CN102468553B - Silver coating material and manufacture method thereof - Google Patents
Silver coating material and manufacture method thereof Download PDFInfo
- Publication number
- CN102468553B CN102468553B CN201110371118.1A CN201110371118A CN102468553B CN 102468553 B CN102468553 B CN 102468553B CN 201110371118 A CN201110371118 A CN 201110371118A CN 102468553 B CN102468553 B CN 102468553B
- Authority
- CN
- China
- Prior art keywords
- coating
- thickness
- silver
- coating material
- silver coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The silver coating material of the low cost that even if the present invention provides the adaptation of coating when using in high temperature environments also good and the contact resistance of coating can be suppressed to rise and manufacture method thereof.The silver coating material of the present invention is to form the basal layer that the thickness being made up of Ni is 0.01～1.0 μm, the intermediate layer that thickness is 0.01～0.2 μm being formed on being made up of Cu, the silver coating material that is formed on the top layer that thickness is 0.1 μm～2.0 μm being made up of Ag again on the raw-material surface being made up of rustless steel, wherein, the crystallite diameter being perpendicular on (111) direction, face making top layer reaches more than 300 angstroms.
Description
Technical field
The present invention relates to silver coating material and manufacture method thereof, particularly to silver coating material and the manufacture method thereof of the materials'use as the contact of adapter, switch, relay etc. or terminal component, described adapter, switch, relay etc. are used for the vehicle-mounted or electrical wiring of the people's livelihood.
Background technology
All the time, as the material of the contact of adapter or switch etc. or terminal component etc., use at rustless steel or the cost such as copper or copper alloy ratio on relatively low and that corrosion resistance or mechanical property etc. are excellent raw material, implement the plating material of the plating of stannum, silver, gold etc. according to the needs of the necessary characteristic such as electrical characteristics or tin-welding.
The raw materials such as rustless steel implement the low cost of the tin plated materials of tin plating process, but corrosion resistance in high temperature environments is poor.Although additionally, implement the gilding excellent corrosion resistance of gold-plated process, reliability height on the raw materials such as rustless steel, but cost is high.On the other hand, the silver coating material cost compared with gilding implementing silver-plated process on the raw materials such as rustless steel is relatively low, excellent corrosion resistance compared with tin plated materials.
As the silver coating material implementing silver-plated process on the raw materials such as rustless steel, propose use in electric contact metallic plate, this use in electric contact metallic plate is to form the nickel coating that thickness is 0.1～0.3 μm on the surface of the laminal substrate being made up of rustless steel, it is formed on the copper plate that thickness is 0.1～0.5 μm, it is formed on the silver coating (such as, with reference to No. 3889718 publication of Japanese Patent Laid) that thickness is 1 μm again.
In addition, also proposed the self-cleaning contact stainless steel strip with coating silver, stainless steel strip of this coating silver is that to form the thickness of activated process on the surface of stainless steel substrate be 0.01m～the Ni-based bottom of 0.1 μm, being formed on by least one thickness constituted in nickel, nickel alloy, copper, copper alloy is 0.05 μm～the intermediate layer of 0.2 μm, it is formed on the top layer that thickness is 0.5～2.0 μm (such as, with reference to No. 4279285 publication of Japanese Patent Laid) of silver or silver alloy again.
Also have, also proposed the self-cleaning contact component material with coating silver, the material of this coating silver is by copper, copper alloy, formed by nickel on the metallic matrix that ferrum or ferroalloy are constituted, nickel alloy, the basal layer that thickness is 0.005～0.1 μ that any one in cobalt or cobalt alloy is constituted, the thickness being formed on being made up of copper or copper alloy is the intermediate layer of 0.01～0.2 μm, it is formed on the top layer that thickness is 0.2～1.5 μm being made up of silver or silver alloy again, the arithmetic average roughness Ra of metallic matrix is 0.001～0.2 μm, intermediate layer formed after arithmetic average roughness Ra be 0.001～0.1 μm (such as, with reference to Japanese Patent Laid-Open 2010-146926 publication).
, the deterioration of coated adaptation, the contact resistance of coating the highest situation can be become when existing silver coating material uses in high temperature environments.Even additionally, No. 3889718 publication of Japanese Patent Laid and the silver coating material of No. 4279285 publication of Japanese Patent Laid, when using in high temperature environments also can the deterioration of coated adaptation, can not fully suppress the situation that the contact resistance of coating rises.On the other hand, when the silver coating material of Japanese Patent Laid-Open 2010-146926 publication uses in high temperature environments, although the adaptation of coating is good, the rising of the contact resistance of coating can be suppressed, however it is necessary that and the arithmetic average roughness Ra of roll is adjusted to 0.001～0.2 μm, the arithmetic average roughness Ra of the metallic matrix transferred by roll is adjusted to 0.001～0.2 μm, in addition, need to properly select the kind of the electroplating current density when forming intermediate layer and the additive in electroplate liquid, arithmetic average roughness Ra after being formed in intermediate layer is adjusted to 0.001～0.1 μm, therefore, operation becomes complicated, Expenses Cost.
Summary of the invention
Thus, in view of above-mentioned existing problem, even if it is an object of the invention to provide that the adaptation of coating when using in high temperature environments is also good and the silver coating material of low cost that the contact resistance of coating can be suppressed to rise and manufacture method thereof.
In order to solve above-mentioned problem, present inventor has performed and conscientiously study, find the intermediate layer forming, on the raw-material surface being made up of rustless steel, the basal layer being made up of Ni, being formed on being made up of Cu, be formed on again in the silver coating material on top layer that is made up of Ag, by making the crystallite diameter being perpendicular on (111) direction, face on top layer reach more than 300 angstroms, even if can manufacture, the adaptation of coating when using in high temperature environments is also good and the silver coating material of low cost that the contact resistance of coating can be suppressed to rise, thus completes the present invention.
I.e., the silver coating material of the present invention be formed on the raw-material surface being made up of rustless steel be made up of Ni basal layer, be formed on the intermediate layer being made up of Cu, the silver coating material being formed on the top layer being made up of Ag again, wherein, the crystallite diameter being perpendicular on (111) direction, face making top layer reaches more than 300 angstroms.In this silver coating material, the thickness of basal layer preferably 0.01～1.0 μm, the thickness in intermediate layer preferably 0.01～0.2 μm, the thickness on top layer preferably 0.1～2.0 μm.
In addition, the manufacture method of the silver coating material of the present invention is to form, on the raw-material surface being made up of rustless steel, the basal layer being made up of Ni, it is formed on the intermediate layer being made up of Cu, it is formed on the top layer being made up of Ag again, wherein, the crystallite diameter being perpendicular on (111) direction, face making top layer reaches more than 300 angstroms.In the manufacture method of this silver coating material, top layer preferably by by 80～150g/L the potassium cyanide of silver potassium cyanide, 60～150g/L and the plating bath that formed of the Potassium Selenocyanate of 5～30mg/L in liquid temperature be 15～30 DEG C, electric current density be 2～10A/dm2Condition electroplate and formed.Additionally, the thickness of basal layer preferably 0.01～1.0 μm, the thickness in intermediate layer preferably 0.01～0.2 μm, the thickness on top layer preferably 0.1～2.0 μm.
According to the present invention, even if can manufacture, the adaptation of coating when using in high temperature environments is also good and the silver coating material of low cost that the contact resistance of coating can be suppressed to rise.
Accompanying drawing explanation
Fig. 1 is the figure of contact resistance and the relation of heat time heating time representing the silver coating material obtained by embodiment and comparative example.
Fig. 2 is the figure of the crystallite diameter being perpendicular on (111) direction, face and the relation of contact resistance when heating 150 minutes representing the silver coating material obtained by embodiment and comparative example.
Detailed description of the invention
The embodiment of the silver coating material of the present invention is to form the basal layer that the thickness being made up of Ni is 0.01～1.0 μm on the raw-material surface being made up of rustless steel, the thickness being formed on being made up of Cu is the intermediate layer of 0.01～0.2 μm, it is formed on the silver coating material on the top layer that thickness is 0.1 μm～2.0 μm being made up of Ag again, wherein, the crystallite diameter being perpendicular on (111) direction, face on top layer is more than 300 angstroms (30nm).
In addition, in the embodiment of the manufacture method of the silver coating material of the present invention, the raw-material surface being made up of rustless steel is formed the basal layer that the thickness being made up of Ni is 0.01～1.0 μm, after the thickness being formed on being made up of Cu is the intermediate layer of 0.01～0.2 μm, the thickness that formation is made up of Ag on intermediate layer is 0.1 μm～the top layer of 2.0 μm so that the crystallite diameter being perpendicular on (111) direction, face on top layer reaches more than 300 angstroms.
The reason that the thickness in the intermediate layer being made up of Cu of the silver coating material of the present invention is made as 0.01～0.2 μm being, if less than 0.01 μm, then the effect increasing the intermediate layer being made up of Cu is less；If it exceeds 0.2 μm, the most in high temperature environments Cu diffusion increase and contact resistance rises.Additionally, the reason that the thickness on the top layer being made up of Ag is made as 0.1～2.0 μm is, if less than 0.1 μm, then the effect as the top layer being made up of Ag is less；If it exceeds 2.0 μm, even if the most not controlling crystallite diameter, rising or because the rising using the contact resistance caused in high temperature environments is the most less of the contact resistance caused because of thermal conductance when reflow soldering processes.It addition, in the top layer being made up of Ag silver grade preferably 99.9 mass % more than.
Before the surface of raw material (being plated material) forms basal layer, preferably carry out being plated electrolytic degreasing and the pickling of material surface.Such as, prepare the stainless steel substrates such as SUS301 as being plated material, this is plated material and other SUS plate is put in alkali degreasing liquid, after the electrolytic degreasing that will be plated material and carry out under voltage 5V as anode, other SUS plate as negative electrode 15 seconds, the electrolytic degreasing that material is carried out 15 seconds under voltage 5V will be plated as negative electrode, other SUS plate as anode, then carry out washing, carrying out in 15% hydrochloric acid solution the pickling of 15 seconds, thereby can carry out being plated electrolytic degreasing and the pickling of material surface.
Being formed of the basal layer being made up of Ni is carried out preferably by plating.Such as, in the electroplate liquid formed by the Nickel dichloride. of 150g/L and the hydrochloric acid of 3 mass %, material will be plated as negative electrode, nickel electrode plate as anode, with electric current density 2A/dm while stirring with the rotating speed of 400rpm with agitator2Carry out the plating (Ni strike plating) of 10 seconds, then in the electroplate liquid formed by the boric acid of the nickel sulfamic acid of 350g/L, the Nickel dichloride. of 20g/L and 35g/L, material will be plated as negative electrode, SK nickel electrode plate as anode, with electric current density 2A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 50 DEG C2Carry out electroplating (plating Ni) and, until Ni thickness reaches 0.1 μm, thereby can form the basal layer being made up of Ni.
Being formed of the intermediate layer being made up of Cu is carried out preferably by plating.Such as, in the plating bath formed by the cupric potassium cyanide of 60g/L and the potassium cyanide of 20g/L, material will be plated as negative electrode, copper electrode plate as anode, with electric current density 1A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 50 DEG C2Carry out electroplating (plating Cu) and, until Cu thickness reaches 0.1 μm, thereby can form the intermediate layer being made up of Cu.
Being formed of the top layer being made up of Ag is carried out preferably by plating.Especially for being formed by the top layer constituted at the Ag that crystallite diameter is more than 300 angstroms being perpendicular on (111) direction, face, be preferably by 80～150g/L the potassium cyanide of silver potassium cyanide, 60～150g/L and the plating bath that formed of the Potassium Selenocyanate of 5～30mg/L in liquid temperature be 15～30 DEG C, electric current density be 2～10A/dm2Condition carry out electroplating (plating Ag).Such as, in the plating bath formed by the silver potassium cyanide of 3g/L and the potassium cyanide of 90g/L, using be plated material as negative electrode, coating platinum Ti electrode plate as anode, with electric current density 2.5A/dm while stirring with the rotating speed of 400rpm with agitator2Carry out the plating (Ag strike plating) of 10 seconds, then in the plating bath formed by the Potassium Selenocyanate of the silver potassium cyanide of 111g/L, the potassium cyanide of 120g/L and 13mg/L, material will be plated as negative electrode, Ag battery lead plate as anode, with electric current density 5A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 18 DEG C2Carry out electroplating (plating Ag) and, until thickness reaches 0.5 μm, thereby, (glossiness is more than the 1.0) top layer being made up of the Ag that crystallite diameter is more than 300 angstroms being perpendicular on (111) direction, face can be formed.
Hereinafter, the silver coating material of the present invention and the embodiment of manufacture method thereof are described in detail.
Embodiment 1
First, prepare the SUS301 metal basal board of 70mm × 50mm × 0.054mm as raw material (being plated material), this is plated material and other SUS plate is put in alkali degreasing liquid, after the electrolytic degreasing that will be plated material and carry out under voltage 5V as anode, other SUS plate as negative electrode 15 seconds, using being plated the electrolytic degreasing that material is carried out 15 seconds under voltage 5V as negative electrode, other SUS plate as anode, then carry out washing, carrying out in 15% hydrochloric acid solution the pickling of 15 seconds.
Then, in the electroplate liquid formed by the Nickel dichloride. of 150g/L and the hydrochloric acid of 3 mass %, material will be plated as negative electrode, Ni battery lead plate as anode, with electric current density 2A/dm while stirring with the rotating speed of 400rpm with agitator2Carry out the plating (Ni strike plating) of 10 seconds.
Then, in the electroplate liquid formed by the boric acid of the nickel sulfamic acid of 350g/L, the Nickel dichloride. of 20g/L and 35g/L, material will be plated as negative electrode, SK nickel electrode plate as anode, with electric current density 2A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 50 DEG C2Carry out electroplating (plating Ni) until Ni thickness reaches 0.1 μm.
Then, in the plating bath formed by the cupric potassium cyanide of 60g/L and the potassium cyanide of 20g/L, material will be plated as negative electrode, copper electrode plate as anode, with electric current density 1A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 50 DEG C2Carry out electroplating (plating Cu) until Cu thickness reaches 0.1 μm.
Then, in the plating bath formed by the silver potassium cyanide of 3g/L and the potassium cyanide of 90g/L, using be plated material as negative electrode, coating platinum Ti electrode plate as anode, with electric current density 2.5A/dm while stirring with the rotating speed of 400rpm with agitator2Carry out the plating (Ag strike plating) of 10 seconds.
Then, in the plating bath formed by the Potassium Selenocyanate of the silver potassium cyanide of 111g/L, the potassium cyanide of 120g/L and 13mg/L, material will be plated as negative electrode, Ag battery lead plate as anode, with electric current density 5A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 18 DEG C2Carry out electroplating (plating Ag) until thickness reaches 0.5 μm.
For the silver coating material so made, while the heat-resisting adaptation evaluating coating and heat resistant contact resistance, calculate the crystallite diameter on the direction being perpendicular to (111) face of coating, measure the glossiness of coating.
The heat-resisting adaptation of coating is evaluated by the following method: heated 5 minutes at 260 DEG C by silver coating material by heating plate (HTH-500N that Ya Suwang Co., Ltd. (ア ズ ワ Application society) makes), after carrying out 3 heating, with constant temperature and moisture test machine (λ-201R that Isuzu Motors Co., Ltd. (ISUZU society) makes), silver coating material is maintained at 85 DEG C, under conditions of humidity 85% after 6 hours, ten stroke lattice belt stripping tests (Japanese: Network ロ ス カ Star ト テ mono-プ ピ mono-リ Application グ) are carried out according to JISH8504, by visually evaluating coating with or without stripping.Its result be coating do not peel off, the heat-resisting adaptation of coating good.
The heat resistant contact resistance of coating is evaluated by the following method: before and after heating silver coating material at 260 DEG C 150 minutes with drying machine (OF450 of Ya Suwang Co., Ltd.), with electric contact simulator (Japanese: contact シ ミ ユ レ mono-タ；The CRS-1 that mountain rugged essence machine research is made) measure the contact resistance under loading 50gf.Its result is: the contact resistance of coating (initial stage) before heating is 5.0m Ω, is 11.2m Ω after heating 90 minutes, is 13.6m Ω, it is suppressed that the rising of the contact resistance after heating after heating 150 minutes.
Crystallite diameter on the direction being perpendicular to (111) face of coating is the half-peak breadth at (111) peak by the X ray diffracting spectrum (XRD figure spectrum) obtained by XRD analysis device (RINT-3C of Electric Co., Ltd of science) and uses Scherrer formula (シ エ ラ mono-(Scherrer) formula) to calculate.Its result is, the crystallite diameter on the direction being perpendicular to (111) face of coating is 395 angstroms (39.5nm).
The glossiness of coating is to use the Grossmeters photodensitometer ND-1 (デ Application シ ト メ mono-タ mono-ND-1) of electricity Se Industrial Co., Ltd (Japan) to be measured being parallel to be plated on the rolling direction of material.Its result is, the glossiness of coating is 1.4.
Embodiment 2
In the plating bath formed by the Potassium Selenocyanate of the silver potassium cyanide of 111g/L, the potassium cyanide of 60g/L and 13mg/L, material will be plated as negative electrode, Ag battery lead plate as anode, with electric current density 5A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 25 DEG C2Carry out electroplating (plating Ag) until thickness reaches 0.5 μm, in addition, silver coating material is made by method same as in Example 1, the silver coating material that this is prepared, while evaluated heat-resisting adaptation and the heat resistant contact resistance of coating by method same as in Example 1, calculate the crystallite diameter on the direction being perpendicular to (111) face of coating, measure the glossiness of coating.
Its result is, coating is not peeled off, the heat-resisting adaptation of coating is good.Additionally, the contact resistance of coating (initial stage) before heating is 5.4m Ω, it is 13.5m Ω after heating 90 minutes, is 54.4m Ω after heating 150 minutes, it is suppressed that the rising of the contact resistance after heating.And, the crystallite diameter on the direction being perpendicular to (111) face of coating is 306 angstroms (30.6nm).Additionally, the glossiness of coating is 1.1.
Comparative example 1
In the plating bath formed by the Potassium Selenocyanate of the silver potassium cyanide of 185g/L, the potassium cyanide of 120g/L and 13mg/L, material will be plated as negative electrode, Ag battery lead plate as anode, with electric current density 5A/dm while stirring with the rotating speed of 400rpm with agitator at liquid temperature 18 DEG C2Carry out electroplating (plating Ag) until thickness reaches 0.5 μm, in addition, silver coating material is made by method same as in Example 1, the silver coating material that this is prepared, while evaluated heat-resisting adaptation and the heat resistant contact resistance of coating by method same as in Example 1, calculate the crystallite diameter on the direction being perpendicular to (111) face of coating, measure the glossiness of coating.
Its result is, coating is not peeled off, the heat-resisting adaptation of coating is good., the contact resistance of coating (initial stage) before heating is 5.2m Ω, is 16.8m Ω after heating 90 minutes, is 107.6m Ω after heating 150 minutes, could not suppress the rising of the contact resistance after heating.Additionally, the crystallite diameter on the direction being perpendicular to (111) face of coating is 258 angstroms (25.8nm), the glossiness of coating is 1.2.
Comparative example 2
Except after plating Ni, not carrying out before Ag strike plating plating in addition to Cu, silver coating material is made by method same as in Example 2, the silver coating material that this is prepared, while evaluated heat-resisting adaptation and the heat resistant contact resistance of coating by method same as in Example 1, calculate the crystallite diameter on the direction being perpendicular to (111) face of coating, measure the glossiness of coating.
Its result is, coating have stripping, coating heat-resisting adaptation bad.On the other hand, the contact resistance of coating (initial stage) before heating is 5.5m Ω, is 5.1m Ω after heating 90 minutes, is 8.1m Ω after heating 150 minutes, and the contact resistance after heating is almost without rising.Additionally, the crystallite diameter on the direction being perpendicular to (111) face of coating is 306 angstroms (30.6nm), the glossiness of coating is 1.4.
For the silver coating material obtained by these embodiments and comparative example, figure 1 illustrates the figure of contact resistance and the relation of heat time heating time, figure 2 illustrates the figure of contact resistance when heating 150 minutes and the relation of the crystallite diameter being perpendicular on (111) direction, face.
The silver coating material of the present invention can be as the contact of adapter, switch, relay etc. or the materials'use of terminal component, and described adapter, switch, relay etc. are used for the vehicle-mounted or electrical wiring of the people's livelihood.Particularly outside can serve as the spring contact construction material for switch, moreover it is possible to the switching material as mobile phone or the remote controller etc. of electrical equipment uses.
Claims (3)
1. a silver coating material, it is to form the basal layer that the thickness being made up of Ni is 0.01～1.0 μm, the intermediate layer that thickness is 0.01～0.2 μm being formed on being made up of Cu, the silver coating material on the top layer that thickness is 0.1～2.0 μm that is formed on being made up of Ag again on the raw-material surface being made up of rustless steel, it is characterized in that, make the crystallite diameter being perpendicular on (111) direction, face on top layer reach more than 300 angstroms.
2. the manufacture method of a silver coating material, the basal layer that the thickness being made up of Ni is 0.01～1.0 μm is formed on the raw-material surface being made up of rustless steel, the thickness being formed on being made up of Cu is the intermediate layer of 0.01～0.2 μm, the thickness being formed on being made up of Ag again is the top layer of 0.1～2.0 μm, it is characterized in that, make the crystallite diameter being perpendicular on (111) direction, face on top layer reach more than 300 angstroms to form top layer.
3. the manufacture method of silver coating material as claimed in claim 2, it is characterized in that, described top layer be by by 80～150g/L the potassium cyanide of silver potassium cyanide, 60～150g/L and the plating bath that formed of the Potassium Selenocyanate of 5～30mg/L in liquid temperature be 15～30 DEG C, electric current density be 2～10A/dm2Condition electroplate and formed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-253045 | 2010-11-11 | ||
| JP2010253045 | 2010-11-11 | ||
| JP2011-234676 | 2011-10-26 | ||
| JP2011234676A JP5737787B2 (en) | 2010-11-11 | 2011-10-26 | Silver plating material and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102468553A CN102468553A (en) | 2012-05-23 |
| CN102468553B true CN102468553B (en) | 2016-08-03 |
Family
ID=46071861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110371118.1A Active CN102468553B (en) | 2010-11-11 | 2011-11-11 | Silver coating material and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102468553B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5346965B2 (en) * | 2011-02-08 | 2013-11-20 | Ｄｏｗａメタルテック株式会社 | Silver plating material and method for producing the same |
| JP6611602B2 (en) * | 2015-01-30 | 2019-11-27 | Ｄｏｗａメタルテック株式会社 | Silver plating material and method for producing the same |
| CN105714345A (en) * | 2016-04-14 | 2016-06-29 | 中山品高电子材料有限公司 | Method of silver electroplating on nickel of LED bracket |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2915623B2 (en) * | 1991-06-25 | 1999-07-05 | 古河電気工業株式会社 | Electrical contact material and its manufacturing method |
| JP3772240B2 (en) * | 2003-06-11 | 2006-05-10 | 東洋精箔株式会社 | Spring material for electric contact used for push button switch and method for manufacturing the same |
| JP4728571B2 (en) * | 2003-10-31 | 2011-07-20 | 古河電気工業株式会社 | Manufacturing method of silver-coated stainless steel strip for movable contacts |
| JP4279285B2 (en) * | 2005-11-17 | 2009-06-17 | 古河電気工業株式会社 | Silver-coated stainless steel strip for movable contact and method for producing the same |
| JP2008169408A (en) * | 2007-01-09 | 2008-07-24 | Auto Network Gijutsu Kenkyusho:Kk | Silver-plated terminal for connector |
-
2011
- 2011-11-11 CN CN201110371118.1A patent/CN102468553B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102468553A (en) | 2012-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9646739B2 (en) | Method for producing silver-plated product | |
| JP5848169B2 (en) | Silver plating material | |
| CN104619883B (en) | Surface treatment plating material and its manufacture method and electronic component | |
| US8637164B2 (en) | Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part | |
| US10829862B2 (en) | Tin-plated product and method for producing same | |
| JP5848168B2 (en) | Silver plating material | |
| JP5737787B2 (en) | Silver plating material and method for producing the same | |
| CN102634826A (en) | Silver-coated material and manufacturing method thereof | |
| CN102468553B (en) | Silver coating material and manufacture method thereof | |
| US10077502B2 (en) | Silver-plated product | |
| JP6193687B2 (en) | Silver plating material and method for producing the same | |
| CN203901850U (en) | Spring steel wire, spring and conductive or electronic equipment | |
| JP2014084476A (en) | Surface treatment plated material and production method of the same, and electronic component | |
| JP5598851B2 (en) | Silver-coated composite material for movable contact part, method for producing the same, and movable contact part | |
| JP2016130362A (en) | Silver plated material and manufacturing method of the same | |
| JP6793618B2 (en) | Sn plating material and its manufacturing method | |
| JP5442385B2 (en) | Conductive member and manufacturing method thereof | |
| JP6809856B2 (en) | Silver plating material and its manufacturing method | |
| JP6543138B2 (en) | Sn plated material and method of manufacturing the same | |
| CN105531780A (en) | Electrical contact structure comprising movable contact part and fixed contact part | |
| TW202406735A (en) | Surface coating materials for electrical contacts, and electrical contacts, switches and connector terminals using the surface coating materials for electrical contacts | |
| JP2019151871A (en) | Plated material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |