業株式会社 | コネクタ用銅基合金の製造法 |
JP4444245B2 (ja) * | 2005-07-15 | 2010-03-31 | 日鉱金属株式会社 | 電気電子機器用Cu−Zn−Sn合金 |
JP4820228B2 (ja) * | 2005-07-22 | 2011-11-24 | Jx日鉱日石金属株式会社 | Snめっきの耐熱剥離性に優れるCu−Zn−Sn系合金条及びそのSnめっき条 |
JP4247256B2 (ja) * | 2005-08-24 | 2009-04-02 | 日鉱金属株式会社 | Cu−Zn−Sn系合金すずめっき条 |
JP4538424B2 (ja) * | 2006-03-29 | 2010-09-08 | 日鉱金属株式会社 | Cu−Zn−Sn系合金すずめっき条 |
-
2008
- 2008-03-20 TW TW097109796A patent/TW200844267A/zh unknown
- 2008-03-21 JP JP2009505261A patent/JP5373598B2/ja active Active
- 2008-03-21 WO PCT/JP2008/055303 patent/WO2008114868A1/ja active Application Filing
- 2008-03-21 CN CN2008800086630A patent/CN101636514B/zh active Active
- 2008-03-21 KR KR1020097018949A patent/KR101155360B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI374950B (zh) | 2012-10-21 |
JP5373598B2 (ja) | 2013-12-18 |
CN101636514A (zh) | 2010-01-27 |
JPWO2008114868A1 (ja) | 2010-07-08 |
KR101155360B1 (ko) | 2012-06-19 |
KR20090109586A (ko) | 2009-10-20 |
WO2008114868A1 (ja) | 2008-09-25 |
TW200844267A (en) | 2008-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NIPPON MINING HOLDINGS INC. Free format text: FORMER OWNER: NIPPON MINING + METALS CO., LTD. Effective date: 20101122 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20101122 Address after: Tokyo, Japan Applicant after: Nippon Mining Holdings Inc. Address before: Tokyo, Japan Applicant before: Nippon Mining & Metals Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: Japan Tokyo Chiyoda Otemachi a chome 1 No. 2 Patentee after: JX Nippon Mining & Metals Co., Ltd. Address before: Tokyo, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Tokyo Port Area, Japan Patentee after: JX Nippon Mining & Metals Corp. Address before: No.1-2, yidingmu, Daisaku Machi, Chiyoda District, Tokyo, Japan Patentee before: JX Nippon Mining & Metals Corp. |