CN102361023A - Ceramic shell capable of enhancing radiation shielding and preparation method thereof - Google Patents

Ceramic shell capable of enhancing radiation shielding and preparation method thereof Download PDF

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Publication number
CN102361023A
CN102361023A CN2011103201583A CN201110320158A CN102361023A CN 102361023 A CN102361023 A CN 102361023A CN 2011103201583 A CN2011103201583 A CN 2011103201583A CN 201110320158 A CN201110320158 A CN 201110320158A CN 102361023 A CN102361023 A CN 102361023A
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aluminium oxide
oxide ceramics
ceramics layer
layers
ceramic package
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CN2011103201583A
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CN102361023B (en
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张文娟
李军
孙晓明
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CETC 13 Research Institute
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CETC 13 Research Institute
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Abstract

The invention discloses a ceramic shell capable of enhancing radiation shielding. The ceramic shell comprises a ceramic shell body composed of five aluminum oxide ceramic layers, wherein 3-5 aluminum oxide ceramic layers are added to the upper surface of the ceramic shell body; 2-4 aluminum oxide ceramic layers are added to the lower surface of the ceramic shell body; and the upper surface of each aluminum oxide ceramic layer is provided with lines and patterns which are formed by metallized slurry printing, wherein the lines have a wiring action, and the patterns have a radiation shielding action. A preparation process of the ceramic shell comprises the following steps of: preparing of the aluminum oxide ceramic layers, preparing of metallized slurry, punching, pore-filling, printing, laminating, thermal cutting, checking, sintering, nickel-plating, brazing and gold-plating. The ceramic shell has the beneficial effects that: the volume is small, the weight is light, and radiation shielding effect on space ionization total dose is improved by more than 10 times than that of common ceramic shell.

Description

A kind of ceramic package that can strengthen the irradiation shielding and preparation method thereof
Technical field
The present invention relates to a kind of ceramic package that strengthens irradiation shielding and preparation method thereof, be applicable to that the space uses the package casing preparing technical field.
Background technology
The space radiation meeting produces ionising radiation total dose effect, single particle effect equivalent damage to spaceborne microelectronic component.For cmos device, its total dose effect is mainly from the positive charge accumulation of gate oxide and field oxide and at Si/SiO especially 2The interface trapped charge that the interface produces forms interfacial state.Cause the threshold voltage drift and the static leakage current of CMOS device to increase, cause device electrical parameter to be degenerated, even make the astrionic system disabler, influence the satisfactory completion of satellite mission.Along with the extensive use of microelectronic component in satellite, and the long-life service requirement of satellite, the damage of total dose effect is increasing to the threat of satellite transit.
Evidence, the encapsulation reinforcement technique is difficult for shielding neutron and gamma rays, but effective relatively for the high energy electron and the proton of shielding space radiation environment, and the electronics and proton that especially radiation brings concerning VanAllen, shield effectiveness is obvious.It is reported that the 32Pin flat packaging shell of Austin company preparation adopts shielding cover board to carry out anti-irradiation encapsulation, result of study shows, compares with the shell that does not have shield effectiveness, can improve 6.5 times for the shield effectiveness of electronics.But this screen method can only be to having effect perpendicular to the radiation of cover plate direction, there are differences with the space environment of reality.France 3D PLUS company announces a kind of microelectronics Packaging of the anti-irradiation of development newly; Be called the Walo-pack encapsulation; Be at the outside overcoat that increases one deck heavy metals tungsten and aluminium of package casing device to be protected, the index of its ionizing radiation-resistant accumulated dose can reach 200krad (Si); Also mention simultaneously the screen that upper and lower surfaces at device adds heavy metal in the United States Patent (USP) and protect, but the fatal shortcoming of these two kinds of methods is exactly the volume and weight that has increased device.
Summary of the invention
The technical problem that the present invention will solve provides that a kind of volume is little, light weight, to effective ceramic package of the irradiation shielding of space ionization accumulated dose and preparation method thereof.
For solving the problems of the technologies described above; The technical scheme that the present invention taked is: a kind of ceramic package that can strengthen the irradiation shielding; Comprise the ceramic package body that constitutes by five layers of aluminium oxide ceramics layer; Upper surface at said ceramic package body increases by 3~5 layers of aluminium oxide ceramics layer, increases by 2~4 layers of aluminium oxide ceramics layer at its lower surface, is provided with the lines that play the wiring effect and the figure that plays the irradiation shielding action of employing metallization slurry printing at the upper surface of each aluminium oxide ceramics layer; In said each aluminium oxide ceramics layer, also be provided with the hole of running through this aluminium oxide ceramics layer, be filled with the metallization slurry in the said hole.
A kind of preparation method that can strengthen the ceramic package of irradiation shielding; Its method step is following: (1) preparation aluminium oxide ceramics layer: the thickness of the aluminium oxide ceramics layer of preparation as required is pressed onto the ceramic powder casting belt material more than one deck and obtains one deck aluminium oxide ceramics layer together;
(2) preparation metallization slurry: with the quality percentage composition be the liquid-phase mixing of 75%~79% solid phase and 21%~25% to grinding dispersion together then, obtain satisfactory metallization slurry; Said solid phase is that 85%~89% tungsten powder, 1%~3% glass dust and 10%~14% alumina powder are formed by the quality percentage composition, and said liquid phase is that 60%~80% terpinol and 20%~40% ethyl cellulose are formed by the quality percentage composition;
(3) punching: on each the said aluminium oxide ceramics layer for preparing, punch according to designing requirement;
(4) filling perforation: in the hole of above-mentioned each aluminium oxide ceramics layer, fill said metallization slurry;
(5) printing: adopt said metallization slurry to play the lines and the figure that plays the irradiation shielding action of wiring effect in the upper surface printing of each aluminium oxide ceramics layer;
(6) lamination: adopting the quality percentage composition is that 30%~50% polyvinyl butyral resin and 50%~70% ethanol are configured to bonding agent; Above-mentioned bonding agent is sprayed to the lower surface of each aluminium oxide ceramics layer; 10~14 layers above-mentioned aluminium oxide ceramics is range upon range of then is added to together, and static pressure such as employing are pressed into an integral body;
(7) fervent: as the integral body behind the lamination to be cut into block one by one, to form single green spare;
(8) check: the outward appearance to above-mentioned each green spare is tested, and the failure abandons;
(9) sintering: above-mentioned green spare is put in the sintering furnace, ship's speed is adjusted to (500 ± 10) mm/h, sintering pillar height is selected 15~20mm, carries out sintering, obtains porcelain spare;
(10) nickel plating: through electroplating the porcelain spare coating surface one deck nickel behind sintering;
(11) soldering: through silver-copper brazing alloy with seal mouth ring and wire bonds to above-mentioned porcelain spare, form assembly;
(12) gold-plated: as, to form the ceramic package finished product at coating surface one deck gold of above-mentioned assembly.
Beneficial effect of the present invention is following: the present invention's " sandwich " that the irradiation shield effectiveness is optimum is dissolved in the design of ceramic package and is gone; Make that irradiation screen and ceramic package are integrated, effectively reduced because the volume and weight that the structure of irradiation screen and ceramic package disconnects and increases.Ceramic package of the present invention has improved more than 10 times than conventional ceramic package the irradiation shield effectiveness of space ionization accumulated dose.
Embodiment
Concrete implementation method of the present invention is following:
(1) preparation aluminium oxide ceramics layer: the thickness of the aluminium oxide ceramics layer of preparation as required is pressed onto the ceramic powder casting belt material more than one deck and obtains one deck aluminium oxide ceramics layer together; For example, the thickness of every layer of ceramic powder casting belt material is 0.2mm, and needing the thickness of the every layered material of product of preparation is 0.6mm, then need 3 layers of ceramic powder casting belt material be pressed onto and form one deck together.
(2) preparation metallization slurry: with the quality percentage composition be the liquid-phase mixing of 75% solid phase and 25% to grinding dispersion together then, obtain satisfactory metallization slurry; Said solid phase is that 85% tungsten powder, 3% glass dust and 12% alumina powder are formed by the quality percentage composition, and said liquid phase is that 60% terpinol and 40% ethyl cellulose are formed by the quality percentage composition.
(3) on each the said aluminium oxide ceramics layer for preparing, punch according to designing requirement.
(4) filling perforation: the metallization slurry of filling step in interconnected pores (2) preparation.
(5) printing: adopt the metallization slurry of step (2) preparation to play the lines of wiring effect and the figure of an irradiation shielding action in the upper surface printing of each aluminium oxide ceramics layer.
(6) lamination: adopting the quality percentage composition is that 40% polyvinyl butyral resin and 60% ethanol are configured to bonding agent; Above-mentioned bonding agent is sprayed to the lower surface of each aluminium oxide ceramics layer; To guarantee the lamination associativity of large-area metalization and pottery; With 10 layers of range upon range of being added to together of above-mentioned aluminium oxide ceramics, static pressure such as employing are pressed into an integral body then.
(7) fervent: as the integral body behind the lamination to be cut into block one by one, to form single green spare.
(8) check: the outward appearance to above-mentioned each green spare is tested, and the failure abandons.
(9) sintering: above-mentioned green spare is put in the sintering furnace, ship's speed is adjusted to (500 ± 10) mm/h, sintering pillar height is selected 18mm, carries out sintering, obtains porcelain spare.
(10) nickel plating: through electroplating the porcelain spare coating surface one deck nickel behind sintering.
(11) soldering: through silver-copper brazing alloy with seal mouth ring and wire bonds to porcelain spare, form assembly.
(12) gold-plated: as, to form the ceramic package finished product at coating surface one deck gold of above-mentioned assembly.
Its volume of the present invention is little, in light weight, and the irradiation shield effectiveness of space ionization accumulated dose has been improved more than 10 times than conventional ceramic package.

Claims (3)

1. one kind can strengthen the ceramic package that irradiation shields; Comprise the ceramic package body that constitutes by five layers of aluminium oxide ceramics layer; It is characterized in that: the upper surface at said ceramic package body increases by 3~5 layers of aluminium oxide ceramics layer; Increase by 2~4 layers of aluminium oxide ceramics layer at its lower surface; Upper surface at said each aluminium oxide ceramics layer is provided with the lines that play the wiring effect and the figure that plays the irradiation shielding action that adopt the printing of metallization slurry, in said each aluminium oxide ceramics layer, also is provided with the hole of running through this aluminium oxide ceramics layer, is filled with the metallization slurry in the said hole.
2. a kind of ceramic package that can strengthen the irradiation shielding according to claim 1 is characterized in that: the upper surface at said ceramic package body increases by 3 layers of aluminium oxide ceramics layer, increases by 2 layers of aluminium oxide ceramics layer at its lower surface.
3. preparation method that can strengthen the ceramic package of irradiation shielding; It is characterized in that: its method step is following: (1) preparation aluminium oxide ceramics layer: the thickness of the aluminium oxide ceramics layer of preparation as required is pressed onto the ceramic powder casting belt material more than one deck and obtains one deck aluminium oxide ceramics layer together;
(2) preparation metallization slurry: with the quality percentage composition be the liquid-phase mixing of 75%~79% solid phase and 21%~25% to grinding dispersion together then, obtain satisfactory metallization slurry; Said solid phase is that 85%~89% tungsten powder, 1%~3% glass dust and 10%~14% alumina powder are formed by the quality percentage composition, and said liquid phase is that 60%~80% terpinol and 20%~40% ethyl cellulose are formed by the quality percentage composition;
(3) punching: on each the said aluminium oxide ceramics layer for preparing, punch according to designing requirement;
(4) filling perforation: in the hole of above-mentioned each aluminium oxide ceramics layer, fill said metallization slurry;
(5) printing: adopt said metallization slurry to play the lines and the figure that plays the irradiation shielding action of wiring effect in the upper surface printing of each aluminium oxide ceramics layer;
(6) lamination: adopting the quality percentage composition is that 30%~50% polyvinyl butyral resin and 50%~70% ethanol are configured to bonding agent; Above-mentioned bonding agent is sprayed to the lower surface of each aluminium oxide ceramics layer; Be added to together 10~14 layers above-mentioned aluminium oxide ceramics is range upon range of then, static pressure such as employing are pressed into an integral body;
(7) fervent: as the integral body behind the lamination to be cut into block one by one, to form single green spare;
(8) check: the outward appearance to above-mentioned each green spare is tested, and the failure abandons;
(9) sintering: above-mentioned green spare is put in the sintering furnace, ship's speed is adjusted to (500 ± 10) mm/h, sintering pillar height is selected 15~20mm, carries out sintering, obtains porcelain spare;
(10) nickel plating: through electroplating the porcelain spare coating surface one deck nickel behind sintering;
(11) soldering: through silver-copper brazing alloy with seal mouth ring and wire bonds to above-mentioned porcelain spare, form assembly;
(12) gold-plated: as, to form the ceramic package finished product at coating surface one deck gold of above-mentioned assembly.
CN 201110320158 2011-10-20 2011-10-20 Ceramic shell capable of enhancing radiation shielding and preparation method thereof Active CN102361023B (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103996673A (en) * 2014-05-22 2014-08-20 中国科学院新疆理化技术研究所 Method for improving total dosage effect of anti-ionizing radiation of device
CN104261808A (en) * 2014-09-09 2015-01-07 登封福中特种电器元件有限公司 High-temperature conductor paste for printing electronic ceramic cast slice
CN104844198A (en) * 2014-02-18 2015-08-19 清华大学 Hand-held terminal product appearance ceramic thin type member and production method thereof
CN104966699A (en) * 2015-06-30 2015-10-07 陶象余 Anti-radiation chip encapsulation casing
CN107046779A (en) * 2017-06-22 2017-08-15 中国电子科技集团公司第二十九研究所 The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit
CN107672252A (en) * 2017-08-11 2018-02-09 浙江长兴电子厂有限公司 A kind of ceramic package
CN108269743A (en) * 2018-01-04 2018-07-10 河北中瓷电子科技有限公司 Step-like aluminium nitride ceramics block preparation method and step-like aluminium nitride ceramics block
CN115521154A (en) * 2022-09-16 2022-12-27 信维电子科技(益阳)有限公司 Preparation process of ceramic slurry for MLCC

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2427435Y (en) * 2000-03-21 2001-04-25 中国科学院空间科学与应用研究中心 Shield parts for anti-mono-particle effect radiation
WO2002069348A1 (en) * 2001-02-23 2002-09-06 The University Of Chicago Radiation shielding phosphate bonded ceramics using enriched isotopic boron compounds
CN101748319A (en) * 2008-12-19 2010-06-23 北京有色金属研究总院 Electron-irradiation resisting shielding material and method for preparing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2427435Y (en) * 2000-03-21 2001-04-25 中国科学院空间科学与应用研究中心 Shield parts for anti-mono-particle effect radiation
WO2002069348A1 (en) * 2001-02-23 2002-09-06 The University Of Chicago Radiation shielding phosphate bonded ceramics using enriched isotopic boron compounds
CN101748319A (en) * 2008-12-19 2010-06-23 北京有色金属研究总院 Electron-irradiation resisting shielding material and method for preparing same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104844198A (en) * 2014-02-18 2015-08-19 清华大学 Hand-held terminal product appearance ceramic thin type member and production method thereof
CN104844198B (en) * 2014-02-18 2017-04-26 清华大学 Hand-held terminal product appearance ceramic thin type member and production method thereof
CN103996673A (en) * 2014-05-22 2014-08-20 中国科学院新疆理化技术研究所 Method for improving total dosage effect of anti-ionizing radiation of device
CN104261808A (en) * 2014-09-09 2015-01-07 登封福中特种电器元件有限公司 High-temperature conductor paste for printing electronic ceramic cast slice
CN104966699A (en) * 2015-06-30 2015-10-07 陶象余 Anti-radiation chip encapsulation casing
CN107046779A (en) * 2017-06-22 2017-08-15 中国电子科技集团公司第二十九研究所 The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit
CN107672252A (en) * 2017-08-11 2018-02-09 浙江长兴电子厂有限公司 A kind of ceramic package
CN108269743A (en) * 2018-01-04 2018-07-10 河北中瓷电子科技有限公司 Step-like aluminium nitride ceramics block preparation method and step-like aluminium nitride ceramics block
CN115521154A (en) * 2022-09-16 2022-12-27 信维电子科技(益阳)有限公司 Preparation process of ceramic slurry for MLCC

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