CN102361026A - 一种具有防氧化功能的铜基键合丝 - Google Patents

一种具有防氧化功能的铜基键合丝 Download PDF

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CN102361026A
CN102361026A CN2011103171094A CN201110317109A CN102361026A CN 102361026 A CN102361026 A CN 102361026A CN 2011103171094 A CN2011103171094 A CN 2011103171094A CN 201110317109 A CN201110317109 A CN 201110317109A CN 102361026 A CN102361026 A CN 102361026A
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copper
bonding wire
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gold
plating
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赵碎孟
周钢
薛子夜
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GUANGZHOU JB ELECTRONIC TECHNOLOGY Co Ltd
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Abstract

本发明提供一种具有防氧化功能的铜基键合丝，该键合丝以铜作为基础材料，添加微量金属元素构成母合金材料，制备成微细金属丝，并于铜丝表面包裹的金层组成，键合丝各成分重量组分为：Cu为88-97％，微量金属元素La为0.0006-0.010％，Ce为0.001-0.005％，Pd为0.003-0.005％，金镀层2-10％。其制备过程主要包括混合、熔炼、拉制、清洗、镀金、退火、绕线、包装等步骤。该铜基键合丝具有良好抗氧化性、导电性以及低弧度特点，改善了单一铜材的硬度，价格低等优点，铜丝采用普通包装，在常温下可以长期保存，能够适应电子封装低成本、高性能、多功能等发展的需求。

Description

一种具有防氧化功能的铜基键合丝
技术领域
本发明涉及键合丝技术，具体涉及一种具有防氧化功能的铜基键合丝。 
背景技术
集成电路中半导体封装需要用到一种关键的材料：键合丝(Bonding Wires)，电子行业的快速发展，促进了键合丝制造技术的快速发展。键合丝是一种直径精细的高拉伸强度金属丝，是集成电路、半导体分立器件和LED发光管制造过程中必不可少的封装内引线。常见的有合金键合丝、铜键合丝、铝键合丝、金键合丝等。键合丝需具备的特质是耐腐蚀、传导性、连接性好，键合速度快。 
在现有键合丝应用技术中，比较有代表性的键合丝是键合金丝和键合铜丝两种。其中，键合金丝是一种传统的键合丝，LED发光封装的内引线大多采用直径15至75微米的高***金制成的金键合丝，金属基黄金的纯度大于99.999％，再配以钯、镍、铈等微量元素，经熔炼、拉丝、退火等程序制成。键合金丝因具有良好的导电性、抗氧化性和卓越的成弧稳定、键合快速性，目前在键合丝使用中占主导地位，但其价格昂贵、强度偏低，这些缺点已经在目前企业追求利润空间，降低生存压力方面形成制约瓶颈。 
另外一种键合丝是键合铜丝，其价格优势较键合金丝明显，抗拉强度也有所提升，但是键合铜丝还存在很多不足之处，主要问题为： 
其一、键合铜线烧球后瞬间氧化，硬度较高，与铝基粘合时需要很大的键合力才能完整粘连，易砸伤铝基，对芯片及铝基要求非常高。 
其二、铜的氧化温度低，键合铜线很容易氧化，在储存时，条件受限。传统铜线采用真空包装，但大量的包装，偶尔会有个别泄漏现象，同时运输搬运 过程也是造成泄漏的因素。包装一旦泄漏，若短时间内不使用，铜线就会因氧化而失效。同时，在设备上使用时，铜线已经开始氧化，单轴长度只能使用最长200m的铜线，若超过200m，后部份铜线就会因氧化而失效。因为线短，所以增加了换线次数，致使键合生产效率低。 
实际应用中，如果在铜键合丝表面形成大量氧化物，则铜键合丝很难键合，并且很难成球，因而，在成球的过程中，铜键合丝必须存储在无氧的环境中。因此，铜成球时一般采用民有性气体保护。由于铜的硬度、屈服强度等物理参数都高于金，因而键合南非要施加更大的键合力和能量，容易出现焊盘出坑，对芯片造成损伤甚至破坏。 
发明内容
基于上述原因，申请人针对上述金键合丝和铜键合丝在实际应用中存在的问题，通过试验研究得到了一种新的铜基键合丝，该铜基键合丝包括材料铜，并并添加La、Ce、Pd微量金属元素，构成基材，基材金属丝表面镀金层，键合丝中各成分的质量占比Cu为88-97％，微量金属元素La为0.0006-0.010％，Ce为0.001-0.005％，Pd为0.003-0.005％，金镀层2-10％，具有价格低廉、键合丝硬度适合以及防氧化优点。 
本发明通过下述技术方案时限的。 
一种铜基键合丝，铜为主要基础材料，并添加La、Ce、Pd微量金属元素，构成基材，在基材金属丝表面镀防氧化金层构成该铜基键合丝。 
所述键合丝的基础材料为铜，铜的纯度高于99.99％，并且铜包括成品的铜线材料。 
所述键合丝材料是以铜为基础材料添加几种微量金属元素，而构成基材，改善单一铜材过硬的问题。 
所述键合丝表面镀金的厚度为0.1微米-2.5微米，其纯度高于99.99％。 
所述键合丝材料中各成分质量比重Cu为88-97％，微量金属元素La为0.0006-0.010％，Ce为0.001-0.005％，Pd为0.003-0.005％，金镀层2-10％。 
所述铜基键合丝的制备步骤如下： 
步骤一，制作母合金基材。将纯度高于99.99％的Cu，加选定的微量金属材料La、Ce、Pd，混合为母合金基材。 
步骤二，熔铸母合金胚材。将上述材料在真空度10-2-10-3Mpa的熔炉内高温融化，保持熔炼温度为1600℃，精炼时间50分钟以上，熔炼过程中采用高纯度氩气保护，最后采用凝固方式制备直径为8毫米左右的铜棒胚料熔铸成母合金铜棒胚料。 
步骤三，预制细铜丝。将上述直径为8毫米左右的母合金铜棒胚料进行粗拔处理，拉伸后加工成直径为1毫米左右的铜丝，进一步拉伸铜丝至直径为100微米左右，然后进行固定退火处理。 
步骤四，清洗金属丝。将上述直径为100微米左右的微细金属丝进行表面清洗，清洗采用超声波技术，清洗介质采用无水酒精。 
步骤五，表面镀金。将上述微细铜丝进行电镀处理，电镀液为软金电镀液，金的纯度高于99.99％，电镀电流密度0.25A/dm2-5.0A/dm2，电镀速度控制在20m/min内。 
步骤六，退火处理。将表面镀金的微细铜丝进行退火处理，采用氮气保护环境下热处理，热处理温度为415℃-425℃，处理时间控制在1.0S-2.1S，控制退火时张力大小3.0g以内。 
步骤七，精制键合丝。将表面镀金处理的微细铜丝进行精细拉拔处理，拉伸至直径为15微米至75微米，拉伸速度控制在450米/分钟至600米/分钟； 
步骤八，绕线。使用绕线机，将键合丝定长绕制在量英寸直径的线轴上，绕线速度控制在50m/min-100m/min，线间距约为5毫米，分卷长度为50米至1000米。 
步骤九，包装。因上述铜基键合丝具有防氧化镀层，所以采用普通包装，不必真空包装即可进行常温保存。 
铜基母合金中添加了微量金属元素，改善了单一铜材的硬度，并且在母合金基础材料表面镀金，增加了防氧化的功能，键合丝兼具铜丝和金丝的双重优点，所述键合丝具备的优点具体表现有： 
1、成本低。由于大量采用铜键合丝，在50微米级金键合线市场占有率下级最为显著。在此直径下，采用铜键合丝，成本要节省约90％。 
除此之外，相对于金键合丝，铜丝还有几个关键优势，铜具有更高的导电和导热性；避免金属化合物的生长；在高温下，其连接更具有更高的可靠性和稳定性。 
2、通过采取多元掺杂合金，在铜材中添加其他金属成分，降低铜的硬度，特别是成球硬度，减少对芯片的冲击力和破坏，降低键合能量。 
3、低电阻率。铜键合丝的高导电性(比金丝高约23％)使其在高品质器件中具有更广阔的应用前景，适用于高性能电气电路。在精细键合技术领域有助于提高功率器件性能和可靠性。这些封装技术相对比较复杂，多采用非常细微的电极接触点或者引线框架，因而需要采用很细小的键合丝。由于优越的电性能，铜键合丝是最有发展前景的一类键合丝。 
4、高导热性。铜的导热性比金高21％，使得封装体内的热量可以很快且更有效的散发出来，从而使键合丝可以更快的冷却下来，应力被尽快释放。 
在成球的过程中，高导热性还有一个优点就是：影响键合丝机械性能的热 影响区变得更短，因而保证更高的键合性能。特别是叠层型封装技术的发展，低弧度键合丝的需求迅速发展，对键合丝的可靠性提出了更高的要求。 
5、金属间化合物生长缓慢。采用铜键合丝其机械性能的稳定性要高于金键合丝，标准稳定性测试表明铜键合丝要比金键合丝高出25％-30％。 
6、抗氧化性能。铜基键合丝镀金使得键合丝具有良好的抗氧化性能，常温下在空气中不会氧化，因此便于包装和存储。省去了真空包装的较高技术成本，普通包装，并且对运输、存储条件要求不高；传统键合丝因为使用过程中氧化，因此其长度受限制，而本发明键合丝可以设计为长度不等的多种类型，其长度不再受化学变化的限制；在键合过程中，传统铜线避免氧化的发生需要在无空气保护条件性进行，本发明键合丝不需要无空气保护。 
具体实施方式
实施例1 
一种防氧化铜基键合丝，以铜作为主要基础材料，并添加La、Ce、Pd微量金属元素，构成基材，在基材金属丝表面镀防氧化金层构成该铜基键合丝。 
所述键合丝的基础材料为铜，铜的纯度高于99.99％。 
为改善单一铜材过硬的问题，所述键合丝材料在以铜为基础材料前提下添加几种微量金属元素，而构成基材。 
所述键合丝表面镀金的厚度为0.6微米，金的纯度高于99.99％。 
所述键合丝材料中各成分质量比重Cu为93.9922％，微量金属元素La为0.0008％，Ce为0.003％，Pd为0.004％，金镀层6％。 
所述铜基键合丝的制备步骤具体如下： 
步骤一，制作母合金基材。将纯度高于99.99％的Cu，加选定的微量金属材料La、Ce、Pd，混合为母合金基材。 
步骤二，熔铸母合金胚材。将上述材料在真空度0.005Mpa的熔炉内高温融化，保持熔炼温度为1600℃，精炼时间80分钟，熔炼过程中采用高纯度氩气保护，最后采用凝固方式制备直径为8毫米左右的铜棒胚料熔铸成母合金铜棒胚料。 
步骤三，预制细铜丝。将上述直径为8毫米左右的母合金铜棒胚料进行粗拔处理，拉伸后加工成直径为1毫米左右的铜丝，进一步拉伸铜丝至直径为100微米左右，然后进行固定退火处理。 
步骤四，清洗金属丝。将上述直径为100微米左右的微细金属丝进行表面清洗，清洗采用超声波技术，清洗介质采用无水酒精。 
步骤五，表面镀金。将上述微细铜丝进行电镀处理，电镀液为软金电镀液，金的纯度高于99.99％，电镀电流密度1A/dm2，电镀速度控制在15m/min。 
步骤六，退火处理。将表面镀金的微细铜丝进行退火处理，采用氮气保护环境下热处理，热处理温度为421℃，处理时间控制1.5S，控制退火时张力大小2.5g。 
步骤七，精制键合丝。将表面镀金处理的微细铜丝进行精细拉拔处理，拉伸至直径为35微米，拉伸速度控制在500米/分钟； 
步骤八，绕线。使用专用绕线机，将键合丝定长绕制在量英寸直径的线轴上，绕线速度控制在75m/min，线间距约为5毫米，分卷长度为1000米。 
步骤九，包装。常温常压下采用普通包装。 
实施例2 
一种防氧化铜基键合丝，以铜作为主要基础材料，并添加La、Ce、Pd微量金属元素，构成基材，在基材金属丝表面镀防氧化金层构成该铜基键合丝。 
所述键合丝的基础材料为铜，选用成品细铜丝，其中铜的纯度高于99.99％。 
为改善单一铜材过硬的问题，所述键合丝材料在以铜为基础材料前提下添加几种微量金属元素，而构成基材。 
所述键合丝表面镀金的厚度为0.25微米，金的纯度高于99.99％。 
所述键合丝材料中各成分质量比重Cu为96.9911％，微量金属元素La为0.0009％，Ce为0.005％，Pd为0.003％，金镀层3％。 
所述铜基键合丝的制备步骤如下： 
步骤一，制作母合金基材。将纯度高于99.99％的Cu，加选定的微量金属材料La、Ce、Pd，混合为母合金基材。 
步骤二，熔铸母合金胚材。将上述材料在真空度0.01Mpa的熔炉内高温融化，保持熔炼温度为1600℃，精炼时间60分钟，熔炼过程中采用高纯度氩气保护，最后采用凝固方式制备直径为8毫米左右的铜棒胚料熔铸成母合金铜棒胚料。 
步骤三，预制细铜丝。将上述直径为8毫米左右的母合金铜棒胚料进行粗拔处理，拉伸后加工成直径为1毫米左右的铜丝，进一步拉伸铜丝至直径为100微米左右，然后进行固定退火处理。 
步骤四，清洗金属丝。将上述直径为100微米左右的微细金属丝进行表面清洗，清洗采用超声波技术，清洗介质采用无水酒精。 
步骤五，表面镀金。将上述微细铜丝进行电镀处理，电镀液为软金电镀液，金的纯度高于99.99％，电镀电流密度0.40A/dm2，电镀速度16m/min。 
步骤六，退火处理。将表面镀金的微细铜丝进行退火处理，采用氮气保护环境下热处理，热处理温度为420℃，处理时间控制在1.2S，控制退火时张力大小2.6g。 
步骤七，精制键合丝。将表面镀金处理的微细铜丝进行精细拉拔处理，拉伸至直径为50微米，拉伸速度控制在500米/分钟； 
步骤八，绕线。使用专用绕线机，将键合丝定长绕制在量英寸直径的线轴上，绕线速度控制在60m/min，线间距约为5毫米，分卷长度为1000米。 
步骤九，包装。常温常压下采用普通包装。 
实施例2产品如表1所示检测报告，与传统键合铜丝比较，新的铜基键合丝抗氧化性好，焊接参数略小，在微间距封装中可以采用更细的焊线，微间距应用性能优异(焊垫尺寸较小)，提高功率调节器件(TO220、TO92、DPAK等等)的电流容量和性能，在焊接后能够形成比传统键合铜丝更稳定、刚性更好的弧形。 
表1焊线设备调整参数及接力检测结果 
Figure BSA00000593722900081
所述实施例包括但不限于上述。 

Claims (5)

1.一种具有防氧化功能的铜基键合丝，其特征在于键合丝包括材料铜，并并添加La、Ce、Pd微量金属元素，构成基材，基材金属丝表面镀金层，键合丝中各成分的质量占比Cu为88-97％，微量金属元素La为0.0006-0.010％，Ce为0.001-0.005％，Pd为0.003-0.005％，金镀层2-10％。
2.根据权利要求1所述的一种具有防氧化功能的铜基键合丝，其特征在于：所述键合丝的基础材料为铜，并且铜包括成品的铜线材料。
3.根据权利要求1所述的一种具有防氧化功能的铜基键合丝，其特征在于：所述键合丝材料是以铜为基础材料添加几种微量金属元素，构成基材。
4.根据权利要求1所述的一种具有防氧化功能的铜基键合丝，其特征在于：所述键合丝表面镀金的厚度为0.1微米-2.5微米。
5.根据权利要求1-4任一项所述的一种具有防氧化功能的铜基键合丝，其特征在于：所述键合丝的制备步骤如下：
步骤一，制作母合金基材，将纯度高于99.99％的Cu，加选定的微量金属材料La、Ce、Pd，混合为母合金基材；
步骤二，熔铸母合金胚材，将上述材料在真空度10-2-10-3Mpa的熔炉内高温融化，保持熔炼温度为1600℃，精炼时间50分钟以上，熔炼过程中采用高纯度氩气保护，最后采用凝固方式制备直径为8毫米左右的铜棒胚料熔铸成母合金铜棒胚料；
步骤三，预制细铜丝，将上述直径为8毫米左右的母合金铜棒胚料进行粗拔处理，拉伸后加工成直径为1毫米左右的铜丝，进一步拉伸铜丝至直径为100微米左右，然后进行固定退火处理；
步骤四，清洗金属丝，将上述直径为100微米左右的微细金属丝进行表面清洗，清洗采用超声波技术，清洗介质采用无水酒精；
步骤五，表面镀金，将上述微细铜丝进行电镀处理，电镀液为软金电镀液，金的纯度高于99.99％，电镀电流密度0.25A/dm2-5.0A/dm2，电镀速度控制在20m/min内；
步骤六，退火处理，将表面镀金的微细铜丝进行退火处理，采用氮气保护环境下热处理，热处理温度为415℃-425℃，处理时间控制在1.0S-2.1S，控制退火时张力大小3.0g以内；
步骤七，精制键合丝，将表面镀金处理的微细铜丝进行精细拉拔处理，拉伸至直径为15微米至75微米，拉伸速度控制在450米/分钟至600米/分钟；
步骤八，绕线，使用绕线机，将键合丝定长绕制在量英寸直径的线轴上，绕线速度控制在50m/min-100m/min，线间距约为5毫米，分卷长度为50米至1000米；
步骤九，包装，常温常压条件下采用普通包装，常温常压保存。
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