CN102386122B - 采用硬掩膜形成隔离沟槽的方法 - Google Patents
采用硬掩膜形成隔离沟槽的方法 Download PDFInfo
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- CN102386122B CN102386122B CN201110342149.4A CN201110342149A CN102386122B CN 102386122 B CN102386122 B CN 102386122B CN 201110342149 A CN201110342149 A CN 201110342149A CN 102386122 B CN102386122 B CN 102386122B
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CN102386122A CN102386122A (zh) | 2012-03-21 |
CN102386122B true CN102386122B (zh) | 2017-06-09 |
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CN102751186A (zh) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | 沟槽的制作方法 |
CN113270434A (zh) * | 2021-03-12 | 2021-08-17 | 华虹半导体(无锡)有限公司 | Cis器件的隔离结构制作方法 |
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CN101051610A (zh) * | 2006-04-03 | 2007-10-10 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制造方法 |
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US5891807A (en) * | 1997-09-25 | 1999-04-06 | Siemens Aktiengesellschaft | Formation of a bottle shaped trench |
KR100568100B1 (ko) * | 2001-03-05 | 2006-04-05 | 삼성전자주식회사 | 트렌치형 소자 분리막 형성 방법 |
US6756313B2 (en) * | 2002-05-02 | 2004-06-29 | Jinhan Choi | Method of etching silicon nitride spacers with high selectivity relative to oxide in a high density plasma chamber |
KR100561522B1 (ko) * | 2003-12-30 | 2006-03-16 | 동부아남반도체 주식회사 | 반도체 소자 분리막 형성 방법 |
CN100459074C (zh) * | 2006-02-22 | 2009-02-04 | 南亚科技股份有限公司 | 具有沟槽式栅极的半导体装置及其制造方法 |
KR100753083B1 (ko) * | 2006-04-28 | 2007-08-31 | 주식회사 하이닉스반도체 | 반도체소자의 리세스채널 형성 방법 |
CN101330035B (zh) * | 2007-06-18 | 2010-05-19 | 中芯国际集成电路制造(上海)有限公司 | 浅沟槽隔离结构及其制造方法 |
CN101599419B (zh) * | 2008-06-03 | 2011-10-05 | 中芯国际集成电路制造(北京)有限公司 | 沟槽的形成方法 |
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CN101051610A (zh) * | 2006-04-03 | 2007-10-10 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制造方法 |
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