GB2109638A - Printed circuit boards - Google Patents
Printed circuit boards Download PDFInfo
- Publication number
- GB2109638A GB2109638A GB08134033A GB8134033A GB2109638A GB 2109638 A GB2109638 A GB 2109638A GB 08134033 A GB08134033 A GB 08134033A GB 8134033 A GB8134033 A GB 8134033A GB 2109638 A GB2109638 A GB 2109638A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- gold
- portions
- circuit board
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
A process for manufacturing a printed circuit board comprises printing a circuit onto a board of insulating material, applying a plating resist to expose portions of the circuit to which, in use, components can be soldered, plating at least some of the exposed portions with gold and removing the plating resist. Preferably, the printed circuit comprises copper electroplated with tin, and a solder resist is applied to expose the gold plated portions and other portions of the circuit to which, in use, components can be soldered. Preferably, the gold plated portions are plated first with nickel and then with gold.
Description
SPECIFICATION
Printed circuit boards
This invention relates to printed circuit boards and processes for manufacturing the same. In particular, this invention relates to a printed circuit board suitable for use in a Light Emitting
Diode (LED) display assembly.
Printed circuit boards for use in LED display assemblies have been proposed wherein a copper circuit printed on a board of insulating material is electroplated with nickel and gold. The circuit includes contacts to which, in use, LED's are soldered and connectors to which other components, such as integrated circuits, may also be soldered. Such assemblies are normally operated at low voltages and the area of each contact is generally small. Therefore, gold is selected for use because of its low resistivity, resistance to oxidation and relatively high melting point. The gold plating protects the copper against oxidation and enables good soldered joints to be readily obtained. Printed circuit boards of this type are relatively simple to manufacture. However, the cost of manufacture may be variable because of fluctuations in the price of gold.
It is an object of the present invention to enable the provision of a printed circuit board, and a process for manufacturing the same, whereby the above disadvantage may be overcome, or at least mitigated.
According to a first aspect of the present invention there is provided a process for manufacturing a printed circuit board, which process comprises printing a circuit onto a board of insulating material, applying a plating resist to expose portions of the circuit to which, in use, components can be soldered, plating at least some of the exposed portions with gold and removing the plating resist.
According to a second aspect of the present invention there is provided a printed circuit board whenever produced by the process of the first aspect.
According to a third aspect of the present invention there is provided a Light Emitting Diode display assembly whenever comprising a printed circuit board in accordance with the second aspect.
The present invention enables the provision of a printed circuit board which may be relatively cheaply manufactured at times when the price of gold is high.
The invention will now be further illustrated with reference to an exemplary embodiment thereof.
A copper circuit is printed onto a board of insulating material. The copper is then electroplated with tin. In use, the layer of tin protects the copper against oxidation and facilitates the soldering of components to the completed circuit. A plating resist is then applied, exposing only the contacts, to which, in use,
LED's are to be soldered. The contacts are selectively plated with nickel and then gold and the plating resist is removed. A permanent solder resist is then applied, exposing the gold plated contacts and certain areas of the tin plated copper which are to act, in use, as connectors. The solder resist may be applied by screen process printing.
In use, LED's are soldered to the gold plated contacts and other components, such as integrated circuits, are soldered to the tin plated connectors. In addition to preventing damage to the circuit during the soldering operations, the solder resist protects the tin layer against oxidation.
Thus, there is provided a printed circuit board wherein contacts are formed of a highly conductive, chemically unreactive, metal, soldering operations are facilitated by the provision of connectors plated with tin, and the connecting parts of the circuit are protected from damage during soldering operations, and from oxidation. The printed circuit board may be manufactured relatively inexpensively at times when the price of gold is high because the amount of gold required is greatly reduced compared to the amounts utilized in the previously proposed printed circuit boards described above.
Claims (8)
1. A process for manufacturing a printed circuit board, which process comprises printing a circuit onto a board of insulating material, applying a plating resist to expose portions of the circuit to which, in use, components can be soldered, plating at least some of the exposed portions with gold and removing the plating resist.
2. A process according to Claim 1, wherein the at least some of the exposed portions are plated first with nickel and then with gold.
3. A process according to Claim 1 or 2, wherein the printed circuit comprises copper electroplated with tin.
4. A process according to any one of Claims 1 to 3, which further comprises applying a solder resist to expose the gold plated portions (and any other desired portions) of the circuit to which, in use, components can be soldered.
5. A process for manufacturing a printed circuit board, substantially as hereinbefore described.
6. A printed circuit board whenever produced by the process of any one of the preceding claims.
7. A Light Emitting Diode display assembly whenever comprising a printed circuit board in accordance with Claim 6.
8. Any novel feature or combination of features described herein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08134033A GB2109638B (en) | 1981-11-11 | 1981-11-11 | Printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08134033A GB2109638B (en) | 1981-11-11 | 1981-11-11 | Printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2109638A true GB2109638A (en) | 1983-06-02 |
| GB2109638B GB2109638B (en) | 1984-11-28 |
Family
ID=10525798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08134033A Expired GB2109638B (en) | 1981-11-11 | 1981-11-11 | Printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2109638B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991009511A2 (en) * | 1989-12-19 | 1991-06-27 | Technology Applications Company Limited | Electrical conductors of conductive resin |
| EP1209958A2 (en) * | 2000-11-24 | 2002-05-29 | Millennium Gate Technology Co., Ltd. | Laminated structure for electronic equipment and method of electroless gold plating |
| CN102421255A (en) * | 2011-08-08 | 2012-04-18 | 高德（无锡）电子有限公司 | Processing method of electroplated lead applied to LED printed circuit board |
-
1981
- 1981-11-11 GB GB08134033A patent/GB2109638B/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991009511A2 (en) * | 1989-12-19 | 1991-06-27 | Technology Applications Company Limited | Electrical conductors of conductive resin |
| WO1991009511A3 (en) * | 1989-12-19 | 1991-10-03 | Technology Applic Company Limi | Electrical conductors of conductive resin |
| EP1209958A2 (en) * | 2000-11-24 | 2002-05-29 | Millennium Gate Technology Co., Ltd. | Laminated structure for electronic equipment and method of electroless gold plating |
| EP1209958A3 (en) * | 2000-11-24 | 2004-04-21 | Millennium Gate Technology Co., Ltd. | Laminated structure for electronic equipment and method of electroless gold plating |
| CN102421255A (en) * | 2011-08-08 | 2012-04-18 | 高德（无锡）电子有限公司 | Processing method of electroplated lead applied to LED printed circuit board |
| CN102421255B (en) * | 2011-08-08 | 2013-05-08 | 高德（无锡）电子有限公司 | Processing method of electroplated lead applied to LED printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2109638B (en) | 1984-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |