CN104261808A - High-temperature conductor paste for printing electronic ceramic cast slice - Google Patents
High-temperature conductor paste for printing electronic ceramic cast slice Download PDFInfo
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- CN104261808A CN104261808A CN201410475699.7A CN201410475699A CN104261808A CN 104261808 A CN104261808 A CN 104261808A CN 201410475699 A CN201410475699 A CN 201410475699A CN 104261808 A CN104261808 A CN 104261808A
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- conductor paste
- temperature conductor
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Abstract
The invention discloses high-temperature conductor paste for printing an electronic ceramic cast slice. A preparation process of the high-temperature conductor paste comprises the following steps: 1 sequentially putting PVB, terpilenol, ethyl acetate, a plasticizer and NP-10 into a container according to the percent weight of a solvent system, and stirring until all raw materials are completely dissolved to obtain a solvent mixture; 2 sequentially adding alpha-Al2O3 powder to the solvent mixture obtained in the step 1 according to the percent weight of the powder, and stirring the W powder material for an hour to obtain stirred paste; and 3 putting the stirred paste obtained in the step 2 into a rolling machine to roll for three times, so as to obtain the high-temperature conductor paste. The high-temperature conductor paste is used for pasting elements on a ceramic surface; the printing effect of the cast slice of the high-temperature conductor paste is superior to that of the original high-temperature conductor paste; and after an electronic ceramic green body is fired, the product is uniform and clear in grains, and good in microstructure.
Description
Technical field
The present invention relates to electronic ceramics and make Material Field, be specifically related to a kind of high temperature conductor paste for the printing of electronic ceramics curtain coating raw cook.
Background technology
Multiple forming method is had in electronic ceramics green compact forming field.As rolled embrane method, aqueous gel-casting, coating method, extrusion molding, hot die-casting method, dry pressing, casting method.Wherein flow casting molding is comparatively an one of common method, and its efficiency is high, and planeness is good, and thick consistency is good.For the quality of curtain coating raw cook printing by high temperature conductor paste quality, the quality matched, directly affects electronic ceramics finished product substandard products various mechanical property, physicals, thermal characteristics and electrical property.
Putting into practice in process of the present invention, contriver finds that having now high temperature conductor paste exists problem below: one, conduction band surface irregularity after printing, edge is irregular.Rear surface to be sintered is more coarse, and edge is more irregular.Two, after sintering metal layer and ceramic interface in conjunction with bad.Three, after sintering, ceramic body is seriously uneven, and metallization and pottery are had a common boundary place and arched upward, and pressure burning is flat again all can not deal with problems.Four, lead resistance R (R:0.6 Ω ~ 0.8 Ω) bigger than normal.
Summary of the invention
A kind of formula and configuration technique of the high temperature conductor paste for the printing of electronic ceramics curtain coating raw cook are the object of the present invention is to provide; Solve the technical problem that existing high temperature conductor paste exists.
The invention provides a kind of formula and blending process of the high temperature conductor paste for the printing of electronic ceramics curtain coating raw cook;
Material selec-tion:
1) selection of .W powder
Select the W powder of three kinds of different median sizes;
W powder one, median size is 3.0 ~ 5.2 μm;
The median size of W powder two is 1.6 μm;
W powder three, median size are 1.0 ~ 1.45 μm.
2). α-Al
2o
3the selection of powder: α-Al
2o
3the median size of powder is the selection of 2.5 μm ~ 4.0 μm of powder ratios
W powder one: W powder two: W powder three=5: 3.5: 1.5 (wt%)
(W powder one+W powder two+W powder three): α-Al
2o
3=90 ~ 95: 5 ~ 10 (wt%)
3). solvent system starting material are selected
Main solvent: Terpineol 350, ethyl acetate, softening agent;
Nonionic surface active agent: NP-10;
Caking agent: PVB;
The selection of solvent system ratio
Caking agent PVB: Terpineol 350: ethyl acetate: softening agent: NP-10=11 ~ 13%: 55 ~ 60%: 9 ~ 12%: 2.8 ~ 3.5%: 12 ~ 14%.
High temperature conductor paste blending process step:
Step one, successively in the ratio of solvent system and weight percent PVB, Terpineol 350, ethyl acetate, softening agent, NP-10 are put into container and stir, make it completely broad, obtain solvent material;
Step 2, step one obtain solvent material in, add α-Al successively in powder ratio and weight percent
2o
3powder, W powder material continues to stir, and churning time is 1 hour, obtains and stirs slurry;
Step 3, the stirring slurry that step 2 obtains is placed on and rolls pulp grinder and roll three times, obtain high temperature conductor paste of the present invention.
W powder in described high temperature conductor paste, the content of α-Al203 are 79 ~ 82%; Caking agent PVB, Terpineol 350, ethyl acetate, softening agent, NP-10 proportion are 18 ~ 21%.
In the present invention, W powder material---tungsten powder take Tungsten oxide 99.999 as raw material, and with hydrogen reducing in four pipe retort furnaces or multi-tube furnace, granularity is from 0.6-30 μm.Main point carse, medium and small several granularity, silver gray powder, foreign matter content take national standard as foundation.
α-Al
2o
3---Alpha-alumina, be again nano aluminium oxide, nano aluminium oxide xz-L14 shows fluffy white powder state, and crystal formation is α type.Particle diameter is 20nm; Specific surface area >=50m/g.Even particle size distribution, purity are high, high dispersive, α-Al
2o
3, its specific surface is low, has resistant to elevated temperatures inertia, but does not belong to activated alumina, almost do not have catalytic activity; Nano aluminium oxide xz-L14 thermotolerance is strong, good moldability, crystalline phase is stable, hardness is high, good stability of the dimension, can be widely used in the strengthening and toughening of the products such as various plastics, rubber, pottery, refractory materials, the wear resisting property particularly improving the compactness of pottery, smooth finish, cool-hot fatigue, fracture toughness property, creep-resistant property and macromolecular material product is particularly remarkable.Due to the far-infrared emission material that alpha-phase aluminum oxide is also excellent performance, be applied in fiber product and high-pressure mercury lamp as far infrared transmission and lagging material.In addition, alpha-phase aluminum oxide resistivity is high, has good insulating property, in the key fitment that can be applicable to YGA laser crystalline substance and ic substrate.
Main solvent: Terpineol 350 (Terpineol), also known as terpinol, Chinese another name: terpinol; Terpinum; 2-(4-methyl-3-cyclohexenyl)-2-propyl alcohol.Can refer to that at least four kinds of molecular formula are the monocyclic terpene alcohol compound of C10H180, i.e. α-, β-, γ-and δ-Terpineol 350.These compounds are plant chemical ingredient, and sterling is colourless transparent liquid, have different characteristic odor.
Ethyl acetate, molecular formula is C4H802, No. CAS for 141-78-6. be that hydroxyl in acetic acid is replaced by oxyethyl group and the compound generated.Colourless transparent liquid, has fruit fragrant, volatile, to air-sensitive, can absorb water and divide, and moisture can make it slowly decompose and react acid.
Softening agent: fluidizer (English: Plasticizer), or claim softening agent, plasticizer, be a kind ofly increase the flexibility of material or the additive of materials liquefy.It adds object and contains plastic cement, concrete, dry wall material, cement and gypsum etc.Same fluidizer is frequently used on different objects, but its effect is often not identical.
Nonionic surface active agent: NP-10; The Soxylat A 25-7 of alkylphenol.NP-10 is the Soxylat A 25-7 of nonyl phenol.
Caking agent PVB---Chinese: polyvinyl butyral acetal.English name: Polyvinyl butyral.Chinese another name: polyvinyl butyral film; Polyvinyl butyral resin; Poly-acid methyl ester; 413 films; PVB resin.English another name: polyvinylbutyral resin; Poly (vinyl butyral); No. CAS: 63148-65-2 molecular formula: C
16h
28o
5; Molecular weight: 300.39532.
The practical application of high temperature conductor paste and effect: this high temperature conductor paste is used in a kind of ceramic surface dress and pastes on element, its ratio of printing effect at curtain coating raw cook is better than original high temperature conductor paste.The planeness of pottery after high temperature sintering, the neat degree at the consistent situation in metallization conduction band surface and edge is better than original high temperature conductor paste.After electronic ceramics green compact bake, the lines of product is evenly clear, and microstructure is good.
Embodiment
The invention provides a kind of formula and blending process of the high temperature conductor paste for the printing of electronic ceramics curtain coating raw cook;
Powder is selected:
1) selection of .W powder
Select the W powder of three kinds of different median sizes;
W powder one, median size is 3.0 ~ 5.2 μm;
The median size of W powder two is 1.6 μm;
W powder three, median size are 1.0 ~ 1.45 μm.
2). α-Al
2o
3the selection of powder: α-Al
2o
3the median size of powder is 2.5 μm ~ 4.0 μm;
The selection of powder ratio
W powder one: W powder two: W powder three=5: 3.5: 1.5 (wt%);
(W powder one+W powder two+W powder three): α-Al 2O3=90 ~ 95: 5 ~ 10 (wt%).
3). solvent starting material are selected
Main solvent: Terpineol 350, ethyl acetate, softening agent;
Nonionic surface active agent: NP-10;
Caking agent: PVB;
The selection of solvent system ratio
Caking agent PVB: Terpineol 350: ethyl acetate: softening agent: NP-10=11 ~ 13%: 55 ~ 60%: 9 ~ 12%: 2.8 ~ 3.5%: 12 ~ 14%
W powder in described high temperature conductor paste, the content of α-Al203 are 79 ~ 82%; Caking agent PVB, Terpineol 350, ethyl acetate, softening agent, NP-10 proportion are 18 ~ 21%.
High temperature conductor paste blending process step:
Step one, successively in the ratio of solvent system and weight percent caking agent PVB, Terpineol 350, ethyl acetate, softening agent, NP-10 are put into container and stir, make it completely broad, obtain solvent material;
Step 2, step one obtain solvent material in, add α-Al successively in powder ratio and weight percent
2o
3powder, W powder material continues to stir, and churning time is 1 hour, obtains and stirs slurry;
Step 3, the stirring slurry that step 2 obtains is placed on and rolls pulp grinder and roll three times, obtain high temperature conductor paste of the present invention.
Claims (3)
1., for a high temperature conductor paste for electronic ceramics curtain coating raw cook printing, it is characterized in that, Material selec-tion:
1) selection of .W powder
Select the W powder of three kinds of different median sizes;
W powder one, median size is 3.0 ~ 5.2 μm;
The median size of W powder two is 1.6 μm;
W powder three, median size are 1.0 ~ 1.45 μm;
2). α-Al
2o
3the selection of powder: α-Al
2o
3the median size of powder is 2.5 μm ~ 4.0 μm;
The selection of powder ratio
W powder one: W powder two: W powder three=5: 3.5: 1.5 (wt%)
(W powder one+W powder two+W powder three): α-Al
2o
3=90 ~ 95: 5 ~ 10 (wt%)
3). solvent system starting material are selected
Main solvent: Terpineol 350, ethyl acetate, softening agent;
Nonionic surface active agent: NP-10;
Caking agent: PVB;
The selection of solvent system ratio
Caking agent PVB: Terpineol 350: ethyl acetate: softening agent: NP-10=11 ~ 13%: 55 ~ 60%: 9 ~ 12%: 2.8 ~ 3.5%: 12 ~ 14%.
2. high temperature conductor paste according to claim 1, is characterized in that, high temperature conductor paste blending process step:
Step one, successively in the ratio of solvent system and weight percent PVB, Terpineol 350, ethyl acetate, softening agent, NP-10 are put into container and stir, make it completely broad, obtain solvent material;
Step 2, step one obtain solvent material in, add α-Al successively in powder ratio and weight percent
2o
3powder, W powder material continues to stir, and churning time is 1 hour, obtains and stirs slurry;
Step 3, the stirring slurry that step 2 obtains is placed on and rolls pulp grinder and roll three times, obtain high temperature conductor paste of the present invention.
3. high temperature conductor paste according to claims 1 or 2, is characterized in that, the W powder in described high temperature conductor paste, the content of α-Al203 are 79 ~ 82%; Caking agent PVB, Terpineol 350, ethyl acetate, softening agent, NP-10 proportion are 18 ~ 21%.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105060940A (en) * | 2015-06-18 | 2015-11-18 | 中国电子科技集团公司第五十五研究所 | Alumina multilayer ceramic tungsten metallide slurry and preparation method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101791818A (en) * | 2010-03-04 | 2010-08-04 | 中国电子科技集团公司第五十五研究所 | Method for preparing aluminium oxide ceramics green ceramic chip by tape casting |
CN102314957A (en) * | 2011-07-06 | 2012-01-11 | 中国电子科技集团公司第五十五研究所 | Multilayer high-temperature co-fired-ceramic thick-film tungsten conductor paste and preparation method thereof |
CN102361023A (en) * | 2011-10-20 | 2012-02-22 | 中国电子科技集团公司第十三研究所 | Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
CN102584255A (en) * | 2012-02-06 | 2012-07-18 | 宁波凯普电子有限公司 | Benzene-free casting modified slurry for ultrathin piezoelectric ceramic and preparation method of benzene-free casting modified slurry |
CN103058665A (en) * | 2011-10-20 | 2013-04-24 | 中国科学院上海硅酸盐研究所 | Ceramic casting slurry and preparation method thereof |
CN103408294A (en) * | 2013-08-29 | 2013-11-27 | 湖南新华源科技有限公司 | Method for processing electronic ceramic casting slurry |
CN104003731A (en) * | 2014-06-09 | 2014-08-27 | 云南云天化股份有限公司 | Dielectric paste for thick-film process and preparation method thereof |
-
2014
- 2014-09-09 CN CN201410475699.7A patent/CN104261808A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101791818A (en) * | 2010-03-04 | 2010-08-04 | 中国电子科技集团公司第五十五研究所 | Method for preparing aluminium oxide ceramics green ceramic chip by tape casting |
CN102314957A (en) * | 2011-07-06 | 2012-01-11 | 中国电子科技集团公司第五十五研究所 | Multilayer high-temperature co-fired-ceramic thick-film tungsten conductor paste and preparation method thereof |
CN102361023A (en) * | 2011-10-20 | 2012-02-22 | 中国电子科技集团公司第十三研究所 | Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
CN103058665A (en) * | 2011-10-20 | 2013-04-24 | 中国科学院上海硅酸盐研究所 | Ceramic casting slurry and preparation method thereof |
CN102584255A (en) * | 2012-02-06 | 2012-07-18 | 宁波凯普电子有限公司 | Benzene-free casting modified slurry for ultrathin piezoelectric ceramic and preparation method of benzene-free casting modified slurry |
CN103408294A (en) * | 2013-08-29 | 2013-11-27 | 湖南新华源科技有限公司 | Method for processing electronic ceramic casting slurry |
CN104003731A (en) * | 2014-06-09 | 2014-08-27 | 云南云天化股份有限公司 | Dielectric paste for thick-film process and preparation method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105060940A (en) * | 2015-06-18 | 2015-11-18 | 中国电子科技集团公司第五十五研究所 | Alumina multilayer ceramic tungsten metallide slurry and preparation method thereof |
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